Effect of heat-treatment on LaNiO3 film electrode of PZT thin films derived by a sol–gel method

Lanthanum nickel oxide (LaNiO₃ or LNO) conducting thin films that could be used as electrodes for improving fatigue and aging properties of ferroelectric thin films were investigated. In this paper, LNO films were directly spin-coated onto SiO₂/Si(1 0 0) substrates followed by thermal treatment in air and in oxygen. It was found that crack-free dense and uniform films with good crystallinity and medium grains were obtained, preferentially (1 0 0)-oriented LNO thin films could be formed at a lower annealing temperature of 550 °C and that with the increase in thermal annealing temperature the LNO thin film possessed better electrical properties especially at 750 °C. However, the LNO film displayed a structure transformation above 850 °C. A phenomenon was found that the first heat-treatment temperature and time played a key role to determine the crystallite size of LNO films. A subsequent deposition of a sol–gel derived Pb(Zr_0.53Ti_0.47)O₃ (PZT53/47) thin film on the LNO-coated SiO₂/Si(1 0 0) substrates was also found to have a (1 0 0)-oriented texture. Moreover, the Au/PZT/LNO capacitor was found to significantly improve the fatigue and the effects of the LNO electrodes to the fatigue were discussed.     

Effect of heat-treatment on LaNiO3 film electrode of PZT thin films derived by a sol–gel method

Lanthanum nickel oxide (LaNiO₃ or LNO) conducting thin films that could be used as electrodes for improving fatigue and aging properties of ferroelectric thin films were investigated. In this paper, LNO films were directly spin-coated onto SiO₂/Si(1 0 0) substrates followed by thermal treatment in air and in oxygen. It was found that crack-free dense and uniform films with good crystallinity and medium grains were obtained, preferentially (1 0 0)-oriented LNO thin films could be formed at a lower annealing temperature of 550 °C and that with the increase in thermal annealing temperature the LNO thin film possessed better electrical properties especially at 750 °C. However, the LNO film displayed a structure transformation above 850 °C. A phenomenon was found that the first heat-treatment temperature and time played a key role to determine the crystallite size of LNO films. A subsequent deposition of a sol–gel derived Pb(Zr_0.53Ti_0.47)O₃ (PZT53/47) thin film on the LNO-coated SiO₂/Si(1 0 0) substrates was also found to have a (1 0 0)-oriented texture. Moreover, the Au/PZT/LNO capacitor was found to significantly improve the fatigue and the effects of the LNO electrodes to the fatigue were discussed.     

Microstructure and electrical properties of Pb(Zr0.52Ti0.48)O3 ferroelectric films on different bottom electrodes

The crystalline quality, dielectric and ferroelectricity of the Pb(Zr_0.52Ti_0.48)O₃ (PZT) films deposited on the LaNiO₃ (LNO), LNO/Pt and Pt bottom electrodes were comparatively analyzed to investigate the possibility for their application. LNO thin films were successfully prepared on Si (100) and Pt(111)/Ti/SiO₂/Si substrates by modified metallorganic decomposition (MOD). The PZT thin films were spin-coated onto the LNO, LNO/Pt and Pt bottom electrodes by sol–gel method. The crystallographic orientation and the microstructure of the resulting LNO films and PZT thin films on the different bottom electrodes were characterized by X-ray diffraction analysis. The dielectric and ferroelectric properties of PZT films on the different bottom electrodes are discussed. The PZT films deposited onto Pt/Ti/SiO₂/Si and LNO/Si substrates show strong (110) and (100) preferred orientation, respectively, while the films deposited onto LNO/Pt/Ti/SiO₂/Si substrates show the peaks of mixed orientations. PZT films on LNO and LNO/Pt bottom electrodes have larger dielectric constant and remnant polarizations compared with those grown on the Pt electrode.     

Low-temperature epitaxial growth of conductive LaNiO3 thin films by RF magnetron sputtering

Epitaxial growth of LaNiO₃ (LNO) thin films was successful on CeO₂/YSZ/Si(100), MgO(100) and SrTiO₃ (STO)(100) substrates by RF magnetron sputtering at 300 °C, although pulsed laser deposition requires 600 °C to prepare epitaxial LNO films according to the literature. Epitaxial LNO films deposited on CeO₂/YSZ/Si(100) and STO(100) had single orientation of LNO[100]//CeO₂[110]//YSZ[110]//Si[110]) and LNO[100]//STO[100], respectively. On the other hand, epitaxial LNO films deposited on MgO(100) had mixed orientations of LNO[100]//MgO[100] and LNO[100]//MgO[110]. The lattice parameter, composition and resistivity of the LNO thin films were strongly dependent on the substrate temperature. The minimum resistivity of LNO films was approximately 5×10⁻⁶ Ω m, which value almost agrees with the resistivity in the literature. It was found that the temperature to achieve minimum resistivity was 200 °C, irrespective of the type of substrate. The surface of the LNO films was smooth and flat.     

Effect of thermal annealing on transparent conductive LaNiO3 thin film prepared by an aqueous method

Dense, crack-free and uniform lanthanum nickel oxide (LNO) thin films were prepared by an aqueous method on various substrates, such as single crystal silicon, microcrystalline glass ceramic (GC) and amorphous glass. The effects of various thermal annealing temperatures on the microstructure, interface and electrical properties of the LNO films were investigated by XRD and SEM with the EDX and a four-probe method, respectively. It was found that with the increase in thermal annealing temperature, the LNO film on Si substrates displayed a structure change from pseudocubic to rhombohedral and was accompanied by the appearance of a NiO impure phase, while the LNO film on a GC substrate diffused into the substrate. In these cases, the film resistivity was increased. As a result, a LNO thin film with a resistivity of 2–3 × 10^–5 · m was achieved by thermally annealing at 750–800°C for 1 hour in air. The measurement of the surface resistance under different temperatures shows that the LNO film possesses better high temperature stability. Its transmittance spectrum was also observed.     

Fabrication of epitaxial conductive LaNiO3 films on different substrates by pulsed laser ablation

LaNiO₃ (LNO) thin films were deposited on (1 0 0) MgO, SrTiO₃ (STO) and LaAlO₃ (LAO) crystal substrates by pulsed laser deposition (PLD) under 20 Pa oxygen pressure at different substrate temperatures from 450 to 750 °C. X-ray diffraction (XRD), ex situ reflection high energy electron diffraction (RHEED) and atomic force microscopy (AFM) were employed to characterize the crystal structure of LNO films. LNO films deposited on STO and LAO at a temperature range from 450 to 700 °C exhibit high (0 0 l) orientation. XRD ψ scans and RHEED observations indicate that LNO films could be epitaxially grown on these two substrates with cubic-on-cubic arrangement at a wide temperature range. LNO films deposited at 700 °C on MgO (1 0 0) substrate have the (l l 0) orientation, which was identified to be bicrystalline epitaxial growth. La₂NiO₄ phase appears in LNO films deposited at 750 °C on three substrates. The epitaxial LNO films were tested to be good metallic conductive layers by four-probe method.     

Comparative analysis for the crystalline and ferroelectric properties of Pb(Zr,Ti)O3 thin films deposited on metallic LaNiO3 and Pt electrodes

The crystalline quality and ferroelectricity of the Pb(Zr,Ti)O₃ (PZT) films deposited on the metallic LaNiO₃ (LNO) and Pt electrodes were comparatively analyzed to investigate the possibility for their application to non-volatile memory devices. LNO thin films were successfully deposited on various substrates by using r.f. magnetron sputtering even at a low temperature ranging from 250 to 500 °C, and the ferroelectric PZT thin films were spin-coated onto the LNO and Pt bottom electrodes. Metallic LNO thin films exhibited [100] orientation irrespective of the substrate species and PZT films coated onto LNO films had highly a- and c-axis orientations, while those with Pt bottom electrode were polycrystalline. PZT films with LNO bottom electrode had smaller grain size and larger dielectric constant compared to those grown on the Pt electrode. The ferroelectric thin films fabricated on LNO bottom electrode displayed an asymmetric D–E hysteresis loop, which was explained by the defect effects formed at the interface. Especially, the LNO/PZT/LNO capacitor was found to significantly improve the polarization fatigue and the effects of the LNO electrodes to the fatigue were discussed.     

Si(100)衬底上PLD法制备高取向度AlN薄膜

采用脉冲激光沉积法(PLD),以KrF准分子为脉冲激光源,Si(100)为衬底,同时引 入缓冲层TiN和Ti_0.8Al_0.2N,制备了结晶质量优异的A1N薄膜,X射线衍射(XRD)及反射 式高能电子衍射(RHEED)分析表明A1N薄膜呈(001)取向、二维层状生长.研究发现,薄膜 的生长模式依赖于缓冲层种类,直接在Si衬底上或MgO／Si衬底上的A1N薄膜呈三维岛状生 长;而同时引入缓冲层TiN和Ti_0.8Al_0.2N时,A1N薄膜呈二维层状生长.此外,激光能量密 度大小对A1N薄膜的结晶性有显著的影响,激光能量密度过大,薄膜表面粗糙,有颗粒状沉积 物生成.在氮气气氛中沉积,能使薄膜的取向由(001)改变为(100).     

Role of La0.5Sr0.5CoO3 template layers on dielectric and electrical properties of pulsed-laser ablated Pb(Nb2/3Mg1/3)O3-PbTiO3 thin films

Relaxor ferroelectric thin films of 0.7Pb(Mg_1/3Nb_2/3)O₃-0.3PbTiO₃ (PMN-PT) deposited on platinized silicon substrates with and without template layers were studied. Perovskite phase (80% by volume) was obtained through proper selection of the processing conditions on bare Pt/Ti/SiO₂/Si substrates. The films were initially grown at 300 °C using pulsed-laser ablation and subsequently annealed in a rapid thermal annealing furnace in the temperature range of 750-850 °C to induce crystallization. Comparison of microstructure of the films annealed at different temperatures showed change in perovskite phase formation and grain size etc. Results from compositional analysis of the films revealed that the films initially possessed high content of lead percentage, which subsequently decreased after annealing at temperature 750-850 °C. Films with highest perovskite content were found to form at 820-840 °C on Pt substrates where the Pb content was near stoichiometric. Further improvement in the formation of perovskite PMN-PT phase was obtained by using buffer layers of La_0.5Sr_0.5CoO₃ (LSCO) on the Pt substrate. This resulted 100% perovskite phase formation in the films deposited at 650 °C. Dielectric studies on the PMN-PT films with LSCO template layers showed high values of relative dielectric constant (3800) with a loss factor (tan δ) of 0.035 at a frequency of 1 kHz at room temperature.     

退火温度对Pb(Zr_(0.53)Ti_(0.47))O_3薄膜结构及其性能的影响

采用sol-gel法在Pt/Ti/SiO_2/Si衬底上制备Pb(Zr_(0.53)Ti_(0.47))O_3薄膜.利用X射线衍射仪(XRD)和原子力显微镜(AFM)对其晶格结构和微观形貌进行了表征,通过改变退火温度制得了具有单一钙钛矿结构的Pb(Zr_(0.53)Ti_(0.47))O_3薄膜.然后将该薄膜与环氧树脂形成复合结构材料.对其铁电性能以及复合材料的阻尼性能进行了测试,结果表明,退火温度的升高有利于改善薄膜的铁电性能,在750℃下退火的Pb(Zr_(0.53)Ti_(0.47))O_3薄膜,其剩余极化值2Pr达到了68.6μC/cm~2, 矫顽场强2E_c达到158.7kV/cm;同时退火温度的升高还有利于薄膜致密度的提高,对复合材料的阻尼性能也有一定的改善,当退火温度达到800℃,复合材料的阻尼损耗因子达到最大值,阻尼温域最宽,阻尼性能最好.     

Improved dielectric properties of chemical solution derived Pb0.5Sr0.5TiO3 thin films by a layer-by-layer annealing method

Pb_0.5Sr_0.5TiO₃ thin films were prepared on Pt/TiO₂/SiO₂/Si and LaNiO₃ (LNO)/Si substrates by using chemical solution deposition technique, and a layer-by-layer annealing method was used in an attempt to improve the dielectric properties of the thin films. The structure, dielectric, and ferroelectric properties of the thin films were investigated. Improved dielectric properties of the thin films were clearly confirmed: the dielectric constant and dielectric loss for the films on Pt/TiO₂/SiO₂/Si substrates annealed at 650 °C were 1064 and 0.027, respectively, at 1 kHz, with a dielectric tunability of more than 50%; similarly, the films prepared on LNO/Si substrates, showed a high dielectric constant of 1280 and a low dielectric loss of 0.023, at 1 kHz. P-E hysteresis loop measurements indicated that the remanent polarization and coercive field for the films on Pt/TiO₂/SiO₂/Si substrates annealed at 650 °C were 15.7 μC/cm² and 51 kV/cm, respectively.     

Fabrication of Superconducting MgB2 Thin Films by Magnetron co-Sputtering on (001) MgO Substrates

We fabricated superconducting MgB₂ thin films on (001) MgO substrates by magnetron rf and dc co-sputtering on heated substrates. We annealed the samples ex-situ and in-situ at temperatures between 450 ^°C and 750 ^°C. The substrate temperature during the sputtering process and the post annealing temperatures play a crucial role in forming MgB₂ superconducting thin films. We achieved a critical onset temperature of up to 27.1 K for the ex-situ and 25.6 K for the in-situ annealed samples at a film thickness of 30 nm. The samples shows an out of plane (0002)-Peak which was determined by x-ray diffraction.     

Effects of Magnetic Annealing on Structure and Magnetic Properties of L10-FePt/Ag Films

The structural and magnetic properties of L1₀-FePt/Ag films were studied by X-ray diffraction and a vibrating sample magnetometer. The FeAg/Pt films were obtained by depositing FeAg thin films on thermally oxidized Si (001) substrates via magnetron sputtering and Pt layers on their surface after annealing FeAg thin films at 400 °C with and without an out-of-plane magnetic field of 10 kOe. These films were further annealed at various temperatures to obtain L1₀-FePt phase. The results indicated that the pre-annealing of FeAg thin films under 10 kOe magnetic field caused (001) orientation of Fe particles, and the deposition of Pt layer on such orientated underlayers reduced the ordering temperature of FePt in FeAg/Pt films, realizing the L1₀-FePt phase at 400 °C. The higher coercivity and ordering degree were also observed in the samples, compared with those pre-annealed without magnetic field at the same annealing condition.     

Si（111）衬底上沉积LaNiO3薄膜的取向控制和导电性能研究

通过金属有机物沉积的方法在Si（111）衬底上成功制备出了高度（100）和（110）取向的LaNiO3薄膜。研究了不同热处理过程、薄膜厚度、前驱体溶液对LaNiO3取向的影响,以及厚度热处理温度、（100）方向的取向度与薄膜方阻之间的关系。LaNiO3薄膜的相结构由XRD（X射线衍射）分析,薄膜的晶粒大小和表面粗糙度由AFM（原子力显微镜）分析。     

Annealing temperature and ultraviolet irradiation effect on the ferroelectric properties of Bi(3.25)La(0.75)Ti3O12 thin films

Bi(3.25)La(0.75)Ti3O12 thin films were prepared on Pt/Ti/SiO2/Si substrates by the metal organic decomposition method. The structural characterizations and the surface morphology observations were carried out applying X-ray diffraction and atomic force microscope, respectively. The annealing temperature and the ultraviolet irradiation effect on the ferroelectric properties were studied. It was found that the remnant polarization (Pr) and the coercive field (Ec) increased with the increase of the applied electric field (E) for all films. With the annealing temperature increasing from 670 degrees C to 750 degrees C, the increase tendency of Pr(E) and Ec (E) got enhanced from 670 degrees C to 720 degrees C, followed by weakened from 720 degrees C at 750 degrees C. These phenomena could be well explained by the different internal strain in films. The remnant polarization and the coercive field showed an obvious decrease when the top electrodes of the thin films were illuminated with UV light due to the screening effect of trapped charge carries.     

Structural and electrical characteristics of chemical solution derived (Bi3.2La0.4Nd0.4)Ti3O12 thin films

(Bi_3.2La_0.4Nd_0.4)Ti₃O₁₂ (BLNT) thin films were prepared on Pt/Ti/SiO₂/Si substrates by using chemical solution deposition technique, and the effects of annealing temperatures in the range of 550-750 °C on structure and electrical properties of the thin films were investigated. X-ray diffraction analysis shows that the thin films have a bismuth-layered perovskite structure with preferred (117) orientation. The surface morphology observation by field-emission scanning electron microscopy confirms that films are dense and smooth with uniformly distributed grains. The grain size of the thin films increases with increasing annealing temperature; meanwhile, the structural distortion of the thin films also increases. It was demonstrated that the thin films show good electrical properties. The dielectric constant and dielectric loss are 191 and 0.028, respectively, at 10 kHz for the thin film annealed at 600 °C, and the 2Pr value of the thin film annealed at 700 °C is 20.5 μC/cm² at an electric field of 500 kV/cm.     

The influences of rapid-thermal annealing on the characteristics of Sr0.6Ba0.4Nb2O6 thin film

The Sr0.6Ba0.4Nb2O6 (SBN) thin films were successfully prepared on Pt/Ti/Si and SiO2/Si/Al substrates and crystallized subsequently using rapid thermal annealing (RTA) process in ambient atmosphere for 1 min. The surface morphologies and thicknesses of as-deposited and annealed SBN thin films were characterized by field emission scanning electron microscopy, and the thickness was about 246 nm. As compared with the as-deposited SBN thin films, the RTA-treated process had improved the crystalline structures and also had large influence on the crystalline orientation. When the annealing temperatures increased from 700 degrees C to 900 degrees C, the diffraction intensities of (410) and (001) peaks apparently increased. Annealed at 900 degrees C, the (001) peak had the maximum texture coefficient and SBN thin films showed a highly c-axis (001) orientation. The influences of different RTA-treated temperatures on the polarization-applied electric field (P-E) curves and the capacitance-voltage (C-V) curves were also investigated.     

电极对PZT铁电薄膜的微观结构和电性能的影响

采用溶胶—凝胶(sol—gel)工艺分别在Pt／Ti／SiO2／Si和LNO／Si电极上制备Pb(Zr0．53，Ti0．47)O3(PZT)铁电薄膜。研究了不同电极材料对PZT铁电薄膜的微结构及电性能的影响。(100)择优取向的PZT／LNO薄膜的介电性能和铁电性能较(111)／(100)取向的PZT／Pt薄膜略有下降，但在抗疲劳特性和漏电流特性方面都有了很大提高。PZT／LNO薄膜10m次极化反转后剩余极化几乎保持未变，直至10^12次反转后，剩余极化仅下降了17％。     

The growth and transformation of Pd2Si on (111), (110) and (100) Si

Thin Pd films on (111), (110), (100) and amorphous Si substrates form [001] fiber textured Pd₂Si in the temperature range 100°–700°C. The degree of texture is a function of substrate orientation, increasing in the order amorphous Si, (100) Si, (110) Si and (111) Si. Only on the (111) Si substrate is the Pd₂Si film epitaxially oriented. Temperature-dependent growth on this orientation can be characterized by [001] textured growth, epitaxial azimuth orientation at the Si interface and progressive layer by layer formation of the mosaic crystal to the thin film surface.During Pd deposition, rapid non-diffusion-controlled growth of epitaxial Pd₂Si on (111) Si occurs at substrate temperatures of 100° and 200°C. An unidentified palladium silicide of low crystallographic symmetry forms during Pd deposition onto a 50°C substrate. The diffusion-controlled growth of Pd₂Si on (111) Si follows a t^0.5 dependence. The velocity constant is

$\text{k = 7 × 10}{}^{\mathrm{?2}}\text{exp}\text{?}\text{29200±800}\text{RT}\text{cm}{}^2\text{/}\text{sec}$

Palladium deposited on 100°C (111) Ge substrates reacts during deposition to form epitaxially oriented Pd₂Ge. However, growth of this phase at higher temperatures results in a randomly oriented film. The transformation of Pd₂Ge to PdGe is kinetically controlled. After a 15 min anneal at 560°±10°C in N₂ only PdGe is detectable on (111) Ge.The high temperature stability of thin film Pd₂Si is controlled by time- temperature kinetics. For a given annealing cycle, the nucleation and growth rates of the PdSi phase are inversely related to the crystalline perfection of Pd₂Si. Decreasing transformation rates follow the order (100), (110), (111) Si. formation of thin film Pd₂Si occurs by the formation of PdSi and subsequent growth of Si within the PdSi phase. After a 30 min N₂ anneal, initial transformation occurs at 735°C on (100) Si, 760°C on (110) Si and 840°C on (111) Si. Extended high temperature annealing produces a two-phase structure of highly twinned and misoriented Si and small PdSi grains that penetrate as much as 3 μm into the Si.