石墨烯添加量对铜基复合材料性能的影响

采用一步化学还原法结合放电等离子烧结工艺制备石墨烯增强铜基复合材料,利用XRD、SEM、拉曼光谱、拉伸试验机、纳米压痕仪、涡流电导率仪等研究石墨烯含量对复合材料微观组织、力学性能和导电性能的影响。结果表明:石墨烯在复合材料基体中均匀分布,石墨烯的添加能显著增强铜基体的力学性能。与纯铜相比,添加0.025%(质量分数)的氧化石墨烯,可使其屈服强度提高219.8%,抗拉强度提高35.9%,弹性模量提高6.9%,此外,其导电率仍有93.1%IACS。随着石墨烯含量的增加,复合材料的屈服强度、抗拉强度及弹性模量均有所下降,这是因为高石墨烯含量复合粉体中部分石墨烯纳米片未能被铜颗粒包覆,其与铜基体界面结合强度低,石墨烯的剪切应力转移强化效果降低。     

石墨烯增强铜基复合材料研究进展

铜(Cu)基复合材料具有优异的力学、热学、电学及耐磨和耐腐蚀等性能,广泛应用于各种工业技术领域。石墨烯(Graphene,Gr)具有二维平面结构和优异的综合性能,是金属基复合材料理想的增强相。石墨烯增强铜基复合材料拓展了铜及其合金的应用范围,适当的制备方法可以使其在保持优异导电导热性能的同时拥有更好的力学性能。石墨烯在铜基体中的存在形式主要以还原氧化石墨烯、石墨烯纳米片或与金属氧化物/碳化物纳米颗粒连接,旨在增强两者之间的界面结合。因此,石墨烯在铜基体中的结构完整性及存在形式直接影响了其性能的优劣。本文综述了Cu/Gr复合材料的制备及模拟方法、复合材料的性能评价及力学性能与功能特性的相互影响规律。指明Cu/Gr复合材料的发展关键在于：(1)分散性与界面结合;(2)三维石墨烯结构的构建;(3)界面结合对力学性能与功能特性的影响及两者间的相互协调。     

氧化石墨烯/铜基复合材料的微观结构及力学性能

采用球磨和真空热压烧结方法成功制备氧化石墨烯/铜复合材料。利用OM,SEM,XRD,显微硬度计和电子万能试验机等分析球磨后的复合粉形貌,研究氧化石墨烯添加量对复合微观结构及力学性能的影响。结果表明:制备的氧化石墨烯/铜基复合材料组织致密,氧化石墨烯以片状形态较均匀地分布在铜基体中,并与铜基体形成良好的结合界面。氧化石墨烯质量分数为0.5%时,复合材料的综合力学性能较好,显微硬度和室温压缩强度分别为63HV和276MPa,相对于纯铜基体分别提高了8.6%和28%。其强化机理为剪切应力转移强化、位错强化和细晶强化。     

石墨烯/铜复合材料的制备及其性能与应用

石墨烯具有特殊的二维平面蜂窝状结构和优异的性能,是理想的金属复合材料的增强体。粉末冶金法作为制备石墨烯/铜复合材料的传统的方法,面临着石墨烯难以分散以及与金属基底结合差等困境,尽管该法可有效提高复合材料力学性能,但也降低了其导热导电性能。随着人们对石墨烯/铜的结构与界面问题的深入研究,一些新的粉体制备工艺如原位生长法制备出了优异性能铜基复合材料,这将有助于开发出优异性能的铜基电接触材料。从石墨烯/铜复合材料的制备工艺(化学气相沉积法、机械混合以及原位生长石墨烯等)、性能(机械性能、导热性能以及抗氧化和防腐蚀性能等)及其在电接触材料的应用和石墨烯/铜的未来发展趋势等方面进行阐述。     

石墨烯/铜复合材料的制备及其性能与应用

石墨烯具有特殊的二维平面蜂窝状结构和优异的性能,是理想的金属复合材料的增强体。粉末冶金法作为制备石墨烯/铜复合材料的传统的方法,面临着石墨烯难以分散以及与金属基底结合差等困境,尽管该法可有效提高复合材料力学性能,但也降低了其导热导电性能。随着人们对石墨烯/铜的结构与界面问题的深入研究,一些新的粉体制备工艺如原位生长法制备出了优异性能铜基复合材料,这将有助于开发出优异性能的铜基电接触材料。从石墨烯/铜复合材料的制备工艺(化学气相沉积法、机械混合以及原位生长石墨烯等)、性能(机械性能、导热性能以及抗氧化和防腐蚀性能等)及其在电接触材料的应用和石墨烯/铜的未来发展趋势等方面进行阐述。     

石墨烯增强铜基复合材料的界面调控及其性能研究进展

铜基复合材料有望全面提升铜及铜合金的力学性能和导电、导热等功能特性。石墨烯具有优异的力学和物理性能,是铜基复合材料的理想增强相。石墨烯/铜界面的性质决定了复合材料性能,进行界面调控以提高石墨烯/铜的界面结合性已成为研究人员关注的热点问题。总结了近几年开发的石墨烯缺陷设计法、碳-碳杂化增强相法、金属和陶瓷纳米颗粒修饰石墨烯法以及原位生长石墨烯和石墨烯复合增强相法等多种界面调控策略,讨论了多种界面调控策略对石墨烯增强铜基复合材料的力学、导电、导热性能的作用机理,展望了应用界面调控策略研发的高性能复合材料的应用前景和未来研发的发展方向。     

石墨烯含量对铜基复合材料的导电、导热、耐腐蚀和力学性能的影响（英文）

采用电场压力激活辅助合成工艺(Field activated and pressure assisted synthesis process (FAPAS))制备铜基石墨烯复合材料,研究不同的石墨烯含量对铜基体材料的微观结构和性能的影响机理。结果表明,石墨烯的添加能提高材料的位错密度、阻止位错在晶界移动,硬度提升17.6%;由于石墨烯添加量少,对铜基复合材料的位错密度和晶粒尺寸影响有限,片状的石墨烯能有效地弥补制备产生的缺陷,使材料的热导率和电导率分别提升2.9%和4.4%;石墨烯的添加使腐蚀电池两极间的电位差减小,降低了铜离子在氧化膜中的扩散能力,使复合材料的阻抗提升5.3%,腐蚀电流密度下降28.2%,有效地提升了铜基复合材料的耐腐蚀性能。铜基石墨烯复合材料的石墨烯最佳添加量为0.5 wt.%。     

石墨烯增强铜基复合材料的研究进展

石墨烯具有超高的比表面积和优异的力学性能, 是铜基复合材料理想的增强体。传统的粉末冶金工艺很难解决石墨烯在铜基体中的分散问题, 以及石墨烯与铜基体结合性差的难题。随着近些年研究者对石墨烯-铜界面问题深入的探索, 一些新的制备工艺不断出现。本文系统地介绍和对比了近几年石墨烯增强铜基复合材料的制备工艺, 概述了关于石墨烯/铜复合材料力学性能的研究进展, 总结了石墨烯增强铜基复合材料力学性能的机理, 并对未来石墨烯增强铜基复合材料的研究重点进行了展望。     

PBT/石墨烯/碳纳米管复合材料的制备及其导电性能研究

以膨胀石墨为基体,用硝酸铁、碳酸铵等物质对其进行修饰,结合化学气相沉积工艺,原位制备出石墨烯/碳纳米管复合粉体材料;利用扫描电镜对复合粉体进行了表征。采用熔融混炼的方法制备PBT/石墨烯/碳纳米管复合材料并测试了其表面电阻。研究结果表明:该方法可以制备出性能优异的石墨烯/碳纳米管复合粉体材料,将该复合粉体加入到PBT中所制备的复合材料具有优良的电性能;当复合粉体加入量为5%时,PBT/石墨烯/碳纳米管复合材料的表面电阻可达到106Ω。     

碳纳米管增强铜基复合材料的研究进展

高强高导铜基材料是一类有着广阔应用前景的材料,将碳纳米管作为增强相来制备铜基复合材料可以满足其对于强度和导电性的要求。制备出性能优良的复合材料的关键是解决碳纳米管的均匀分散及其与铜基体的界面结合问题。介绍了目前碳纳米管增强铜基复合材料的制备工艺及其所取得的成绩,并展望了将来的发展方向。     

Tribological properties of copper matrix composites reinforced with homogeneously dispersed graphene nanosheets

Graphene reinforced copper matrix composites (Gr/Cu) were fabricated by electrostatic self-assembly and powder metallurgy. The morphology and structure of graphene oxide, graphene oxide-Cu powders and Gr/Cu composites were characterized by scanning electronic microscopy, transmission electronic microscopy, X-ray diffraction and Raman spectroscopy, respectively. The effects of graphene contents, applied loads and sliding speeds on the tribological behavior of the composites were investigated. The results indicate that the coefficient of friction of the composites decreases first and then increases with increasing the graphene content. The lowest friction coefficient is achieved in 0.3?wt% Gr/Cu composite, which decreases by 65% compared to that of pure copper. The coefficient of friction of the composite does not have significant change with increasing the applied load, however, it increases with increasing the sliding speed. The tribological mechanisms of the composite under different conditions were also investigated.     

Influence of carbon nanotubes and dispersions of SiC on the physical and mechanical properties of pure copper and copper‐nickel alloy

This paper investigates the physical and mechanical properties of copper‐nickel alloy (at 50 wt.%–50 wt.%) and pure copper, mixed with various types of reinforcement materials such as carbon nanotubes (0.5 wt.%–2 wt.%) as nanoparticles, silicon carbide (1 wt.%–4 wt.%) as microparticles. The acquired composite specimens characteristics were estimated such as microstructure, density, electrical and thermal conductivity, hardness, and compression stress properties to determine the suitable reinforcement percentage that has the best physical and mechanical properties with different main matrix material whether copper‐nickel mechanical alloying or pure copper powder. The micron‐sized silicon carbide and nanosized carbon nanotubes were added to improve the mechanical and physical properties of the composite. The electrical and thermal conductivity of pure copper alloy enhanced compared with the copper‐nickel alloy matrix material. The hardness and compression yield stress of both pure copper and copper‐nickel composites have enhancement values and for copper‐nickel base composites hardness and compression yield stress have enhanced with the most positive enhancement values to examined an optimum percentage of reinforcing material.     

Effect of size and shape of metal particles to improve hardness and electrical properties of carbon nanotube reinforced copper and copper alloy composites

Utilizing the extra-ordinary properties of carbon nanotube (CNT) in metal matrix composite (MMC) for macroscopic applications is still a big challenge for science and technology. Very few successful attempts have been made for commercial applications due to the difficulties incorporating CNTs in metals with up-scalable processes. CNT reinforced copper and copper alloy (bronze) composites have been fabricated by well-established hot-press sintering method of powder metallurgy. The parameters of CNT–metal powder mixing and hot-press sintering have been optimized and the matrix materials of the mixed powders and composites have been evaluated. However, the effect of shape and size of metal particles as well as selection of carbon nanotubes has significant influence on the mechanical and electrical properties of the composites. The hardness of copper matrix composite has improved up to 47% compared to that of pure copper, while the electrical conductivity of bronze composite has improved up to 20% compared to that of the pure alloy. Thus carbon nanotube can improve the mechanical properties of highly-conductive low-strength copper metals, whereas in low-conductivity high-strength copper alloys the electrical conductivity can be improved.     

石墨烯含量对铜基石墨烯复合材料力学和电学性能的影响

为改进铜基复合材料的力学和电学性能,向铜基体分别加入0.2%、0.3%、0.4%(质量分数)的石墨烯,充分混合后,采用放电等离子烧结技术(SPS)制备了石墨烯/铜(G/Cu)复合材料。通过扫描电镜(SEM)、拉曼(Raman)光谱和XRD等表征了复合材料微观结构,测试了其硬度、屈服强度、抗压强度和导电率等性能,以确定石墨烯在铜基体中的合适掺杂量。结果表明:随着石墨烯含量的降低,其力电性能显著提高。当石墨烯质量分数为0.2%时,G/Cu复合材料的综合性能(力学及电学性能)达到最好匹配,实现了铜基材料的高强度、高导电性:其抗压强度和屈服强度分别为557.23 MPa和256 MPa,相对于用SPS方法制备的纯铜分别提高了59.21%和70.7%;电导率为52.3 MS/m,其IACS高达91.8%。     

Preparation of 3YSZ/Cu composite by in-situ chemical route

To improve electrical and mechanical properties of electrodes for contact welding, a 3 mol% yttria stabilized zirconia (3YSZ) to reinforced copper matrix composite was developed by an in-situ chemical process. The microstructure and properties of the in-situ composite were investigated. The results showed that in-situ nano-scale particles were uniformly dispersed in the copper matrix by dispersed nano-particle and its cluster. Due to their reinforcement, the hardness of the in-situ 3YSZ/Cu composite significantly increased. Moreover, the electrical conductivity of the in-situ composite decreased with the increase of 3YSZ content.     

石墨烯增强铜基复合材料研究进展

石墨烯是一种新兴的二维碳纳米材料,具有良好的力学、导电以及润滑性能,是铜基复合材料中最具潜力的增强体.本文综述了石墨烯增强铜基复合材料的制备工艺,详细分析并归纳了石墨烯增强铜基复合材料的界面结构对于复合材料力学性能的影响及增强机制,总结了石墨烯增强铜基复合材料摩擦学行为研究的最新进展,并深入阐述了石墨烯增强铜基复合材料的润滑耐磨机制,最后,展望了石墨烯增强铜基复合材料的发展前景.     

Enhancing the mechanical–electrical property simultaneously in pure copper composites by using carbonized polymer dots

In the development of copper-based composite materials, the dilemma of improving the mechanical properties without affecting the electrical properties is an important issue that must be solved. Here, carbonized polymer dot (CPD), as a novel reinforcement, was employed to fabricate CPD/Cu (pure copper) composite via powder metallurgy technique for the first time. The microstructure analysis revealed that the CPD was uniformly dispersed in the copper matrix in the form of nanoclusters, and the nanoclusters of CPD are composed of a three-dimensional amorphous carbon (AC) network structure and inserted carbon dots (some of them have a typical graphene structure, while others not). More importantly, excellent interface combination between the CPD and copper matrix is observed due to the existing of plenty of chemical functional groups. Based on this special microstructure, our prepared CPD/Cu composite achieves excellent mechanical and electrical conductivity simultaneously. Compared to pure Cu, the ultra-tensile strength of 0.2CPD/Cu composite is increased by about 17.0%, while the elongation is only?~?2% lower. The electrical conductivity of the composite is?~?98% IACS, which is much higher than that of pure copper prepared under the same condition (only?~?92% IACS). New insights into how to prepare advanced copper matrix composites with simultaneously improved overall performance will be found from our research.

     

Microstructure and mechanical properties of spark plasma sintered titanium‐added copper/reduced graphene oxide composites

Copper matrix composites were fabricated through mixing fixed amount of reduced graphene oxide and the different amounts of titanium. The dried copper/titanium/reduced graphene oxide mixture powders were firstly obtained by the wet‐mixing process, and then the spark plasma sintering process realized their faster densification. In the as‐sintered bulk composites, the layered reduced graphene oxide network, uniform titanium particles and copper‐titanium solid solution are observed in copper matrix. Investigations on mechanical properties show that the as‐prepared bulk composites exhibit the hardness and compressive yield strength compared with single reduced graphene oxide added composites. Increased titanium addition resulted into higher hardness and strength. The relevant formation and failure mechanisms of the composites and their influence on mechanical properties were discussed.