9.00-20 16PR轮胎的硫化测温

使用ZLW-16型智能硫化测温仪对9．00—2016PR轮胎进行硫化测温。测温结果表明，与模型和水胎接近的部位升温速率和温度高于中心部位，且由中心到表面形成明显的温度梯度；所测轮胎各部位胶料均存在较大程度的过硫化现象。将胎冠等部位正硫化时间缩短10min，并将三角胶150℃的正硫化时间调整为7min后，9．00-2016PR等载重轮胎的耐久性能提高15-25h，速度性能提高1～2个级别。     

L4．00R20越野子午线轮胎的硫化测温

介绍14．00R20越野子午线轮胎的硫化测温过程,绘制测温曲线,利用胶料的活化能和测温数据计算各部位胶料的硫化程度。结果表明：轮胎硫化条件和各部位硫化程度较理想,胎侧中部的硫化程度最大,达到400％以上;胎冠肩部的硫化程度最小,不到100％。     

测温技术在子午线轮胎硫化中的应用

对载重于午线轮胎285／75R24．5和轻载子午线轮胎185／80R14C进行了硫化测温试验。测温结果表明，载重子午线轮胎带束层区域易欠硫，胎面区域易过硫；轻载子午线轮胎胎圈区域易欠硫，胎体和胎面区域易过硫。硫化后冷却时的后硫化效应对总硫化程度影响很大，尤以轻载子午线轮胎为甚。可以通过合理调整硫化时间和温度改善轮胎整体硫化程度。     

9.00-2016PR外胎硫化测温

以9．00－2016PR轮胎为试验对象,通过测温检验外胎各部位硫化程度,发现胎面胶硫化程度最探,胎圈部位硫化程度最浅,其中钢丝圈包布与突布局之间硫化不足,需进行后硫化才可达到要求,用硫化罐高压硫化外胎时,由于罐体下,中,下部位的外压温差,使同罐外胎硫化东同,导致外胎质量不均一。     

10.00-20 16PR轮胎的硫化测温

通过智能硫化测温仪对10.00-20 16PR轮胎进行硫化测温。测温结果表明,硫化程度最浅的部位在胎圈区域,正硫化结束时其硫化程度已超过胶料的起泡点。依据测温结果将正硫化时间从70 min缩短为60 min,冷却时间从30 min缩短为25 min,轮胎的耐久性能提高,肩部生热明显下降。     

硫化罐变温变压硫化工艺

使用ZLW-16型智能硫化测温仪对9.00-20 16PR,11.00-20 18PR和12.00-20 18PR三种规格轮胎的硫化罐变温变压硫化工艺过程和正常硫化工艺过程进行测温,并对相应硫化工艺轮胎进行了耐久性和道路试验.结果表明,变温变压硫化工艺与正常硫化工艺硫化的轮胎相比,最低硫化程度部位的硫化程度无明显差别,均满足硫化要求,胎侧和胎冠部位胎体内外层等温度较高部位的硫化程度降低,轮胎耐久性能大幅度提高,肩部生热明显下降,耐磨性能明显改善.     

轮胎硫化过程的数值模拟

介绍了利用有限元法对轮胎硫化过程进行数值模拟的基本原理和方法,并采用MARC有限元分析软件分析了半钢子午线轮胎175/70R13在硫化过程中各部位的受热历程,计算结果与轮胎硫化实时测温结果相当吻合,同时给出院 轮胎硫化过程中不同时刻的温度场分布云图,可以看出轮胎各部位的硫化历程差别较大,胎冠和胎肩的升温度速度小于胎侧和胎圈,胎肩、胎冠及胎趾的降温速度缓慢。     

预热温度对轮胎硫化温度及程度场的影响

通过建立三维有限元实体模型来模拟轮胎的硫化工艺过程，分别研究了不同初温对轮胎硫化温度场及硫化程度的影响。研究表明．生胎的预热温度在不超过105℃时。其预热过程的硫化效应很小，且各点的硫化温度较均匀，因此预热处理使轮胎总的硫化程度趋于均匀。结果还表明，在105℃以下，预热温度每提高10℃，轮胎的机内硫化时间可缩短1．5min．若减少胶囊内通过热水的时间．其硫化均匀性可大大提高。     

半钢子午线轮胎的硫化测温

对245／75R16LT轮胎进行硫化测温，并依据得到的各部位胶料的等效硫化时间和实际硫化程度调整硫化工艺，调整后轮胎各部位胶料硫化程度均一性得到改善，成品轮胎的高速和耐久性能提高，同时，可节约能源，降低生产成本。     

半钢子午线轮胎全氮气硫化工艺研究

对蒸汽/氮气硫化工艺与全氮气硫化工艺进行对比,并对205/55R16 91V半钢子午线轮胎采用两种硫化工艺进行硫化测温和分析。结果表明,相对蒸汽/氮气硫化工艺,采用全氮气硫化工艺轮胎的上下模温差较低,硫化时间缩短,各部位硫化程度符合要求,成品轮胎性能提高,单胎硫化能耗成本降低40%。     

改性双马来酰亚胺树脂的固化工艺研究

本文用ＤＳＣ法研究改性双马来酰亚胺树脂的固化动力学参数和固化工艺,固化度和红外光谱确定了后处理工艺。研究所得的固化工艺条件中１４０℃／ｈ、１９０℃／２ｈ,２４０℃／４ｈ能达到完全固化。     

Dielectric spectroscopy of anaerobic adhesive cure

Dielectric spectroscopy (DS) is shown to be a most useful tool for the study of the surface initiated redox cure in model anaerobic acrylic adhesives. These models are deliberately designed to exhibit different levels of cure heterogeneity. The cure is initiated by the surfaces of two substrates on either side of a bondline. The heterogeneous cure situation is referred to as low cure through volume (CTV). Poor CTV is an undesirable feature that leads to mechanical weakness in an adhesive bond. Thus, experimental techniques based on DS are developed to investigate the cure characteristics and in particular the CTV phenomenon in the model anaerobic adhesives.     

辐射固化胶粘剂的应用与研究

近年来,辐射固化胶粘剂由于其快速固化及优异的性能发展很快,广泛应用于各行各业。文章介绍了它的特性及应用领域,并对它近年的研究进展简要地做了介绍。     

硫化体系的变更对白炭黑填充橡胶性能的影响

文章通过对白炭黑填充橡胶的硫化体系的变更,探讨了加入MBTS（苯并噻唑）对橡胶物性及轮胎性能的影响。结果表明,在白炭黑填充的橡胶中加入MBTS,大大提高硫化速率,缩短硫化时间,橡胶物理特性差异很小,轮胎评价达到试验要求。     

LED光源对PCB油墨革命性的影响

PCB油墨是指印制电路板(Printed Circuit Board,简称为PCB)所采用的油墨,光引发剂是PCB油墨的重要组分之一,目前常用引发剂最敏感的吸收波长在365nm左右,与高压汞灯(PCB油墨常用的固化光源)发出的最强波长一致;LED光源发出的光波长是395nm,基于光引发剂的吸收光谱与光源的发射光谱相匹配的原则,随着UVLED曝光机的出现,要求对传统PCB油墨中光引发剂的最大吸收波长做出相应的改变,光引发剂的改变将会给PCB油墨带来革命性的影响。     

橡胶固化的流变学研究

本文的目的是得到一种快速、可重复的方法来反映并量化两种不同橡胶产品在固化温度下结构的形成,从控制应力屈服测试和蠕变测试结果我们发现流变学方法可以用来很好的表征橡胶的固化。     

天然橡胶抗返原硫化体系的研究

研究了普通(CV)、有效(EV)、半有效(SEV)和平衡(EC)四种硫化体系对NR抗硫化返原和硫化胶物理机械性能的影响。结果表明：有效和平衡硫化体系的抗硫化返原性最好；在不同的硫化体系中加入抗返原剂Si69之后，都能有效地提高硫化天然胶的抗硫化返原性和物理机械性能。综合使用性能和抗硫化返原性，以半有效硫化体系较好。     

新型酚醛树脂固化反应动力学及固化机理研究

采用DSC热分析对S酚醛树脂的固化过程进行了动力学研究,得出了该树脂的固化工艺温度及固化动力学参数,其凝胶化温度、固化温度和后处理温度分别为360.7K、421.6K和463.4K;反应级数n=0.912、表观活化能E=76.14kJ·mol^-1,反应频率因子A=4.704×10^8min^-1。采用红外光谱分析初步探讨了该树脂的固化机理,结果表明其固化反应主要是苄羟基与苯环邻位上活泼氢产生交联缩合反应,少量为苄羟基之间的缩合反应。     

Preparation,characterization, and thermal properties of controllable metal–imidazole complex curing agents for epoxy resins

A series of complexes incorporating the epoxy–imidazole adduct of phenyl glycidyl ether with 2‐ethyl‐4‐methylimidazole (PGE‐EMI), has been prepared with the acetato and chloro transition metal salts of Mn, Co, Ni, Cu, Zn, and Ag. These complexes have been characterized using spectroscopic methods (IR, UV‐Vis, ¹H‐ and ¹³C‐NMR, where appropriate) and their thermal stabilities have been determined using elevated temperature NMR techniques. These high‐temperature NMR results indicated that the chloro complexes studied (of Mn²⁺, Co²⁺, Ni²⁺, Cu²⁺, and Zn²⁺) exist in equilibrium (i.e., they dissociate reversibly in a solution of dimethylsulphoxide, DMSO, at elevated temperatures), while the corresponding acetato complexes dissociate irreversibly. For the silver complexes, thermogravimetric analysis (TGA) was used to monitor the dissociation, showing that the weight loss recorded was consistent with the dissociation of the metal salt to liberate the PGE–imidazole ligand. The thermal stabilities of the metal complexes were influenced by changing both the transition metal (e.g., from Mn to Zn) and varying the anion (e.g., from acetate to chloride). From ¹H‐NMR analysis, a decrease of ca. 10°C was observed in the thermal dissociation of the acetato complexes when compared with the chloro complexes, showing that the series of PGE‐EMI complexes with acetate anions is less thermally stable than the corresponding chlorides. This finding suggests that these PGE‐EMI complexes may be modified to accommodate their use in a variety of different curing schedules when used to cure epoxy resins. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 201–217, 2000     

Dielectric cure determination of a thermosetting epoxy composite prepreg

Evaluation of degree of cure (DoC) of a glass reinforced epoxy composite prepreg used for manufacturing of printed circuit board (PCB) is an intensive issue because of its practical importance and cost reduction in industry. Typical techniques such as differential scanning calorimetry (DSC) and fourier transform infrared spectroscopy (FTIR) are destructive and require curing a material during a chosen time, quenching the sample to stop cure before performing analysis. Thus, it is necessary to remove the temperature influence on the determination of DoC. In this study, the feasibility of nondestructive dielectric sensing method as an in situ DoC measuring technique through cure monitoring of prepreg is presented, where a vacuum packing configuration has been established so as for the prepreg to evaluate accurately the DoC in a quenched state at an ambient temperature. The optimal curing condition to get the fully cured state of a prepreg material is determined by the dielectric cure monitoring based on the behavior of ion viscosity. The temperature effect compensated DoC of prepreg is correlated and compared with that evaluated by DSC and FTIR. The correlated DoC with ion viscosity has identified the curing behavior of prepreg by determining cure kinetic parameters. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44707.