超深亚微米物理设计中天线效应的消除

分析了超深亚微米物理设计中天线效应的产生机理以及基于超深亚微米工艺阐述了计算天线比率的具体方法。同时,根据天线效应的产生机理并结合时钟树综合提出了消除天线效应的新方法。此方法通过设置合理的约束进行时钟树综合,使得天线效应对时钟延时和时钟偏斜的影响降到最低,从而对芯片时序的影响降到最低。最后结合一款芯片的物理设计,该设计采用台积电(TSMC)65 nm低功耗(LP)工艺,在布局布线中运用所述的方法进行时钟树综合并且使得时钟网络布线具有最大的优先权。此方法有效地消除了设计中存在的天线效应,并且使得天线效应对时钟树的影响降到最低以及对时序的影响降到最小。     

Clock Buffer Polarity Assignment for Power Noise Reduction

Power/ground noise is a major source of VLSI circuit timing variations. This work aims to reduce clock network induced power noise by assigning different signal polarities (opposite switchings) to clock buffers in an existing buffered clock tree. Three assignment algorithms are proposed: 1) partitioning; 2) 2-coloring on minimum spanning tree; and 3) recursive min-matching. A post-processing of clock buffer sizing is performed to achieve desired clock skew. SPICE based experimental results indicate that our techniques could reduce the average peak current and average delay variations by 50% and 51%, respectively.      

一种非零偏差时钟网布线算法

特定的非零偏差时钟网比零偏差时钟网更具优势,它有助于提高时钟频率、降低偏差的敏感度.文章提出了一种新的非零偏差时钟树布线算法,它结合时钟节点延时和时钟汇点位置,得到一个最大节点延时次序合并策略,使时钟树连线长度变小.实验结果显示,这种算法与典型的最邻近选择合并策略相比较,可以减少20%～30%的总连线长度.     

Design of Thermally Robust Clock Trees Using Dynamically Adaptive Clock Buffers

On-chip temperature gradient has emerged as a major design concern for high-performance integrated circuits for the current and future technology nodes. Clock skew is an undesirable phenomenon for synchronous digital circuits that is exacerbated by the temperature difference between various parts of the clock tree. The main aim of this paper is to provide intelligent solution for minimizing the temperature-dependent clock skew by designing dynamically adaptive circuit elements, particularly the clock buffers. Using an RLC model of the clock tree, we investigate the effect of on-chip temperature gradient on the clock skew for a number of temperature profiles that can arise in practice due to different architectures and applications. As an effective way of mitigating the variable clock skew, we present an adaptive circuit technique that senses the temperature of different parts of the clock tree and adjusts the driving strengths of the corresponding clock buffers dynamically to reduce the clock skew. Simulation results demonstrate that our adaptive technique is capable of reducing the skew by up to 92.4%, leading to much improved clock synchronization and design performance.      

Clock Mesh Network Design with Through‐Silicon Vias in 3D Integrated Circuits

Many methodologies for clock mesh networks have been introduced for two‐dimensional integrated circuit clock distribution networks, such as methods to reduce the total wirelength for power consumption and to reduce the clock skew variation through consideration of buffer placement and sizing. In this paper, we present a methodology for clock mesh to reduce both the clock skew and the total wirelength in three‐dimensional integrated circuits. To reduce the total wirelength, we construct a smaller mesh size on a die where the clock source is not directly connected. We also insert through‐silicon vias (TSVs) to distribute the clock signal using an effective clock TSV insertion algorithm, which can reduce the total wirelength on each die. The results of our proposed methods show that the total wirelength was reduced by 12.2%, the clock skew by 16.11%, and the clock skew variation by 11.74%, on average. These advantages are possible through increasing the buffer area by 2.49% on the benchmark circuits.     

Crosstalk optimization for through-silicon vias by exploiting temporal signal misalignment

The vertical interconnects between the components of a 3D system-on-chip (SoC) are realized by through-silicon vias (TSVs). These large global vias are a frequent performance bottleneck due to their high capacitive crosstalk. In order to reduce it, this work analyses the effect of temporal misalignment between the transitions on the signal nets of an interconnect structure and presents a technique to exploit it. The approach, based on a crosstalk-aware net-to-TSV assignment and hardware-efficient low-power codes, enables a dramatic improvement in the 3D interconnect performance. Circuit simulations show that the proposed technique reduces the delay and the noise of modern TSV interconnects by about 35%–50%, without noticeable cost. In combination with the classical bus invert coding, an additional decrease in the energy consumption by about 17% is obtained.     

Analysis of stripline-fed slot-coupled patch antennas with vias forparallel-plate mode suppression

The paper presents an analysis of slot-coupled stripline-fed patch antennas with vias around the slot to minimize the power launched into the parallel-plate mode. A moment-method scattering formulation is invoked to include the effect of vias on the impedance characteristics of the antenna. Coupling between the stripline feed and the ground-plane slot is obtained by invoking reciprocity. Two design examples were fabricated and the measured input impedances verify the accuracy of the analysis. Vias considerably modify the impedance and resonant characteristics of a patch antenna. The radiation efficiency of patch antennas with and without vias is studied and proper location of the vias is shown to drastically reduce power in the parallel-plate mode     

A High-Speed Variation-Tolerant Interconnect Technique for Sub-Threshold Circuits Using Capacitive Boosting

This paper describes an interconnect technique for subthreshold circuits to improve global wire delay and reduce the delay variation due to process-voltage-temperature (PVT) fluctuations. By internally boosting the gate voltage of the driver transistors, operating region is shifted from subthreshold region to super-threshold region enhancing performance and improving tolerance to PVT variations. Simulations of a clock distribution network using the proposed driver shows a 66%-76% reduction in 3sigma clock skew value and 84%-88% reduction in clock tree delay compared to using conventional drivers. A 0.4-V test chip has been fabricated in a 0.18-mum 6-metal CMOS process to demonstrate the effectiveness of the proposed scheme. Measurement results show 2.6times faster switching speed and 2.4times less delay sensitivity under temperature variations.     

Timing-driven via placement heuristics for three-dimensional ICs

The dependence of the interconnect delay on the interplane via location in three-dimensional (3-D) ICs is investigated in this paper. The delay of these interconnects can be significantly decreased by optimally placing the interplane vias. The via locations that minimize the propagation delay of two-terminal interconnects consisting of multiple interplane vias under the distributed Elmore delay model are determined. For interconnect trees, the interplane via locations that minimize the summation of the weighted delay of the sinks of the tree are also determined. For these interconnect structures, the interplane via locations are obtained both through geometric programming and near-optimal heuristics. Placement constraints are imposed such that the path is negligibly affected. The proposed heuristics are used to implement efficient algorithms that exhibit lower computational times as compared to general optimization solvers with negligible loss of optimality. Various interplane via placement scenarios are considered. Simulation results indicate delay improvements for relatively short point-to-point interconnects of up to 32% with optimally placed interplane vias. For interconnect trees, the maximum improvement in delay for optimally placed interplane vias is 19%. The proposed algorithms can be integrated into a design flow for 3-D circuits to enhance placement and routing where timing is a primary design criterion.     

带偏差约束的时钟线网的拓扑构造和优化

提出了一种新的拓扑构造和优化方法,综合考虑了几种拓扑构造方法的优点,总体考虑偏差约束,局部进行线长优化.实验结果表明,它可以有效控制节点之间的偏差,同时保证减小时钟布线树的整体线长.     

Automated low-power technique exploiting multiple supply voltagesapplied to a media processor

This paper describes an automated design technique to reduce power by making use of two supply voltages. The technique consists of structure synthesis, placement, and routing. The structure synthesizer clusters the gates off the critical paths so as to supply the reduced voltage to save power. The placement and routing tool assigns either the reduced voltage or the unreduced one to each row so as to minimize the area overhead. The reduced supply, voltage is also exploited in a clock tree to reduce power. Combining these techniques together, we applied it to a media processor chip. The combined technique reduced the power by 47% in random-logic modules and by 73% in the clock tree, while keeping the performance     

Edge layer embedding algorithm for mitigating on-package variation in 3D clock tree synthesis

A 3D stacked IC is made of multiple dies possibly with heterogeneous process technologies. Therefore, the die-to-die variation between the stacked dies creates on-package variation in a 3D chip. In this paper, we analyze the effect of on-package variation on the 3D clock trees and address the problem of on-package variation aware layer embedding in 3D clock tree synthesis. The layer embedding problem is divided into two sub-problems: clock node embedding and clock edge embedding. While the clock node embedded problem has been intensively investigated by the previous 3D clock tree synthesis flows because the solution directly determines the TSV allocation, the clock edge embedding problem has not been fully addressed yet. We show in this work that a careful clock edge embedding can greatly reduce the impact of on-package variation on the 3D clock skew, thereby enhancing chip yield, and propose a two-step solution to the problem of on-package variation aware layer embedding of clock edges. Specifically, we formulate the edge embedding problem into a problem of maximizing the sharing of layers among the clock paths to minimize the impact of on-package variation globally and solve it efficiently, followed by applying a fine-grained refinement technique to balance the clock latency locally among the clock paths. From the experiments with Benchmark circuits, we confirm that compared to the results produced by the conventional on-package variation unaware layer embedding of clock edges, the proposed algorithm is able to improve the chip yield by 6.2–25.8% and 5.3–44.4% for 2-layered and 4-layered 3D designs, respectively.     

Design and Application of Adaptive Delay Sequential Elements

Lower operating voltages and faster clock frequencies in advanced fabrication processes increase the circuit delay sensitivity to voltage, temperature, and process variations and modeling approximations. Uncorrelated delay variations along data and clock paths cause timing violations. In this paper, we propose a method for correcting timing violations by in-circuit tuning of clock latencies after fabrication. We introduce adaptive delay sequential elements (ADSEs) that use charge storage on pMOS floating gates to tune the clock latencies of timing critical flip-flops. ADSEs facilitate in-circuit optimization of clock latencies under varying operating conditions. ADSE tuned clock latencies are nonvolatile and can be repeatedly adjusted after fabrication using only electrical signals. We present examples of implicit and explicit pulsed ADSEs and their tuning operations. Our experiments with fabricated prototypes show that ADSEs can tune their clock latencies with picosecond resolution over one-half of the clock period. Our experiments also show that ADSE sensitivities to supply voltage, temperature, noise, and transistor mismatch are comparable to nonadaptive sequential elements. We present experimental data that show ADSE tuned delays change only 15% after ten years at 125degC. We propose a method for selective tuning of embedded ADSEs and demonstrate its application in a fabricated prototype. ADSEs can selectively replace timing-critical flip-flops of a circuit with negligible area impact     

CSAM: A clock skew-aware aging mitigation technique

In this work, we propose a clock skew-aware aging mitigation (CSAM) technique which considers the effect of asymmetric aging both on logic path and clock tree together. Simultaneous consideration of both parts in the design optimization problem enables us to reduce the area overhead while increasing the lifetime. For the aging mitigation of the logic path, we make use of both internal node control (INC) and input vector control (IVC) techniques while, for the clock tree circuits, a proper choice between NAND or NOR based integrated clock gating (ICG) cell is made. The optimization may be performed based on two objective functions of maximizing lifetime or minimizing the area overhead for a predetermined clock frequency and lifetime. To assess the efficacy of the proposed technique, we compared the lifetimes and area overheads for a set of circuits from ISCAS89 and ITC99 benchmark suites when CSAM and conventional techniques are used. The results, obtained using SPICE simulations for the circuits in a 45-nm technology, reveals that an average lifetime improvement of 34% and an average area overhead reduction of 25.7% for the two objective functions, respectively.     

Enrichment of Package Antenna Approach With Dual Feeds, Guard Ring, and Fences of Vias

This paper enriches the package antenna approach to wireless modules by introducing the dual feeds, the guard ring, and fences of vias. The dual feeds enable the antenna for not only single-ended but also differential signal operations. The guard ring and fences of vias reduce the antenna backward radiation and improve the isolation between the antenna and radio chip. The design guideline of the guard ring and fence of vias for the package antenna approach is developed for the first time. An example antenna of this package approach using a microstrip patch radiator has been designed and fabricated in a low-temperature cofired ceramic (LTCC) technology for the wireless modules operating at the 5-GHz band. The antenna has a size of 17 $,times,$17 $,times,$2 mm $^{3}$ and contains the open cavity that is large enough to accommodate a radio chip of current size. Simulated and measured input impedance matching and far-field radiation properties are discussed. They show that the antenna achieves over 2.2% bandwidth while maintaining 90% efficiency.      

时钟延时及偏差最小化的缓冲器插入新算法

本文提出了以最小时钟延时和时钟偏差为目标的缓冲器插入新算法.基于Elmore延时模型,我们得到相邻缓冲器间的延时是缓冲器在时钟树中位置的凸函数.当缓冲器布局使所有缓冲器间延时函数具有相同导数值时,时钟延时达到最小;当所有源到各接收端点路径的延时函数值相等时,时钟偏差达到最小.对一棵给定的时钟树,我们在所有从源点到各接收端点路径上插入相同层数的缓冲器,通过优化缓冲器的位置实现时钟延时最小;通过调整缓冲器尺寸和增加缓冲器层数,实现时钟偏差最小.     

Pattern-matching-based X-architecture zero-skew clock tree construction with X-Flip technique and via delay consideration

As IC fabrication technologies get into nanometer era, clock routing gradually dominates chip performance indicated by delay, cost, and power consumption. X-architecture can be applied for routing metal wires in diagonal and rectilinear directions to overcome the above challenges due to wirelength reduction. In this paper, we present a clock routing algorithm, called PMXF, to construct an X-architecture zero-skew clock tree with minimum delay. An X-pattern library is defined for simplifying the merging procedure of the DME approach, an X-Flip technique is proposed for reducing the wirelength between the paired points, and a wire sizing technique is applied for achieving zero skew. In terms of clock delay, wirelength, power consumption, and via count listed in the experimental results on benchmarks, the proposed PMXF algorithm can respectively achieve more reductions compared with other previous X-architecture clock routing algorithms.     

A buffer distribution algorithm for high-performance clock netoptimization

We propose a new approach for optimizing clock trees, especially for high-speed circuits. Our approach provides a useful guideline to a designer, by user-specified parameters, and three of these tradeoffs are provided in this paper. (1) First, to provide a “good” tradeoff between skew and wire length, a new clock tree routing scheme is proposed. The technique is based on a combination of hierarchical bottom-up geometric matching and minimum rectilinear Steiner tree. Our experiments complement the theoretical results. (2) For high-speed clock distribution in the transmission line mode (e.g., multichip modules) where interconnection delay dominates the clock delay, buffer congestion might exist in a layout. Using many buffers in a small wiring area results in substantial interline crosstalks as well as wirability, when the elongation of the imbalanced subtrees is necessary. Placing buffers evenly (locally or globally) over the plane at the minimum impact on wire length increase helps avoid buffer congestion and results in less crosstalk between clock wires. Thus, an effective technique for buffer distribution is proposed. Experimental results verify the effectiveness of the proposed algorithms. (3) Finally, a postprocessing step constraining on phase-delay is also proposed. The technique is based on a combination of hierarchical bottom-up geometric matching and bounded radius minimum spanning tree. The proposed algorithm has an important application in MCM clock net synthesis as well as VLSI clock net synthesis     

Exponentially tapered H-tree clock distribution networks

Exponentially tapered interconnect can reduce the dynamic power dissipation of clock distribution networks. A criterion for sizing H-tree clock networks is proposed. The technique reduces the power dissipated for an example clock network by up to 15% while preserving the signal transition times and propagation delays. Furthermore, the inductive behavior of the interconnects is reduced, decreasing the inductive noise. Exponentially tapered interconnects decrease by approximately 35% the difference between the overshoots in the signal at the input of a tree. As compared to a uniform tree with the same area overhead, overshoots in the signal waveform at the source of the tree are reduced by 40%.     

A multiple clocking scheme for low-power RTL design

This paper presents a resource allocation technique to design low-power register-transfer-level datapaths. The basis of this technique is to use a multiple clocking scheme of n nonoverlapping clocks, by dividing the frequency f of a single clock into n cycles, to partition the circuit into n disjoint modules and assign each module to a distinct clock, and to operate each module only during its corresponding duty cycle, thus clocking each module by a frequency f/n to reduce power. However, the overall effective frequency of the circuit remains f, i.e., the single clock frequency. Further power reduction is also obtained by tradeoffs between voltage, power, and delay across multiple clock partitions. Power savings up to 50% of the proposed multiple clocking scheme in comparison to single gated clock designs are also reported