Electrical Properties of Halogen-Doped CdTe Layers on Si Substrates Grown by Metalorganic Vapor-Phase Epitaxy

Electrical properties of halogen-doped CdTe layers grown on Si substrates using iodine and chlorine dopants are presented. No change in electrical properties of the layers was observed with chlorine as a dopant. However, doping with iodine resulted in highly conductive n-type layers or highly resistive p-type layers depending upon the growth conditions, even though a similar amount of dopant was introduced into the growth chamber. Layers grown at 560°C, with a vapor-phase Te/Cd precursor ratio of 3.0, were p-type. The resistivity of the layers remained unchanged for low dopant supply rates, but increased abruptly when the dopant supply rate was increased beyond a certain value. On the other hand, layers grown at 325°C with Te/Cd ratios from 0.1 to 0.25 were n-type. A maximum free electron concentration of 1.3 × 10¹⁷ cm⁻³ was obtained at room temperature. The types and conductivities of the grown layers were strongly dependent on the growth conditions.     

Metalorganic vapor phase epitaxy of (100) CdZnTe layers using diisopropylzinc source

Growth characteristics of (100) Cd_1−xZn_xTe (CZT) have been studied using metalorganic vapor phase epitaxy. CZT layers were grown on (100) GaAs substrates using diisopropylzinc (DiPZn), dimethylcadmiun (DMCd), and diethyltelluride (DETe) as precursors. Growths were carried out in the temperature range from 375 to 450°C. Since DiPZn has lower vapor pressure than DMCd, CZT layers with Zn composition below 0.06 were grown with good compositional control. Layers with uniform Zn composition and thickness over an area of 10 × 15 mm² were grown. Enhancement of CZT growth rate was observed when a small amount of DiPZn is introduced under fixed flows of DMCd and DETe. Zn composition increases abruptly for further increase of DiPZn flow rate, where growth rate decreases. Growth mechanisms for the above growth conditions were also discussed.     

MBE growth and characterization of in situ arsenic doped HgCdTe

We report the results of in situ arsenic doping by molecular beam epitaxy using an elemental arsenic source. Single Hg_1−xCd_xTe layers of x ∼0.3 were grown at a lower growth temperature of 175°C to increase the arsenic incorporation into the layers. Layers grown at 175°C have shown typical etch pit densities of 2E6 with achievable densities as low as 7E4cm⁻². Void defect densities can routinely be achieved at levels below 1000 cm⁻². Double crystal x-ray diffraction rocking curves exhibit typical full width at half-maximum values of 23 arcsec indicating high structural quality. Arsenic incorporation into the HgCdTe layers was confirmed using secondary ion mass spectrometry. Isothermal annealing of HgCdTe:As layers at temperatures of either 436 or 300°C results in activation of the arsenic at concentrations ranging from 2E16 to 2E18 cm⁻³. Theoretical fits to variable temperature Hall measurements indicate that layers are not compensated, with near 100% activation after isothermal anneals at 436 or 300°C. Arsenic activation energies and 77K minority carrier lifetime measurements are consistent with published literature values. SIMS analyses of annealed arsenic doping profiles confirm a low arsenic diffusion coefficient.     

Electric current controlled liquid phase epitaxy of GaAs on N+ and semi-insulating substrates

Electric current controlled liquid phase epitaxy (LPE) of GaAs has been performed on both n⁺ and semi-insulating substrates. Growth is induced by current flow across the substrate-melt interface. The furnace temperature is held constant during growth so that direct electrical control of the growth process is achieved. The dependence of the growth rate on both the electric current density across the substrate-melt interface and the ambient furnace temperature was determined. Current densities from 5 to 20 A/cm² were employed and furnace temperatures ranging from 680 to 800°C were used. Sustained steady state growth rates as small as 0.022μm/min and as large as 1.4μm/min were obtained. For a given furnace temperature and current density, the measured growth rates on semi-insulating substrates range from 48% to 77% of the rates obtained on n⁺ n substrates. The surface morphology of the epitaxial layers is observed to depend on the electric current density employed during growth. Electric current controlled doping modulation was studied in epitaxial layers grown from unintentionally doped melts. The degree of doping modulation achieved is approximately proportional to the change in applied current density. Approximately a 40% increase in the net electron concentration is obtained by changing the current density from 10 to 30 A/cm² during growth. Preliminary experiments with tin doped epitaxial layers indicate that similar changes in the amount of tin incorporation can be achieved.     

Pb1-xSnxTe epitaxial layers prepared by the hot-wall technique

Epitaxial layers of Pb_1-xSn_xTe were grown on polished-etched KCl substrates using the modified hot-wall technique. Four layers, each 5-30 μm thick, of area 5.5 × 5.5 mm² were simultaneously grown at growth rates of 0.3–4.8 μm/hr. A typical substrate temperature of 325°C , and baffle and source temperatures of 450-560°C were used. P-and n-type layers were obtained from stoichio-metric and metal-rich sources of (Pb_1-xSn_x)_1+δ Te_1-δ, 0.01≤δ ≤0.02, respectively. From metal-rich sources with 0<δ<0.01, the layers obtained were n-type at 300K but p-type at 77K. The layers became intrinsic between approximately 250K and 295K. Carrier concentrations of as-grown layers with 0≤x ≤0.26 were in the range of 10¹⁶-10¹⁷ /cm³ and mobilities were of the order of 10⁴ cm² /V-sec at 77K. Both n-and p-type layers were also obtained from metal-rich sources of δ = 0.01 by controlling the Te vapor pressure from a separate reservoir. With Te temperatures higher than the n-p turnover point of 240°C , p-type characteristics were obtained. Layers that were p-type at 77K grown with the Te temperatures near the n-p turnover point had the best mirror-like surfaces.     

Electrical properties of indium-doped LPE layers of Pb1−xSnx Te

Liquid-phase epitaxial (LPE) layers of Pb_1−xSn_xTe with an alloy composition 0≤×≤0.25 were doped n-type by adding from 0.002 to 10 at.% indium to the growth solution. Doping characteristics of indium and electrical properties of the epilayers at 77 and 4.2K were studied by Hall and resistivity measurements made directly on the grown layers. Electron concentration and mobility at 77 and 4.2K are presented as a function of indium doping for various x values. Doping coefficients of ~0.05 and ~0.03 are found for PbTe and Pb_0.8Sn_0.2Te, respectively, grown at ~450°C. For medium to high indium doping, the electron concentration saturates to a constant value independent of doping and LPE growth temperature. The saturation values decrease substantially with increasing x and increase with a decrease in sample temperature. Bulklike mobilities practically independent of doping are recorded up to an indium concentration N_ln~0.3 at.%, above which the mobility decreases with increasing indium concentration. The data shows that indium is a suitable donor in liquid-phase epitaxial layers of Pb_l-XSn_xTe.     

N- type doping of gallium antimonide and aluminum antimonide grown by molecular beam epitaxy using lead telluride as a tellurium dopant source

Lead telluride was used as a “captive” source of tellurium (Te) for the n-type doping of gallium antimonide (GaSb) and aluminum antimonide (AlSb)grown by molecular beam epitaxy. Controllable carrier concentrations from 1.2 x 10¹⁶ to 1.6 x 10¹⁸ cm^-3 were obtained. High room-temperature Hall mobilities of 4200 cm²/V · s were measured for the low-doped GaSb samples. In the growth temperature range of interest, doping ef-ficiencies are approximately 50% of those in GaAs. For GaSb, SIMS data show that the Te incorporation decreases significantly at growth temperatures above 500° C. How-ever, in AlSb, there is no significant reduction in the incorporation of Te up to at least 650° C. In contrast, the Te incorporation into AlSb decreases at low temperatures. There is also some evidence of surface segregation in AlSb. Contrary to other doping studies, increasing the Sb : Ga flux ratio was found to reduce the Te incorporation.     

P-Type doping with arsenic in (211)B HgCdTe grown by MBE

Arsenic incorporation and doping in HgCdTe layers grown by molecular beam epitaxy (MBE) were examined in this paper. Arsenic incorporation into MBE-HgCdTe was carried out in two different ways: (1)ex-situ arsenic ion-implantation on indium-doped n-type HgCdTe layers, and (2) through a new approach called arsenic planar doping. We report onex-situ arsenic diffusion on indiumdoped MBE-HgCdTe layers at 450°C. In the investigated layers, arsenic redistribution occurs with a multi-component character. We obtained a diffusion coefficient of D_As = (1-3) × 10⁻¹³ cm²/s at 450°C. Results of differential Hall and fabricated p-n junctions suggest that during high temperature annealing, arsenic preferentially substitutes into Te sublattices and acts as acceptor impurities. In the second case, arsenic has been successfully incorporated during the MBE growth as an acceptor in the planar doping approach. Withoutex-situ annealing, as-grown layers show up to 50% activation of arsenic during the growth. These results are very promising forin-situ fabrication of infrared devices using HgCdTe material.     

A Roadmap for Controlled and Efficient n‐Type Doping of Self‐Assisted GaAs Nanowires Grown by Molecular Beam Epitaxy

N‐type doping of GaAs nanowires has proven to be difficult because the amphoteric character of silicon impurities is enhanced by the nanowire growth mechanism and growth conditions. The controllable growth of n‐type GaAs nanowires with carrier density as high as 10²⁰ electron cm^?3 by self‐assisted molecular beam epitaxy using Te donors is demonstrated here. Carrier density and electron mobility of highly doped nanowires are extracted through a combination of transport measurement and Kelvin probe force microscopy analysis in single‐wire field‐effect devices. Low‐temperature photoluminescence is used to characterize the Te‐doped nanowires over several orders of magnitude of the impurity concentration. The combined use of those techniques allows the precise definition of the growth conditions required for effective Te incorporation.     

Molecular beam epitaxy growth of high-quality arsenic-doped HgCdTe

We have initiated a joint effort to better elucidate the fundamental mechanisms underlying As-doping in molecular beam epitaxy (MBE)-grown HgCdTe. We have greatly increased the As incorporation rate by using an As cracker cell. With a cracker temperature of 700°C, As incorporation as high as 4×10²⁰ cm⁻³ has been achieved by using an As-reservoir temperature of only 175°C. This allows the growth of highly doped layers with high quality as measured by low dislocation density. Annealing experiments show higher As-activation efficiency with higher anneal temperatures for longer time and higher Hg overpressures. Data are presented for layers with a wide range of doping levels and for layer composition from 0.2 to 0.6.     

Photoluminescence of phosphorous doped Ge on Si (100)

Photoluminescence (PL) of selectively grown phosphorus (P) doped germanium (Ge) is investigated. 350–600 nm thick P-doped Ge is grown on 100 nm thick P-doped Ge buffer layer, which is annealed at 800 °C before the main part of Ge deposition. In the case of Ge deposited at 325 °C, approximately two times higher PL intensity is observed by P doping of ~3.2×10¹⁹ cm⁻³. Further increase of PL intensity by a factor of 1.5 is observed by increasing the growth temperature from 325 °C to 400 °C due to improved crystal quality. Varying PH₃ partial pressure at 400 °C, red shift of the PL occurred with increasing P concentration due to higher bandgap narrowing. With increasing P concentration up to ~1.4×10¹⁹ cm⁻³ at 400 °C the PL peak intensity increases by filling electrons into the L valley and decreases due to enhanced point defect concentration and degraded crystallinity. By post-annealing at 500–800 °C, the PL intensity is further increased by a factor of 2.5 because of increased active P concentration and improved crystal quality. Reduced direct bandgap energy by introducing tensile strain is also observed.     

1990 Electronic Materials Conference

Silicon doped epitaxial layers of InP have been prepared by low pressure metalorganic chemical vapour deposition, using disilane as the source of silicon. Trimethylindium and phosphine were used as the source reactants for the growth. The doping characteristics for the epitaxial growth were investigated at substrate temperatures in the range 525–750° C and for doping levels in the range 4 × 10¹⁶−2 × 10¹⁹ cm⁻³. The results indicated that the Si doping level is proportional to the disilane flow rate. The Si incorporation rate increases with temperature, but becomes temperature-independent forT > 620° C. Comparison between Si concentrations determined by Secondary Ion Mass Spectroscopy, donor levels determined by Hall effect measurements, and optical measurements at 7 K indicates that approximately 50% of the Si in the InP is in the form of electrically inactive species. Uniform doping over 5 cm wafer dimensions has been obtained for growth atT = 625° C.     

OMVPE growth of CdTe on InSb substrates

In this paper we report on the growth and electrical characteristics of CdTe on InSb substrates, grown by OMVPE. The growth was carried out over a range of temperatures from 350 to 440° C, and a range of dimethylcadmium (DMCd) and diethyltelluride (DETe) pressures from 0.5 − 7 × 10⁻⁴ atm and 2 − 10 × 10⁻⁴ atm, respectively. The sublinear growth characteristic observed has been explained by means of the Langmuir Hinshelwood model. This provides an insight into the mechanism by which this material is grown. The effect of temperature and the reactant partial pressure on the growth rate and electrical characteristics have been explained in light of the observed results. The photoluminescence properties of these layers are indicative of their suitability for device applications, and are superior to those of CdTe layers grown on bulk CdTe. It has been shown that growth of high quality layers can be achieved over a wide range of partial pressure ratios of DMCd and DETe.     

Role of cadmium in enhancing optical properties and chlorine doping of photo-assisted OMVPE-grown znse

The influence of cadmium doping in enhancing: (i) near-band edge (NBE) to deep-level emissions (DLE) photoluminescence intensity ratio, and (ii) chlorine incorporation in HCl doped ZnSe films, has been studied. The epitaxial ZnSe was grown using low-temperature photo-assisted organometallic vapor phase epitaxy (OMVPE) using DMSe, DMZn, and DMCd alkyl sources. More intense near band-edge emission is observed when the growth temperature is reduced from 400 to 360°C. The deep-level emissions show a threshold-like dependence on UV light intensity for a given temperature. Cadmium doping is found to improve the NBE/DLE photoluminescence intensity ratio, and this improvement is more pronounced at higher growth temperature. Properties of n-type ZnSe films codoped with cadmium and chlorine, using HCl and DMCd as dopant sources have also been investigated. Samples co-doped with Cd showed higher electron concentrations and this effect was more pronounced at lower UV intensities. By the use of Cd co-doping, we have achieved the highest electron concentrations (2.4 x 10¹⁸ cm^-3) yet reported for HCl doping of OMVPE-grown ZnSe.     

Be doped GaAs grown by migration enhanced epitaxy at low substrate temperature

Conductive Be doped GaAs grown by molecular beam epitaxy at low substrate temperatures (300° C) was obtained for the first time by using migration enhanced epitaxy (MEE) without subsequent annealing. The layers were characterized using Hall effect, double crystal x-ray diffraction, and photoluminescence. With low arsenic exposure, the low temperature MEE layers doped with Be had the same carrier density and similar luminescent efficiency as layers grown by conventional MBE at 580° C. Mobility at 77 K was reduced somewhat for layers doped at 2 × 10¹⁷cm⁻³, which also exhibited hopping conductivity below 40 K. Double crystal x-ray diffraction showed that low temperature MEE samples grown at low As exposure had the narrow linewidth associated with conventional MBE material grown at 580° C, unlike layers grown by conventional MBE at low temperatures, which exhibit an expansion in lattice parameter.     

Specific features of doping with antimony during the ion-beam crystallization of silicon

A method of doping during the growth of thin films by ion-beam crystallization is proposed. By the example of Si and Sb, the possibility of controllably doping semiconductors during the ion-beam crystallization process is shown. A calibrated temperature dependence of the antimony vapor flow rate in the range from 150 to 400°C is obtained. It is established that, an increase in the evaporator temperature above 200°C brings about the accumulation of impurities in the layer growth direction. Silicon layers doped with antimony to a concentration of 10¹⁸ cm^–3 are grown. It is shown that, as the evaporator temperature is increased, the efficiency of the activation of antimony in silicon nonlinearly decreases from ~10⁰ to ~10^–3.     

Selective doping of N-type ZnSe layers with chlorine grown by molecular beam epitaxy

N-type ZnSe with electron concentration up to 3 × 10²⁰ cm⁻³ and low resistivity down to 1 × 10⁻⁴ ohm-cm, has been grown using a selective doping technique with chlorine during molecular beam epitaxy. The photoluminescence evaluation shows that the selectively doped ZnSe layers are superior to uniformly doped ones, especially for the case of high-concentration chlorine doping. The in-depth profile of chlorine concentration in a selectively doped sample was measured with secondary-ion mass spectroscopy (SIMS). The SIMS analysis shows only slight diffusion of the incorporated chlorine atoms even in highly doped samples.     

Physico-chemical properties of Ga and In dopants during liquid phase epitaxy of CdxHg1−xTe

This work deals with the study by means of radioactive tracers and autoradiography, as well as measuring of galvanomagnetic properties, of Ga and In doping of epitaxial Cd_xHg_1−xTe layers during their crystallization from a Te-rich melt. Ga and In were introduced in the form of Ga⁷² and In¹¹⁴ master alloys with Te. The effective distribution coefficients of Ga and In during the crystallization of the Cd_xHg_1−xTe solid solutions with x=0.20 to 0.23 were determined by cooling the Te-base melt to 515–470°C. Depending on the concentration of the dopants and the time-temperature conditions of Cd_xHg_1−xTe growth, these ratios for Ga and In were 1.5–2.0 and 1.0–1.5, respectively. The electrical activity of Ga and In was determined after annealing of the Cd_xHg_1−xTe layers in saturated Hg vapor at 270–300°C. In doping of the epitaxial layers to (3–8)×10¹⁴ cm⁻³ with subsequent annealing in saturated Hg vapor at ∼270°C increases the carrier lifetime approximately by a factor of two as compared with the undoped material annealed under the same conditions.     

Thermal annealing effects on p-type conductivity of nitrogendoped ZnSe grown by metalorganic vapor phase epitaxy

Post-growth thermal annealing (e.g., 500°C, 30 min), is proposed as one of the promising techniques to realize and to improve the quality of p-type ZnSe layers grown by metalorganic vapor phase epitaxy (MOVPE). The layers were grown at low temperature (350°C) by photo-assisted MOVPE with doping nitrogen from tertiarybutylamine (t-BuNH₂). The flow rate of t-BuNH₂ was limited to be relatively low, in order to avoid heavy doping, with which as-grown layers exhibited electrically high-resistivity; but the thermal annealing converted the layers to p-type. As the as-grown layers exhibited the stronger donor-to-acceptor pair recombination lines or the weaker donor-bound excitonic emission (I_x) lines in photoluminescence, the annealed layers resulted in higher net acceptor concentration, which was 1 x 10¹⁷ cm⁻⁴ at the optimum conditions at present.     

Transmission electron microscopy study of the effect of selenium doping on the ordering of GalnP2

Selenium doped Ga_0.51In_0.49P films have been grown by metalorganic chemical vapour deposition at 600, 670 and 740° C. The extent of ordering of the Group III sublattice has been monitored by transmission electron microscopy. Ordering disappears at carrier concentrations on the order of 10¹⁸ cm⁻³ for samples grown at 600 and 740° C although a small degree of ordering persists in the samples grown at 670° C up to a carrier concentration of 10¹⁹ cm⁻³. At each growth temperature, the ordering observed decreased and the bandgap measured increased with increasing Se doping.