蓝宝石衬底分步清洗及其对后续氮化的影响

通过反射高能电子衍射仪(RHEED)分析蓝宝石衬底在经过双热电偶校温的ECR-PEMOCVD装置中清洗氮化实验表面晶质的RHEED图像,研究了常规清洗和ECR等离子体所产生的活性氢氮等离子体源对蓝宝石衬底清洗、氮化的实验.结果表明,经常规清洗后的蓝宝石衬底表面晶质差异较大,有些衬底再经通常的30min等离子体清洗是达不到要求的,而要根据情况施行分步清洗才能清洗充分,清洗充分的衬底经20min就可氮化出来,不充分的再长的时间也很难氮化.     

蓝宝石衬底的ECR等离子体清洗与氮化的RHEED研究

通过分析RHEED(反射高能电子衍射)图像研究了ECR(电子回旋共振)等离子体所产生的活性氢源和氮源对蓝宝石衬底的清洗与氮化作用,结果表明:在ECR氢等离子体中掺入少量的氮气可以明显提高蓝宝石衬底的清洗效果,从而获得平整而洁净的衬底表面;而采用ECR氮等离子体对经过氢氮混合等离子体清洗20min后的蓝宝石衬底进行氮化,能观测到最清晰的氮化铝成核层的RHEED条纹,且生长的GaN缓冲层质量是最好的.     

蓝宝石衬底的ECR等离子体清洗与氮化的RHEED研究

通过分析RHEED(反射高能电子衍射)图像研究了ECR(电子回旋共振)等离子体所产生的活性氢源和氮源对蓝宝石衬底的清洗与氮化作用,结果表明:在ECR氢等离子体中掺入少量的氮气可以明显提高蓝宝石衬底的清洗效果,从而获得平整而洁净的衬底表面;而采用ECR氮等离子体对经过氢氮混合等离子体清洗2 0 min后的蓝宝石衬底进行氮化,能观测到最清晰的氮化铝成核层的RHEED条纹,且生长的Ga N缓冲层质量是最好的     

GaN的ECR-PEMOCVD生长中衬底清洗和氮化的分析

在改进的电子回旋共振(ECR)等离子体增强金属有机物化学汽相沉积(ECR-PEMOCVD)装置(ESPD-U)中,以氮等离子体为氮源,三乙基镓(TEG)为镓源,在蓝宝石(α-Al2O3)衬底上生长氮化镓(GaN)薄膜.在不同的温度、氮氢流量下,分别对α-Al2O3衬底进行等离子体清洗和氮化,并用RHEED实时监测.通过对RHEED图像的分析,得出衬底清洗和氮化的最佳条件.     

α-Al2O3上生长GaN过程中氮化的研究

在自行设计研制的电子回旋共振等离子体增强金属有机物化学气相沉积(ECR?蛳EMOCVD)装置上生长氮化镓(GaN)薄膜，以氮等离子体为氮源，三乙基镓（TEG）为镓源，蓝宝石（α?蛳Al2O3）为衬底。通过反射高能电子衍射、原子力显微镜、射线衍射实验数据分析，研究了ECR等离子体所产生的活性氢源和氮源对蓝宝石（α?蛳Al2O3）衬底的氮化作用, 结果表明：在ECR等离子体中，不掺入氢气，温度较低时可以明显提高α?蛳Al2O3衬底的氮化效果，获得平整的氮化层，且生长的氮化镓缓冲层质量是最好的。     

氮化工艺对GaN缓冲层生长的影响

以氮等离子体为氮源,以三乙基镓（TEG）为镓源,在蓝宝石（Al2O3）衬底上生长GaN缓冲层。主要考察了氮化温度和氮气流量对缓冲层生长的影响。实验中采用了氢氮混合等离子体清洗的方法,提高了清洗的质量。用X射线衍射来表征晶体的结构,用原子力显微镜来表征表面形貌。通过对高能电子衍射仪获得的缓冲层与氮化层的衍射图样进行比较,对GaN的氮化实验参数进行了优化。     

氮化时间对RF-MBE法生长InN薄膜晶体结构的影响

采用射频等离子体分子束外延(RF-MBE)技术在蓝宝石(Al2O3)衬底上外延生长了InN薄膜,在生长之前对其进行不同时间的氮化处理.通过扫描电子显微镜(SEM)和X射线衍射(XRD)对薄膜的形貌和结构进行了表征,发现氮化时间小于60 min时获得的InN薄膜的晶体结构为多晶且表面粗糙,而氮化时间为60 min及120 min时获得的InN薄膜为单晶结构,表面粗糙度有所下降.分析表明,氮化时间对InN薄膜的晶体结构有很重要的影响.     

常压射频低温冷等离子体清洗光刻胶研究

介绍了一种新型的常压射频低温冷等离子体放电设备,用该设备进行了清洗光刻胶的工艺实验研究.实验结果表明:在100mm硅片表面涂上9912光刻胶,用等离子体进行清洗的速率可达500nm/min,测量了清洗速率与放电功率、氧气流量和衬底温度之间的变化关系;并对离子注入(B ,5×1015cm-2)后的光刻胶进行了清洗实验,得到清洗速率为300nm/min.清洗后的电镜分析证明,经等离子体清洗后,硅片表面无损伤、无残胶.     

以碳化硅做衬底的蓝色二极管脉冲激光器

Cree研究公司演示了一台在常温下运行的蓝色半导体二极管脉冲激光器，将其应用于商业设备上将会极大提高光存储容量．该公司生产的403urn激光器是以碳化硅做衬底和氮化像做激光介质．1995年日本Nichia化学工业公司曾演示过以蓝宝石做衬底的氯化筹二极管激光器，但Cree公司的激光器是第一个基于碳化硅衬底的氮化修激光器．与Nichin公司的蓝宝石衬底的蓝色氯化噱激光器比较，碳化硅衬底的氯化综激光器具有如下重要优点：·这种衬底具有自然的能通过激光能的解理面，而蓝宝石晶体没有这种解理面，因此研究人员必须用反应性离子蚀刻的方法制成…     

基于胶体球掩模板法制备图形化蓝宝石衬底

制备并研究了纳米级图形化蓝宝石衬底.采用磁控溅射技术在蓝宝石衬底上沉积 SiO2薄膜,利用自组装方法在SiO2薄膜上制备单层聚苯乙烯(PS)胶体球阵列,利用感应耦合等离子体干法刻蚀将周期性PS胶体球的图形转移到SiO2薄膜上,通过湿法腐蚀制备了纳米级图形化蓝宝石衬底.利用扫描电子显微镜对胶体球掩膜、SiO2纳米柱掩膜和图形化蓝宝石衬底结构进行了观察,研究了湿法腐蚀蓝宝石衬底的中间产物对刻蚀的影响,分析了腐蚀温度和腐蚀时间对蓝宝石衬底的影响.结果表明,湿法腐蚀的中间产物会降低蓝宝石衬底的刻蚀速率.蓝宝石衬底的腐蚀速率随着腐蚀温度的升高而加快;在同一腐蚀温度下,随着腐蚀时间的增加,图形尺寸进一步减小.     

基于双热电偶校准ECR-PEMOCVD薄膜生长温度分析研究

通过简单叙述Ⅲ族GaN基氮化物薄膜,以及了解半导体薄膜生长系统的温度变化情况重要性,提出了基于双热电偶校准薄膜生长装置ECR-PEMOCVD温度的方法.试验表明,置放样品的托盘温度(薄膜的生长的真实温度)与生长环境温度(设定温度)是不一样的,两者的差异甚至很大.最后讨论了在经过校温的系统上进行蓝宝石衬底的氢氮等离子体清洗实验,并通过RHEED图像评价清洗结果质量.     

Use of electron cyclotron resonance plasmas to prepare CdZnTe (211)B substrates for HgCdTe molecular beam epitaxy

Without any additional preparation, Cd_1−yZn_yTe (211)B (y∼3.5%) wafers were cleaned by exposure to an electron cyclotron resonance (ECR) Ar/H₂ plasma and used as substrates for HgCdTe molecular beam epitaxy. Auger electron spectra were taken from as-received wafers, conventionally prepared wafers (bromine: methanol etching, followed by heating to 330–340°C), and wafers prepared under a variety of ECR process conditions. Surfaces of as-received wafers contained ∼1.5 monolayers of contaminants (oxygen, carbon, and chlorine). Conventionally prepared wafers had ∼1/4 monolayer of carbon contamination, as well as excess tellurium and/or excess zinc depending on the heating process used. Auger spectra from plasma-treated CdZnTe wafers showed surfaces free from contamination, with the expected stoichiometry. Stoichiometry and surface cleanliness were insensitive to the duration of plasma exposure (2–20 s) and to changes in radio frequency input power (20–100 W). Reflection high energy electron diffraction patterns were streaked indicating microscopically smooth and ordered surfaces. The smoothness of plasma-etched CdZnTe wafers was further confirmed ex situ using interferometric microscopy. Surface roughness values of ∼0.4 nm were measured. Characteristics of HgCdTe epilayers deposited on wafers prepared with plasma and conventional etching were found to be comparable. For these epilayers, etch pit densities on the order of 10⁵ cm⁻² have been achieved. ECR Ar/H₂ plasma cleaning is now utilized at Night Vision and Electronic Sensors Directorate as the baseline CdZnTe surface preparation technique.     

N2 remote plasma cleaning of InP to improve SiNx:H/InP interface performance

Cleaning of InP surfaces using electron cyclotron resonance (ECR) nitrogen plasmas has been studied. Electrical performance of Al/SiN_x:H/InP structures has been analysed to determine the effect of the plasma cleaning. The SiN_x:H insulator layers are deposited at 200°C using an ECR chemical vapour deposition technique. It is observed that a 30 s low-power (60 W) ECR N₂ plasma treatment of InP surface reduces the interface defects and improves the resistivity and breakdown field values of the SiN_x:H.     

Electron cyclotron resonance hydrogen and nitrogen plasma surfacepassivation of AlGaAs/GaAs heterojunction bipolar transistors

Electron cyclotron resonance (ECR) hydrogen (H) and nitrogen (N) plasma surface passivation on an AlGaAs/GaAs heterojunction bipolar transistor (HBT) is reported. As a result of the plasma processing, the base current ideality factor is improved from 2.67 to 1.96, and the maximum current gain is increased from 720 to 1000. In the low-current regime, the base current is reduced by two orders of magnitude. The nitride layer grown by nitrogen plasma passivates the GaAs surface and appears to be thermally stable without significant degradation     

Hot plasma chemical vapor deposition of GaN on GaAs(100) substrate

GaN films have been deposited on GaAs(lOO) substrates by a novel growth technique, hot plasma chemical vapor deposition. A radio frequency N plasma source with high power, up to 5 kW, provides an abundance of nitrogen atoms during growth. In addition, strong ultraviolet emissions from the hot plasma irradiate onto the substrate and promote the dissociation of triethylgallium, this results in growth of GaN at very low temperature (even at room temperature). In this paper, we describe the characteristics of hot nitrogen plasma and present the results of the low temperature growth of GaN. In addition, we have investigated the effects of the nitridation of GaAs substrates. Reflection high energy electron diffraction indicates the formation of a surface cubic nitrided layer on the pretreated GaAs. The GaN films grown on fully nitrided GaAs(l00) substrates are of dominantly cubic structures.     

Effect of the Sapphire-Nitridation Level and Nucleation-Layer Enrichment with Aluminum on the Structural Properties of AlN Layers

The effect of atomic aluminum deposited onto sapphire substrates with different nitridation levels on the quality of AlN layers grown by ammonia molecular-beam epitaxy is investigated. The nitridation of sapphire with the formation of ~1 monolayer of AlN is shown to ensure the growth of layers with a smoother surface and better crystal quality than in the case of the formation of a nitrided AlN layer with a thickness of ~2 monolayers. It is demonstrated that the change in the duration of exposure of nitrided substrates to the atomic aluminum flux does not significantly affect the parameters of subsequent AlN layers.