NPC太阳电池的TiO2薄膜结构的研究

采用溶胶凝胶法、粉末涂敷法和磁控溅射法在导电玻璃上制得纳米TiO2薄膜。电子衍射和X射线衍射实验表明该薄膜主要是锐钛矿相结构，透射电子显微镜实验证明了薄膜晶粒为纳米尺度，扫描电子显微镜实验观察了薄膜的表面形貌。分析并讨论了利用以上各种方法制得的纳米TiO2薄膜的结构及其所组成的染料敏化太阳电池的性能。发现由致密TiO2层和多孔TiO2层组成的多层TiO2薄膜组装的太阳电池的性能优于任一种单层TiO2薄膜。     

中频交流反应溅射TiO2薄膜制备及光催化性能研究

利用中频交流反应磁控溅射技术制备TiO2薄膜，利用AES、XRD和SEM分析了制得的TiO2薄膜的成分、结构和表面形貌，并利用多种降解对象研究了TiO2薄膜的光催化降解性能．结果发现：利用Ar／O2混合气体反应溅射纯Ti靶制备的TiO2薄膜符合化学计量比，呈现柱状生长．TiO2薄膜均为锐钛矿相，晶粒随薄膜厚度增加逐渐长大．制得的TiO2薄膜对亚甲基蓝、甲基橙和敌敌畏都具有确实的光催化降解效果，同时具有很好的光催化性能稳定性。     

磁控反应溅射TiO2薄膜的实验研究

应用直流和中频交流程序自动控制磁控溅射设备，利用金属Ti靶、纯Fe靶制备出了有一定厚度的质量较好的不同氧流量的Fe掺杂TiO2薄膜，TiO2薄膜被沉积在玻璃基底上。薄膜的制备用程序控制。通过在TiO2薄膜中形成一定的结构，并利用各种分析测试手段对其性能进行了测试，初步探讨了不同氧流量对TiO2薄膜的影响。实验表明程序自动控制不同氧流量Fe掺杂TiO2薄膜的特性有了很大改变。     

非平衡磁控溅射法Ti/TiO2薄膜的制备及分析

在光学玻璃衬底上利用新型非平衡磁控溅射技术沉积了Ti／TiO2薄膜。原子力显微镜分析表明，薄膜表面光滑、致密、均匀，表面粗糙度（Ra）小于10nm，组成薄膜的颗粒尺寸小于100nm。膜厚测量分析表明，TiO2薄膜的沉积速率达110nm／min。在拉曼光谱中，没有出现晶态TiO2薄膜的散射峰，表明所得TiO2薄膜为非晶结构。利用紫外-可见光全反射谱分析了薄膜的光学性能，结果发现，单纯TiO2薄膜存在微弱吸收，在波长约550nm时出现最大反射率，其后波长越大，吸收率越高；在Ti/TiO2薄膜体系中，随着沉积的Ti膜的厚度增大，Ti薄膜界面的反射率增大，薄膜吸收率提高；在玻璃衬底的正反面均沉积适当厚度的Ti／TiO2薄膜时，能够获得不同的色彩效果；根据薄膜干涉特征，计算所得TiO2薄膜的折射系数约为3．0。另外，所得TiO2薄膜不存在明显光电效应。     

微等离子体氧化法TiO2、TiO2(W)薄膜的制备及性能

利用微等离子体氧化方法,在纯Ti金属表面制备TiO2、TiO2(W)薄膜,并用X射线衍射(XRD)、扫描电镜(SEM)初步研究了薄膜的组织结构和表面形貌.在不同的条件下,得到3种不同类型结构组成的薄膜单一TiO2的锐钛型结构、单一TiO2金红石结构及TiO2(W)薄膜;同时对薄膜的催化特性进行了初步的研究.     

染料敏化太阳能电池TiO2薄膜的制备方法

阐述了对应用在染料敏化太阳能电池中作为电极的TiO2薄膜的要求,对如何能制备出具有较好电池性能的TiO2薄膜电极的方法进行了综述,分析了各种方法的优劣,对未来染料敏化太阳能电池中TiO2薄膜的制备方法提出了建议。     

微等离子体氧化法TiO2、TiO2(W)薄膜的制备及性能

利用微等离子体氧化方法,在纯Ti金属表面制备TiO2、TiO2(W)薄膜,并用X射线衍射(XRD)、扫描电镜(SEM)初步研究了薄膜的组织结构和表面形貌.在不同的条件下,得到3种不同类型结构组成的薄膜:单一TiO2的锐钛型结构、单一TiO2金红石结构及TiO2(W)薄膜;同时对薄膜的催化特性进行了初步的研究.     

钛氧化物的蒸发特性

试验以Ti2O3、Ti3O5和TiO2作为初始膜料，在ZZS7OO—6／G型真空镀膜机上采用O^2-离子束辅助蒸发制备氧化钛薄膜。用XRD检测方法确定各种膜料和薄膜的相成分，并全面的分析了各种膜料的蒸发特性和薄膜；用分光光度计测量薄膜的透射率，并分析薄膜的光学性能。试验表明，在采用Ti2O3、Ti3O5和TiO2作为蒸发制备氧化钛薄膜时，在钛的氧化物中存在Ti3O5固态同一蒸发相；各种膜料在蒸发时，发生分解，熔池中的物质的成分逐渐转变并晟终完全成同一蒸发相成分。     

半导体耦合法改性纳米TiO2薄膜在DSSC中的应用

染料敏化纳米晶TiO2薄膜太阳能电池具有成本低廉、制作简单和环保等优点，吸引了国内外研究者的广泛关注。综述了半导体复合TiO2薄膜在DSSC中应用的研究进展，重点阐述了半导体复合TiO2薄膜的机理，总结了半导体复合TiO2薄膜的种类及制备方法，并分析了其对太阳能电池光电性能的影响。     

稀土元素掺杂TiO2薄膜的制备及其光学性能研究

采用溶胶-凝胶法制备得到Y3 和Ho3 掺杂的TiO2薄膜,XRD分析表明薄膜结晶性能良好,具有锐钛矿晶型。薄膜表面AFM分析表明,薄膜的晶粒具有纳米尺寸。采用紫外-可见分光光度计对掺杂和未掺杂的TiO2薄膜进行紫外-可见吸收光谱分析,表明Y3 和Ho3 掺杂的TiO2薄膜在紫外光区吸光度有所提高,同时在可见光区光吸收范围出现了红移,相同掺杂浓度的Y3 和Ho3 掺杂的TiO2薄膜,前者在400~450nm的可见光区具有更高的吸光度。     

Einsatz physikalischer Analysemethoden zur Charakterisierung von dünnen Schichten und Grenzflächen in der Halbleiterindustrie

Characterization of thin films and interfaces are necessary in semiconductor industry to ensure high yields and the required reliability of the products. Requirements to thin film and interface analysis are reviewed, and typical applications in semiconductor industry are shown. Thin film characteristics which have to be determined using physical analysis techniques are film geometry, surface and interface roughness, chemical composition, and microstructure. Advances in physical failure analysis are essential to the reduction of feature size and introduction of advanced materials and processes for future technology generations. Future trends are discussed. To reduce the time for problem solving in the manufacturing process, out of‐fab characterization tools will partly move to“at‐line” labs which are located next to or sometimes inside the cleanroom.     

AZO透明导电薄膜的制备技术及应用进展

概述了国内外AZO透明导电薄膜的多种制备技术和开发应用进展。详细介绍了磁控溅射、溶胶-凝胶、脉冲激光沉积、真空蒸镀、化学气相沉积等工艺在AZO薄膜制备中的研究现状,并且在对AZO膜与ITO膜性能比较的基础上,指出AZO薄膜的产业化前景好。     

A comparison of three techniques for measuring strain at feature of thin film materials

Good knowledge of the mechanical properties of thin film materials is important for reliable design of advanced electronic packages such as multi-chip modules (MCMs). Strain at fracture is one of the important properties which has not been well characterized for some of the candidate thin film materials for MCMs. In part, this is due to the lack of simplw and accurate techniques to measure strain at fracture of thin film materials. Two new techniques have been developed to alleviate this problem. The first is an acoustic technique in which an accelerometer is attached to the film. The film is then gradually strained and when the film fractures, an acoustic wave propagates through the film thereby creating a transient signal from the accelerometer. This signal is used to trigger an oscilloscope. The second technique is similar except that it utilizes a laser probe to detect the acoustic wave. In this photo-acoustic method, the laser is reflected from the film onto a bisectional photodetector while the film is gradually strained. Upon film fracture, the acoustic wave modulates the laser beam and a transient voltage pulse is produced by the photodetector. Both techniques are capable of detecting the formation of extremely small cracks. The two techniques are compared with a previously reported electrochemical technique. All three techniques are accurate, simple to implement, and inexpensive but have relative advantages and disadvantages.     

薄膜材料导热行为及其测试和预测

薄膜材料在集成电路,光电子技术,微结构传感器等微电子元件的应用日益广泛,其导热性能直接影响元器件的热噪声,进而对其可行一和使用性能产生明显影响,薄膜材料导热性能及其测试研究愈益受人瞩目,为此,本文对薄膜材料导热性能及各种测试方法进行了综述,并在分析薄膜微结构模型的基础上,对计算薄膜有效热导率的不同预测议程进行了评述,从而可为薄膜材料的制备工艺和性能变化提供技术判据。     

Quasi-crystalline thin films in AlMn and MnBi

In the present work we discuss some methods for obtaining thin films with quasi-crystalline structures. Methods which produce decagonal and dodecagonal structures are presented in detail. Such techniques involve a post-deposition treatment heating treatment. We show that the analysis of thin film structures can play an important role in understanding the quasi-crystalline structures and the related crystalline phases.     

SiC薄膜制备工艺进展

本文综述了ＳｉＣ薄膜的制备工艺及进展，介绍了物理气相沉积、化学气相沉积、等离子化学气相沉积及光化学气相沉积等各种ＳｉＣ薄膜的制备方法，简单阐述了各种工艺对薄膜性能的影响，评述了各种制备工艺的优缺点。     

Oberflächen‐ und Dünnschichtanalytik – unverzichtbares Werkzeug für Schichtentwicklung und ‐produktion

Surface and thin film analysis – indispensable tool for coating development and ‐production Development and production of thin films for functional coating on special materials is unalterable combined with a permanent quality control and therefore use of sophisticated analysis and measurement techniques. The field of interest is belonging to all steps of the production chain, starting with the characterization of the substrate surface (e. g. glass, plastics), followed by polishing and cleaning processes up to depth profiling of complex multilayers. The typical analyses are focused onto topographical and chemical features and their influence onto the product functionality. The use of surface and thin film analytics for problem oriented characterization is demonstrated by a few examples, which deal with surface roughness, contamination, impurities and dopand profiles as well as composition variations in the surface near region.     

Selected area and in-depth auger analysis of thin films

Auger electron spectroscopy (AES) has rapidly developed from a purely research oriented technique into an extremely versatile analytical method with unique features for qualitative and quantitative materials characterization. The low escape depth (5–10 Å) of the emitted Auger electrons makes it ideal for surface analysis and for depth profile impurity distribution analysis when combined with in situ ion sputtering.Both surface and depth profile analysis can be accomplished on a selected area by the use of optical or primary electron beam scanning techniques. Results are presented which illustrate the significance of the analytical capabilities of AES in the qualitative and quantitative analysis of thin film electronic materials used in the fabrication of precision thin film resistors, capacitors and conductors.     

太阳电池用绒面ZnO-TCO薄膜制备技术及特性的研究进展

概括阐述了薄膜太阳电池用绒面结构ZnO透明导电薄膜(ZnO-TCO)方面的最新研究进展.绒面结构ZnO-TCO薄膜可以提高薄膜太阳电池效率和稳定性并降低生产成本.磁控溅射技术和MOCVD(Lp-MOCVD/LPCVD)技术是制备绒面结构ZnO-TCO薄膜(例如"弹坑"状和"类金字塔"状表面)的主流生长技术,而喷雾热分解技术则是正在开发的非真空法低成本工艺路线.论述了2种主流技术生长ZnO-TCO薄膜的发展历程,并重点讨论了近期关于绒面ZnO-TCO薄膜微观结构、电学以及光学等特性与工艺关系的研究结果.进一步降低成本和实现大面积产业化是绒面ZnO-TCD薄膜拓展应用的发展趋势.     

气相沉积技术制备TiN类硬质膜

硬质膜由于具有良好的耐磨、耐蚀和耐热等特点,所以在航天、化工和机械等领域获得了日益广泛的应用,而硬质膜的组成和制备工艺也随之得到不断发展.本文综述了TiN类硬质膜的应用和制备硬质膜常用的气相沉积方法、工艺参数及其优缺点.阐明了制备工艺正向着以三束(电子束、离子束和激光束)为基础多种工艺复合的方向发展.而硬质膜正向着多元膜、梯度膜和纳米复合膜方向发展.