界面形貌对清障涂层界面残余应力影响的数值模拟

利用有限元方法,对热障涂层热循环降温过程中产生的残余应力进行了数值模拟,研究了有尖点和无尖点正弦波形微坑以及短形微坑对界面残余应力的影响,结果表明,微坑形状不同,界面上残余应力的大小,性质与分布也不同;微坑的形状变化和尖点的出现,将会使该处的应力发生突变,不利于增强界面结合强度,因此,从对热障涂层界面残余应力的影响角度看,无尖点的正弦波形微坑既优于有尖点微坑也优于矩形微坑。     

热障涂层界面微结构尺寸与残余应力关系的数值模拟

利用有限元方法,对热障涂层热循环降温过程中产生的残余应力进行了数值模拟。以无尖点正弦波形界面形貌为对象,研究了其微结构尺寸（包括微坑间距,宽度和深度）对平行和垂直于界面的残余应力最大值SMX和SMY的影响规律。结果表明,在本文所给定的尺度范围内,微结构尺寸为SMX和SMY均有影响,但对SMY的影响要更为显著;在微坑深度,宽度和间距等3个微结构尺寸参数中,微坑深度对界面残余应力的影响最大。     

界面形貌对热障涂层残余应力影响的数值模拟

利用ABAQUS有限元分析软件对热障涂层中的残余应力进行了模拟分析,研究了不同界面微结构及其尺寸(包括圆弧半径、高度)对平行和垂直于界面的残余应力最大值的影响。结果表明,界面形貌结构尺寸与热障涂层中的陶瓷层及粘结层界面残余应力有密切的关系,凹凸不平的界面将会使界面残余应力发生突变,界面形貌的曲率对残余应力的影响较大。这些结论为提高涂层界面结合强度提供了理论支持,也为热障涂层界面的优化提供了指导。     

热障涂层界面形貌尺寸与残余应力的关系

利用ANSYS有限元分析软件对热障涂层中的残余应力进行了模拟分析，得出了界面形貌尺寸与残余应力之间的关系。模拟结果表明，热障涂层中的残余应力是界面形貌尺寸的函数。这些结论为提高涂层界面结合强度的热障涂层界面造形提供了理论支持，也为热障涂层界面的优化提供了指导意见。     

界面粗糙度对氧化层残余应力分布的影响

根据热障涂层中陶瓷层和粘结层界面间的氧化层界面形貌和界面粗糙情况,建立了具有氧化层的热障涂层平面应变模型,模拟计算了氧化层界面残余应力分布,分析了粗糙度对氧化层残余应力分布的影响.计算结果表明,随粗糙度的增加,氧化层中的X和Y方向应力值均不断增加,沿着波形下降的趋势应力逐渐增大,波谷处应力最大,且X方向的应力值远大于y的方向应力值.     

TGO界面特征对热障涂层残余应力的影响

采用非线性有限元方法模拟计算了热障涂层中陶瓷层(TCC)及粘结层(BC)与热生长氧化物(TGO)层界面的残余应力的分布,计算过程中,考虑到了材料物性的非线性特征及界面形貌特征的影响.结果表明,形貌单元尺寸及分布密度对TGO界面应力有明显的影响,TCC/TGO界面的应力大于BC/TGO界面的应力.在锥形坑形貌中心尖点处存在应力集中现象,且呈现最大应力值,是涂层失效的危险点,并且残余应力值随着界面形貌分布密度的增加而减小.     

CMAS对热障涂层界面裂纹和残余应力的影响

随着航空发动机涡轮叶片工作温度的提升,使得一种主要由CaO,MgO,Al₂O₃和SiO₂组成的玻璃态物质(CMAS)对热障涂层的危害越来越严重,从而对热障涂层的性能和耐久性有了更高的要求。本文以电子束物理气相沉积热障涂层为研究对象,利用有限元方法研究了CMAS的渗入对界面裂纹扩展及CMAS对陶瓷层(TC)内部残余应力的影响规律。采用波长固定、振幅变化的正弦曲线表示不同粗糙度的涂层界面,同时考虑了CMAS的弹性模量变化的影响及不同界面形貌与CMAS之间的相互作用。结果表明：CMAS弹性模量的增加对界面裂纹具有抑制作用,并且TGO幅值和厚度越小,抑制作用越明显。CMAS弹性模量对TC层最大残余应力S₂₂的影响存在临界点,在临界点之前,CMAS弹性模量的变化对TC层最大残余应力的影响较大,随着CMAS弹性模量的增加,TC层最大残余应力大幅度减小;在临界点之后,TC层最大残余应力基本不受CMAS弹性模量变化的影响。这些结果对电子束物理气相沉积喷涂的热障涂层失效机理的研究具有重要意义,可以为热障涂层界面的优化提供指导。     

热生长下热障涂层残余应力及失效分析

针对典型热障涂层结构以界面开裂和涂层剥落为主要失效模式,考虑界面凹凸微观形貌特征,借助材料转换的方法实现氧化生长,利用粘弹塑性有限元法,研究了氧化层热生长和蠕变等因素对热障涂层残余应力的影响,并从应力应变循环演化的角度对热障涂层系统中微裂纹的萌生位置进行了预测。结果表明,随着氧化层厚度的增大,垂直于界面方向的残余应力迅速增大;材料蠕变对热障涂层系统应力释放作用显著;从残余应力和应变演化的角度进行评价,结构中的微裂纹会率先出现在粘接层凸峰以及陶瓷层/氧化层/黏结层界面的中间位置,仿真分析结果与试验结果一致。     

TGO形貌对热障涂层残余应力的影响

基于Hyper Mesh建立了热障涂层残余应力仿真有限元模型,通过MSC Nsatran计算获得了热障涂层残余应力的分布情况,获得了残余应力随热生长氧化物(TGO)形貌参数的变化规律。结果表明:TGO形貌为正弦波形时,随波长及厚度增加,热障涂层内部最大残余拉应力增加;最大残余拉应力出现在TGO与粘接层交界面的波峰处。TGO形貌为锯齿波形时,当波长达到一定值后,波长的变化对最大拉应力大小影响不大;随着TGO厚度的增加,热障涂层内部最大拉应力增加;最大残余拉应力出现在TGO与粘接层交界面的波峰处。TGO形貌为椭圆波形时,当波长达到一定值后,波长的变化对最大拉应力大小影响不大;随着TGO厚度增加,热障涂层内部最大拉应力增加;最大残余拉应力出现在TGO与粘接层交界面曲率最小处。     

陶瓷层孔隙对热障涂层TGO界面残余应力影响的有限元研究

作为一种热障涂层不可避免的结构缺陷,孔隙的存在具有随机性,其分布位置会给TGO(热生长氧化层)界面残余应力带来巨大影响。为了更好地了解孔隙率对热障涂层TGO界面残余应力的影响,考虑单个孔隙对TGO界面残余应力的影响,通过改变孔隙与TGO界面的距离、孔隙位置及孔隙的尺寸,来分析TGO界面残余应力的变化情况。结果表明:当半径为5μm的圆形孔隙与TGO/TC界面距离为35μm时,孔隙几乎对TGO界面残余应力没有影响,孔隙离界面越近,对残余应力的大小及分布影响越大;距离一定时,孔隙尺寸越小对界面残余应力的影响越小。     

界面粗糙度对热障涂层残余应力和裂纹演化的影响

由于残余应力的作用是造成热障涂层失效剥落的主要因素之一,本工作采用不同幅值的正弦曲线来模拟粗糙度对陶瓷层(TBC)-结合层(BC)界面处残余应力分布的影响;以内聚力模型模拟TBC-BC界面,研究了在外加机械载荷作用下粗糙度对界面裂纹萌生和扩展的影响。结果表明,粗糙度对残余应力分布以及裂纹的形核与扩展有很大的影响。随着粗糙度的增大,陶瓷层和结合层靠近界面的波峰波谷处最大拉/压应力也增大。当施加一定拉伸位移载荷时,最大损伤与裂纹首先在幅值最小的波峰波谷处产生。     

等离子喷涂金属/陶瓷梯度热障涂层研究进展

热障涂层在众多领域具有重要的应用价值,但基体与涂层的物理性能不匹配是遏制其服役性能和寿命提高的主要原因。金属/陶瓷梯度热障涂层通过逐渐改变涂层内部的成分、结构,可有效地改善基体和涂层因物理性能突变而导致的界面失效问题。首先介绍了金属/陶瓷梯度热障涂层对比于双层热障涂层的独特微观结构,并简要分析了其具有明显性能优势的原因。随后总结了金属/陶瓷梯度热障涂层残余应力的具体分布、影响因素和模拟模型优化现状,重点从优化涂层制备工艺、改进喷涂技术、改善涂层设计三个方面,介绍了改善涂层性能的研究进展。其中优化球磨和喷涂工艺参数、模拟研究喷涂过程、改进喷涂技术的方式是通过提高涂层质量来提升其物理性能,而改变涂层成分分布形式、涂层层数和厚度主要是通过改善涂层残余应力分布和水平来提升其抗热失效能力。最后提出了进一步优化模拟模型、改进喷涂技术、创新涂层设计和完善机理研究,是未来等离子喷涂金属/陶瓷梯度热障涂层的重点研究方向。     

Finite element analysis of stresses and interface crack in TBC systems

Thermal barrier coatings have been used on high temperature components. Due to high stresses leading to unpredictable failure, a transient thermal-structural finite element solution was employed to analyze the stress distribution and J-integral at the interface between the bond coating and thermally growing oxide(TGO) in the EB-PVD thermal barrier coatings subjected to thermal loadings. The effects of some environmental and material parameters were studied, such as thermal convection coefficient, ceramic elastic modulus and TGO thickness. The results show that the stresses and J-integral values are impacted by these parameters.     

Numerical modeling of short crack behavior in a thermal barrier coating upon thermal shock loading

The behavior of microstructurally short inherent cracks within a preoxidized thermal barrier coating system upon thermal shock loading is considered. A thin alumina oxide layer holding residual stresses was induced at the ceramic/metal interface to simulate thermally grown oxide on the bond coat. Undulation of the oxidized bond coat was modeled as a sinusoidal surface. The variations of the stress-intensity factors of inherent centrally located cracks and of edge cracks were calculated during the thermal cycling. The instant crack shapes during the first thermal cycle and at steady state were investigated. It was found that oxide layer thickness, crack tip location, as well as interfacial undulation are factors influencing the risk of crack propagation. It was also found that an edge crack constitutes a greater threat to the coating durability than a central crack. The propagation of an edge crack, if it occurs, will take place during the first load cycle, whereas for a central crack, crack tip position decides the risk of crack propagation.     

The interfacial indentation test to determine adhesion and residual stresses in NiCr VPS coatings

The interfacial indentation test allows determining the interface toughness of a coating obtained by thermal spraying. During this test, a Vickers indentation is carried out on a cross-section of the sample. A crack is initiated and propagated along the interface. An analytical model allows defining an interface toughness representing the coating adhesion. The objective of this study is to compare this test with other tests (tensile adhesive test, shear test) and to specify its applicability. The residual stresses are also estimated by two different methods. Their influence on adherence is discussed in a third part. Those experiments were conducted on NiCr 80-20 VPS coatings with different thicknesses and roughnesses. In particular, it is shown that the interfacial indentation test is the most universal one and that compressive residual stresses improve coating adhesion.     

Fracture mechanics analysis of microcracks in thermally cycled thermal barrier coatings

The effects from thermal shock loading on pre-existing microcracks within thermal barrier coatings (TBCs) have been investigated through a finite element based fracture mechanical analysis. The TBC system consists of a metallic bond coat and a ceramic top coat. The rough interface between the top and bond coats holds an alumina oxide layer. Stress concentrations at the interface due to the interface roughness, as well as the effect of residual stresses, were accounted for. At the eventual closure between the crack surfaces, Coulomb friction was assumed. To judge the risk of fracture from edge cracks and centrally placed cracks, the stress intensity factors were continuously monitored during the simulation of thermal shock loading of the TBC. It was found that fracture from edge cracks is more likely than from centrally placed cracks. It was also concluded that the propagation of an edge crack is already initiated during the first load cycle, whereas the crack tip position of a central crack determines whether propagation will occur.