Design and anaylsis of a 2.5-Gbps optical receiver analog front-end in a 0.35-/spl mu/m digital CMOS technology

This paper presents the design of an optical receiver analog front-end circuit capable of operating at 2.5 Gbit/s. Fabricated in a low-cost 0.35-/spl mu/m digital CMOS process, this integrated circuit integrates both transimpedance amplifier and post limiting amplifier on a single chip. In order to facilitate high-speed operations in a low-cost CMOS technology, the receiver front-end has been designed utilizing several enhanced bandwidth techniques, including inductive peaking and current injection. Moreover, a power optimization methodology for a multistage wide band amplifier has been proposed. The measured input-referred noise of the optical receiver is about 0.8 /spl mu/A/sub rms/. The input sensitivity of the receiver front-end is 16 /spl mu/A for 2.5-Gbps operation with bit-error rate less than 10/sup -12/, and the output swing is about 250 mV (single-ended). The front-end circuit drains a total current of 33 mA from a 3-V supply. Chip size is 1650 /spl mu/m/spl times/1500 /spl mu/m.     

A 90-dBΩ 10-Gb/s Optical Receiver Analog Front-End in a 0.18-μm CMOS Technology

A 10-Gb/s 90-dBOmega optical receiver analog front-end (AFE), including a transimpedance amplifier (TIA), an automatic gain control circuit, and a postamplifier (PA), is fabricated using a 0.18-mum CMOS technology. In contrast with a conventional limiting amplifier architecture, the PA is consisted of a voltage amplifier followed by a slicer. By means of the TIA and the PA codesign, the receiver front-end provides a -3-dB bandwidth of 7.86 GHz and a gain bandwidth product (GBW) of 248.5 THz-Omega. The tiny photocurrent received by the AFE is amplified to a differential voltage swing of 900 mV_pp when driving 50-Omega output loads. The measured input sensitivity of the optical receiver is -13 dBm at a bit-error rate of 10^-12 with a 2³¹-1 pseudorandom test pattern. The optical receiver AFE dissipates a total power of 199 mW from a 1.8-V supply, among which 35 mW is consumed by the output buffer. The chip size is 1300 mumtimes1796 mum     

单片集成CMOS光接收前端电路设计

文中采用SMIC 0.18μm CMOS工艺设计了适用于芯片间光互连的的接收机前端放大电路,将跨阻放大器(TIA)和限幅放大器(LA)集成于同一块芯片中.跨阻放大器采用调制型共源共栅(RGC)结构来提高其带宽,限幅放大器采用二阶有源反馈结构和有源电感负载来获得高的增益带宽积.整个接收机前端放大电路具有85dB中频增益,-3dB带宽为4.36GHz.芯片的面积为1mm×0.7mm,在1.8V电源电压下功耗为144mW.     

10 Gb/s OEIC optical receiver front-end and 3.125 Gb/s PHEMT limiting amplifier

A 10 Gb/s OEIC (optoelectronic integrated circuit) optical receiver front-end has been studied and fab ricated based on the φ-76 mm GaAs PHEMT process; this is the first time that a limiting amplifier (LA) has been designed and realized using depletion mode PHEMT. An OEIC optical receiver front-end mode composed of an MSM photodiode and a current mode transimpedance amplifier (TIA) has been established and optimized by simu lation software ATLAS. The photodiode has a bandwidth of 10 GHz, a capacitance of 3 fF/μm and a photosensitive area of 50×50 μm~2. The whole chip has an area of 1511×666 μm~2. The LA bandwidth is expanded by spiral inductance which has been simulated by software HFSS. The chip area is 1950×1910μm~2 and the measured results demonstrate an input dynamic range of 34 dB (10-500 mVpp) with constant output swing of 500 tnVpp.     

A CMOS analog front-end IC for portable EEG/ECG monitoring applications

A new digital programmable CMOS analog front-end (AFE) IC for measuring electroencephalograph or electrocardiogram signals in a portable instrumentation design approach is presented. This includes a new high-performance rail-to-rail instrumentation amplifier (IA) dedicated to the low-power AFE IC. The measurement results have shown that the proposed biomedical AFE IC, with a die size of 4.81 mm/sup 2/, achieves a maximum stable ac gain of 10 000 V/V, input-referred noise of 0.86 /spl mu/ V/sub rms/ (0.3 Hz-150 Hz), common-mode rejection ratio of at least 115 dB (0-1 kHz), input-referred dc offset of less than 60 /spl mu/V, input common mode range from -1.5 V to 1.3 V, and current drain of 485 /spl mu/A (excluding the power dissipation of external clock oscillator) at a /spl plusmn/1.5-V supply using a standard 0.5-/spl mu/m CMOS process technology.     

A 40 Gbit/s fully integrated optical receiver analog front-end in 90 nm CMOS

A fully integrated 40 Gbit/s optical receiver analog front-end (AFE) including a transimpedance amplifier (TIA) and a limiting amplifier (LA) for short distance communication is described in this paper.The proposed TIA employs a modified regulated cascode (RGC) configuration as input stage,and adopts a third order interleaving active feedback gain stage.The LA utilizes nested active feedback,negative capacitance,and inductor peaking technology to achieve high voltage gain and wide bandwidth.The tiny photo current received by the receiver AFE is amplified to a single-ended voltage swing of 200 mV(p p).Simulation results show that the receiver AFE provides conversion gain of up to 83 and bandwidth of 34.7 GHz,and the equivalent input noise current integrated from 1 MHz to 30 GHz is about 6.6 μA(rms).     

1-Gb/s 80-dB/spl Omega/ fully differential CMOS transimpedance amplifier in multichip on oxide technology for optical interconnects

A 1-Gb/s differential transimpedance amplifier (TIA) is realized in a 0.25-/spl mu/m standard CMOS technology, incorporating the regulated cascode input configuration. The TIA chip is then integrated with a p-i-n photodiode on an oxidized phosphorous-silicon (OPS) substrate by employing the multichip-on-oxide (MCO) technology. The MCO TIA demonstrates 80-dB/spl Omega/ transimpedance gain, 670-MHz bandwidth for 1-pF photodiode capacitance, 0.54-/spl mu/A average input noise current, -17-dBm sensitivity for 10/sup -12/ bit-error rate (BER), and 27-mW power dissipation from a single 2.5-V supply. It also shows negligible switching noise effect from an embedded VCO on the OPS substrate. Furthermore, a four-channel MCO TIA array is implemented for optical interconnects, resulting in less than -40-dB crosstalk between adjacent channels.     

Bandwidth enhancement for transimpedance amplifiers

A technique for bandwidth enhancement of a given amplifier is presented. Adding several interstage passive matching networks enables the control of transfer function and frequency response behavior. Parasitic capacitances of cascaded gain stages are isolated from each other and absorbed into passive networks. A simplified design procedure, using well-known low-pass filter component values, is introduced. To demonstrate the feasibility of the method, a CMOS transimpedance amplifier (TIA) is implemented in a 0.18-/spl mu/m BiCMOS technology. It achieves 3 dB bandwidth of 9.2 GHz in the presence of a 0.5-pF photodiode capacitance. This corresponds to a bandwidth enhancement ratio of 2.4 over the amplifier without the additional passive networks. The transresistance gain is 54 dB/spl Omega/, while drawing 55 mA from a 2.5-V supply. The input sensitivity of the TIA is -18 dBm for a bit error rate of 10/sup -12/.     

1.25-Gb/s regulated cascode CMOS transimpedance amplifier for Gigabit Ethernet applications

A transimpedance amplifier (TIA) has been realized in a 0.6-/spl mu/m digital CMOS technology for Gigabit Ethernet applications. The amplifier exploits the regulated cascode (RGC) configuration as the input stage, thus achieving as large effective input transconductance as that of Si Bipolar or GaAs MESFET. The RGC input configuration isolates the input parasitic capacitance including photodiode capacitance from the bandwidth determination better than common-gate TIA. Test chips were electrically measured on a FR-4 PC board, demonstrating transimpedance gain of 58 dB/spl Omega/ and -3-dB bandwidth of 950 MHz for 0.5-pF photodiode capacitance. Even with 1-pF photodiode capacitance, the measured bandwidth exhibits only 90-MHz difference, confirming the mechanism of the RGC configuration. In addition, the noise measurements show average noise current spectral density of 6.3 pA//spl radic/(Hz) and sensitivity of -20-dBm for a bit-error rate of 10/sup -12/. The chip core dissipates 85 mW from a single 5-V supply.     

基于0.18μm CMOS工艺2.5Gb/s宽动态范围光接收机前端放大电路设计

基于0.18μm CMOS工艺设计了适用于2.5Gb/s传输速率的宽动态范围光接收机前端放大电路（包括前置放大器和限幅放大器）.前置放大器采用了RGC输入级的跨阻放大器,并且应用了消直流电路和自动增益控制电路扩展输入动态范围.限幅放大器采用了按比例缩小尺寸、并联峰化和带有有源负反馈的Cherry-Hooper放大器等方法扩展带宽.仿真结果表明：前端放大电路的中频增益为116dBΩ,-3dB带宽为2.13GHz,输入信号动态范围为40dB（0.01～1mA）.     

A highly integrated analog front-end for 3G

This paper describes a reconfigurable analog front-end (AFE) and audio codec IC supporting the wideband code division multiple access (WCDMA) standard. The chip is fabricated on Intel's 0.18-/spl mu/m (SOC) flash+logic+analog (FLA) process technology using a 0.35-/spl mu/m feature size analog transistor. The transmit path contains a 10-bit segmented rail-to-rail digital-to-analog converter, automatically tunable active RC filter, and programmable gain amplifier (PGA) with self-tuning gain and offset correction circuit. The receive path incorporates a PGA, active RC filter, and an 8-bit analog-to-digital converter with built-in offset correction. The AFE operates at 2.7 V with a current consumption of 55 mA and total active area of 15 mm/sup 2/.     

A 2.5-mW SOS CMOS optical receiver for chip-to-chip interconnect

This paper reports on the design of a differential optical receiver in silicon-on-sapphire (SOS) complementary metal-oxide-semiconductor (CMOS). The low-power characteristics (2.5 mW) and small footprint make it a good candidate for two-dimensional optoelectronic interchip interconnects where the transparency of the substrate facilitates system integration and packaging. A differential transimpedance amplifier (TIA) with positive feedback at the front end extends the bandwidth of traditional differential TIAs when the capacitance of the photodetector is smaller than the capacitance of the gates in the differential pair. The full receiver tested in the 0.5-/spl mu/m ultrathin silicon (UTSi) SOS-CMOS Peregrine process consumes 2.5 mW when operated at or near gigabit rates, with bit-error rates of better than 10/sup -12/ taken at 750 Mb/s.     

A 0.18 μm CMOS TIA Plus Limiting Amplifier with a 5.3 GHz Overall Bandwidth for Fiber Optic Communications

A shunt series feedback transimpedance amplifier (TIA), based on a current amplifier using a zero–pole cancellation, followed by a 6 stages limiting amplifier (LA), proves to be suitable as receiver front-end for a 8 Gb/s communications over fiber optic. The front-end is realized with a 0.18 μm CMOS technology, and shows the following performances: the TIA has a 50 dBΩ transimpedance gain and 5.5 GHz bandwidth, the LA has a 46 dB gain and 7.9 GHz bandwidth. The differential voltage swing at the output is 300 mV. The total power consumption is 112 mW.     

A 1.2 mW RDS receiver for portable applications

A 0.9 V 1.2 mA fully integrated radio data system (RDS) receiver for the 88-108 MHz FM broadcasting band is presented. Requiring only a few external components (matching network, VCO inductors, loop filter components), the receiver, which has been integrated in a standard digital 0.18 /spl mu/m CMOS technology, achieves a noise figure of 5 dB and a sensitivity of -86dBm. The circuit can be configured and the RDS data retrieved via an I/sup 2/C interface so that it can very simply be used as a peripheral in any portable application. A 250 kHz low-IF architecture has been devised to minimize the power dissipation of the baseband filters and FM demodulator. The frequency synthesizer consumes 250 /spl mu/A, the RF front-end 450 /spl mu/A while providing 40 dB of gain, the baseband filter and limiters 100 /spl mu/A, and the FM and BPSK analog demodulators 300 /spl mu/A. The chip area is 3.6 mm/sup 2/.     

On the performance analysis and design of an integrated front-end PIN/HBT photoreceiver

A detailed study on the performance analysis and optimum design of an integrated front-end PIN/HBT photoreceiver for fiber-optic communication is presented. Receiver circuits with two different transimpedance amplifiers-a single-stage common emitter (CE) amplifier and a three-stage amplifier comprising a CE amplifier and two emitter followers (EFs), are analyzed assuming a standard load of 50 /spl Omega/. A technique to include the transit-time effect of a PIN photodetector on the overall receiver circuit analysis is introduced and discussed. Gain-bandwidth product (GB) and gain-bandwidth-sensitivity measure product (GBS) are obtained as functions of feedback resistance (R/sub F/) and various device parameters. Hence, some optimum designs are suggested using a photodetector of area 100 /spl mu/m/sup 2/ and with a feedback resistance of 500 /spl Omega/. The bandwidth plays a major role in determining the optimum designs for maximum GB and maximum GBS. A bandwidth >8 GHz has been obtained for the photoreceiver even with a single-stage CE amplifier. The optimum design for a receiver with a three-stage amplifier shows a bandwidth of 35 GHz which is suitable for receivers operating well beyond 40 Gb/s; however, in this case, the gain is reduced. The performance of different fixed square-emitter structures are investigated to choose the optimum designs corresponding to different gains. Very low power dissipation has been estimated for the optimized devices. The noise performance of the devices with optimum designs was calculated in terms of the minimum detectable optical power for a fixed bit-error rate of 10/sup -9/. The present design indicates that GB and noise performance can be improved by using an optimum device design.     

应用于10Gb/s光接收机的全差分CMOS跨阻前置电路设计

设计了一种的低成本、低功耗的10 Gb/s光接收机全差跨阻前置放大电路。该电路由跨阻放大器、限幅放大器和输出缓冲电路组成,其可将微弱的光电流信号转换为摆幅为400 mVpp的差分电压信号。该全差分前置放大电路采用0.18 m CMOS工艺进行设计,当光电二极管电容为250 fF时,该光接收机前置放大电路的跨阻增益为92 dB,-3 dB带宽为7.9 GHz,平均等效输入噪声电流谱密度约为23 pA/(0~8 GHz)。该电路采用电源电压为1.8 V时,跨阻放大器功耗为28 mW,限幅放大器功耗为80 mW,输出缓冲器功耗为40 mW,其芯片面积为800 m1 700 m。     

A Single-Chip 2.5-Gb/s CMOS Burst-Mode Optical Receiver

This paper describes the design of a 2.5-Gb/s burst-mode optical receiver in a 0.18-mum CMOS process. A dual-gain-mode transimpedance amplifier (TIA) with constant damping factor control is proposed to tolerate a wide dynamic range input signal. By incorporating an automatic threshold tracking circuit (ATC), the TIA and limiting amplifier (LA) are dc coupled with feedforward offset cancellation. Dual-band filters are adopted in the ATC for a rapid response time while keeping the tracking error small. By integrating both a TIA and a post-LA in a single chip, the burst-mode receiver provides a conversion gain of 106 dBmiddotOmega in the high gain mode, 97 dBmiddotOmega in the low gain mode, and a -3-dB bandwidth of 1.85 GHz. The measured input sensitivity, overload level, and dynamic range of the optical receiver are -19 dBm, -2 dBm, and 17 dB, respectively. The response time is less than 50 ns. Operating under a single 1.8-V supply, this chip dissipates only 122 mW.     

1.65 /spl mu/m-band optical amplification with Er/sup 3+/-doped fluorozirconate fibre using 0.8 /spl mu/m upconversion pumping

In order to expand the available bandwidth for wavelength division multiplexing transmission systems, a 1.65 /spl mu/m-band optical fibre amplifier with Er/sup 3+/-doped fluorozirconate fibre using 0.8 /spl mu/m upconversion pumping has been demonstrated. The positive gain, 3.8 dB, is the first ever achieved by means of (/sup 2/H/sub 11/2/, /sup 4/S/sub 3/2/) /spl rarr/ /sup 4/I/sub 9/2/ stimulated emission transition.     

A 10-Gb/s receiver with series equalizer and on-chip ISI monitor in 0.11-/spl mu/m CMOS

A 10-Gb/s receiver is presented that consists of an equalizer, an intersymbol interference (ISI) monitor, and a clock and data recovery (CDR) unit. The equalizer uses the Cherry-Hooper topology to achieve high-bandwidth with small area and low power consumption, without using on-chip inductors. The ISI monitor measures the channel response including the wire and the equalizer on the fly by calculating the correlation between the error in the input signal and the past decision data. A switched capacitor correlator enables a compact and low power implementation of the ISI monitor. The receiver test chip was fabricated by using a standard 0.11-/spl mu/m CMOS technology. The receiver active area is 0.8 mm/sup 2/ and it consumes 133 mW with a 1.2-V power supply. The equalizer compensates for high-frequency losses ranging from 0 dB to 20 dB with a bit error rate of less than 10/sup -12/. The areas and power consumptions are 47 /spl mu/m /spl times/ 85 /spl mu/m and 13.2 mW for the equalizer, and 145 /spl mu/m /spl times/ 80 /spl mu/m and 10 mW for the ISI monitor.     

Self-biased cross-coupled low-cost fully-differential CMOS operational amplifier

A low-cost fully-differential operational amplifier (opamp) using a novel self-biased cascode output stage and cross-coupled input stage is proposed. Fabricated in only an 84/spl times/67 /spl mu/m/sup 2/ area with TSMC 0.35 /spl mu/m technology, and loaded with more than 100 pF capacitance, the opamp possesses 60 dB DC gain, 3 V//spl mu/s slew rate, 7.8 MHz unity-gain bandwidth, and -48 dB total harmonic distortion.