Nucleation mechanism for epitaxial growth of aluminum films on sapphire substrates by molecular beam epitaxy

Aluminum (Al) epitaxial films with various thicknesses are grown on sapphire substrates by molecular beam epitaxy (MBE). The nucleation evolution of surface morphology and structural property during the growth of Al epitaxial films on sapphire substrates are investigated in detail. It is found that the 10 nm-thick Al epitaxial films grown on the sapphire substrates show the full-width at half-maximum (FWHM) for Al(111) of 0.35° and the root-mean square (RMS) surface roughness of 2.4 nm. When the thickness increases, the surface initially starts to roughen and then becomes smoother. At the same time, the crystal quality of the Al epitaxial films becomes better thanks to the annihilation of dislocations. As the thickness of Al epitaxial films reaches 800 nm, the FWHM for Al(111) is 0.04° and the RMS surface roughness is 0.14 nm, indicating the high crystal quality and flat surface morphology of Al epitaxial films. The corresponding nucleation mechanism of Al epitaxial films grown on sapphire substrates is hence proposed. This work is of great significance for the fabrication of Al-based devices.     

Epitaxial growth of Ge thin film on Si (001) by DC magnetron sputtering

We have demonstrated that sub-10 nm-thick heteroepitaxial Ge films on Si (001) having smooth surfaces can be obtained by DC magnetron sputtering. Ge films grown at 350 °C preserve the smooth surfaces with a roughness root mean square (RMS) of 0.39 nm, whereas, the Ge films grown at 500 °C show significant roughness with an island-like morphology. In samples grown at 350 °C, it is confirmed that the Ge films are grown epitaxially by cross-section transmission electron microscopy (TEM) and X-ray diffraction (XRD) rocking curve measurements. Rapid thermal annealing (RTA) at 720 °C is effective in improving the crystalline quality and the degradation in the roughness is negligible. Raman spectra and an XRD reciprocal space map reveal that the epitaxial Ge grown at 350 °C show an in-plane compressive strain and that the strain continues to remain after a 720 °C RTA.     

Comparative Study on MOCVD Growth of a-Plane GaN Films on r-Plane Sapphire Substrates Using GaN, AlGaN, and AlN Buffer Layers

In this work, we have comparatively investigated the effects of the GaN, AlGaN, and AlN low-temperature buffer layers (BL) on the crystal quality of a-plane GaN thin films grown on r-plane sapphire substrates. Scanning electron microscopy images of the a-plane GaN epilayers show that using an AlGaN BL can significantly reduce the density of surface pits. The full-width at half-maximum values of the x-ray rocking curve (XRC) are 0.19°, 0.36°, and 0.48° for the films grown using Al_0.15Ga_0.85N, GaN, and AlN BLs, respectively, indicating that an AlGaN BL can effectively reduce the mosaicity of the films. Room-temperature photoluminescence shows that the AlGaN BL results in lower impurity incorporation in the subsequent a-plane GaN films, as compared with the case of GaN and AlN BLs. The higher crystal quality of a-plane GaN films produced by the Al_0.15Ga_0.85N BL could be due to improvement of BL quality by reducing the lattice mismatch between the BL and r-sapphire substrates, while still keeping the lattice mismatch between the BL and epitaxial a-plane GaN films relatively small.     

Effect of the film thickness on the crystal structure and ferroelectric properties of (Hf0.5Zr0.5)O2 thin films deposited on various substrates

In this work, the effect of the film thickness on the crystal structure and ferroelectric properties of (Hf_0.5Zr_0.5)O₂ thin films was investigated. The thin films were deposited on (111) Pt-coated SiO₂, Si, and CaF₂ substrates with thermal expansion coefficients of 0.47, 4.5, and 22×10⁻⁶/°C, respectively. From the X-ray diffraction measurements, it was found that the (Hf_0.5Zr_0.5)O₂ thin films deposited on the SiO₂ and CaF₂ substrates experienced in-plane tensile and compressive strains, respectively, in comparison with the films deposited on the Si substrates. For films deposited on all three substrates, the volume fraction of the monoclinic phase increased with increasing film thickness, with the SiO₂ substrate having the lowest monoclinic phase volume fraction at all film thicknesses tested. The grain size of the films, which is an important factor for the formation of the ferroelectric phase, remained almost constant at about 10 nm in diameter regardless of the film thickness and type of substrate utilized. Ferroelectricity was observed for the 17 nm-thick films deposited on SiO₂ and Si substrates, and the maximum remanent polarization (P_r) value of 9.3 µC/cm² was obtained for films deposited on the SiO₂ substrate. In contrast, ferroelectricity with P_r=4.4 µC/cm² was observed only for film on SiO₂ substrate in case of 55 nm-thick films. These results suggest that the films under in-plane tensile strain results in the larger ferroelectricity for 17 nm-thick films and have a ferroelectricity up to 55 nm-thick films.     

Effect of AlN buffer layer thickness on the properties of GaN films grown by pulsed laser deposition

The GaN films are grown by pulsed laser deposition (PLD) on sapphire, AlN(30 nm)/Al₂O₃ and AlN(150 nm)/Al₂O₃, respectively. The effect of AlN buffer layer thickness on the properties of GaN films grown by PLD is investigated systematically. The characterizations reveal that as AlN buffer layer thickness increases, the surface root-mean-square (RMS) roughness of GaN film decreases from 11.5 nm to 2.3 nm, while the FWHM value of GaN film rises up from 20.28 arcmin to 84.6 arcmin and then drops to 31.8 arcmin. These results are different from the GaN films deposited by metal organic chemical vapor deposition (MOCVD) with AlN buffer layers, which shows the improvement of crystalline qualities and surface morphologies with the thickening of AlN buffer layer. The mechanism of the effect of AlN buffer layer on the growth of GaN films by PLD is hence proposed.     

Characterization of interfacial reaction and chemical bonding features of LaOx/HfO2 stack structure formed on thermally-grown SiO2/Si(1 0 0)

A stack structure consisting of ～1.5 nm-thick LaO_x and ～4.0 nm-thick HfO₂ was formed on thermally grown SiO₂ on Si(1 0 0) by MOCVD using dipivaloymethanato precursors, and the influence of N₂ annealing on interfacial reaction for this stack structure was examined by using X-ray photoelectron spectroscopy and Fourier transform infrared attenuated total reflection. We found that compositional mixing between LaO_x and HfO₂ becomes significant from 600 °C upwards and that interfacial reaction between HfLa_yO_z and SiO₂ proceeds consistently at 1000 °C in N₂ ambience.     

Structural properties of β-Ga2O3 formed by dry thermal oxidization process on GaN

Dry thermal oxidation of GaN thin films grown on Al₂O₃ (0001) has been performed at different temperatures. The oxidized samples were investigated through X-ray diffraction (XRD) and atomic force microscope (AFM). For samples oxidized at temperatures from 800 °C to 950 °C, XRD peaks from the (−201), (−402) and (−603) planes of β-Ga₂O₃ were observed, indicating that a β-Ga₂O₃ layer was formed on GaN epitaxially. The epitaxial relationships were determined to be β-Ga₂O₃(−201)||GaN(002) and an in-plane orientation of β-Ga₂O₃[010]||GaN[110]. When the oxidation temperature is increased further to 1000 °C, in addition to the peaks from the (−201), (−402) and (−603) planes, extra peaks corresponding to other planes appeared, indicating that the oxidized layer had deteriorated to polycrystalline Ga₂O_3.     

Fabrication of Ag nanoparticle/ZnO thin films using dual-plasma-enhanced metal-organic chemical vapor deposition (DPEMOCVD) system incorporated with photoreduction method and its application

We report a novel method to grow silver nanoparticle/zinc oxide (Ag NP/ZnO) thin films using a dual-plasma-enhanced metal-organic chemical vapor deposition (DPEMOCVD) system incorporated with a photoreduction method. The crystalline quality, optical properties, and electrical characteristics of Ag NP/ZnO thin films depend on the AgNO₃ concentration or Ag content and annealing temperature. Optimal Ag NP/ZnO thin films have been grown with a AgNO₃ concentration of 0.12 M or 2.54 at%- Ag content and 500 °C- rapid thermal annealing (RTA); these films show orientation peaks of hexagonal-wurtzite-structured ZnO (002) and face-center-cubic-crystalline Ag (111), respectively. The transmittance and resistivity for optimal Ag NP/ZnO thin films are 85% and 6.9×10⁻⁴ Ω cm. Some Ag NP/ZnO transparent conducting oxide (TCO) films were applied to InGaN/GaN LEDs as transparent conductive layers. The InGaN/GaN LEDs with optimal Ag NP/ZnO TCO films showed electric and optical performance levels similar to those of devices fabricated with indium tin oxide.     

Effect of growth temperature on diode parameters of n-ZnO/p-Si heterojuction diodes grown by atomic layer deposition

n-ZnO/p-Si heterojunctions were grown by atomic layer deposition (ALD) on (100) p-Si substrates at different growth temperatures in the range of ~100–250 °C. The current-voltage characterization of all the heterojunctions showed typical rectifying behavior, a true signature of a p-n junction diode. The diode grown at 100 °C were having significantly lower reverse saturation current (~21 nA) and high rectification factor (~120) compared to those grown at relatively higher temperatures such as 200 or 250 °C. From capacitance-voltage measurements, it was found that the depletion width in the ZnO side of n-ZnO/p-Si diode was maximum (~60 nm) for the diode grown at 100 °C and decreased gradually to ~3 nm for the diodes grown at high temperatures of 250 °C. The electron concentration in ZnO films was found to increase significantly on increasing the growth temperature from ~100 to 250 °C. The junction capacitance also showed an increasing trend with increase in the growth temperature. The variation of diode parameters with growth temperature has been discussed in terms of carrier concentration in ZnO films and associated growth mechanisms of the ALD. Such low temperature grown n-ZnO/p-Si diodes with lower reverse saturation current and large depletion width may be suitable for photo detection applications.     

The influence of thickness and ammonia flow rate on the properties of AlN layers

Undoped AlN layers have been grown on c-plane sapphire substrates by metal-organic chemical vapor deposition in order to study the effects of ammonia (NH₃) flow rate and layer thickness on the structural quality and surface morphology of AlN layers by high-resolution X-ray diffraction, scanning electron microscopy, and atomic force microscopy. Lower NH₃ flow rate improves crystallinity of the symmetric (0 0 0 2) plane in AlN layers. Ammonia flow rate is also correlated with surface quality; pit-free and smooth AlN surfaces have been obtained at a flow rate of 70 standard cm³ per minute. Thicker AlN films improve the crystallinity of the asymmetric (1 0 1̄ 2) plane.     

Study on mobility enhancement in MOVPE-grown AlGaN/AlN/GaN HEMT structures using a thin AlN interfacial layer

Al_0.26Ga_0.74N/AlN/GaN high-electron-mobility transistor (HEMT) structures with AlN interfacial layers of various thicknesses were grown on 100-mm-diameter sapphire substrates by metalorganic vapor phase epitaxy, and their structural and electrical properties were characterized. A sample with an optimum AlN layer thickness of 1.0 nm showed a highly enhanced Hall mobility (μ_Hall) of 1770 cm²/Vs with a low sheet resistance (ρ_s) of 365 Ω/sq. (2DEG density n_s = 1.0 × 10¹³/cm²) at room temperature compared with those of a sample without the AlN interfacial layer (μ_Hall = 1287 cm²/Vs, ρ_s = 539 Ω/sq., and n_s = 0.9 × 10¹³/cm²). Electron transport properties in AlGaN/AlN/GaN structures were theoretically studied, and the calculated results indicated that the insertion of an AlN layer into the AlGaN/GaN heterointerface can significantly enhance the 2DEG mobility due to the reduction of alloy disorder scattering. HEMTs were successfully fabricated and characterized. It was confirmed that AlGaN/AlN/GaN HEMTs with the optimum AlN layer thickness show superior DC properties compared with conventional AlGaN/GaN HEMTs.     

Amorphous SiC as a structural layer in microbridge-based RF MEMS switches for use in software-defined radio

This paper reports an effort to develop amorphous silicon carbide (a-SiC) films for use in shunt capacitor RF MEMS microbridge-based switches. The films were deposited using methane and silane as the precursor gases. Switches were fabricated using 500 nm and 300 nm-thick a-SiC films to form the microbridges. Switches made from metallized 500 nm-thick SiC films exhibited favorable mechanical performance but poor RF performance. In contrast, switches made from metallized 300 nm-thick SiC films exhibited excellent RF performance but poor mechanical performance. Load-deflection testing of unmetallized and metallized bulk micromachined SiC membranes indicates that the metal layers have a small effect on the Young’s modulus of the 500 nm and 300 nm-thick SiC MEMS. As for residual stress, the metal layers have a modest effect on the 500 nm-thick structures, but a significant affect on the residual stress in the 300 nm-thick structures.     

Low-temperature solid-phase crystallization of amorphous SiGe films on glass by imprint technique

Low-temperature (<500 °C) solid-phase crystallization (SPC) of amorphous Si_1?xGe_x (x: 0–0.7) films was examined on insulating substrates by using Ni-imprint technique. Incubation time for SPC was remarkably reduced by catalytic effects without changing growth velocity. As a result, Ni-free large SiGe grains (～4 μm) were obtained at controlled positions. The crystallinity of the grown regions was almost the same as that of poly-SiGe formed by the conventional high temperature SPC at 600 °C.     

Raman spectroscopic study of In2S3 films prepared by spray pyrolysis

Indium sulfide (In₂S₃) thin films are of interest as buffer layers in chalcopyrite absorber based solar cells; and as media providing two-photon absorption for intermediate-band solar cells. We investigated the suitability of chemical spray pyrolysis (CSP) for growing In₂S₃ thin films in a structural order where indium atoms are preferentially in the octahedral sites. We sprayed aqueous or alcoholic solutions of indium chloride (InCl₃) and thiourea (SC(NH₂)₂) precursors onto a substrate with surface temperatures (T_S) of 205, 230, 275 and 320 °C. The as-deposited films grown from aqueous solutions were annealed in 5% H₂S containing atmosphere at 500 °C. We used Raman spectroscopy, X-ray diffraction and Energy Dispersive X-ray spectroscopy to evaluate the effect of growth temperature and the effect of annealing on the film structure and stoichiometry. The use of alcoholic solvent instead of aqueous allows us to use much lower T_S while preserving the quality of the β-In₂S₃ films obtained. Similarly, films with increased stoichiometry and quality are present at a higher T_S; and when annealed. The annealing of the films grown at T_S of 205 °C results in a much higher gain of the crystal quality compared to the gain when annealing the films grown at T_S of 320 °C, although the quality remain higher when deposited at T_S of 320 °C. Simultaneously with the increase of the film quality, there is a sign of increased quality of the crystal ordering with indium in the octahedral sites. Such a crystal ordering favor the use of CSP deposited In₂S₃ films in the intermediate band solar cells.     

Influence of annealing temperature on the phase composition and optical properties of CuInS2 films

We studied the growth of CuInS₂ thin films by single-source evaporation of CuInS₂ powder in a high-vacuum system with a base pressure of 10^?3 Pa. After evaporation, the films were annealed in a sulfur atmosphere at temperatures from 200 to 500 °C for 1 h. XRD curves and Raman spectra of the films demonstrated that chalcopyrite CuInS₂ was the major crystalline phase. The morphology of Cu_xS exhibited a star-like structure, which we report for the first time. The phase composition and optical properties of our polycrystalline thin films were effectively modified by annealing in S. For films annealed at 200 and 350 °C, a secondary CuIn₁₁S₁₇ phase appeared, which may be related to solid-state reaction in the S atmosphere. This secondary CuIn₁₁S₁₇ phase has not been widely reported in previous studies. After annealing at 500 °C, only a chalcopyrite phase was detected, with bandgap energy of 1.46 eV, which is nearly identical to the optimal bandgap energy (1.5 eV) of single-crystal CuInS₂. This indicates that the composition of the CuInS₂ film annealed at 500 °C was nearly stoichiometric. The bandgap of the samples first increased and then decreased with increasing annealing temperature, which may be attributed to an increase in grain size, the secondary CuIn₁₁S₁₇ phase, and deviation from stoichiometry.     

Study on the thermal stability of Ga-doped ZnO thin film: A transparent conductive layer for dye-sensitized TiO2 nanoparticles based solar cells

Generally, optoelectronic devices are fabricated at a high temperature. So the stability of properties for transparent conductive oxide (TCO) films at such a high temperature must be excellent. In the paper, we investigated the thermal stability of Ga-doped ZnO (GZO) transparent conductive films which were heated in air at a high temperature up to 500 °C for 30 min. After heating in air at 500 °C for 30 min, the lowest sheet resistance value for the GZO film grown at 300 °C increased from 5.5 Ω/sq to 8.3 Ω/sq, which is lower than 10 Ω/sq. The average transmittance in the visible light of all the GZO films is over 90%, and the highest transmittance is as high as 96%, which is not influenced by heating. However, the transmittance in the near-infrared (NIR) region for the GZO film grown at 350 °C increases significantly after heating. And the grain size of the GZO film grown at 350 °C after annealing at 500 °C for 30 min is the biggest. Then dye-sensitized TiO2 NPs based solar cells were fabricated on the GZO film grown at 350 °C (which exhibits the highest transmittance in NIR region after heating at 500 °C for 30 min) and 300 °C (which exhibits the lowest sheet resistance after heating at 500 °C for 30 min). The dye-sensitized solar cell (DSSC) fabricated on the GZO film grown at 350 °C exhibits superior conversion efficiency. Therefore, transparent conductive glass applying in DSSCs must have a low sheet resistance, a high transmittance in the ultraviolet–visible–infrared region and an excellent surface microstructure.     

Band gap engineered resistor for mitigating linear energy transfer sensitivities in scaled submiron CMOS technology SRAM cells

Use of cross-coupling latch resistors is a prime method of mitigating single event upsets (SEU). Scaling has dramatically reduced ability of using this technique because of the large area needed as well as high temperature coefficient of resistance (TCR) of lightly doped polysilicon resistors. We present results of a study of the electrical properties of Al_1?xIn_xN films resistor which offers distinct advantage over polysilicon resistors. The films were grown on silicon nitride by magnetron sputter deposition at room temperature. Sheet resistance in the range of 8–10 kΩ/□ was reproducibly grown. The resistor film is thermally stable with TCR of less than minus 0.09%/°C for temperature range of minus 55 °C to +125 °C.     

Structural,optical, and photocatalytic properties of the spray deposited nanoporous CdS thin films; influence of copper doping,annealing, and deposition parameters

Nanoporous thin films of Cd_1−xCu_xS (0≤x≤0.06) were grown on a heated glass substrate employing a home-made spray pyrolysis technique. The influences of [Cu]/[Cd] and the annealing in the range 300–500 °C on the structural and morphological properties of the films were investigated by X-ray diffraction (XRD), Fourier transformation infrared spectroscopy (FTIR), field emission scanning electron microscope (FE-SEM) and atomic force microscopy (AFM). The influences of Cu doping ratio, solution flow rate, and the deposition time on the optical properties and photocatalytic activity of these films are also reported. The films are of polycrystalline nature and hexagonal structure. Increasing the Cu doping ratio and annealing temperature improve the (1 0 1) preferential orientation. The crystallite size is ranged from 23.82 to 32.11 nm. XRD and FTIR reveal the formation of CdO in the 6% Cu-doped CdS film annealed at 400 °C and in all films annealed at 500 °C. The pure CdS film is of a porous structure and the close-packing and porosity of the films increase with increasing Cu%. Also, the pore diameter can be controlled from 50 to 15 nm with the increase of Cu content. The films showed transmittance below 70%. The optical band gap of the films is decreased from 2.43 to 1.82 eV with increasing Cu% and flow rate/deposition time. Additionally, the refractive indices and dispersion parameters of the films are also affected by the deposition conditions. Cu doping enhanced the films' photostability as well as the photocatalytic removal of methylene blue (MB).     

Synthesis and gas sensing behavior of nanostructured V2O5 thin films prepared by spray pyrolysis

Nanocrystalline vanadium pentoxide (V₂O₅) thin films have been deposited by a spray pyrolysis technique on preheated glass substrates. The substrate temperature was changed between 300 and 500 °C. The structural and morphological properties of the films were investigated by means of X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), and atomic force microscopy (AFM). The influence of different substrate temperatures on ethanol response of V₂O₅ has also been investigated. XRD revealed that the films deposited at T_pyr=300 °C have low peak intensities, but the degree of crystallinity improved when the temperature was increased to 500 °C and films had orthorhombic structures with preferential orientations along the (0 0 1) direction. The fractal analysis showed a decreasing trend versus the pyrolysis temperature. Sensing properties of the samples were studied in the presence of ethanol vapor. The operating temperature of the sensor was optimized for the best gas response. The response increased linearly with different ethanol concentrations. It was found that films deposited at the lowest substrate temperature (300 °C) had the highest sensing response to ethanol.     

Highly ordered C60 films on epitaxial Fe/MgO(0 0 1) surfaces for organic spintronics

Hybrid interfaces between ferromagnetic surfaces and carbon-based molecules play an important role in organic spintronics. The fabrication of devices with well defined interfaces remains challenging, however, hampering microscopic understanding of their operation mechanisms. We have studied the crystallinity and molecular ordering of C₆₀ films on epitaxial Fe/MgO(0 0 1) surfaces, using X-ray diffraction and scanning tunneling microscopy (STM). Both techniques confirm that fcc molecular C₆₀ films with a (1 1 1)-texture can be fabricated on epitaxial bcc-Fe(0 0 1) surfaces at elevated growth temperatures (100–130 °C). STM measurements show that C₆₀ monolayers deposited at 130 °C are highly ordered, exhibiting quasi-hexagonal arrangements on the Fe(0 0 1) surface oriented along the [1 0 0] and [0 1 0] directions. The mismatch between the surface lattice of the monolayer and the bulk fcc C₆₀ lattice prevents epitaxial overgrowth of multilayers.