磁头无铅微焊点液滴飞溅和失效性分析

磁头无铅微焊点可靠性分析主要包括焊点前期液滴飞溅的防护和后期焊点失效性分析,在实际生产中,应用钎料球喷射连接技术时,钎料液滴飞溅时有发生,本文融合激光加热和氮气压力技术,建立了一种新的用于计算磁头内置DFH控制元件连接钎料液滴冲击速度的双液滴模型,同时,采用正交试验法对比了不同激光加热参数和氮气压力条件下磁头内置DFH控制元件连接钎料液滴飞溅的情况,并进一步融合可控扫描式磁场和偏置两种方法,研究了磁头微焊点的失效情况.试验结果表明:下落前,激光脉冲能量是决定液滴温度的主要因素;下落后,对钎料液滴温度影响最大的是钎料液滴的初始温度.磁头无铅微焊点失效是焊点液滴飞溅和金属间化合物共同作用的结果.     

基于统计的高密度CCGA封装热循环寿命预测方程

利用ANSYS有限元软件建立了CCGA-1144全阵列三维1/8模型,分析了焊柱在热循环条件下的应力应变情况,提出疲劳寿命预测模型.并对CCGA结构进行可靠性正交试验设计,利用有限元方法预测了正交试验各方案的疲劳寿命,并利用统计学方法分析了不同结构参数变化对疲劳寿命的影响,建立了寿命预测回归方程.     

MEMS热风速计流固耦合模拟

通过设置流-固耦合面和固-固耦合面,采用ANSYS软件对MEMS热风速计进行了有限元模拟,基本解决了热风速计有限元模拟中遇到的多物理场耦合问题.通过对不同风速,不同风向情况下的风速计芯片的热分布进行了模拟和分析,得到了一些有助于芯片设计的结论.最后,为了验证模型的正确性,进行了实验测量.实验数据与模拟结果基本相符,误差在8%以内.     

LCoS显示芯片像素单元热分析

热分析技术是LCoS芯片可靠性设计的关键所在,通过使用有限元分析软件ANSYS建立了LCoS芯片像素单元的有限元模型,严格模拟了LCoS显示芯片工作时像素单元内部的热场分布情况,实验结果为LCoS芯片及其应用系统的热设计提供了重要的数值依据.     

芯片尺寸封装焊点的可靠性分析与测试

利用ANSYS有限元分析软件,将芯片尺寸封装(CSP)组件简化为了二维模型,并模拟了CSP组件在热循环加栽条件下的应力应变分布;通过模拟发现了组件的结构失效危险点,然后对危险点处的焊点热疲劳寿命进行了预测;最后进行了CSP焊点可靠性测试.结果表明,用薄芯片可提高焊点可靠性.当芯片厚度从0.625 mm减小到0.500 ...     

光伏并网对配网电压影响的PSCAD仿真与分析

讨论了光伏电池的基本工作原理和主要电气参数,PSCAD仿真软件中无光伏阵列仿真元件,根据光伏阵列的数学模型,利用PSCAD自行搭建了自定义的光伏阵列控制元件,来模拟实际的光伏阵列控制装置.基于PSCAD仿真平台搭建了光伏并网模型,通过仿真模型分析了光伏并网对配网电压的影响.     

基于一维漂移布朗运动的SLD退化失效建模

超辐射发光二极管(SLD)集LD大输出功率和LED宽光谱优点于一体,是光纤陀螺仪中的关键元件与薄弱环节,其可靠性在很大程度上决定了光纤陀螺仪的可靠性。针对SLD寿命长、失效数据难于获取的特点,研究了基于性能退化数据的可靠性评估方法。在对SLD进行失效机理分析的基础上,提出用一维漂移布朗运动模型对产品在环境应力作用下的退化特性进行建模,基于所得模型,由SLD的性能退化信息估计模型中的参数进而评估得到SLD的可靠性指标。这克服了传统可靠性分析方法依赖寿命数据的缺点,能够在没有寿命数据的情况下评估得到SLD的可靠性指标,从而可节约大量的试验经费和试验时间,在工程应用上具有重要的价值。     

CSP封装Sn-3.5Ag焊点的热疲劳寿命预测

对芯片尺寸封装(CSP)中Sn-3.5Ag无铅焊点在热循环加速载荷下的热疲劳寿命进行了预测.首先利用ANSYS软件建立CSP封装的三维有限元对称模型,运用Anand本构模型描述Sn-3.5Ag无铅焊点的粘塑性材料特性;通过有限元模拟的方法分析了封装结构在热循环载荷下的变形及焊点的应力应变行为,并结合Darveaux疲劳寿命模型预测了无铅焊点的热疲劳寿命.     

高量程微加速度计的可靠性强化实验及分析

由于微加速度计的可靠性已经成为产品商业化过程中必须解决的一个重要问题,而冲击环境作用下导致微加速度计性能失效是微加速度计经常要面对的主要问题。针对高冲击对微加速度计破坏的影响进行可靠性研究。利用ANSYS有限元仿真进行分析初步得到失效模式和机理,设计并实施了微加速度计在冲击环境下的可靠性强化实验得到在冲击环境下的主要失效模式,并进行了相应分析,通过实验得到数据进行微加速度计的可靠性评估。通过可靠性强化实验进行验证,对微加速度计在冲击环境下的可靠性进行评估,并折算出在冲击影响作用下的平均寿命和可靠寿命以及绘制出其可靠度曲线。     

CSP封装Sn-3.5Ag焊点的热疲劳寿命预测

对芯片尺寸封装(CSP)中Sn-3.5Ag无铅焊点在热循环加速载荷下的热疲劳寿命进行了预测.首先利用ANSYS软件建立CSP封装的三维有限元对称模型,运用Anand本构模型描述Sn-3.5Ag无铅焊点的粘塑性材料特性;通过有限元模拟的方法分析了封装结构在热循环载荷下的变形及焊点的应力应变行为,并结合Darveaux疲劳寿命模型预测了无铅焊点的热疲劳寿命.     

有限元动力分析及其在焊点可靠性评价中的应用

有限元分析是求解动力响应的重要数值模拟方法,该文首先阐述了有限元动力学方程的建立原理,对主要求鹪方法进行了比较说明。并以一块电路板为案例,建立有限元模型,利用有限元软件计算焊点在冲击载荷作用下的动力响应,给出焊点应力分布图,为焊点寿命估计和可靠性评价提供参考。     

基于高阶有限元方法的人体头部比吸收率分析

随着智能手机的普及,手机电磁辐射对人体健康的影响受到越来越多的关注。针对人体组织结构复杂、媒质不均匀的特点,采用高阶有限元方法对人体进行电磁建模。该方法可以高效、可靠地分析手机天线对人体局部比吸收率(SAR)分布的影响。文中介绍了高阶有限元方法基本理论,并模拟计算了900 MHz频率的PIFA手机作用下均匀介质人头模型的局部比吸收率分布,其结果与商业软件对比,验证了该方法的正确性。最后,在900 MHz的频率下应用高阶有限元法模拟计算了PIFA手机对复杂分层非均匀介质人头局部比吸收率分布的影响,表明了该方法的可行性和可靠性。     

Finite element modeling of the head skeleton with a new local quantitative assessment approach

The present study was undertaken to build a finite element model of the head skeleton and to perform a new assessment approach in order to validate it. The application fields for such an improved model are injury risk prediction as well as surgical planning. The geometrical reconstruction was performed using computed tomography scans and a total of 4680 shell elements were meshed on the median surface of the head skeleton with the particular characteristic of adapted mesh density and real element thickness. The assessment protocol of the finite element model was achieved using a quasi-static experimental compression test performed on the zygomatic bone area of a defleshed isolated head. Mechanical behavior of the finite element model was compared to the real one and the assessment approach was divided into two steps. First, the mechanical properties of the anatomical structure were identified using the simulation and then the simulated displacement field was compared to local displacement measurement performed during test using a digital correlation method. The assessment showed that the head skeleton model behaved qualitatively like the real structure. Quantitatively, the local relative error varied from 8% up to 70%.     

A 3-D hp finite/infinite element method to calculate power deposition in the human head

The electromagnetic power deposition and transfer properties of a G1 continuous head model reconstructed from magnetic resonance imaging (MRI) data are investigated by using the coupled hp finite/infinite element (FE/IE) method. The discretization error is controlled by a self-adaptive process driven by an explicit a posteriori error estimate. Based on the benchmark problem of reproducing the Mie series solution, the scattering of a plane wave on the curvilinear head model is used to evaluate the hp FE/IE approach and calibrate the error bound. The radiation pattern from a short dipole antenna modeling a cell phone, is analyzed in terms of the level and distribution of the specific absorption rates (SAR). The numerical experiments show that the hybrid hp FE/IE implementation is a competitive tool for accurate assessment of human electromagnetic exposure.     

基于多体动力学与有限元的油缸系统疲劳寿命研究

针对动力稳定装置关键部件疲劳寿命问题,文中采用基于多体动力学与有限元的方法,以动力稳定装置的夹钳油缸系统为研究对象,进行了仿真分析。该方法利用ADAMS软件对动力稳定装置进行多体动力学分析,得到夹钳油缸系统的受力载荷谱。将受力载荷谱导入有限元软件Ansys Workbench中,对夹钳油缸系统进行瞬态动力学分析。根据瞬态动力学分析结果,利用疲劳分析软件NCODE计算夹钳油缸系统的疲劳寿命状况。仿真分析结果表明,夹钳油缸系统疲劳寿命最薄弱的地方在其根部位置,最小循环次数为8.807×10⁵。     

基于有限元法的开关磁阻电机磁场特性分析

为了准确掌握开关磁阻电机的磁场特性,建立了其磁场二维模型,采用电磁场有限元方法对开关磁阻电机的磁场分布特性和参数进行分析计算。结果表明：在定子齿极与转子齿极完全不重合时,有限元分析因端部磁场的作用产生较大的误差,相对误差约为40%;随着定子齿极与转子齿极重合量的增加,有限元的计算误差逐步减小,到对齐位置时,漏磁很小,自感漏磁几乎为零。研究结果为电机结构的优化设计提供了理论依据。     

Transient solutions of a software reliability model with imperfect debugging and error generation

In this paper we obtain transient solutions of a software reliability model under the assumption that the failure rate is proportional to the remaining errors in the software under imperfect debugging and error generation. The maximum number of errors in the software is assumed to be finite. We obtain the transient probabilities for the remaining errors, mean number of errors remaining, reliability of the software, expected number of failures etc. A method to estimate model parameters is given. Finally, a numerical example is presented.     

The accuracy of structural approximations employed in analysis ofarea array packages

At the present time, area-array packages are a very common electronics packaging approach. One of the major concerns in designing such packages is the reliability of solder joints, die, and the various material interfaces present in the package. Currently, analytical, numerical, and experimental methods are employed in the analysis of thermo-mechanical stresses/strains in area array packages. The sources of error in these analytical and numerical models may be broadly characterized as being due to geometry representation, material behavior, solution procedure, and due to the accuracy in representing the load history. In this paper we assess the errors in package models due to geometry representation and material behavior using a representative area-array package, namely the 225 input/output (I/O) plastic ball grid array (PBGA). The package deformation due to a fixed temperature change is experimentally characterized using Moire interferometry and numerically simulated using both two- and three-dimensional finite element models. The difference in behavior between the finite element prediction and experimental results is explained using solder material behavior data available in the literature. A comparison of accuracy as well as efficiency is made between the different finite element models. Finally, conclusions are drawn on the aspects of package construction and material that influence behavior, and on the most efficient finite element model to accurately capture this behavior