包装盒型的三维仿真研究

提出了一种基于盒型拓扑图的对二维包装平面图进行三维仿真的方法,对经过预处理的二维数据进行拓扑分析,采用盒型拓扑图描述分析结果,能够识别和处理带有开窗的复杂盒型,最后采用折叠传播算法构造三维模型．     

基于网络的虚拟设计

论述了基于网络的虚拟设计以及其在CAD包装盒上的应用,介绍了基于Java2D／3D开发网络化CAD系统的关键技术。提出了一种利用包装纸盒二维平面图自动生成三维立体盒型的方法。该系统还能实现纸盒动画、贴图等效果,提高了纸盒设计的效率和质量。     

基于三维盒维数算法的城市分维计算

通过将传统的二维盒维数算法扩展到三维空间,提出了一个基于三维空间的盒维数计算方法。分别利用三维盒维数算法和二维盒维数算法计算城市的分维,通过对计算结果进行比较分析,观察到城市空间结构在第三维同样具有分形特征,证明传统城市分维计算中采用基于二维空间的分维算法或者简单地利用二维分维加1的方法表示三维分维都是不准确的,并进而给出正确的城市分维计算方法。     

关于泛型程序的覆盖度量方法的探讨

白盒测试是检验程序正确性的重要方法。代码的覆盖度量是保证白盒测试的充分性的主要准则。现今，泛型编程技术已经在程序设计中占据了重要地位，而泛型程序设计的特点，则给传统白盒测试中的代码覆盖度量法则带来了新的挑战。针对泛型技术的特点，该提出了一种增强的覆盖度量方法，该方法可用于泛型程序的白盒测试。     

UMLTGF:一个基于灰盒方法从UML活动图生成测试用例的工具

UML已经成为建模语言的事实标准，如何从UML分析设计模型生成测试用例也为面向对象软件测试带来了新的挑战．为了从UML设计模型中的活动图直接生成测试用例，给出了UML活动图的形式化定义和灰盒测试方法．该方法首先分析UML活动图上的所有执行路径（每条路径称为一个测试场景），然后根据测试场景中的节点和转换所代表的活动及其输入／输出变量、相关约束条件等生成测试用例．并根据该方法实现了一个自动生成测试用例的工具UMLTGF，它可以从Rational Rose的规约文件中提取活动图信息并生成相应的测试用例．该工具能够提高软件测试的效率，降低测试成本．     

高级加密标准Rijndael算法中的S盒及其实现

本文详细描述了Rijndael加密算法中非线性变换S盒的实现过程．首先介绍生成S盒所需的数学基础，然后给出实现S盒的算法以及相应的C语言代码．     

一种新的网格重叠差分盒分形模型

分形维数一个最重要的特性是其维数大小与人眼感觉图像表面的粗糙程度有很大的相关性,分形在图像的纹理分析、图像的分割与分类等方面有着很多成功的运用。在基于分形理论提出的分形维数的佑计方法中,差分盒法是一种经常被使用的分形维数佑计技术。研究发现差分盒法对细致纹理的最小二乘法线性拟合度比较好,但是对较为粗糙的纹理其最小二乘法的线性拟合度不够理想,估计出的分形维数往往失真。为了解决这个问题,提出了一种网格重叠差分盒模型,用以计算差分盒的盒子数的网格在一定程度上重叠,计算整个图像统计自相似意义上的盒子数,其最小二乘法的线性拟合度比较好。为了进一步提高差分盒的盒子计数精度,提出了非整数盒子计数法,修正了缩放尺度,试验证明其能更真实地反映纹理的分形维数。     

对FPGA技术下的高科技应用探讨

本文介绍应用于FPGA的独特并行流水特点,用阶段化设计思想而成的差分盒维分形算法技术群,用以红外图像分形维数;并设计实现MIL-STD-1553B总线远程端点的数据链路层协议;及设计了基于FPGA的图像中值滤波器.     

基于分形特征变化的语音端点检测技术研究

端点检测是语音识别的基本问题,最低要求是区分噪音和话音,如果实现对音节甚至音素的切分,那么对于语言识别, 关键词识别，以及连续语音识别都将是有益的．本文提出一种基于盒维与信息维的端点检测算法，首先根据信息维自适应调整门限划分噪音段和话音段，在此基础上，依据盒维与信息维的变化，及汉语音节特点，给出了一种汉语音节划分算法．采用实际电话信道话音数据进行测试．结果表明，本文提出的方法是有效的，话音段检测准确率较高，达到95％，音节切分准确率达85％，尚需进一步研究．     

基于混沌映射的动态S盒构造方法

在本文中，我们提出了一种利用混沌映射构造动态S盒的方法，算法通过遍历混沌映射，得到一个整数序列的置换，同时，由于混沌映射具有对寝值和控制参数敏感的特征，细微地调整初始值和控制参数，将产生整数序列的不同置换，从而达到动态生成S盒的目的。我们对使用该方法生成的S盒的性能进行了分析，结果表明，利用该方法生成的S盒较好地符合S盒的设计准则。     

二维包装结构图的三维面模型构造

提出了一种从包装盒三维平面图到三维盒形结构的构造方法,首先给出包装结构的二维平面图约束模型,然后给出包装结构控制图,包结构生成树是及连带子权地揎义,根据二维设计生成的平面线框图,自动抽取盒型表面,构造包装结构控制民包结构树,然后,提出以包装结构生成树为基础的建立包装盒三维面模型结构的算法,最后,讨论模型构造中的预处理问题,贴图是坐标映射问题及关系的实现     

特殊斜线型包装盒的三维成型研究

目前采用基于盒型拓扑图的方法可以实现包装平面图的三维成型,但无法解决折叠角度非默认90°情况下的正确三维成型问题。通过对平面盒型拓扑结构的立体建模,建立了折叠角度与包装盒尺寸大小之间的关系,实现了折叠角度的参数化,从而解决了特殊盒型结构进行三维成型时折叠角度的准确性问题。     

二维圆环结构中弹性波传播的谱单元分析

为研究弹性波在结构中的波场特征,推导建立一种任意四边形二维谱单元,将其应用于二维圆环结构中的波传播行为模拟.以矩形平板结构中弹性导波传播分析为例,通过与传统有限元分析结果对比,验证所建立谱单元的有效性.有裂纹和无裂纹二维圆环结构谱单元模拟结果表明:弹性波在圆环结构中传播会发生频散;圆环结构表面的裂纹对瑞利波的传播影响最大;根据其反射波包位置可以确定损伤位置.     

Physical design for 3D system on package

The SoC paradigm is a system integration approach that integrates large numbers of transistors as well as various mixed-signal active and passive components onto a single chip. This realization-led to the 3D system-in-package (SiP) approach, alternatively called 3D ICs or 3D stacked die/package. Designers can take SiP a step further by embedding both active and passive components, but passive-component embedding is bulky and requires thick-film discrete components. Thick-film component embedding distinguishes SiP from system on package (SoP), an emerging 3D system integration concept that involves embedding both active and passive components. SoP, however, incorporates ultrathin films at microscale to embed the passive components, and the package rather than the board is the system. SoP overcomes both the computing and integration limitations of SoC, SiP, multichip modules (MCMs), and traditional system packaging by having global wiring as well as RF, digital, and optical component integration in the package instead of on the chip. Moreover, 3D SoP addresses the wire delay problem by enabling the replacement of long, slow global interconnects with short, fast vertical routes.     

Package Fingerprints: A visual summary of package interface usage

ContextObject-oriented languages such as Java, Smalltalk, and C++ structure their programs using packages. Maintainers of large systems need to understand how packages relate to each other, but this task is complex because packages often have multiple clients and play different roles (class container, code ownership, etc.). Several approaches have been proposed, among which the use of cohesion and coupling metrics. Such metrics help identify candidate packages for restructuring; however, they do not help maintainers actually understand the structure and interrelationships between packages.ObjectivesIn this paper, we use pre-attentive processing as the basis for package visualization and see to what extent it could be used in package understanding.MethodWe present the Package Fingerprint, a 2D visualization of the references made to and from a package. The proposed visualization offers a semantically rich, but compact and zoomable views centered on packages. We focus on two views (incoming and outgoing references) that help users understand how the package under analysis is used by the system and how it uses the system.ResultsWe applied these views on four large systems: Squeak, JBoss, Azureus, and ArgoUML. We obtained several interesting results, among which, the identification of a set of recurring visual patterns that help maintainers: (a) more easily identify the role of and the way a package is used within the system (e.g., the package under analysis provides a set of layered services), and (b) detect either problematic situations (e.g., a single package that groups together a large number of basic services) or opportunities for better package restructuring (e.g., removing cyclic dependencies among packages). The visualization generally scaled well and the detection of different patterns was always possible.ConclusionThe proposed visualizations and patterns proved to be useful in understanding and maintaining the different systems we addressed. To generalize to other contexts and systems, a real user study is required.     

The Package Blueprint: Visually analyzing and quantifying packages dependencies

Large object-oriented applications are structured over many packages. Packages are important but complex structural entities that are difficult to understand since they act as containers of classes, which can have many dependencies with other classes spread over multiple packages. However to be able to take decisions (e.g. refactoring and/or assessment decisions), maintainers face the challenges of managing (sorting, grouping) the massive amount of dependencies between classes spread over multiple packages. To help maintainers, there is a need for at the same time understanding, and quantifying, dependencies between classes as well as understanding how packages as containers of such classes depend on each other.In this paper, we present a visualization, named Package Blueprint, that reveals in detail package internal structure, as well as the dependencies between an observed package and its neighbors, at both package and class levels. Package blueprint aims at assisting maintainers in understanding package structure and dependencies, in particular when they focus on few packages and want to take refactoring decisions and/or to assess the structure of those packages. A package blueprint is a space filling matrix-based visualization, using two placement strategies that are enclosure and adjacency. Package blueprint is structured around the notion of surfaces that group classes and their dependencies by their packages (i.e., enclosure placement); whilst surfaces are placed next to their parent node which is the package under-analysis (i.e., adjacency placement). We present two views: one stressing how an observed package depends upon the rest of the system and another stressing how the system depends upon that package.To evaluate the contribution of package blueprint for understanding packages we performed an exploratory user study comparing package blueprint with an advanced IDE. The results show that users of package blueprint are faster in analyzing and assessing package structure. The results are proved statically significant and they show that package blueprint considerably improves the experience of standard browser users.     

Structure topology optimization: fully coupled level set method via FEMLAB

This paper presents a procedure which can easily implement the 2D compliance minimization structure topology optimization by the level set method using the FEMLAB package. Instead of a finite difference solver for the level set equation, as is usually the case, a finite element solver for the reaction–diffusion equation is used to evolve the material boundaries. All of the optimization procedures are implemented in a user-friendly manner. A FEMLAB code can be downloaded from the homepage www.imtek.de/simulation and is free for educational purposes.     

聚合釜先进控制与管理软件的开发及应用

介绍了化工间歇聚合反应釜先进控制与管理软件包的系统结构、功能设计与开发。软件包由"化工间歇聚合反应过程的辨识与控制"和"化工间歇聚合反应釜生产管理系统"两个子系统组成。前者用来对生产过程进行监测并实现聚合反应过程从升温、反应、恒温、回收全过程自动控制;后者用来完成聚合釜的生产管理和优化指导任务。它已在某生产装置上得到应用,取得了显著的经济效益和社会效益。