国内微型器件装配技术的现状与应用

微机电系统(MEMS)以飞快的速度发展成为一个集微型机械、微传感器、微能源、微致动器、微控制器、微执行器、信号处理和智能控制于一体的新兴研究领域。微机电系统结构的复杂性促进了微装配技术的蓬勃发展，吸引了大批国内外研究人员对其进行广泛研究。本文首先分析了微器件装配技术对微机电系统的重要性及其产生的深远影响，然后介绍了近年来国内微装配技术的发展现状和参与微装配项目研发的研究单位的一些有应用价值的研究成果，最后阐述了微装配系统的发展趋势。     

微观作用力驱动的纳米颗粒自装配技术

自装配技术在物理、生物化学、MEMS以及纳米制造等领域得到了广泛应用,对该领域的研究显示出重要的应用前景和重大的理论价值,成为一个充满生机活力的热点。本文在阐述微器件自装配领域研究成果的基础上,重点介绍了应用毛细力、亲水(疏水)力作为驱动力实现微器件的二维和三维功能结构自装配过程,并指出了目前研究方法在纳米级微器件三维功能结构自装配中存在的问题,最后提出了综合应用介电泳力、毛细力及亲水(疏水)力实现纳米颗粒与三维基体自装配的方法。     

适用于微纳流控芯片对准连接的微装配系统

针对微纳流控芯片等器件的对准装配问题,分析了具体操作要求,建立了一套包含显微光学观测单元、机械进给调整和器件吸取一放置等的微装配系统,采用暗场照明观测微纳结构,高精度移动平台精确调整基片与盖片之间的角度与位置,利用真空吸附的方法抓取和释放.采用该系统成功地制造了多种可用的微纳流控芯片,以玻璃微纳流控芯片的对准装配为示范...     

LIGA技术制造微流量计的研究

介绍了利用ＬＩＧＡ技术中的同步辐射光刻、微电铸技术和微装配技术制作微流量计的研究，讨论了微流量计的结构和工作原理。设计和研制了一种微流量计。     

浅谈产品的虚拟装配技术

虚拟装配技术是虚拟现实技术、计算机仿真技术等多种先进技术在制造装配领域的综合应用,与一般的装配仿真、基于虚拟现实技术的装配仿真相比较,具有更大的智能性和优越性,可完成或者支持装配过程的可视化或装配工艺的规划,极大提高机械设计和制造的效率。     

微型装配用的硅夹钳

高度柔性和可靠的夹钳与搬运机器人,广泛地应用在电子工业和机器制造的许多领域。然而,现有夹持工具的几何尺寸、造型及其控制,阻碍了夹持系统在微系统、微操作、微装配以及微并接技术中的应用。简单的解决办法也许是线性缩小传统的夹钳,但这是不可能实现的,因为,这方面需要的夹持系统本身,已属于微技术系统。所以需要在微技术基础之上寻求新的解决方案。     

面天线虚拟制造技术研究——虚拟装配技术应用初探

介绍了虚拟制造和虚拟装配技术的概念，总结了虚拟装配技术的应用和发展趋势，论述了在面天线设计中应用虚拟装配技术的必要性和可行性，并提出了虚拟装配技术应用的规划。     

虚拟装配技术在带式输送机研究的可行性

虚拟装配技术是信息化制造技术之一。该文阐述了虚拟装配技术在带式输送机中研究的意义及国内外研究现状分析,分析了其拟采用的实验方案及可行性分析及研究方法,展望了虚拟技术对带式输送机信息化发展的重要意义。     

空间相机机身桁架装配工艺

机身装配作为空间相机制造的一个关键环节,对保证机身的力学性能至关重要.为了提高空间相机机身的结构刚度和稳定性,针对机身的装配环节进行了研究.研究了胶接装配方法及其相对于传统机械连接法的优势,对胶接法的装配精度进行了分析.研究了胶接装配的各种粘接要素,并进行了分析和实验.最后对装配后的机身进行了力学和热学实验,释放了装配...     

毫米级全方位微装配机器人的识别、定位及运动控制

介绍了一种毫米级全方位微机器人,设计用于微型工厂中的微装配操作.采用外部计算机视觉系统进行监控,先利用CCD摄像头捕捉微型机器人顶部及夹钳上的特征标志,再通过设计的视觉处理方法,实现了对微机器人的高精度识别和定位.在利用计算机视觉进行反馈控制的基础上,采用了对装配平台进行分区、快速前进与高精度步进相结合的运动控制策略,实现高精度的微装配任务.实验验证了以上方法和策略的有效性.     

Optomechatronic Design of Microassembly Systems for Manufacturing Hybrid Microsystems

Microassembly systems are a class of representative optomechatronic systems that play a critical role in the fabrication, packaging, and interconnection of hybrid microsystems such as hybrid microelectromechanical systems. Optomechatronic integration is essential to the development of microassembly systems due to the basic importance of microscope optics to microassembly. In this paper, the role of microscope optics in microassembly systems is analyzed. The general architecture of microassembly systems is introduced. Unique properties of microscale optomechatronics that differ from macroscale optomechatronics are summarized. These fundamental differences motivate the definition and discussion of microoptomechatronics. Major methodology issues in optomechatronic design of microassembly systems are introduced using examples. A wavelet-based microscopic image segmentation technique is presented to demonstrate the strength of using the unique properties of microoptomechatronics in microscopic image information processing.     

Si基微组装技术——薄膜混合IC的一个重要分支

本文描述了Si基微组装技术的目前状况、基本特点和一般制作工艺以及应用概况。阐明了该技术在微电子行业中的重要地位。     

Closed-loop optimal control-enabled piezoelectric microforce sensors

This paper presents a closed-loop optimally controlled force-sensing technology with applications in both micromanipulation and microassembly. The microforce-sensing technology in this paper is based on a cantilevered composite beam structure with embedded piezoelectric polyvinylidene fluoride (PVDF) actuating and sensing layers. In this type of sensor, the application of an external load causes deformation within the PVDF sensing layer. This generates a signal that is fed through a linear quadratic regulator (LQR) optimal servoed controller to the PVDF actuating layer. This in turn generates a balancing force to counteract the externally applied load. As a result, a closed feedback loop is formed, which causes the tip of this highly sensitive sensor to remain in its equilibrium position, even in the presence of dynamically applied external loads. The sensor's stiffness is virtually improved as a result of the equilibrium position whenever the control loop is active, thereby enabling accurate motion control of the sensor tip for fine micromanipulation and microassembly. Furthermore, the applied force can be determined in real time through measurement of the balance force.     

微组装电路的设计特点与制造技术

分析了国内微组装电路的发展现状，深入探讨了微 组装电路的设计特点和结构工艺制造技术，提出了发展微组装电路物途径。     

Automatic microassembly system assisted by vision servoing and virtual reality

We proposed an automated micromanipulation workcell for visually servoed teleoperated microassembly assisted by virtual reality techniques. It is composed of two micromanipulators equipped with microtools operating under a light microscope. Visual servoing techniques are applied for efficient and reliable position/force feedback during microassembly tasks. First, a pushing-based micromanipulation strategy for the microobject to follow a planned trajectory is proposed under vision based-position control. Then, we present the cooperation control strategy of the microhandling operation under vision-based force control integrating a sensor fusion framework approach. A guiding-system based on virtual microworld exactly reconstructed from the CAD-CAM databases of the real environment being considered is presented for the imprecisely calibrated microworld. Finally, a planned scenario is executed and experimental results of microassembly tasks performed on millimeter-sized components are provided.     

振动驱动微能源技术研究进展

首先介绍了微能源的几种类型,比较了不同类型微能源的优缺点。振动式微能源具有体积小、重量轻、能量密度高、寿命长、无污染和对环境适应性强等优点,详细描述了静电转换型、电磁转换型和压电转换型三种振动驱动微能源技术的原理和特点。系统综述了三种振动驱动微能源技术的国内外研究现状,包括微能源的结构和采集、存储电路。分析了其存在的技术和应用瓶颈问题,例如微能源使用的材料和结构不完善、转换效率较低、微加工和微装配技术不成熟、难以应用于实际环境、振动环境对其寿命的影响等问题,并且展望了微能源未来的发展趋势。     

Contact Micromanipulation—Survey of Strategies

This paper surveys contact micromanipulation strategies that are developed to tackle the microscale-related phenomena in microassembly. Strategies are divided according to how they take account of adhesion forces. Micromanipulation refers to handling of objects that have dimensions below hundreds of micrometers with handling accuracy down to submicrometers. The line between micro- and nanomanipulation is not definite but typically the object size in nanomanipulation is considered to reach from atomic and molecular scale to hundreds of nanometers. In contact micromanipulation, the tool physically touches the manipulated objects during handling. Scaling-effect-induced adhesion forces severely complicate micromanipulation when compared to conventional macromanipulation. At microscale, the most important adhesive forces are van der Waals force, electrostatic force, and capillary force. Adhesion forces are also the reason behind the fairly low level of automation in microassembly systems. Improved success rate of micromanipulation operations requires that the special features of microscale phenomena be taken into consideration.      

A high-yield microassembly structure for three-dimensional microelectrode arrays

This paper presents a practical microassembly process for three-dimensional (3-D) microelectrode arrays for recording and stimulation in the central nervous system (CNS). Orthogonal lead transfers between the micromachined two-dimensional probes and a cortical surface platform are formed by attaching gold beams on the probes to pads on the platform using wire-free ultrasonic bonding. The low-profile (150 microns) outrigger design of the probes allows the bonding of fully assembled high-density arrays. Micromachined assembly tools allow the formation of a full 3-D probe array within 30 min. Arrays having up to 8 x 16 shanks on 200-micron centers have been realized and used to record cortical single units successfully. Active 3-D probe arrays containing on-chip CMOS signal processing circuitry have also been created using the microassembly approach. In addition, a dynamic insertion technique has been explored to allow the implantation of high-density probe arrays into feline cortex at high-speed and with minimal traumatic injury.     

概率包标记技术综述

防御分布式拒绝服务攻击是目前网络安全的一大难题,在应对分布式拒绝服务攻击的各种措施中,概率包标记技术是一种重要手段,受到了广泛的重视。文章对Savage提出的基本概率包标记以及目前的常见的概率包标记方案进行了分析研究,按照采用的标记手段和方法做了一定的归类并对其性能和效果进行了比较和分析,最后对概率包标记技术的发展趋势作了简单分析和展望。