Z-pin植入对二维机织复合材料层合板力学性能影响的数值模拟

针对植入Z-pin后的碳纤维增强平纹机织复合材料的微观结构,建立了含Z-pin机织复合材料单层板和层合板的单胞模型。预测了Z-pin直径、分布间隔对单层板的面内纵向拉伸力学性能的影响,发现含有Z-pin的机织复合材料单胞在受面内拉伸时,会在Z-pin附近出现应力集中,单胞首先会在应力集中区域发生失效而导致强度降低。通过三维单胞模型模拟了Z-pin在层合板中拉出脱离的过程,得出了不同Z-pin直径、不同分离层厚度下的拉拔力-位移曲线。建立了用非线性弹簧模拟Z-pin的双悬臂梁（DCB）模型,结合虚拟裂纹闭合技术（VCCT）,模拟了含有Z-pin复合材料层合板的Ⅰ型裂纹扩展,结果表明：Z-pin直径越大,分布越密,层合板的等效Ⅰ型应变能释放率 G_IC越大,且直径越大,G_IC 随裂纹扩展的波动幅度越大,分布越密,G_IC 波动的波长越小。     

超细纤维增强复合材料 Ⅰ 型层间断裂韧性分析

采用静电纺丝技术制备了厚度约0.1mm的超细纤维无纺布薄膜, 并入层合板中间界面, 固化成型后加工为双悬臂梁(DCB)试样。根据ASTM D5528标准测试了 Ⅰ 型层间断裂韧性。实验结果表明, 增强试样比空白试样的 Ⅰ 型临界应变能释放率(G_{Ⅰ C})提高了约35％。同时采用有限元分析方法研究了含无纺布薄膜试样和空白试样的裂纹扩展过程, 数值结果与实验结果吻合较好, 更好地解释了含无纺布薄膜层合板的层间断裂机理。      

Z-pin增强复合材料Ⅰ型断裂韧性数值分析

采用细观力学方法以及虚拟裂纹闭合法(VCCT)对含有Z-pin增强复合材料双悬臂梁(DCB)结构Ⅰ型断裂韧性进行了研究。利用有限元法建立了结构模型,采用实体单元模拟复合材料层压板结构和非线性弹簧元模拟Z-pin。通过计算应变能释放率对含有不同体积分数Z-pin的复合材料层压板Ⅰ型断裂韧性与不含Z-pin的复合材料层压板Ⅰ型断裂韧性进行了对比分析。研究表明,含有Z-pin增强复合材料双悬臂梁(DCB)结构Ⅰ型断裂韧性在裂纹扩展过程中受到Z-pin桥联作用的影响而显著增强,且其增强效果与Z-pin的体积分数、处在桥联区的Z-pin数目均相关,这表明Z-pin增强方法能够有效提高复合材料层压板的分层扩展阻力。     

氧化石墨烯-碳纳米管复合膜层间增韧碳纤维/环氧树脂复合材料

碳纤维增强树脂基复合材料层合板结构的层间性能一直是材料的性能短板,本文利用氧化石墨烯(GO)和碳纳米管(CNT)设计制备了具有一定渗透性和树脂浸润性的复合膜,采用层间增韧方法,制备了GO-CNT复合膜改性碳纤维/环氧树脂(CF/EP)复合材料,通过张开型Ⅰ型层间断裂韧性(G_ⅠC)与滑移型Ⅱ型层间断裂韧性(G_ⅡC)对GO-CNT-CF/EP复合材料的层间韧性进行了研究,并结合复合材料的破坏微观形貌和损伤/破坏特征分析了GO-CNT复合膜对复合材料的层间增韧效果及增韧机制。结果表明：GO与CNT质量比为3∶7时制备的复合膜具有良好的成膜工艺性和树脂浸润性,EP与GO-CNT复合膜的接触角远低于其与纯GO膜的接触角,并且GO与CNT结构中的羟基、羧基、环氧基等含氧基团增加了它们与EP的物理亲和性和化学作用,有利于复合材料层间GO-CNT/EP微区结构的强韧化。GO-CNT复合膜对复合材料的张开型层间断裂韧性G_ⅠC没有增强效果,甚至复合材料的G_ⅠC值还发生了轻微下降。而GO-CNT复合膜对复合材料的滑移型层...     

Z-pin增强陶瓷基复合材料I型应变能释放率

碳纤维平纹编织物和碳纤维Z-pin制备的预成型体,通过化学气相渗透(CVI)工艺制成Z-pin增强平纹编织陶瓷基复合材料层压板。通过双悬臂梁试验研究Z-pin增强平纹编织陶瓷基复合材料层压板的层间I型应变能释放率和增强机理。研究Z-pin面积密度对层间I型应变能释放率的影响。结果表明:Z-pin增强平纹编织陶瓷基复合材料层压板主要增强机理表现为层间裂纹扩展受阻,Z-pin与层压板界面解离,Z-pin桥联裂纹和Z-pin拔出;增大Z-pin面积密度,层间I型应变能释放率增大。     

MWCNTs对碳纤维非褶皱无纺布/环氧层合板力学性能的影响

将羧基化多壁碳纳米管(MWCNTs)添加到TDE85环氧树脂中,然后与碳纤维非褶皱无纺布(C-NCF)复合,制备成[0°/90°/+45°/-45°]_S层合板。采用三点弯曲、短梁剪切和单边切口弯曲测试方法以及动态力学性能分析方法,研究了不同含量的MWCNTs对层合板弯曲性能、层间剪切强度(ILSS)、Ⅱ型层间断裂韧性(G_ⅡC,以及玻璃态转变温度(T_g)的影响。并采用SEM对Ⅱ型试样的断面进行分析。结果表明,MWCNTs的加入显著提高了NCF层合板的力学性能。与空白试样相比,当MWCNTs在树脂中的质量分数为2.0%时,弯曲强度和模量分别提高了约26%和6%;当MWCNTs的质量分数为0.5%时,ILSS、G_ⅡC、T_g分别提高约14%、27%和14%。     

粗骨料体积分数对混凝土Ⅱ型断裂参数的影响

对不同粗骨料体积分数下的混凝土Ⅱ型断裂性能进行了研究。根据最大泥浆厚度(Maximum paste thickness, MPT)理论,给出了断裂韧度K_{Ⅱ C}与粗骨料体积分数V_a之间的经验关系式。通过对含有四种粗骨料体积分数(19%、25%、31%、37%)的无切口试件开展半边加载断裂试验,测得相应的峰值荷载、断裂韧度、能量释放率等断裂参数,并分析了断裂韧带表面的裂纹分布规律。试验结果表明:随着粗骨料体积分数的增加,混凝土的Ⅱ型断裂韧度K_{Ⅱ C}和临界能量释放率G_{Ⅱ C}明显增加,名义断裂韧带处的裂纹轮廓线更长、更曲折;各配比试件的开裂模式基本一致,剪切裂纹主要集中在名义断裂韧带区域。同时,利用数字图像相关技术(Digital image correlation, DIC)对试件表面的损伤演化进行分析,结果表明,试件表面的应变局部化能够较好地表征断裂过程区(Fracture process zone, FPZ)的形态特征及演化过程。随着粗骨料体积分数的增加,FPZ的形态更不规则,分支更多。      

基于虚拟裂纹闭合技术的应变能释放率分析

基于虚拟裂纹闭合技术(VCCT),建立了复合材料层合板层间裂纹尖端的应变能释放率(SERR)三维有限元计算模型。该模型考虑了裂纹尖端大转动和离散单元形状变化对应变能释放率计算的影响,修正了裂纹尖端应变能释放率的计算方法。利用该模型计算了裂纹长度为15 mm和35 mm时纯Ⅰ型和纯Ⅱ型的应变能释放率,纯Ⅰ型应变能释放率分别为 207 J/m2和 253 J/m2;纯Ⅱ型应变能释放率分别为 758 J / m 2和 1040 J / m2;计算值与试验值吻合得很好。同时,该模型计算了混合型不同比值 R=(G_Ⅱ/G_Ⅰ+G_Ⅱ)的长裂纹层合板层间断裂过程的应变能释放率,其中Ⅰ型和Ⅱ型应变能释放率计算值与试验平均值的最大误差为 11.4%,最小误差为 0.4%。该模型能有效计算裂纹尖端的应变能释放率。     

Z-pin增强CMC层间Ⅰ+Ⅱ混合型断裂韧性

提出手工预缝纫方法将3K丝束的T300碳纤维引入预成型体,采用CVI工艺在预成型体和缝线处同时渗透SiC基体,制备了Z-pin增强平纹编织C/SiC陶瓷基复合材料。通过三点弯曲试验测定了Ⅰ+Ⅱ混合型应变能释放率,分析了材料的裂纹扩展行为和Z-pin增强机理。结果表明:随着裂纹扩展长度的增大,Ⅰ+Ⅱ型裂纹扩展阻力不断增大,相同裂纹扩展长度,增加Z-pin植入密度可以提高粘结强度,增大止裂作用。Z-pin增强平纹编织C/SiC陶瓷基复合材料裂纹扩展的耗能途径主要是层间界面剥离、Z-pin弹性剪切和拉伸变形。     

缝合复合材料II型层间断裂特性研究

分别采用测量ENF试样加载点位移与测量其端部剪切位移CSD(Crack Shear Displacement)的试验方法,研究了缝合复合材料层合板的II型层间断裂韧性以及缝合密度,缝合线的直径等缝合参数对于缝合复合材料层合板II型层间断裂韧性和分层模式的影响。结果表明,缝合降低了层合板初始分层韧性G_IIi,但对于分层的扩展有良好的抑制作用。缝合参数对此有较大影响。      

湿热环境下复合材料的混合型层间断裂特性研究

采用混合型挠曲(MMF)试件,研究了材料吸湿和环境温度对T300/5405复合材料混合型层间断裂韧性的影响。给出了在不同温度下,不同吸湿含量试件分层临界扩展时的Ⅰ型分量和Ⅱ型能量释放率分量散点图。结果表明:在吸湿和温度的综合作用下,分层尖端存在塑性变形;常温下,吸湿对材料的层间断裂韧性影响不明显,在高温环境中,随吸湿量增加,层间断裂韧性显著增加;温度对干态材料的断裂韧性影响较小,试件吸湿后,随温度升高,韧性增强。      

Flexural properties of z-pinned composite laminates in seawater environment

Unidirectional carbon-fibre reinforced composite laminates with and without z-pins were immersed in artificial seawater and exposed to two different temperature levels (?1.75 and 50 °C), as well as thaw–freeze cycles (+20/?20 °C). The investigation described is focused on the question to which degree seawater absorption, as well as bending properties are influenced by z-pin reinforcement. The results indicate an increasing influence of the z-pin reinforcement on the water sorption rate, while the sorption rate of unpinned laminates is lower. This is a result of the additional diffusion pathways of the moisture ingress into the laminate caused by the inserted z-pins which in turn change the micro-structure. Furthermore, the sorption rate depends on the immersion temperature. Laminates immersed into seawater with higher temperatures (50 °C) display a significantly higher diffusion rate than those immersed in colder seawater (?1.75 °C) or those immersed under thaw–freeze conditions (+20/?20 °C). Z-pin reinforced laminates with a unidirectional fibre orientation show a reduced bending strength by about 31 %, as well as a reduced flexural modulus by about 11 % in comparison to unpinned samples. Unpinned and z-pinned samples that were exposed to a seawater environment for 1344 h show a reduced flexural modulus depending on the immersion temperatures. As opposed to flexural modulus, flexural strength is not affected by immersion time or temperature. The overall bending strain energy that is necessary for a complete fracture of the unpinned samples under 4-point bending loads can be described with the value of the elastic bending strain energy. In contrast to this the overall bending strain energy of the z-pinned laminates is composed of two different components –the elastic bending strain energy and the post-fracture strain energy. The post-fracture strain energy occurs after exceeding the flexural strength. The overall bending strain energy of z-pinned and unpinned samples without immersion into seawater is around 7.2 J, while the percentage of the post-fracture energy of the pinned samples is 40 % with respect to the overall bending strain energy. The duration of the immersion into water and higher water temperatures increases the overall bending strain energy for both unpinned and pinned samples. The increase is higher for z-pinned samples and is mainly caused by the increase of the post-fracture energy.     

纤维增强复合材料层合板分层破坏的研究

本文对纤维增强复合材料层合板的分层破坏进行了大量的试验,同时用三维有限元进行应力分析。试验和分析结果表明此类层合板的分层总是发生在θ/90界面上,该界面上不仅层间剪应力大而且层间正应力也大。通过对不同θ/90界面的临界能量释放率的测定表明,对层合板不同的θ/90分层界面的G_ⅠC和G_ⅡC是随θ角的变化而变化。文中对一个Ⅰ型,Ⅱ型耦合型能量释放率分层判据的应用作了改进,试验结果表明此改进是有效的。     

分层界面角度对CFRP层板Ⅱ型分层的影响

Ⅱ型层间断裂韧度是复合材料结构损伤容限设计的关键力学参数。针对5种具有不同预置分层界面的国产T300复合材料端部缺口弯曲(ENF)实验件,开展Ⅱ型分层测试,获得预嵌薄膜末端开裂的Ⅱ型层间断裂韧度 G Ⅱc,NPC 和预开裂裂纹处扩展的Ⅱ型层间断裂韧度 G Ⅱc,PC 。结果表明:5种分层界面下 G Ⅱc,NPC 均比 G Ⅱc,PC 高,并且对于 G Ⅱc,NPC 值,0°/0°分层界面的最高,0°/90°分层界面的最低;而对于 G Ⅱc,PC 值,0°/45°分层界面的最高,0°/90°分层界面的最低。同时,采用虚拟裂纹闭合技术(VCCT)模拟不同分层界面处的Ⅱ型分层扩展,获得了分层扩展过程中分层前缘应变能释放率分布,结合实验结果分析了分层界面角度对Ⅱ型断裂韧度测量值的影响。     

Mode III Interlaminar Fracture Behavior of Glass Fiber Reinforced Polymer Woven Laminates at 293 to 4 K

This paper deals with mode III delamination properties of glass fiber reinforced polymer woven laminates at room temperature (293 K), liquid nitrogen temperature (77 K), gas helium temperature (20 K), and liquid helium temperature (4 K). In order to evaluate these properties, the Split Cantilever Beam (SCB) fracture test is performed. The load is applied to a test specimen through a set of identical grips in order to reduce (in some degree) the mode II loading at the free edges. A three-dimensional finite element analysis is used to study the stress and strain state of the specimens and to interpret the experimental measurements. The strain energy release rate is calculated by using the virtual crack closure technique. It is found that the strain energy release rate is dominated by the mode III component. A non-uniform distribution of the strain energy release rate along the delamination front is obtained with mode III component having maximum at the center of the delamination front, while mode II component increases towards the free edges. The strain energy release rate is also determined using the crack closure technique. A finite element analysis is also carried out to calculate the stress intensity factors for the SCB specimens. The fracture surfaces are examined by scanning electron microscopy to identify the fracture mechanisms. The most important conclusion from the present study is that at temperature lowering from 293 to 20 K the mode III fracture toughness increases, further cooling to 4 K produces a toughness decrease.     

Failure criteria for mixed mode delamination in glass fibre epoxy composites

Critical strain energy release rate of glass/epoxy laminates using the virtual crack closure technique for mode I, mode II, mixed-mode I + II and mode III were determined. Mode I, mode II, mode III and mixed-mode I + II fracture toughness were obtained using the double cantilever beam test, the end notch flexure test, the edge crack torsion test and the mixed-mode bending test respectively. Results were analysed through the most widely used criteria to predict delamination propagation under mixed-mode loading: the Power Law and the Benzeggagh and Kenane criteria. Mixed-mode fracture toughness results seem to represent the data with reasonable accuracy.