镀铜膜工艺在高功率输入耦合器中的应用

高功率输入耦合器是为自由电子激光装置的超导腔传输微波功率的部件。为了提高传输性能,需要在耦合器上镀铜膜。本研究基于2种不同镀铜膜工艺实验,通过EDS线扫描、粗糙度、XRD和残余电阻率(RRR)对比分析在室温(25℃)以及200、400、600和910℃等4种不同温度退火后镀铜膜的性能变化,确定出适合特殊环境条件下高功率输入耦合器波纹管内壁镀铜膜工艺。将这一工艺应用于1.3 GHz高功率输入耦合器镀铜膜。结果表明,铜膜与耦合器内表面的结合力、高低温适应性和微波能量传输效率都能很好地满足实际应用的要求。     

双向脉冲参数对金铸层形貌和结构的影响

采用双脉冲电沉积技术,控制单一变量,在酸性的无氰氯金酸溶液中进行金的电沉积。使用扫描电子显微镜、X射线衍射仪研究了脉冲电流密度和占空比对金铸层表面和横截面形貌,及显微结构的影响。实验结果表明,正向峰值电流密度从2.25 A/dm~2增加到3.75 A/dm~2,铸层晶粒细化,但正向电流密度过大导致表面起伏较大,铸层平整度下降;而反向峰值电流密度从6 A/dm~2增加到12 A/dm~2时,晶粒尺寸逐渐变大,结构也变得疏松。正向占空比由20%提高到60%,会使阴极过电位增大,从而铸层晶粒细化,但是正向占空比过大会造成铸层内部出现孔隙,致密度下降;反向占空比从10%提高到40%,铸层针孔逐渐增多,变薄变脆。通过计算织构系数,可知在较高的阴极过电位下,金铸层的择优取向为沿(111)和(222)晶面;低的阴极过电位下,金铸层的择优取向则沿(200)晶面。     

水溶液中电沉积制备LaMg2Ni9储氢合金

利用水溶液电沉积法制备La Mg_2Ni_9储氢合金膜,通过测定合金膜的循环伏安曲线(CV)、交流阻抗(EIS)、Tafel极化曲线等研究其电化学性能,采用扫描电镜(SEM)、X射线衍射(XRD)、能谱(EDS)对合金膜表面形貌、结构及组成进行研究。结果表明:电沉积电流密度为40 A/dm~2时,La Mg_2Ni_9合金膜的表面粗糙并伴有裂纹,析氢电流密度为5.37A/dm~2,表观活化自由能△G~≠最低为47.26 k J/mol,证明合金膜良好的析氢性能;吸附值Q达到最大值为0.091μF·cm~(-2),表明合金膜具有较高的储氢性能。     

SiC纤维表面电镀铜的研究

分别研究了在SiC纤维表面直接硫酸盐镀铜,以及在SiC纤维表面溅射沉积约为1.5μm厚的Ti6Al4V合金后再进行硫酸盐镀铜的工艺,并测试了镀铜纤维的抗拉强度,利用扫描电镜(SEM)观察了镀层表面及断口形貌.研究结果表明:适当的前处理可使纤维表面均匀、连续地镀上铜;电流密度越小,镀铜纤维的抗拉强度越高,镀层中的孔隙越小,晶粒堆积得越紧密.实际应用时采用1～2 A·dm-2的电流密度较好.     

微模具电铸成型工艺研究

针对微细电铸成型技术中微流道模具的铸层均匀性、铸层气孔和表面粗糙度等工艺问题,提出了控制成型过程中阴极电流密度、增加辅助阴极和阴极平动的方法。通过正交实验对基底蚀刻深度、光刻掩膜厚度、电铸槽温度和阴极电流密度等因素进行工艺优化研究。结果表明,得到最佳工艺参数为阴极电流密度4 A/dm~2、二次辅助阴极电流密度1.5 A/dm~2,阴极平动速率0.01 m/s,温度50℃、掩膜厚度50μm、刻蚀深度20μm。获得了尺寸均匀性好、铸层气孔少,表面粗糙度为Ra 0.5μm的微模具。     

含石墨烯纳米片电解液中电流密度对2024铝合金微弧氧化膜性能的影响

目的研究电流密度对陶瓷膜层厚度、硬度及耐磨、耐腐蚀性能的影响。方法在含有氢氧化钠和硅酸钠的电解液中添加石墨烯纳米片(GNPs),采用脉冲直流模式实现不同电流密度条件下2024铝合金的微弧氧化(MAO)处理。采用扫描电镜(SEM)和能谱仪(EDS)对膜层形貌和成分进行了分析,借助电化学极化曲线测试了膜层的耐腐蚀性能,使用X射线衍射仪(XRD)表征了试样的相组成,利用多功能材料表面性能试验机测定了陶瓷膜表面力学性能。结果电流密度从1 A/dm~2增加到5 A/dm~2时,含GNPs的陶瓷膜层厚度由4.2μm增加到5.8μm,不含GNPs的膜层厚度由2.7μm增加到4.5μm。电流密度为1 A/dm~2时,含GNPs的膜层硬度达到163 HV,比同电流密度下不含GNPs的膜层硬度提高63%。电流密度为1 A/dm~2时,摩擦系数约为0.5;电流密度达到5 A/dm~2时,摩擦系数降低为0.3,膜层的耐磨性能提高。电流密度为3 A/dm~2时,自腐蚀电位开始逐渐升高,而自腐蚀电流呈下降趋势,生成的陶瓷膜的耐蚀性最好。电流密度对陶瓷膜成分的影响不明显。结论试样致密层的摩擦系数随电流密度的增大而显著降低,耐磨性能提高。提高电流密度可有效减少膜层上放电孔洞的数量和尺寸,改善膜层的耐蚀性,电流密度达到3 A/dm~2时,膜层的耐蚀性能最佳。引入GNPs可提高膜层的厚度、硬度、耐磨性能、耐腐蚀性能。     

钢基阳极氧化膜的制备与表征

目的在碳钢表面制备阳极氧化膜,探讨阳极氧化膜的成分组成。方法采用恒电流阳极氧化法在含0.1 mol/dm~3 NH_4F和0.5 mol/dm~3 H_2O的乙二醇电解液中,于45#钢表面制备阳极氧化膜。通过SEM、EDS、XPS、Raman、IR、动电位极化测试等技术手段表征所制备的阳极氧化膜。结果所获阳极氧化膜外观为黄色。电流密度为1 A/dm~2时,氧化膜局部区域出现彩虹色;电流密度为1.5 A/dm~2时,氧化膜颜色较均匀。随着氧化时间的增加,氧化膜颜色变深。阳极氧化膜表面具有特征图案。EDS分析发现,阳极氧化膜中存在Fe、O、C。XPS分析进一步表明,阳极氧化膜中还含有F元素。Fe2p XPS谱的各项数据均与α-Fe_2O_3的较为吻合。拉曼分析表明,电流密度为1.5 A/dm2的阳极氧化膜的拉曼光谱的峰的数量多于电流密度为1 A/dm~2的。所有氧化膜的拉曼光谱均在1400 cm~(-1)附近有峰出现,此峰对应于α-Fe_2O_3。700 cm~(-1)处的峰对应于FeOOH。红外光谱分析表明,所有阳极氧化膜的红外光谱波形一致,在700~400 cm~(-1)之间出现振动,540、514、482 cm~(-1)附近的吸收峰归属于Fe_2O_3的振动带,604、672 cm~(-1)的吸收峰归属于FeOOH。极化测试表明,经阳极氧化处理后,自腐蚀电位上升,自腐蚀电流密度降低。结论碳钢能够在乙二醇体系电解液中生成黄色阳极氧化膜。电流密度和氧化时间对膜的颜色有影响。膜表面具有特征图案。阳极氧化膜主要含Fe、O、F等元素。Fe元素以Fe(Ⅲ)的化学态形式存在于阳极氧化膜中。阳极氧化膜中氧化物主要为α-Fe_2O_3,FeOOH也存在其中。阳极氧化处理后的试样的耐蚀性较处理前有所提升。     

钕铁硼在CuCl-EMIC离子液体中 电沉积铜层的研究

目的 开发一种新型的环保型钕铁硼表面镀铜技术。方法 采用CuCl-EMIC离子液体,对钕铁硼基体进行阳极活化前处理,在其表面电沉积铜。通过电化学工作站测试CuCl-EMIC离子液体的循环伏安曲线和镀铜样品的动电位极化曲线,运用扫描电子显微镜、能谱分析仪和X射线粉末衍射仪,考察钕铁硼基体和铜镀层的微观形貌、成分组成和相结构,利用粗糙度仪和拉拔试验仪检测钕铁硼表面的粗糙度和其上铜镀层的结合力。结果 物质的量之比为2∶3~3∶2的CuCl-EMIC离子液体在室温下熔融,可在其中电沉积得到晶态铜。物质的量之比为1的CuCl-EMIC离子液体有更大的还原峰值电流密度。钕铁硼基体经过20~ 30 mA/cm2的电流密度阳极活化后,表面变得平整,孔洞减少,活化后钕铁硼表面的铜镀层均匀致密,结合力达9.2 MPa以上。钕铁硼表面铜镀层的孔隙率随着镀层厚度的增加而减小,当厚度为6 μm时,镀铜试样的腐蚀电位与纯铜相近,孔隙率为0.005 23%。结论 采用物质的量之比为1的CuCl-EMIC离子液体,可以通过阳极活化得到平整、孔洞少和无氧化膜的钕铁硼基体表面,在其上电沉积可得到致密均匀且结合力好的薄铜层。     

间歇式电镀法制备核壳结构钨铜包覆粉体的研究

钨铜复合材料因低膨胀系数、高导热性,可有效传输集成电路产生的热量,从而延长电路的使用寿命。铜包覆钨复合粉体有利于钨铜复合材料的综合性能的提高。采用间歇式电镀法成功制备出钨铜包覆粉体,研究了不同电镀时间对复合粉体表面形貌、镀层厚度、含铜量以及铜镀层沉积速率的影响以及铜镀层的形成机理。结果表明,制备出的复合粉体为铜包钨核壳结构,铜镀层均匀、致密,表面粗糙度小;在电流密度为1.7 A/dm~2的条件下,电镀30和75 min的平均镀层厚度分别为0.69和1.96μm,含铜量分别为9.97%和23.76%,沉积速率分别为36.91和41.34 mg·min~(-1),镀层厚度、沉积速率均随电镀时间的增加而增加;铜镀层的形核和长大遵循Volmer-Weber模式。     

电流密度对镍镀层结构和性能的影响

采用阴极移动电镀技术在电流密度为1～13A/dm2时制备镍镀层。利用扫描电镜(SEM)、X射线衍射仪(XRD)、X射线应力衍射仪以及硬度计等手段,研究电流密度对镍镀层的表面形貌、结晶取向、孔隙率、内应力和硬度的影响。结果表明:镍镀层的织构和性能随电流密度的变化而改变。当电流密度低于7A/dm2时,镀层表面球形颗粒较为粗大、孔隙率较高,在为4A/dm2时,镀层具有最低的拉应力约110 MPa;当电流密度为7A/dm2时,镀层表面球形颗粒均匀细小,具有最小的表面粗糙度Ra 0.69μm,最小的孔隙率0.08个/cm2以及最高的硬度330HV0.1;当电流密度大于7A/dm2时,镀层的表面粗糙度增加,择优取向由(200)晶面向(220)晶面发生转变,电流密度达到13A/dm2时,(220)晶面的织构系数达到了85.4%。     

Effect of the Current Density on Morphology,Porosity, and Tribological Properties of Electrodeposited Nickel on Copper

In the steel industry, nickel coating on copper has increased the lifespan of continuous ingot casting molds. The objective of this work is to estimate the porosity of nanocrystalline nickel electrodeposited onto copper. Characteristics of nickel coating such as hardness, wear resistance, porosity, morphology, and adhesion are very important for maximum performance of molds. The effective porosity in nickel coating was determined by using anodic voltammetry. The porosity of electrodeposited nickel onto copper increased from 0.16% up to 6.22% as the current density increased from 1.5 up to 8.0 A dm⁻². The morphology of the nickel electrodeposited at lower current densities was more compact. Tribological properties were studied using hardness measurements, and calotest. Results of calotest indicated a wear coefficient of 10⁻⁶ for all samples. An extremely low friction coefficient of 0.06-0.08 was obtained for the sample deposited with a current density of 1.5 A dm⁻², and a friction coefficient of 0.15-0.21 was measured for the nickel coating electrodeposited at a current density of 5 A dm⁻². Effects of the current density of the electrodeposition process on the morphology, porosity, and tribological properties were evaluated.     

Influence of Type of Bath Agitation (Magnetic Stirring and Rotating Disk Cathode) on Tribological Properties of Nickel Electrodeposits

In this study, nickel coatings were electrodeposited by magnet stirrer process and rotating disk cathode with a pulse power source. The surface morphology and cross-section observations were made using scanning electron microscopy and optical microscopy. The results showed that there was cauliflower morphology for all samples that were electrodeposited from a bath agitated with a magnet stirrer. On the other hand, only the nickel coating that was deposited on a rotating disk cathode at 4 A/dm² had the cauliflower morphology. By using the rotating disk cathode process the current efficiency was decreased. Also, with increasing the current density for all samples the surface roughness was decreased. The loss of mass diagram, worn surface micrograph and friction-distance profile indicated that the wear resistance of the nickel coatings that were produced by magnet stirrer process at 2 A/dm² and rotating disk cathode process at 4 A/dm² were lower than the other coatings.     

Characterization of nanocrystalline Co–W coatings on Cu substrate,electrodeposited from a citrate-ammonia bath

Cobalt–tungsten nanocrystalline coatings were electrodeposited on copper substrate using different current densities. The deposited coatings were single phase solid solution with an average grain size of about 18 nm, showing a nodular type of surface morphology. By increasing the deposition current density, the density of nodules was increased, with no obvious variation in grain size. Electrochemical impedance spectroscopy (EIS) confirmed the codeposition of tungsten through reduction of tungsten oxide film formed during the electrodeposition process. However, the role of ternary complexes in the bath cannot be ruled out, especially at lower cathodic potentials. The Co–W coating deposited at lower current densities showed higher tungsten content, microhardness, wear resistance and friction coefficient. However, this coating showed an inferior corrosion resistance. By increasing the deposition current density, a low tungsten coating with high corrosion resistant was obtained. This is attributed to the lower value of exchange current density of water reduction in the present of oxygen (i₀^H2O) achieved on the coating with lower tungsten content.     

Properties and structure of RE-Ni-W-P-SiC composite coating prepared by impulse electrodeposition

The properties and structure of electrodeposited RE （CeO2）-Ni-W-P-SiC composite coating were investigated. The results show that the hardness and electrodepositing speed of composite coatings obtained at an impulse current are higher than those at a direct current. The hardness and wear resistance of the coating are obviously increased by adding RE and SiC. The hardness of the coating increases with the increase of treatment temperature and current density, and reaches the optimum value at 400 ℃ and at 10 A/dm^2, respectively. The optimum operation parameters of electrodeposition of the composite coating are as follows： pH value is 4.5, bath temperature is 65 ℃, and current density is 10 A/dm^2.     

Electrodeposition of alloys XIX: Electrodeposition of lead-tin alloys

Pb-Sn alloys containing from 1.2 to 94.3 wt.% Sn were electrodeposited from aqueous solutions prepared from diethylenetriaminepentaacetates of the two metals. The effects of current density and the solution composition on the composition of deposits and cathodic current efficiencies were investigated. Pb-Sn alloy deposition was of irregular type. At current densities equal to or less than 2.0 A dm^-2, lead deposited preferentially. At current densities of more than 2.0 A dm^-2 and in solutions containing more than 50.0 met.% Sn (the percentage weight of the total metal content), preferential deposition of tin occured. An increased in the tin content of the bath increased the percentage of tin in the deposit. The presence of chloride ions in the bath did not seem to affect the composition of the deposit.     

Properties of Chromium Coatings Deposited from “Sulpho-Chromispel-I” Electrolyte of Standard Concentration

The most important properties of reflectivity, internal stress, hardness and surface morphology of chromium coatings deposited from “Sulfo-Chromispel-I” electrolytes (250 g dm^?3 CrO³) are studied The effects of operating parameters and electrolyte composition are evaluated. It is established that chromium coatings depositedfrom “Sulpho-Chromispel-I” electrolytes exhibit low internal stress. The current density and thickness of the coating affect the latter. Internal tension is reduced with the increase in coating thickness at current density of 50 A dm^?2, which is very favourable for depositing thick functional chromium layers. The reflectivity is affected by the concentration of iodide and cathodic current density. At current densities up to 35 A dm^?2 the higher the iodide concentration, the brighter the coating. With increased current densities the coatings produced are coarser and their brightness is reduced. Small amounts of sulphuric acid (4–20 cm³ dm^?3) improve the brightness. The hardness of the coatings deposited from the electrolytes studied is less than that of coatings deposited from a standard sulphate bath—300–400 kg mm^?2. The roughness grade is 0.5-0.6 mm. The coatings deposited from “Sulpho-Chromispel-I” electrolytes are bright with low tensile stress and moderate hardness. They are deposited at ambient temperature over a wide interval of current density, which is rather advantageous from a technological point of view.     

Pulse electroplating of Ni-W-P coating and its anti-corrosion performance

Ni-W-P coatings were electrodeposited on copper substrates by pulse electroplating. Effects of electrolyte pH (1-3), temperature (40–80 °C), average current density (1–7 A/dm²) and pulse frequency (200–1000 Hz) on deposition rate, structure and corrosion resistance performance of Ni-W-P coatings were studied by single factor method. Surface morphology, crystallographic structure and composition of Ni-W-P coatings were investigated by means of scanning electron microscopy, X-ray diffractometry and energy dispersive X-ray spectroscopy, respectively. Corrosion resistance performances of Ni-W-P coatings were studied by potentiodynamic polarization and electrochemical impedance spectroscopy in 3.5% NaCl solution (mass fraction) and soil-containing solution. It was found that the pulse electroplated Ni-W-P coatings have superior corrosion resistance performance and the electroplating parameters significantly affect the structure and corrosion resistance performance of Ni-W-P coatings. The optimized parameters of pulse electroplating Ni-W-P coatings were as follows: pH 2.0, temperature 60 °C, average current density 4 A/dm², and pulse frequency 600 Hz. The Ni-W-P coating prepared under the optimized parameters has superior corrosion resistance (276.8 kΩ) and compact surface without any noticeable defect.     

The Structure and Texture Development of Ni Alloy Electrodeposits—III Nickel-Zinc Electrodeposits

Electrodeposited nickel-zinc alloys have been studied using ‘direct’ methods e.g. x-ray diffraction and transmission electron microscopy on coatings having different thicknesses, deposited on mild steel and copper substrates at current densities of 10 and 60 mA cm². In all cases the coatings evolved with a complex bcc gamma phase. The work has confirmed and extended the ideas of Finch et al.^{1 3} and Pangarov^4-6 to alloy deposition. It has been shown that a better understanding, particularly of the initial deposition stages, can be obtained by considering both strain and surface energy effects. In all cases the film formed at the coating/substrate interface develops with a {110} texture on both mild steel and copper substrates at current densities of 10 and 60 mA cm². From surface energy considerations a {110} texture would be expected as in bcc metals this orientation has the lowest surface energy. XRD measurements by glancing angle indicate that in the initial stage of deposition, the zinc and nickel atoms deposit in the recesses in the {110) plane of the mild steel as the initially formed deposit had a d-spacing similar to that of the mild steel. Similar effects were also indicated for the nickel-zinc film deposited on copper substrates indicating that ‘templating’ occurs during deposition on both mild steel and copper substrates. A semi-quantitative model based on surface energy and strain energy considerations has been used to explain the texture development. Furthermore, the structures of deposits studied in the present work tended to be fine grained in the initial stages but developed coarser columnar due to selected grain growth with favoured grains becoming broader during the intermediate and final of growth. However, unlike previous work on bcc nickel-zinc alloys⁷ which developed a {111} texture in thicker films the {110} texture remained dominant in the majority of the films examined and the final texture in 20 μm bulk films was a {110}.     

Microstructure and wear behaviour of pulse electrodeposited alumina nanoparticle reinforced Co–W nanocomposite coatings

Abstract

The microstructure and wear behaviour of alumina nanoparticle reinforced Co–W alloy coatings have been investigated for potential replacement of hard chrome coatings. The composite coatings were pulse electrodeposited on steel substrates using a citrate bath. The effects of current density, in the range of 1–9 A dm^?2, on the particle reinforcement, phase/microstructure, microhardness, and wear properties of the coating have been studied. The coatings codeposited with current density of 5 A dm^?2 at 333 Hz pulse frequency and 33% duty cycle exhibited microhardness comparable to hard chromium coatings.     

High rate of copper electrodeposition from the hexafluorosilicate bath

A high-rate copper electrodeposition performed from a hexafluorosilicate bath is presented in this article. It is shown that the current density for electrodeposition ranges from 1 to 30 A dm^− 2 and the optimal suggested current density is 15 A dm^− 2 or a rate of 200 μm h^- 1. High plating rate is due to a higher mass transport through the hexafluorosilicate media when compared to a conventional sulphate-based bath. The microstructure, texture and mean grain size of the 30 μm-thick films plated from the additive free bath and the bath containing 10^− 3 mol dm^− 3 thiourea and 500 ppm Cl⁻ is studied with respect to the applied current density. Copper plated from the bath without additives has a macrocrystalline structure with preferable 110 texture and mean grain size of 65-85 nm, while thiourea produces a microsmooth surface and 111 texture with grain size of 40-70 nm.