共查询到20条相似文献,搜索用时 31 毫秒
1.
Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys 总被引:4,自引:0,他引:4
C. M. T. Law C. M. L. Wu D. Q. Yu L. Wang J. K. L. Lai 《Journal of Electronic Materials》2006,35(1):89-93
The near-eutectic Sn-3.5 wt.% Ag-0.7 wt.% Cu (Sn-3.5Ag-0.7Cu) alloy was doped with rare earth (RE) elements of primarily Ce
and La of 0.05–0.25 wt.% to form Sn-3.5Ag-0.7Cu-xRE solder alloys. The aim of this research was to investigate the effect
of the addition of RE elements on the microstructure and solderability of this alloy. Sn-3.5Ag-0.7Cu-xRE solders were soldered
on copper coupons. The thickness of the intermetallic layer (IML) formed between the solder and Cu substrate just after soldering,
as well as after thermal aging at 170°C up to 1000 h, was investigated. It was found that, due to the addition of the RE elements,
the size of the Sn grains was reduced. In particular, the addition of 0.1wt.%RE to the Sn-3.5Ag-0.7Cu solder improved the
wetting behavior. Besides, the IML growth during thermal aging was inhibited. 相似文献
2.
稀土元素对Sn-0.2Ag-0.7Cu钎料合金物理性能的影响 总被引:1,自引:0,他引:1
在筛选出综合性能较好的Sn-0.2Ag-0.7Cu钎料合金中,添加微量混合稀土元素(RE)以提高钎料的焊接性能。研究了稀土的添加量对其熔化温度、电导率和固–液相线温差等焊接性能的影响。结果表明:添加w(RE)为0.1%~0.5%时,固–液相线温差小于15℃,符合现行钎焊工艺要求,且对钎料合金的熔化温度和电导率影响不大。 相似文献
3.
Taking the most promising substitute of the Sn-3.8Ag-0.7Cu solder as the research base, investigations were made to explore
the effect of rare earths (REs) on the creep performance of the Sn-3.8Ag-0.7Cu solder joints. The SnAgCu-0.1RE solder with
the longest creep-rupture life was selected for subsequent research. Creep strain tests were conducted on Sn-3.8Ag-0.7Cu and
SnAgCu-0.1RE solder joints in the intermediate temperature range from 298 K to 398 K, corresponding to the homologous temperatures
η=0.606, 0.687, 0.748, and 0.809 and η = 0.602, 0.683, 0.743, and 0.804, respectively, to acquire the relevant creep parameters,
such as stress exponent and activation energy, which characterize the creep mechanisms. The final creep constitutive equations
for Sn-3.8Ag-0.7Cu and SnAgCu-0.1RE solder joints were established, demonstrating the dependence of steady-state creep rate
on stress and temperature. By correcting the apparent creep-activation energy of Sn-3.8Ag-0.7Cu and SnAgCu-0.1RE solder joints
from the experiments, the true creep-activation energy is obtained. Results indicated that at low stress, the true creep-activation
energy of Sn-3.8Ag-0.7Cu and SnAgCu-0.1RE solder joints is close to the lattice self-diffusion activation energy, so the steady-state
creep rates of these two solder joints are both dominated by the rate of lattice self-diffusion. While at high stress, the
true creep-activation energy of Sn-3.8Ag-0.7Cu and SnAgCu-0.1RE solder joints is close to the dislocation-pipe diffusion activation
energy, so the steady-state creep rates are dominated by the rate of dislocation-pipe diffusion. At low stress, the best-fit
stress exponents n of Sn-3.8Ag-0.7Cu and SnAgCu-0.1RE solder joints are 6.9 and 8.2, respectively, and the true creep-activation
energy of them both is close to that of lattice self-diffusion. At high stress, it equals 11.6 and 14.6 for Sn-3.8Ag-0.7Cu
and SnAgCu-0.1RE solder joints, respectively, and the true creep-activation energy for both is close to that of the dislocation-pipe
diffusion. Thus, under the condition of the experimental temperatures and stresses, the dislocation climbing mechanism serves
as the controlling mechanism for creep deformation of Sn-3.8Ag-0.7Cu and SnAgCu-0.1RE solder joints. The creep values of Sn-3.8Ag-0.7Cu
and SnAgCu-0.1RE solder joints are both controlled by dislocation climbing. Dislocation glide and climb both contribute to
creep deformation, but the controlling mechanism is dislocation climb. At low stress, dislocation climbing is dominated by
the lattice self-diffusion process in the Sn matrix and dominated by the dislocation-pipe diffusion process at high stress. 相似文献
4.
Wei Min Xiao Yao Wu Shi Yong Ping Lei Zhi Dong Xia Fu Guo 《Journal of Electronic Materials》2008,37(11):1751-1755
The effects of rare-earth (RE) element additions on the tensile deformation mechanism of the Sn-3.8Ag-0.7Cu solder alloy have
been investigated. The results show that adding RE elements can remarkably improve the tensile strength and elongation of
the Sn-3.8Ag-0.7Cu alloy. The increase in the mechanical properties are attributed to the constraints of microcrack growth
and grain boundary sliding in the eutectic phase as well as the relaxation of stress concentration in the β-Sn phase due to
the addition of the RE elements. It is considered that the RE elements strengthen the eutectic phase and increase the deformation
resistance of this alloy. 相似文献
5.
Ning Zhang Yaowu Shi Yongping Lei Zhidong Xia Fu Guo Xiaoyan Li 《Journal of Electronic Materials》2009,38(10):2132-2147
This study was concerned with the effect of thermal aging on the impact properties of solder joints. Three kinds of solders,
conventional Sn-37Pb solder, Sn-3.8Ag-0.7Cu solder, and Sn-3.8Ag-0.7Cu doped with rare-earth (RE) elements, were selected
to manufacture joint specimens for the Charpy impact test. U-notch specimens were adopted and isothermally aged at 150°C for
100 h and 1000 h, and then impacted by using a pendulum-type impact tester at room temperature. The Sn-37Pb solder joints
exhibited higher performance in terms of impact absorbed energy in the as-soldered and 100 h thermally aged conditions. Interestingly,
the Sn-3.8Ag-0.7Cu solder joints exhibited improved performance for the impact value after 1000 h of thermal aging. For the
Sn-37Pb and Sn-3.8Ag-0.7Cu solder joints, the impact absorbed energies initially increased when the storage duration was limited
to 100 h, and then gradually decreased with its further increase. For the Sn-3.8Ag-0.7Cu-RE specimens, impact performance
decreased directly with increasing thermal aging. Furthermore, scanning electron microscopy (SEM) observation showed that
the fracture paths were focused on the interface zone for the three kinds of joints in the aged conditions. For the Sn-37Pb
joints, the fracture surfaces mainly presented a ductile fracture mode. For the Sn-3.8Ag-0.7Cu joints, with microstructure
coarsening, crack propagation partly shifted towards the Sn/Cu6Sn5 interface. Compared with the 100 h aged joints, the area fraction of intergranular fracture of Sn grains on the Sn-3.8Ag-0.7Cu
fracture surfaces was increased when the aging time was 1000 h. On the contrary, the fracture morphologies of Sn-3.8Ag-0.7Cu-RE
were mainly brittle as thermal aging increased. Thus, an interrelationship between impact energy value and fracture morphology
was observed. 相似文献
6.
Ning Zhang Yaowu Shi Zhidong Xia Yongping Lei Fu Guo Xiaoyan Li 《Journal of Electronic Materials》2008,37(10):1631-1639
Charpy impact tests on three kinds of as-soldered U-notch specimens were performed with reference to the American Society
of Testing Materials (ASTM) standard E23-07 by using a pendulum-type impact tester at room temperature. Three kinds of solders,
conventional Sn-37Pb, Sn-3.8Ag-0.7Cu, and Sn-3.8Ag-0.7Cu doped with rare-earth (RE) elements, were selected to fabricate the
joint specimens for the impact test. The three joints demonstrate similar impact toughness values, with averages of 11.4 kJ/m2, 10.4 kJ/m2, and 11.0 kJ/m2, respectively. Under observation by scanning electron microscopy (SEM), the Sn-37Pb joint exhibited mainly ductile fracture
morphology. Fractographic observations of lead-free joints exhibited a mixture of ductile and brittle morphologies. The addition
of RE elements resulted in an impact toughness that was slightly higher than that of the Sn-3.8Ag-0.7Cu alloy. The impact
toughness and the fracture mode were notably dependent on the type of solder. Additionally, the thickness of the intermetallic
compound (IMC) layer had a remarkable influence on the fracture path and impact toughness of the solder joints.
An erratum to this article can be found at 相似文献
7.
Because of excellent wetting and mechanical properties, SnAgCu solder alloys have been regarded as the most promising Pb-free
substitutes for the SnPb solder. The Sn-3.8Ag-0.7Cu solder has garnered attention because of its creep resistance. However,
under the drives of increasingly finer pitch design and severe service conditions, novel lead-free solders with higher creep
performance may be needed. Adding a surface-active element to an alloy is an effective way to improve the high-temperature
performance of the solder. The present work focuses on the effect of rare earth (RE) on the physical properties, spreading
property, and mechanical properties of SnAgCu solder. Results show that the creep-rupture life of SnAgCu solder joints at
room temperature could be notably increased by adding a minute amount of RE, up to 7 times more than that of SnAgCu solder
joints when containing 1.0wt.%RE. The differential scanning calorimetry (DSC) curves indicated that the melting temperature
of SnAgCu solder with RE increased a little, and no lower melting-temperature, eutectic endothermal peak appears on the DSC
curve. The electrical conductivity of the solder decreased slightly, but it is still superior to the SnPb eutectic solder.
Compared to that of SnPb solder, the coefficient of thermal expansion (CTE) of SnAgCu (RE) is closer to copper, which usually
serves as the substrate of printed circuit boards (PCBs). It is assumed that this will comparably reduce the thermal stress
derived from thermal mismatch between the solder and the PCBs. The RE had no apparent effect on the spreading property, but
when RE added up to 1.0 wt.%, the spreading area of the solder on the copper substrate decreased, obviously, because of mass
oxide. The RE improved the ultimate tensile strength little, but it increased the elongation up to 30%. However, as the content
of the RE increases, the elongation of the solder gradually decreased to the level of SnAgCu when the RE exceeds 0.25 wt.%.
Additionally, RE made the elastic modulus of SnAgCu solder increase, so the resistance to elastic deformation of the solder
is enhanced. The microstructure of SnAgCuRE led to a refining trend as the RE content increased. The RE compounds appeared
in the solder when RE was 0.1 wt.%. This deteriorates the mechanical properties of the solder. The fractography of the tensile
specimen containing 0.1 wt.% indicated a superior ductility to Sn-3.8Ag-0.7Cu bulk solder. However, as RE is increased to
1.0 wt.%, the fractography shows less ductile characteristics, which is believed to serve as the reason that the elongation
of solder degrades as RE increases. Summarily, the most suitable content of RE is within 0.05–0.5 wt.% and is inadvisable
beyond 1.0 wt.%. 相似文献
8.
J. Chriaštel’ová L. Rízeková Trnková K. Pocisková Dimová M. Ožvold 《Journal of Electronic Materials》2011,40(9):1956-1961
Small amounts of the rare-earth element Ce were added to the Sn-rich lead-free eutectic solders Sn-3.5Ag-0.7Cu, Sn-0.7Cu,
and Sn-3.5Ag to improve their properties. The microstructures of the solders without Ce and with different amounts (0.1 wt.%,
0.2 wt.%, and 0.5 wt.%) of Ce were compared. The microstructure of the solders became finer with increasing Ce content. Deviation
from this rule was observed for the Sn-Ag-Cu solder with 0.2 wt.% Ce, and for the Sn-0.7Cu eutectic alloy, which showed the
finest microstructure without Ce. The melting temperatures of the solders were not affected. The morphology of intermetallic
compounds (IMC) formed at the interface between the liquid solders and a Cu substrate at temperatures about 40°C above the
melting point of the solder for dipping times from 2 s to 256 s was studied for the basic solder and for solder with 0.5 wt.%
Ce addition. The morphology of the Cu6Sn5 IMC layer developed at the interface between the solders and the substrate exhibited the typical scallop-type shape without
significant difference between solders with and without Ce for the shortest dipping time. Addition of Ce decreased the thickness
of the Cu6Sn5 IMC layer only at the Cu/Sn-Ag-Cu solder interface for the 2-s dipping. A different morphology of the IMC layer was observed
for the 256-s dipping time: The layers were less continuous and exhibited a broken relief. Massive scallops were not observed.
For longer dipping times, Cu3Sn IMC layers located near the Cu substrate were also observed. 相似文献
9.
The impact behavior of solder joints was studied using three different high-velocity impact tests: the U-notch Charpy impact
test, the no-notch Charpy impact test, and a laboratory-designed drop test. The solder joints were made of five solder alloys,
Sn-37Pb, Sn-3.8Ag-0.7Cu, Sn-2.0Ag-0.7Cu, Sn-1.0Ag-0.7Cu, and Sn-0.7Ag-0.7Cu (in wt.%), in which the traditional Cu/solder/Cu
butt joint was used. All three impact tests gave the same trend of the impact behavior of the solder joints, with the Sn-37Pb
joints having the highest impact resistance and the Sn-3.8Ag-0.7Cu joints having the lowest impact resistance. For the lead-free
joints, the Sn-1.0Ag-0.7Cu joints had better impact resistance than the Sn-2.0Ag-0.7Cu joints, and the Sn-2.0Ag-0.7Cu joints
better than the Sn-0.7Ag-0.7Cu joints. The impact behavior was correlated well to the fracture morphologies observed by scanning
electron microscopy (SEM). Comparison of the three tests showed that the no-notch Charpy impact test is a promising method
for evaluating the drop performance of solder joints. 相似文献
10.
T. M. Korhonen P. Su S. J. Hong M. A. Korhonen C. -Y. Li 《Journal of Electronic Materials》2000,29(10):1194-1199
We have done experimental research on the dissolution rate and intermetallic growth on Cu, Ni, and CuNi-alloy substrates as
a function of time and Cu/Ni ratio of the substrate. Reactions that occur when CuNi metallizations are soldered with lead-free
solders were investigated. The experiments were performed using Sn-3.5Ag and Sn-3.8Ag-0.7Cu solders and different CuNi alloys.
To determine the rate of dissolution of the substrate material into the solder, CuNi foils of different concentrations were
immersed in Sn-3.5Ag and Sn-3.8Ag-0.7Cu solder baths for soldering times ranging from 15 sec to 5 min at 250°C. In addition,
reflows of solder balls were made on top of bulk substrates to study the reaction when there is a practically infinite amount
of CuNi available compared to the amount of solder. Thin film experiments were also done, where Ni containing under bump metallizations
(UBMs) were fabricated and reflowed with eutectic SnAg solder balls. The nickel slows down the dissolution of the UBM into
the solder and the formation of intermetallics during reflow compared to Cu metallizations. The solder/UBM interfaces were
analyzed with SEM to find out how Ni concentration affects the reaction, and how much Ni is needed to obtain a sufficiently
slow reaction rate. 相似文献
11.
12.
We developed a new lead-free solder alloy, an Sn-Ag-Cu base to which a small amount of Ni and Ge is added, to improve the
mechanical properties of solder alloys. We examined creep deformation in bulk and through-hole (TH)␣form for two lead-free
solder alloys, Sn-3.5Ag-0.5Cu-Ni-Ge and Sn-3.0Ag-0.5Cu, at elevated temperatures, finding that the creep rupture life of the
Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy was over three times better than that of the Sn-3.0Ag-0.5Cu solder at 398 K. Adding Ni to
the solder appears to make microstructural development finer and more uniform. The Ni added to the solder readily combined
with Cu to form stable intermetallic compounds of (Cu, Ni)6Sn5 capable of improving the creep behavior of solder alloys. Moreover, microstructural characterization based on transmission
electron microscopy analyses observing creep behavior in detail showed that such particles in the Sn-3.5Ag-0.5Cu-Ni-Ge solder
alloy prevent dislocation and movement. 相似文献
13.
The mechanical and electrical properties of several Pb-free solder joints have been investigated including the interfacial
reactions, namely, the thickness and morphology of the intermetallic layers, which are correlated with the shear strength
of the solder joint as well as its electrical resistance. A model joint was made by joining two “L-shaped” copper coupons
with three Pb-free solders, Sn-3.5Ag (SA), Sn-3.8Ag-0.7Cu (SAC), and Sn-3.5Ag-3Bi (SAB) (all in wt.%), and combined with two
surface finishes, Cu and Ni(P)/Au. The thickness and morphology of the intermetallic compounds (IMCs) formed at the interface
were affected by solder composition, solder volume, and surface finish. The mechanical and electrical properties of Pb-free
solder joints were evaluated and correlated with their interfacial reactions. The microstructure of the solder joints was
also investigated to understand the electrical and mechanical characteristics of the Pb-free solder joints. 相似文献
14.
N. Dariavach P. Callahan J. Liang R. Fournelle 《Journal of Electronic Materials》2006,35(7):1581-1592
Soldering with the lead-free tin-base alloys requires substantially higher temperatures (∼235–250°C) than those (213–223°C)
required for the current tin-lead solders, and the rates for intermetallic compound (IMC) growth and substrate dissolution
are known to be significantly greater for these alloys. In this study, the IMC growth kinetics for Sn-3.7Ag, Sn-0.7Cu, and
Sn-3.8Ag-0.7Cu solders on Cu substrates and for Sn-3.8Ag-0.7Cu solder with three different substrates (Cu, Ni, and Fe-42Ni)
are investigated. For all three solders on Cu, a thick scalloped layer of η phase (Cu6Sn5) and a thin layer of ε phase (Cu3Sn) were observed to form, with the growth of the layers being fastest for the Sn-3.8Ag-0.7Cu alloy and slowest for the Sn-3.7Ag
alloy. For the Sn-3.8Ag-0.7Cu solder on Ni, only a relatively uniform thick layer of η phase (Cu,Ni)6Sn5 growing faster than that on the Cu substrate was found to form. IMC growth in both cases appears to be controlled by grain-boundary
diffusion through the IMC layer. For the Fe-42Ni substrate with the Sn-3.8Ag-0.7Cu, only a very thin layer of (Fe,Ni)Sn2 was observed to develop. 相似文献
15.
以Sn2.5Ag0.7Cu为基础,添加微量的稀土(RE)r(Ce︰La)为4︰1,研究了钎焊接头的显微组织与力学性能。结果表明:添加微量的RE后,钎料与Cu试样间的界面层厚度明显减小,且界面处的组织更加平滑,相应地其剪切强度随微量RE的添加而增大,并在RE含量(质量分数)为0.1%时达到最大值36MPa。 相似文献
16.
The Sn-0.7%Cu alloy has been considered as a lead-free alternative to lead-tin alloys. In this work, various small amounts
of rare earth (RE) elements, which are mainly Ce and La, have been added to the Sn-0.7%Cu alloy to form new solder alloys.
It was found that the new alloys exhibit mechanical properties superior to that of the Sn-0.7%Cu alloy. In particular, the
addition of up to 0.5% of RE elements is found to refine the effective grain size and provide a fine and uniform distribution
of Cu6Sn5 in the solidified microstructure. Tensile, creep, and microhardness tests were conducted on the solder alloys. It was found
that significant improvements of the tensile strength, microhardness, and creep resistance were obtained with RE element addition.
Upon aging at 150°C for 20 h, the microstructure of Sn-Cu-RE is more stable than that of the Sn-Cu alloy. 相似文献
17.
Three kinds of Sn-Ag-based lead-free solders, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge, and Sn-3.5Ag-0.07Ni (in wt.%),
were selected to explore the effect of microelements (Ni and Ge) on the interfacial reaction between the solder and the Cu
substrate. The thickness of the interfacial intermetallics formed with the Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge and Sn-3.5Ag-0.07Ni
solders is several times that of the Sn-3.5Ag-0.7Cu solder. The added microelements converted the feature of interfacial intermetallics
from pebble shape to worm shape. However, the results of x-ray diffraction (XRD) analysis suggest that the interfacial intermetallics
formed with both solders have the same crystal structure. The results of energy dispersive spectroscopy (EDS) analysis show
that the major interfacial intermetallic formed with the Sn-3.5Ag-0.7Cu solder is Cu6Sn5, while it is (Cux,Ni1−x)6Sn5 with Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge. Ni influences the interfacial intermetallics and plays the influential role on the difference
of interfacial reaction rate between liquid solder and solid Cu and the morphology of interfacial intermetallics. Additionally,
the growth kinetics of the interfacial intermetallic compounds (IMCs) formed in the systems of Cu/Sn-3.5Ag-0.7Cu and Cu/Sn-3.5Ag-0.07Ni
at high-temperature storage was also explored. 相似文献
18.
This study aims to investigate the shear and tensile impact strength of solder ball attachments. Tests were conducted on Ni-doped and non-Ni-doped Sn-0.7wt.% Cu, Sn-37wt.% Pb and Sn-3.0wt.% Ag-0.7wt.% Cu solder ball grid arrays (BGAs) placed on Cu substrates, which were as-reflowed and aged, over a wide range of displacement rates from 10 to 4000 mm/s in shear and from 1 to 400 mm/s in tensile tests. Ni additions to the Sn-0.7wt.% Cu solders has slowed the growth of the interface intermetallic compounds (IMCs) and made the IMC layer morphology smooth. As-reflowed Ni-doped Sn-0.7wt.% Cu BGA joints show superior properties at high speed shear and tensile impacts compared to the non-Ni-doped Sn-0.7wt.% Cu and Sn-3.0wt.% Ag-0.7wt.% Cu BGAs. Sn-3.0wt.% Ag-0.7wt.% Cu BGAs exhibit the least resistance in both shear and tensile tests among the four compositions of solders, which may result from the cracks in the IMC layers introduced during the reflow processes. 相似文献
19.
Chin-Su Chi Hen-So Chang Ker-Chang Hsieh C. L. Chung 《Journal of Electronic Materials》2002,31(11):1203-1207
Ball-grid array (BGA) samples were aged at 155°C up to 45 days. The formation and the growth of the intermetallic phases at
the solder joints were investigated. The alloy compositions of solder balls included Sn-3.5Ag-0.7Cu, Sn-1.0Ag-0.7Cu, and 63Sn-37Pb.
The solder-ball pads were a copper substrate with an Au/Ni surface finish. Microstructural analysis was carried out by electron
microprobe. The results show that a ternary phase, (Au,Ni)Sn4, formed with Ni3Sn4 in the 63Sn-37Pb solder alloy and that a quaternary intermetallic phase, (Au,Ni)2Cu3Sn5, formed in the Sn-Ag-Cu solder alloys. The formation mechanism of intermetallic phases was associated with the driving force
for Au and Cu atoms to migrate toward the interface during aging. 相似文献
20.
Dhafer Abdulameer Shnawah Mohd Faizul Mohd Sabri Irfan Anjum Badruddin Suhana Binti Mohd Said Tadashi Ariga Fa Xing Che 《Journal of Electronic Materials》2013,42(3):470-484
This study compares the high-Ag-content Sn-3Ag-0.5Cu with the low- Ag-content Sn-1Ag-0.5Cu solder alloy and the three quaternary solder alloys Sn-1Ag-0.5Cu-0.1Fe, Sn-1Ag-0.5Cu-0.3Fe, and Sn-1Ag-0.5Cu-0.5Fe to understand the beneficial effects of Fe on the microstructural stability, mechanical properties, and thermal behavior of the low-Ag-content Sn-1Ag-0.5Cu solder alloy. The results indicate that the Sn-3Ag-0.5Cu solder alloy possesses small primary β-Sn dendrites and wide interdendritic regions consisting of a large number of fine Ag3Sn intermetallic compound (IMC) particles. However, the Sn-1Ag-0.5Cu solder alloy possesses large primary β-Sn dendrites and narrow interdendritic regions of sparsely distributed Ag3Sn IMC particles. The Fe-bearing SAC105 solder alloys possess large primary β-Sn dendrites and narrow interdendritic regions of sparsely distributed Ag3Sn IMC particles containing a small amount of Fe. Moreover, the addition of Fe leads to the formation of large circular FeSn2 IMC particles located in the interdendritic regions. On the one hand, tensile tests indicate that the elastic modulus, yield strength, and ultimate tensile strength (UTS) increase with increasing Ag content. On the other hand, increasing the Ag content reduces the total elongation. The addition of Fe decreases the elastic modulus, yield strength, and UTS, while the total elongation is still maintained at the Sn-1Ag-0.5Cu level. The effect of aging on the mechanical behavior was studied. After 720 h and 24 h of aging at 100°C and 180°C, respectively, the Sn-1Ag-0.5Cu solder alloy experienced a large degradation in its mechanical properties after both of the aging conditions, whereas the mechanical properties of the Sn-3Ag-0.5Cu solder alloy degraded more dramatically after 24 h of aging at 180°C. However, the Fe-bearing SAC105 solder alloys exhibited only slight changes in their mechanical properties after both aging procedures. The inclusion of Fe in the Ag3Sn IMC particles suppresses their IMC coarsening, which stabilizes the mechanical properties of the Fe-bearing SAC105 solder alloys after aging. The results from differential scanning calorimetry (DSC) tests indicate that the addition of Fe has a negligible effect on the melting behavior. However, the addition of Fe significantly reduces the solidification onset temperature and consequently increases the degree of undercooling. In addition, fracture surface analysis indicates that the addition of Fe to the Sn-1Ag-0.5Cu alloy does not affect the mode of fracture, and all tested alloys exhibited large ductile dimples on the fracture surface. 相似文献