共查询到19条相似文献,搜索用时 41 毫秒
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《稀有金属》2019,(12)
用固相复合技术制备微电子封装用金包银复合键合丝,利用金相显微镜、高低温拉力仪、推拉力计和扫描电镜(SEM),对不同合金成分的金包银复合键合丝的定向凝固组织及力学性能进行表征,获取晶粒尺寸大小及形貌特征,分析钯、铜元素对再结晶温度、力学性能参数及键合强度的影响,阐明钯和铜对金包银复合键合丝的强化机制。结果表明:在金包银复合键合丝芯材中添加铜,组织呈等轴晶,而同时添加钯和铜,铸态组织由胞状树枝晶和胞状晶组成,晶粒细小均匀。钯和铜可以提高复合键合丝的再结晶温度使其具备更高的耐热性。同时添加钯和铜的复合键合丝具有较高的塑/韧性,键合后弧形稳定,拉力及焊球推力最高,键合质量好。钯、铜微合金化金包银复合键合丝的强化机制为:固溶强化和细晶强化。二元复合添加的复合键合丝具有更高的强化增量,其力学性能更为优异。 相似文献
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Nb微合金化和含铌钢的发展及技术进步 总被引:17,自引:1,他引:16
叙述了国际上铌微合金化技术的发展历史及铌作为微合金化元素在钢中应用的经济性和技术性优势。国际市场铌铁价格的长期稳定使铌微合金化技术成为钢铁工业持续稳定发展的重要伙伴,是保持含铌高强度钢技术创新和使用铌的动力。介绍了高强度管线钢、汽车工业用高级钢板带材及微合金化非调质钢和结构钢等领域中铌微合金化技术的发展经验。 相似文献
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沈韶峰 《有色金属材料与工程》2011,32(1):20-24
介绍单晶铜丝,以其优良的力学性能和便宜的价格,在键合行业逐渐取代金丝,大量应用于集成电路、半导体分立器件;同时,单晶铜在数据传输中因无晶界对数据造成的反射和散射,正广泛应用于高保真的音频、视频数据线和高标准通信网络线缆传输。 相似文献
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Samson Jerold Samuel Chelladurai Ramesh Arthanari Kirubaharan Krishnamoorthy Kamal Shankar Selvaraj Prabu Govindan 《Transactions of the Indian Institute of Metals》2018,71(5):1041-1048
Uncoated and copper coated steel wire mesh reinforcing LM6 aluminium alloy composites have been produced using squeeze casting process by varying reinforcement orientation viz., 0°, 45° and 90° respectively. Microstructure of the castings has been examined and mechanical properties such as hardness, tensile strength and ductility have been investigated. Fracture surface of tensile specimens has been analysed using field emission scanning electron microscope. Microstructure of samples reveals that copper coating on steel wires improves the interface bonding between matrix and reinforcement. Average hardness values of 259 and 90 Hv have been observed in steel wire and matrix respectively. Tensile strength of composites increases with increasing angle of reinforcement orientation from 0° to 90°. Tensile strength increases up to 11% by reinforcing copper coated steel wire mesh at 90° orientation as compared to LM6 aluminium alloy. Fracture surface of composites shows pullout of steel wires in uncoated steel wire mesh composites and broken wires in copper coated steel wire mesh composites respectively. Dimples have been observed on the fracture surface of LM6 aluminium alloy. In general, copper coated steel wire mesh composites offer better hardness and tensile strength compared to uncoated steel wire mesh composites and LM6 aluminium alloy. This may be attributed to the copper coating on steel wires which results better interface bonding between matrix and reinforcement. 相似文献
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铜铝复合材料的研究与应用 总被引:4,自引:0,他引:4
介绍了铜铝复合材料的研究与应用.轧制复合法、爆炸复合法、挤压拉拔法是生产铜铝复合材料的常用方法.应用较多的铜铝复合材料主要有铜包铝复合线材、铜铝复合接头材料、铜铝复合板带等. 相似文献
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采用"热旋锻-拉拔"方法制备了直径为φ65 μm、包覆铜层厚度较均匀、表面质量高和界面结合质量良好的铜包铝复合微丝,研究了合理热旋制度、热旋复合成形铜包铝线材的组织和界面结合状态以及中间退火和拉拔对线材组织与性能的影响.结果表明:合理的旋锻制度为旋锻温度350℃,单道次变形量40%,旋锻后形成了动态再结晶组织和厚度为0.7 μm的界面扩散层.复合线材的合理退火工艺参数为350℃/30 min (退火温度350℃、退火时间30 min),该条件下退火后线材延伸率达到最高值35.7%,界面扩散层厚度约为2.1 μm,退火后铜层和铝芯发生再结晶,组织内部形成等轴晶组织.当退火温度超过350℃时,铜层和铝芯晶粒长大,界面扩散层厚度增加,从而导致线材的延伸率下降.将单道次变形量控制在15%~20%,经过粗拉,制备了φ0.96 mm的丝材;粗拉后不进行退火处理,将单道次变形量控制在8%~15%,经过细拉,制备了表面光洁、直径为φ65 μm的复合微丝.在拉拔过程中,铜层和铝芯均出现〈111〉丝织构. 相似文献
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随着2019年7月世界新能源汽车大会在海南的顺利召开,明晰了新能源汽车在技术创新等领域的发展方向,新能源汽车的发展进一步提速,使新能源汽车驱动电机用高耐热等级变频漆包铜扁线产品将成为未来漆包线行业市场新的增长点。根据目前漆包线产品的技术发展方向,制定新能源汽车用220级变频漆包铜扁线研发的生产工艺流程、技术目标和工艺路线,确定220级变频漆包铜扁线研发的工艺技术,并对研发产品的常规性能和高频脉冲耐电晕寿命性能进行检测,各项性能完全满足新能源汽车用220级变频漆包铜扁线研发的技术目标。 相似文献
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电子封装用导电丝材料及发展 总被引:23,自引:3,他引:20
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。对金丝的种类、工艺及国内外市场情况进行了详细介绍;介绍了铜丝的几种主要工艺;并对铝丝进行概括介绍。 相似文献
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通过漆包线耐压检测、金相显微观察、铜粉检测等检测手段,研究了漆包线耐压性能的影响规律。通过对漆包线耐压击穿点的形貌分析、类型统计,影响耐压性能主要是漆瘤、针孔、划伤,对铜粉含量、铜粉形态等进行研究,研究表明随着铜粉含量的增加击穿不良率越高,铜粉含量控制在 4mg 以下且成细小颗粒状能有效改善耐压性能,为漆包线生产提供了指导。 相似文献
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Nikhil Murdeshwar James E. Krzanowski 《Metallurgical and Materials Transactions A》1997,28(12):2663-2671
A study has been conducted on the deformation mechanisms in metal substrates subject to aluminum ultrasonic wire bonding (UWB).
Aluminum wires were bonded to copper, nickel, stainless steel, and aluminum bronze foil substrates and then removed in aqueous
sodium hydroxide to permit thin sections of bonded areas to be examined in the transmission electron microscope (TEM). The
results showed a variety of dislocation substructures formed during bonding, including dislocation cells, subgrains, and planar
arrays. Aluminum and copper showed evidence of thermal effects on microstructural evolution during bonding, such as dislocation
annihilation at cell walls in copper and complete recrystallization in aluminum. In the nickel and stainless steel substrates,
which have higher recrystallization temperatures, thermal effects on microstructure were not observed. In addition, it was
found that low stacking-fault energy (SFE) materials, such as aluminum bronze, were less likely to undergo cell formation,
and only planar dislocation arrays formed. In general, it is clear that the process of UWB induces cyclic stresses in the
substrates, which exceed the yield strength of the metals examined. In addition, there is some heat generated during the bonding
process, which can influence the resultant deformation microstructure. 相似文献