InyAl1-yAs线性渐变缓冲层对InP基HEMT材料性能的影响

采用气体源分子束外延（GSMBE）技术,研究了InP衬底上In_yAl_1-yAs线性渐变缓冲层对In_0.66Ga_0.34As/In_yAl_1-yAs高迁移率晶体管（HEMT）材料特性影响。研究了不同厚度和不同铟含量的In_yAl_1-yAs线性渐变缓冲层对材料的表面质量、电子迁移率和二维电子气浓度的影响。结果表明,在300 K（77 K）时,电子迁移率和电子浓度分别为8 570 cm²/（Vs）^-1（23 200 cm²/（Vs）-1）3.255E12 cm^-2（2.732E12 cm^-2）。当In_yAl_1-yAs线性渐变缓冲层厚度为50 nm时,材料的表面形貌得到了很好的改善,均方根粗糙度（RMS）为0.154 nm。本研究可以为HEMT器件性能的提高提供强有力的支持。     

截止波长2.2 µm的平面型延伸波长InGaAs探测器

采用闭管扩散的方法成功研制了截止波长2.2 μm的平面型延伸波长InGaAs探测器芯片。在分子束外延法（MBE）生长的In_0.75Al_0.25As/ In_0.75Ga_0.25As/ In_0.75Al_0.25As外延材料上,采用砷化锌作为扩散掺杂源、SiN_x作为扩散掩膜层,实现了扩散成结。分析了扩散结深和载流子侧向收集宽度、I-V特性、光谱响应特性和探测率,结果表明：150 K温度下,器件暗电流密度0.69 nA/cm²@-10 mV,响应截止波长和峰值波长分别为2.12 μm和1.97 μm,峰值响应率为1.29 A/W,峰值量子效率达82%,峰值探测率为1.01×10¹² cmHz^1/2/W。这些结果对后续进一步优化平面型延伸波长InGaAs焦平面探测器有重要的指导意义。     

短波红外铟镓砷探测器材料表面缺陷研究

短波红外铟镓砷(InGaAs)探测器材料的表面缺陷是发展大规模小像元焦平面阵列的核心问题之一,其中与衬底晶格失配的延伸波长探测器材料的表面缺陷控制起来尤为困难。优化了分子束外延(Molecular Beam Epitaxy, MBE) In束源炉的温度设置。结果表明,In炉上下温差为130℃时所生长的短波红外晶格失配In_0.83Ga_0.17As材料的表面缺陷密度最小,由此有效地将材料的表面缺陷密度由3000 cm^-2左右降至约500 cm^-2。结合短波红外晶格失配InGaAs材料的室温光致发光测试,经分析可知,In束源炉上下温差存在最优值的现象是由于In金属液滴和炉子顶部杂质引起卵形缺陷这两种机制的共同作用而引起的。本文制备的低缺陷密度晶格失配InGaAs探测器材料为发展高性能延伸波长短波红外焦平面阵列打下了基础。     

（英）数字递变异变赝衬底上2.6 μm In0.83Ga0.17As/InP光电探测器的性能改进

本文研究了In_0.83Al_0.17As/In_0.52Al_0.48As数字递变异变缓冲层结构(DGMB)的总周期数对2.6 μm延伸波长In_0.83Ga_0.17As光电二极管性能的影响。实验表明,在保持总缓冲层厚度不变的情况下,通过将在InP衬底上生长的In_0.83Al_0.17As/In_0.52Al_0.48As DGMB结构的总周期数从19增加到38,其上所生长的In_0.83Ga_0.17As/In_0.83Al_0.17As光电二极管材料层的晶体质量得到了显著改善。对于在总周期数为38的DGMB上外延的In_0.83Ga_0.17As光电二极管,观察到其应变弛豫度增加到99.8％,表面粗糙度降低,光致发光强度和光响应度均增强,同时暗电流水平被显著抑制。这些结果表明,随着总周期数目的增加,DGMB可以更有效地抑制穿透位错的传递并降低残余缺陷密度。     

p-i-n InP/InGaAs光电探测器电流及电容特性研究

为了实现高灵敏度探测,红外探测器需要得到优化。利用Silvaco器件仿真工具研究了p-i-n型InP/In_0.53Ga_0.47As/In_0.53Ga_0.47As光电探测器结构,模拟了结构中吸收层浓度和台阶宽度对暗电流及结电容的影响。结果表明,随着吸收层掺杂浓度的逐渐增大,器件暗电流逐渐减小,结电容逐渐增大;当台阶宽度变窄时,器件暗电流随之减小,结电容也随之变小。最后研究了光强和频率对器件结电容的影响：在低光强下,器件结电容基本不变;当光强增大到1 W/cm²时,器件结电容迅速增大;器件结电容随频率的升高而减小,其峰值由缺陷能级引起。     

Optimization of active region for 1.3-µm GalnAsP compressive-strain multiple-quantum-well ridge waveguide laser diodes

We report on the optimization of Ga_0.27In_0.73As_0.67P_0.33/Ga_0.11In_0.89As_0.24P_0.76 compressive-strain multiple-quantum-well (CS-MQW) grown by low-pressure metalorganic chemical vapor deposition for 1.3-μm ridge-waveguide laser diodes (LDs). The structural and optical properties are characterized by doublecrystal x-ray diffraction and photoluminescence (PL) measurements, respectively. The optimum thicknesses of the well, barrier, and waveguide layer of the active region are 4 nm, 10 nm, and 100 nm, respectively. The GaInAsP/GaInAsP CS-MQW as-cleaved LDs with the optimum active region, a 3.5-μm-width ridge, and a 900-μm-cavity length exhibit the threshold current density of 1.09 kA/cm², a differential quantum efficiency of 30%, a characteristic temperature of 60 K, a maximum operating temperature up to 75°C, and a redshift rate of 0.30 nm/°C.     

Simulation of double junction In0.46Ga0.54N/Si tandem solar cell

A comprehensive study of high efficiency In_0.46Ga_0.54N/Si tandem solar cell is presented. A tunnel junction (TJ) was needed to interconnect the top and bottom sub-cells. Two TJ designs, integrated within this tandem: GaAs(n⁺)/GaAs(p⁺) and In_0.5Ga_0.5N(n⁺)/Si(p⁺) were considered. Simulations of GaAs(n⁺)/GaAs(p⁺) and In_0.5Ga_0.5N (n⁺)/Si(p⁺) TJ I-V characteristics were studied for integration into the proposed tandem solar cell. A comparison of the simulated solar cell I-V characteristics under 1 sun AM1.5 spectrum was discussed in terms of short circuit current density (J_sc), open circuit voltage (V_OC), fill factor (FF) and efficiency (η) for both tunnel junction designs. Using GaAs(n⁺)/GaAs(p⁺) tunnel junction, the obtained values of J_sc = 21.74 mA/cm², V_OC= 1.81 V, FF = 0.87 and η = 34.28%, whereas the solar cell with the In_0.5Ga_0.5N/Si tunnel junction reported values of J_sc = 21.92 mA/cm², V_OC = 1.81 V, FF = 0.88 and η = 35.01%. The results found that required thicknesses for GaAs(n⁺)/GaAs(p⁺) and In_0.5Ga_0.5N (n⁺)/Si(p⁺) tunnel junctions are around 20 nm, the total thickness of the top InGaN can be very small due to its high optical absorption coefficient and the use of a relatively thick bottom cell is necessary to increase the conversion efficiency.     

OMVPE growth of GaInAsSb/AlGaAsSb for quantum-well diode lasers

GaInAsSb and AlGaAsSb alloys have been grown by organometallic vapor phase epitaxy (OMVPE) using all organometallic sources, which include tritertiarybutylaluminum, triethylgallium, trimethylindium, tertiarybutylarsine (TBAs), and trimethylantimony. Excellent control of lattice-matching both alloys to GaSb substrates is achieved with TBAs. GaInAsSb/AlGaAsSb multiple quantum well (MQW) structures grown by OMVPE exhibit strong 4K photoluminescence with full width at half maximum of 10 meV, which is comparable to values reported for quantum well (QW) structures grown by molecular beam epitaxy. Furthermore, we have grown GaInAsSb/AlGaAsSb MQW diode lasers which consist of n- and p-doped Al_0.59Ga_0.41As_0.05Sb_0.95 cladding layers, Al_0.28Ga_0.72As_0.02Sb_0.98 confining layers, and four 15 nm thick Ga_0.87In_0.13As_0.12Sb_0.88 quantum wells with 20 nm thick Al_0.28Ga_0.72As_0.02Sb_0.98 barrier layers. These lasers, emitting at 2.1 μm, have exhibited room-temperature pulsed threshold current densities as low as 1.2 kA/cm².     

MBE脱氧条件与InGaAs/InP APD性能的相关性

InP基InGaAs/InP雪崩光电二极管（APD）对近红外光具有高敏感度,使其成为微弱信号和单光子探测的理想光电器件。然而随着先进器件结构越来越复杂,厚度尺寸从量子点到几微米不等,性能越来越受材料中晶格缺陷的影响和工艺条件的制约。采用固态源分子束外延（MBE）技术分别在As和P气氛保护下对InP衬底进行脱氧处理并外延生长晶格匹配的In_0.53Ga_0.47As薄膜和APD结构材料。实验结果表明,As脱氧在MBE材料质量方面比P脱氧具有明显的优势,可获得陡直明锐的异质结界面,降低载流子浓度,提高霍尔迁移率,延长少子寿命,并抑制器件中点缺陷或杂质缺陷引起的暗电流。因此,As脱氧可以有效提高MBE材料的质量,这项工作优化了InP衬底InGaAs/InP外延生长参数和器件制造条件。     

Molecular beam epitaxial growth of InGaAsSb on (100) GaSb with emission wavelength in the 2 to 2.5 μm range

Molecular beam epitaxial growth ofIn _x Ga _1−x As _y Sb _1−y lattice-matched to (100) GaSb substrate withx up to 0.26 is reported.As ₂ andSb ₂ sources were used and growth was studied in the temperature range of 490° C ∼ 570° C. Alloys with room temperature photoluminescence peak wavelengths as long as 2.5 μ have been grown with specular morphology. The low temperature photoluminescence of In_0.26Ga_0.74As_0.19Sb_0.81 measured at 1.8 K has a narrow peak at 2.23 μm with a full width at half maximum of 10 meV. This composition is inside the miscibility gap. These results indicate that metastable InGaAsSb alloys with optical device quality can be grown by molecular beam epitaxy.