一种微机械压阻式加速度传感器及其设计优化

给出了一种新型的微梁直拉直压的微机械压阻式加速度传感器的工作原理。该设计能同时提高传感器的灵敏度和自由振动频率。基于分析模型 ,本文还给出了传感器的结构优化和各种量程的设计规则。采用SOI硅片和深反应离子刻蚀 (DRIE)工艺给出了传感器的制造和测试结果     

风车型低频压电振动能量采集器的研究与设计

基于微机电系统（MEMS）设计了风车型结构的压电振动能量采集器,通过压电效应将低频振动能量转化为电能,用以解决环境中低频能量采集的问题。风车型结构的压电振动能量采集器以硅为基底,以PZT 5A为压电材料,包含上、下电极;4条悬臂梁旋转连接中心质量块与四周固定端,类似于风车结构。数学建模与有限元仿真分析表明,在结构尺寸与材料相同的情况下,圆弧风车型结构的谐振频率较直接连接、直角连接结构的谐振频率更低;4条悬臂梁距离中心质量块越远,谐振频率越低;在0.1g(g=9.8 m/s2)加速度谐振状态下,输出电压约为6.2 V,最大位移接近1.2 mm。基于MEMS工艺,通过IntelliSuite软件研究和定义了风车型振动能量采集器的工艺流程。     

A Branched Beam-Based Vibration Energy Harvester

In this paper, a strategy to utilize a branched beam system to improve the frequency response characteristic of vibration energy harvesting is demonstrated. A basic unit of the device consists of several branch beams with proof mass at their ends and one main cantilever beam with a piezoelectric component at its root and proof mass at its end. The device can utilize the resonance of the branch beams and main beam to generate multiple output voltage peaks, providing a better frequency response characteristic than that of the conventional piezoelectric vibration energy harvester. Multiple branch structure and multiple basic units with similar structures can be connected to generate more output voltage peaks in the frequency response characteristic. Only one piezoelectric component is needed in the device, which makes it competitive in the management of harvested electric energy.     

MOS环振式数字加速度传感器

提出了一种新的环振式数字加速度传感器,它采用做在硅梁上的MOS环形振荡器作为敏感元件,两个反方向变化的环振输出信号通过集成在片内的混频器实现频率相减.该传感器具有准数字输出、灵敏度高、温度系数低以及制作工艺简单等特点.分析了环形振荡器的频率特性,以及环形振荡器的谐振频率和加速度的关系,分析并设计了加速度传感器的环形振荡器电路、混频器电路、物理结构以及制作工艺,并制作了样品,其灵敏度为6 .91k Hz/g.     

Continuous-wave operation of single-transverse-mode 1310-nm VCSELsup to 115°C

Long-wavelength vertical cavity surface emitting lasers (VCSELs) have thus far not provided substantial continuous-wave (CW) output power above 70°C. We describe recent advances using a vertically integrated 850 nm optical pump with a 1310-nm VCSEL. Using this approach, the devices described demonstrate record high temperature performance. We show single-transverse mode CW operation from -40 to +115°C, 0.5 mw optical power up to +85°C, and excellent device uniformity     

全固态激光器的数字式光反馈控制驱动电源

介绍一种采用单片机控制的连续运转无制冷、数字式光反馈稳功率全固态激光器驱动电源,其输出光功率在10mW左右,系统包括恒流源、保护电路、脉宽调制、光电池检测放大电路和高速单片机控制系统等部分,基于光电池检测LD光功率输出的非线性控制曲线产生的误差变化,将特性曲线利用软件的窗口控制算法实现区域控制,进而有效地对LD工作电流进行PID稳态控制和光功率参数显示,结合硬件及软件,实现了激光二极管的可靠保护以及光功率稳定、准确输出及在稳光输出情况下,实现激光器的内外调制输出。     

A three-axis micromachined accelerometer with a CMOS position-senseinterface and digital offset-trim electronics

This paper describes a three-axis accelerometer implemented in a surface-micromachining technology with integrated CMOS. The accelerometer measures changes in a capacitive half-bridge to detect deflections of a proof mass, which result from acceleration input. The half-bridge is connected to a fully differential position-sense interface, the output of which is used for one-bit force feedback. By enclosing the proof mass in a one-bit feedback loop, simultaneous force balancing and analog-to-digital conversion are achieved. On-chip digital offset-trim electronics enable compensation of random offset in the electronic interface. Analytical performance calculations are shown to accurately model device behaviour. The fabricated single-chip accelerometer measures 4×4 mm², draws 27 mA from a 5-V supply, and has a dynamic range of 84, 81, and 70 dB along the x-, y-, and z-axes, respectively     

干涉型集成光学加速度计信号处理及SOPC设计

介绍了集成光学芯片、光纤质量块简谐振子和可编程片上系统(SOPC)混合集成光学加速度计的设计方法。采用迈克尔逊干涉方法实现加速度信号光相位调制,综合交流相位跟踪零差补偿技术(PTAC)和合成外差信号解调技术(SHSD)补偿误差并解调出加速度信号,应用SOPC技术设计和实现数字信号处理(DSP)系统,同时实现DSP和智能化数据传输接口并行工作,使系统实时、线性地跟踪到加速度信号。系统设计灵敏度达4.8902V/g。实际测量灵敏度达4.62V/g,工作频带10~1066Hz。     

基于压电振子的振动能量捕获行为研究

压电振子是实现振动能量捕获的重要基础,它的结构参数对其发电量和固有频率产生直接影响,需要进行优化设计.该文针对悬臂梁压电振子结构,采用ANSYS有限元建模方法,进行了静力学及模态仿真分析.研究了压电振子的各参数和质量块对其发电量、固有频率的影响规律,设计并搭建了实验台进行实验研究.实验结果验证了仿真分析的正确性,为压电振子的优化设计提供了依据.     

Silicon that moves-towards the smart sensor

The author describes an electronic accelerometer based on capacitive measurement. It is based on the simple parallel-plate capacitor: one plate is fixed, while the other moves relative to it under acceleration, which causes the capacitance to change. One example of this approach is the Analog Devices ADXL-50, manufactured by surface micromachining. The ADXL 50 consists of a variable differential air capacitor whose plates are etched from a single 2 μm piece of silicon. The fixed plates are simple cantilever beams, supported 1 μm above the chip in free space by polysilicon anchors that form a molecular bond with the chip. The thicker central mass is free to move in a plane perpendicular to the tethers. A series of regular fine elements project from the central mass, each acting as a parallel-plate capacitor. As capacitance is inversely proportional to the distance between the plates, the device has been designed to have the finest gap possible using photolithographic machines, to give the largest possible signal. The operation of the device is briefly discussed     

A high performance Σ-Δ readout circuitry for μg resolution microaccelerometers

This paper reports a second order electromechanical sigma-delta readout for micro-g resolution accelerometers in addition to other high-sensitivity capacitive microsensors with large base capacitance. The chip implements a switched-capacitor readout front-end and an oversampled sigma-delta modulator, and hence can be used for both open-loop analog readout and closed-loop control and readout with direct digital output. The readout circuit has more than 115 dB dynamic range and can resolve less than 3 aF/√Hz. Also this IC includes start-up circuit and feedback mechanism for closed-loop control of the accelerometer with a single 5 V supply in a ±4 g range. Together with the accelerometer, bandwidth of the overall system is limited with the sensor resonance frequency (1.53 kHz) in the open-loop mode. However in closed loop mode, oversampling of the acceleration data increases the bandwidth of the system up to few hundred kilohertz which is limited with the cut-off frequency of the low-pass filter placed at the output of the system. The start-up circuit allows rebalancing of a thick silicon proof mass with the limited 5 V supply after system start from power down or in the case of over-range input acceleration. The readout chip has been combined with a Silicon-On-Glass lateral accelerometer, which has a high sensitivity of 1.88 pF/g with large proof mass and long finger structures. A digital filtration and decimation circuitry is also implemented to signal process the output bit stream of the readout circuit. The complete module consumes 16 mW from a ±2.5 V supply and has an adjustable sensitivity up to 8 V/g with a noise level of 4.8 μg/√Hz in open-loop.     

蝴蝶式多层悬臂梁压电发电装置研究

为了提高压电发电装置的发电能力,设计了一种新型的蝴蝶式多层压电悬臂梁。为了研究该装置中每个压电双晶梁的发电性能,建立了在自由端外力作用下压电悬臂梁的输出电压理论模型,以此用来分析压电双晶梁的开路输出电压。制作了多层压电发电装置,并搭建实验平台对装置的发电电压进行实验测试,将实验测试数据与理论计算结果进行比较,两者误差小于10%。将发电装置中的6层压电片串联后研究发现,装置的发电电压基本不变,而发电功率可达单层的6倍,说明该新型蝴蝶式多层压电悬臂梁结构可提高发电能力。     

基于电光调制的毫米波辐射计研究

研究了一种通过电光调制将毫米波信号加载到光载波上进行处理的毫米波辐射计。天线接收的毫米波信号由电光调制器（EOM）调制加载到光载波的边带上,并通过光纤传输该信号;利用光纤布拉格光栅（FBG）滤波器滤掉载波分量,滤波后保留的边带分量信号由光电探测器（PD）探测。为提高探测灵敏度,使用锁相放大器对PD输出的信号进行检测。分...     

FIR数字滤波在MEMS加速度计中的应用

简要分析了MEMS加速度计应用模型中的噪声来源,介绍了FIR数字低通滤波器的设计方法,并用FPGA实现的FIR滤波器对MEMS加速度计的输出信号进行了实时滤波处理。通过对滤波前后时、频域信号的比较,可以看出采用FIR数字低通滤波器能有效抑制加速度计输出信号中的高频噪声、提高加速度计的测量精度。实验结果表明,滤波前噪声信号标准偏差为1.53×10-5V,经FIR数字低通滤波后的噪声信号标准偏差降低为5.4×10-6V,加速度计的分辨率由126μg提高到42μg。     

CMOS micromachined cantilever-in-cantilever devices with magneticactuation

A novel magnetically actuated cantilever microactuator which produces a large angular deflection is described. The device is a nested cantilever structure for improved sensitivity, and is fabricated entirely using a standard CMOS process. The cantilever deflects bidirectionally, and has a static deflection of more than 2.5°. It has a response time of 25 μs and at resonance has a deflection of more than 25°     

Integrated electronic shutter for back-illuminated charge-coupleddevices

A novel electronic shutter has been integrated into the structure of a back-illuminated frame-transfer charge-coupled device (CCD) to permit short optical exposure times and to reduce the smear that occurs during the transfer of an image from the CCD detection area. The shutter consists of an n⁺ shutter drain placed in the vertical channel stop regions and stepped p-type buried layers formed by a high-energy implantation (1.0-1.5 MeV) located between the CCD n-type buried channel the and p substrate. These structures create electric fields that direct the photoelectrons to either the CCD detection region or the n⁺ shutter drain. The ratio of photons detected with the shutter open to photons detected with the shutter closed has been measured to be greater than 75000 for wavelengths below 540 nm. The corresponding shutter rise and fall times are less than 55 ns     

Packaging of microsystems for harsh environments

Micromachined devices have great potential but using these fragile structures in aggressive environments can pose a challenge. Mechanical shock, chemical exposure, and temperature extremes can damage delicate microsystems. Also, substantial effort is often put forth to develop a device concept only to find later that the device is difficult or expensive to package suitably in a consumer or automotive environment. The cost of materials, processing, and manufacturing make the sensor or actuator device impractical for some applications. A successful MEMS device manages the proper balance for its application between the high device performance and low unit cost. The packaging of MEMS begins with a consideration of the microsystem's environment. An aerospace, automotive, or industrial component could be subjected to temperatures ranging from -40°C to over 150°C. Mechanical shocks in the 10 g to +500 g range can be experienced which can fracture poorly designed silicon beams. Chemical exposure, which can corrode silicon, or the metal interconnection lines on silicon, and shift electrical parameters, are challenges that must be overcome in these applications     

三分量全保偏光纤加速度传感器的研究

报道了三分量全保偏光纤加速度传感器的实验研究结果。传感器由6个弹性柱体共同支撑1个质量块构成三分量结构,由3个迈克尔逊全保偏光纤干涉仪共用一个光源组成。光学部分采用全保偏光纤干涉仪结构,消除了干涉光束偏振态随机变化引起的信号衰落,采用光频调制相位载波解调信号处理技术,消除了相位随机漂移引起的信号衰落,从而实现了对加速度信号的稳定检测。传感器的工作频带为5~500 Hz,加速度灵敏度达到660 rad/g,系统最小可测相位差为10-5rad,最小可测加速度达1.5×10-7m/s2,工作频带内加速度灵敏度变化小于2 dB。三轴加速度灵敏度和频率响应曲线与理论分析的结果基本一致。     

新型L形梁压阻微加速度传感器

介绍了一种新型的基于MEMS体硅加工工艺的L形粱压阻微加速度传感器.在加工过程中采用Si-Si直接键合完成底板与传感器支撑框体之间的粘合,使得后续加工工艺更加简单;采用DRIE释放梁结构,从而保证了梁结构的完整性.分析了该传感器的结构参数和灵敏度,并用ANSYS进行了有限元模拟,同时介绍了其工艺流程,以及封装后的测试结果.芯片尺寸为3.8 mm×3.8 mm×0.82 mm,其中敏感质量块尺寸为2 mm×2 mm×0.4 mm,梁尺寸为2 200μm×100 μm×40μm.经初步测试,在采用5 V电源供电时灵敏度为0.5 mV/g左右,3 dB截止频率为520 Hz左右.     

Fabrication and performance of MEMS-based piezoelectric power generator for vibration energy harvesting

A MEMS-based energy harvesting device, micro piezoelectric power generator, is designed to convert ambient vibration energy to electrical power via piezoelectric effect. In this work, the generator structure of composite cantilever with nickel metal mass is devised. Micro-electronic-mechanical systems (MEMS) related techniques such as sol-gel, RIE dry etching, wet chemical etching, UV-LIGA are developed to fabricate the device and then its performance is measured on vibration testing setup. The investigation shows that the designed device is expected to resonantly operate in low-frequency environmental vibration through tailoring the structure dimension. Under the resonant operation with frequency of about 608 Hz, a first prototype of the generator result in about 0.89 V AC peak-peak voltage output to overcome germanium diode rectifier toward energy storage, and its power output is in microwatt level of 2.16 μW.