聚氯醇醚聚氨酯胶粘剂的研究

本文以环氧氯丙烷聚醚、环氧丙烷聚醚及其混合物、环氧丙烷—环氧氯丙烷共聚醚与甲苯二异氰酸酯反应制得预聚体;以三羟甲基丙烷和二乙醇胺为交联剂,制得一系列聚醚型聚氨酯胶粘剂,并对不同配方,不同固化条件及单组分和双组分的胶对粘接强度的影响作了初步的研究。结果表明:1、胶粘剂的粘接强度与硬段含量、聚环氧氯丙烷聚醚的含量成正比;2、室温下,共聚醚聚氨酯胶粘剂的粘接强度比共混聚醚聚氨酯胶粘剂的粘接强度大;3、用分子量分布宽的聚醚制成的胶粘剂,有较好的粘接强度。     

低温固化阻燃环氧胶粘剂的研制

介绍了一种(-3~4)℃/30 h固化、阻燃抑烟性能优异、低毒、具有良好粘接强度和综合性能的环氧树脂胶粘剂。论述了阻燃胶粘剂配方的选择、环氧树脂的低温固化机理和固化性能,讨论了无机复合阻燃抑烟填料对胶粘剂性能的影响。     

氰基胺固化的水下环氧胶粘剂

本文给出一种以氰基胺固化的水下环氧胶粘剂的配方。并且通过实验证明了:普通脂肪胺与环氧化合物部分预聚后,可作为水下环氧胶粘剂的固化剂,能有效地提高水中粘接强度;吸水性材料对水下环氧胶粘剂的粘接强度起增强的作用。     

用于木材粘接的反应型聚氨酯胶粘剂

本文讨论了反应型聚氨酯胶粘剂的配方及其在木材粘接中应用。重点讨论单组分液体型、热熔型和木材复合板粘接用反应型、湿气固化聚氨酯胶粘剂。     

MQ硅树脂改性增强特种炸药用胶粘剂

西南科技大学的谢长琼等人采用共混填充法制备了MQ硅树脂增强的粘接炸药用室温硫化硅橡胶胶粘剂。测试结果表明：采用该胶粘剂粘接炸药时,其剪切强度由1MPa增加到3．2MPa;当硅橡胶中填充10％的MQ硅树脂时,MQ硅树脂在硅橡胶中分散均匀,能较好的补强硅橡胶;交联剂和催化剂的质量分数为1．5％和0．3％时,胶粘剂的硫化速度和粘接性能满足要求。     

含二氮杂萘酮结构环氧胶粘剂的研制

以低分子质量舍二氮杂萘酮结构环氧树脂与环氧树脂E44配合作为胶粘剂基料，低分子聚酰胺(H-4)为固化剂，试制了一种在常温及中温下都有较好粘接性能的环氧胶粘剂。当配方为m(E44)：m(ER)：m(H-4)=4:4:9时．在180℃下固化3h后，测其常温下的拉伸剪切强度为17．65MPa，80℃下为19．71MPa。并研究了固化工艺对粘接性能的影响。     

溶剂型快干胶粘剂

溶剂型快干胶粘剂用于热塑性塑料ABS和高抗冲聚苯乙烯塑料的粘接,其粘接力强,固化快,固化时不加压,能适应于电视机外壳连续化生产的工艺要求。本文介绍了该胶粘剂的配方及其主要性能。     

PVC用UV固化聚氨酯丙烯酸酯胶粘剂的研究

采用聚氨酯丙烯酸酯预聚体,添加光引发剂、活性稀释剂、增塑剂及偶联剂等制成PVC用UV固化胶粘剂。结果表明,当活性稀释剂质量分数为20％-25％,且mHDDA：mTGPDA：mPO3TMPTA=2：2：1、硅烷偶联剂质量分数为3％-5％、光引发剂用量为3％～5％,且m1173：m184=1．0：1．5时,用自制表面处理剂对PVC进行处理,胶粘剂粘接的剪切强度为15MPa．综合性能较好。适合于软质PVC的粘接。     

废弃复合绝缘子硅橡胶颗粒胶粘剂的制备与性能研究

以室温固化硅橡胶为胶粘剂,对废弃复合绝缘子硅橡胶颗粒粘结配方进行了初步研究。研究结果表明:胶粘剂配方中的交联剂、催化剂、补强材料以及表面处理方式对粘接性能均有影响。优化后的胶粘剂配方为:107硅橡胶100份、D-20(甲基三甲氧基硅烷)20份、气相法白炭黑5份、二月桂酸二丁基锡0.5份,且对白炭黑和硅橡胶颗粒表面均用KH-560进行处理的条件下,所获得的粘接材料力学性能较佳。     

开孔聚酰亚胺泡沫粘接性能研究

探讨了BHPI-J-2010胶粘剂的固化度、耐热性、固化工艺、粘接铝的拉剪强度及粘接聚酰亚胺泡沫的可行性;研究了BHPI—J-2010胶粘剂粘接聚酰亚胺泡沫／45号钢的拉伸性能及固化工艺;考查了开孔聚酰亚胺泡沫／45号钢粘接试样高温拉伸和蠕变性能及胶粘剂的使用寿命。结果表明,BHPI—J-2010胶粘剂对开孔聚酰亚胺泡沫具有良好的粘接性能。     

92％乙酰甲胺磷可溶粒剂的研制及药效试验

[方法]采用挤压造粒的加工工艺,对92％乙酰甲胺磷可溶粒剂的配方进行了研制,尤其对黏结剂的种类和用量、制剂加工过程中水的添加量进行了筛选.[结果]通过室内毒力测定和田间药效试验,筛选出最佳配方:含量97％乙酰甲胺磷的质量分数为95％,黏结剂SND的质量分数为3％,增效剂JZ的质量分数为2％.[结论]配方制得的92％乙酰甲胺磷可溶粒剂药效明显优于30％乙酰甲胺磷乳油.     

冷法新型淀粉胶黏剂的制备

论述了新型淀粉胶黏剂的合成方法。以硫酸铜代替传统用硫酸亚铁作催化剂,选用草酸作胶黏剂脱色剂,采用冷法制备新型淀粉胶黏剂。结果表明：当催化剂硫酸铜用量为0.12%时,以黏度和初粘力为评价指标,通过正交试验确定了淀粉胶黏剂的最佳配方为：水77.9%,淀粉17.3%,双氧水0.28%,氢氧化钠1.3%,硼砂0.12%,单因素实验草酸添加量为2.9%时即可得到良好脱色效果,制备的胶液乳白色,扩大了产品适用范围。     

双组分高固含量水性聚氨酯鞋胶的制备

报道了一种用于鞋胶的双组分水性聚氨酯胶粘剂,包括50％以上的高固含量水性聚氨酯分散体及水可分散多异氰酸酯固化剂的制备。测试结果表明,本实验所制得的样品具有较低的活化温度,范围在50- 75℃之间,且具有很好的耐热温度,耐温高达110℃。所制备的高固含量水性聚氨酯表现出优越的粘接性能,未加固化剂的单组分水性聚氨酯剥离强度(PVC／PVC)高达8．8N／mm。     

The influence of water when bonding with heat-curing epoxy adhesives on sealed sulphuric acid-anodised aluminium

In this paper, it is demonstrated how the formation of blisters or foaming in a heat-curing epoxy adhesive can be avoided during bonding to sealed sulphuric acid-anodised aluminium. The crucial points to control are the release of water from the anodic film and the total amount of water in the joint. The cure cycle will affect the rate of water release, while the total amount to a large degree depends on the relative humidity in the area of bonding before joint assembly. Besides the adhesive, also the anodic film absorbs water within a short time scale. This behaviour is caused by aluminium sulphate, which is always present in the anodic film after sulphuric acid anodisation. At room temperature the aluminium sulphate is in equilibrium with water vapour at about 30% r.h. It has been experimentally demonstrated that the amount of water stored in the anodic film has a dramatic step change between 30% and 40% r.h. at room temperature. Outside this range up to condensing conditions differences are relatively small. The release of water during the curing of the adhesive can in addition to blistering or gassing also cause a boundary layer with changed properties in between the adhesive and the anodic film.     

Effects of water on the curing and properties of epoxy adhesive used for bonding FRP composite sheet to concrete

When a concrete surface is contaminated by water due to rain, saline water, ground water, and water jetty treatment, water, alkalis, and other contaminants on the concrete surface may interact with an epoxy adhesive used for bonding fiber‐reinforced polymer composite sheets to concrete. This can influence both the curing rate and the degree of cure of the curing reaction. This in turn can affect the time required for field application. It can also influence the mechanical properties and durability of epoxy adhesives. In this paper, water effects on the curing and properties of two kinds of commercial adhesives were evaluated. Curing kinetics were studied using isothermal DSC analysis. Results showed that water accelerated the curing reaction. However, excess water offsets part of the accelerating effect. While water is typically considered to be harmful to properties of adhesives, it was seen that a small amount (less than 2%) of water improved degree of cure, mechanical properties, and durability of adhesives. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 2261–2268, 2004     

Cure simulations of thick adhesive bondlines for wind energy applications

Curing of adhesive bondlines is a critical and time-consuming operation in wind turbine blade manufacturing. Significant variation in adhesive thickness can lead to important differences in thermal histories trough the adhesive bonds due to the exothermic nature of the cure process. Reducing bondline cure cycle time and avoiding adhesive overheating are two competing factors in the design of cure temperature cycles. Predictive models on the impact of adhesive thickness variability in bondline cure temperature cycle is currently limited. Adhesive curing and temperature evolution can be simulated by finite element (FE) models coupling the heat transfer problem with the cure kinetics of the adhesive. The cure kinetics of the adhesive system was characterized by isothermal differential scanning calorimetry experiments and implemented in the FE software Abaqus/CAE by user subroutines. Predictions from the FE model were validated experimentally against temperature readings from the curing of 10, 20, and 30 mm thick adhesive bondlines. To highlight the role that predictive models potentially have in the optimization of bondline cure cycles a 2D cross section model representing the trailing edge of a wind turbine blade was used as case study. It was demonstrated that computational models enable customizing cure profiles for nonuniform adhesive thicknesses, ensuring fully cured bondlines with acceptable mechanical properties.     

新型复合板材用聚氨酯胶粘剂的研究

本文介绍了铝－塑复合板用聚氨酯胶粘剂的合成方法,讨论了原料配比反应温度、水含量、NCO／OH的配比对粘合性能和剥离强度的影响。     

In situ cure monitoring of adhesively bonded joints by dielectrometry

Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesives, the in situ cure monitoring during the cure of adhesive joints could improve the quality of adhesively bonded joints as it enables one to control the cure parameters. In this work, a dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. Steel adherends were used for the adhesively bonded joints because the steel adherends worked as the electrodes for the measurement of dissipation factor without additional electrodes. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is largely affected by the degree of cure and temperature of adhesive. Comparing the results obtained by the method developed with those by DSC (differential scanning calorimetry), it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.     

后固化具有膨胀性的耐高温厌氧胶粘剂的研究

对N,N-间苯双马来酰亚胺、聚酰亚胺、甲基丙烯酸金属盐等对厌氧胶耐温性的影响进行了研究,研制出一种耐温230℃、后固化具有膨胀性的厌氧胶,该胶由乙氧化双酚A二甲基丙烯酸酯、N,N-间苯双马来酰亚胺及引发剂、促进剂、稳定剂等组成,该胶粘剂在第一固化温度梯度(常温)部分固化,在第二固化温度梯度(180℃)后固化时,N,N-间苯双马来酰亚胺与主体交联在一起,2小时后体积膨胀约0.2%,形成热固性材料,可耐温230℃。     

The Effect of Adherends on the Curing of an Epoxy Adhesive

The effect of E-glass, cured vinyl ester resin, and silica gel on the curing of an epoxy-anhydride adhesive was examined. The techniques used were calorimetry in both isothermal and scanning modes and Fourier transform infrared spectroscopy in the attenuated total reflectance (ATR-FTIR) mode. Isothermal calorimetry was used to obtain the exotherm, conversion rate, and curing kinetic parameters, and scanning calorimetry was used to obtain the glass transition temperature. ATR-FTIR was used to study the curing kinetics and chemistry of the adhesive. The results suggest either the immobilization of a layer of the epoxy adhesive adjacent to inert solid surfaces or selective adsorption of the accelerator or both, each of which suppresses the cure reaction. This was reversed by the presence of adsorbed water. At least for this epoxy-anhydride system, adsorbed water seems to have had the beneficial effect of increasing the crosslink density in the interfacial region between the adhesive and adherend. Water seems also to change the overall cure reaction, causing more ether formation and less ester formation than without water. An additional finding was that the cured vinyl ester surface appeared to have a catalytic effect on the reaction, perhaps in conjunction with the accelerator, benzyldimethylamine.