厚度对反铁电锆酸铅薄膜光学折射率的影响

用化学溶液法在Pt／Ti／SiO2／Si(100)上制备了厚度分别为89nm和137nm的PbZrO3(PZ)薄膜。X-射线衍射结果表明晶化好的PZ薄膜是钙钛矿结构。用椭偏光谱仪在波长345～1700nm范围内，测量了不同厚度的PZ薄膜的椭偏光谱。获得了不同厚度薄膜的光学常数谱(折射率n和消光系数k)。结果表明在633nm处，厚度分别为89nm和137nm的PZ薄膜，其折射率n分别为2．090和2．236。     

Bi3．25La0．75Ti3O12超薄铁电薄膜的光学性质研究

采用化学溶液沉积法在Pt／Ti／SiO2／Si衬底上制备了厚度小于100nm的Bi3.25La0.75Ti3O12(BLT)铁电薄膜，测量了光子能量为2～4．5eV的紫外可见椭圆偏振光谱．根据经典的电介质光学色散关系和五相结构模型，拟合获得薄膜在透明区和吸收区的光学常数、表面粗糙度、薄膜与衬底界面层以及BLT薄膜的厚度．薄膜在透明区的折射率色散关系可以通过单电子Sellmeier模型成功地进行解释．最后，根据Tauc’s法则，得到Bi0.25La0.7Ti3O12薄膜的直接禁带宽度为3．96eV．     

GaN薄膜的椭偏光谱研究

采用椭圆偏振光谱法,在1.50～6.50 eV光谱内,研究了在蓝宝石衬底(0001)面上使用金属有机化学气相沉积(MOCVD)的方法制备的非掺杂纤锌矿结构GaN薄膜的光学性质。建立GaN表面层/外延层/缓冲层/衬底四层物理结构模型。与Cauchy和Sellmeier色散公式比较后选择了Tanguy Extended色散公式来分析GaN薄膜的光学性质。椭圆偏振光谱拟合结果表明,Tanguy Extended色散公式能更准确、方便地描述GaN薄膜在全波段(特别是带隙及带隙之上波段)的色散关系。提供了GaN薄膜在1.50～6.50 eV光谱范围内的寻常光(o光)和非寻常光(e光)折射率和消光系数色散关系,为定量分析GaN薄膜带边附近各向异性的光学性质提供了依据。     

偶氮金属镍薄膜的折射率和吸收特性研究

偶氮金属镍(Ni(azo)2)是一类具有很大潜力的可录光盘存储介质。为了准确地获取一种偶氮金属镍薄膜的光学常数，用旋涂法(Spin—coating)在单晶硅片上制备了Ni(azo)2薄膜。在波长扫描和入射角可变全自动椭圆偏振光谱仪上研究了Ni(azo)2薄膜的椭偏光谱。采用逼近算法获得了Ni(azo)2薄膜在可见光范围内的复折射率、复介电函数、吸收系数和薄膜厚度。分析了Ni(azo)2薄膜可见吸收光谱的形成机理。结果表明在波长650nm处薄膜的折射率为2．19，吸收常数为0．023，具有良好的吸收和反射特性，显示出作为高密度数字多用光盘(DVD-R)记录介质的良好应用前景。     

Si基ZnO/Ga2O3氨化反应制备GaN薄膜

利用射频磁控溅射法在Si(111)衬底上先溅射ZnO缓冲层，接着溅射Ga2O3薄膜，然后ZnO／Ga2O3膜在开管炉中850℃常压下通氨气进行氨化，反应自组装生成GaN薄膜。XRD测量结果表明利用该方法制备的GaN薄膜是沿c轴方向择优生长的六角纤锌矿多晶结构的薄膜，利用傅里叶红外吸收光谱仪测量了薄膜的红外吸收谱，利用SEM和TEM观测了薄膜形貌，PL测量结果发现了位于350nm和421nm处的室温光致发光峰。     

Sb掺杂SnO2/SiO2纳米光学气敏薄膜的制备及其性质

采用溶胶凝胶(sol-gel)工艺制备了Sb掺杂SnO2/SiO2复合膜。通过X射线衍射(XRD)、傅立叶变换红外谱(FT-IR)及原子力显微镜(AFM)表征了薄膜样品的物相结构与表面形貌,利用紫外-可见光谱研究了复合薄膜光学特性．利用p-偏振光双面反射法对薄膜的气敏特性进行了测试。实验结果表明,薄膜中的晶粒具有纳米尺寸(～35nm)的大小．比表面积大,孔隙率高;薄膜的透光率高,可见光波段近95％;纳米Sb：SnO2：SiO2复合膜的气敏灵敏度高于纯SnO2薄膜及Sb掺杂的SnO2薄膜。     

磁控溅射法制备的PZT非晶薄膜光学性质研究

采用磁控溅射方法在石英玻璃上制备了PbZrxTi1-xO3(PZT)(x=0．52)非晶薄膜，并测量了200～1100nm的紫外．可见．近红外透射光谱．基于薄膜的结构和多层结构的透射关系，发展了仅有6个拟合参数的光学常数计算模型．利用该模型，可以同时获得薄膜在宽波段范围内的光学常数和厚度，得到折射率的最大值为2．68，消光系数的最大值为0．562，拟合薄膜厚度为318．1nm．根据Tauc′s法则，得到PZT非晶薄膜的直接禁带宽度为3．75eV．最后，利用单电子振荡模型成功地解释了薄膜的折射率色散关系．     

Sb：SnO2／SiO2纳米复合薄膜的光学及气敏特性

采用溶胶-凝胶(sol-gel)工艺制备了Sb：SnO2／SiO2复合膜。通过原子力显微镜(AFM)观察了薄膜样品的表面形貌，利用紫外-可见光谱,p-偏振光反射比角谱研究了复合薄膜的光学特性。结果表明，薄膜中的晶粒具有纳米尺寸(～35nm)的大小，比表面积大，孔隙率高；薄膜的透光率高，可见光波段近95％；其光学禁带宽度约3．67eV。因此Sb：SnO2／SiO2纳米复合膜可作为气敏薄膜的理想选择。通过对三种不同的气体C3H8，C2H5OH及NH3气敏特性的测试表明，Sb掺杂大大提高了SnO2薄膜对C2H5OH的灵敏度，纳米Sb：SnO2／SiO2复合膜的气敏灵敏度高于纯SnO2薄膜及Sb掺杂的SnO2薄膜。     

高性能背照式GaN/AlGaN p-i-n紫外探测器的制备与性能

研究了GaN/AlGaN异质结背照式p-i-n结构可见盲紫外探测器的制备与性能。GaN/AlGaN外延材料采用金属有机化学气相沉积（MOCVD）方法生长，衬底为双面抛光的蓝宝石，缓冲层为AlN，n型层采用厚度为0.8 μm的Si掺杂Al0.3Ga0.7N形成窗口层，i型层为0.18 μm的非故意掺杂的GaN，p型层为0.15 μm的Mg掺杂GaN。采用Cl2、Ar和BCl3感应耦合等离子体刻蚀定义台面，光敏面面积为1.96×10-3 cm2。可见盲紫外探测器展示了窄的紫外响应波段，响应区域为310~365 nm，在360 nm处响应率最大，为0.21 A/W，在考虑表面反射时，内量子效率达到82％；优质因子R0A为2.00×108 Ω·cm2，对应的探测率D*=2.31×1013 cm·Hz1/2·W-1；且零偏压下的暗电流为5.20×10-13 A。     

基于原位共角椭偏与反射谱的TiO2薄膜光学常数分析

为了分析溶胶-凝胶法制备的TiO₂薄膜的光学常数,采用旋涂法制备了多层TiO₂薄膜,利用扫描电镜对表面形貌进行了分析,利用椭圆偏振光谱对薄膜的折射率色散和孔隙率进行了拟合分析,并利用原位共角反射光谱对拟合结果进行了验证,得到了TiO₂薄膜厚度、孔隙率和折射率色散曲线。结果表明,TiO₂薄膜厚度与旋涂层数成线性关系,薄膜孔隙率约为15%且与旋涂层数无关,New Amorphous色散模型可以较好地拟合溶胶-凝胶旋涂方法制备的TiO₂薄膜在1.55eV~4.00eV波段的椭偏光谱。该研究为溶胶-凝胶法制备的TiO₂薄膜的光学常数测量提供了参考。     

Effect of AlN buffer thickness on GaN epilayer grown on Si(1 1 1)

We studied the influence of high temperature AlN buffer thickness on the property of GaN film on Si (1 1 1) substrate. Samples were grown by metal organic chemical vapor deposition. Optical microscopy, atomic force microscopy and X-ray diffraction were employed to characterize the samples. The results demonstrated that thickness of high temperature AlN buffer prominently influenced the morphology and the crystal quality of GaN epilayer. The optimized thickness of the AlN buffer is found to be about 150 nm. Under the optimized thickness, the largest crack-free range of GaN film is 10 mm×10 mm and the full width at half maximum of GaN (0 0 0 2) rocking curve peak is 621.7 arcsec. Using high temperature AlN/AlGaN multibuffer combined with AlN/GaN superlattices interlayer we have obtained 2 μm crack-free GaN epilayer on 2 in Si (1 1 1) substrates.     

Effects of TiN Buffer Layer Thickness on GaN Growth

Smooth GaN layers were successfully grown on metallic TiN buffer layers by metalorganic chemical vapor deposition (MOCVD). One important factor in controlling GaN layer smoothness was the TiN layer thickness. We investigated systematically the effects of this thickness, and found an optimal thickness of 5 nm, at which the smallest average grain size (20 nm) and smoothest surface were obtained. The TiN layers increased surface coverage with GaN hexagons at an early stage of GaN growth, indicating that enhancing the GaN nucleation is essential for smooth GaN layer growth, and small grain size and smooth surface are needed to enhance GaN nucleation. Further reduction in TiN layer thickness to 2 nm decreased the surface coverage with GaN hexagons, and a high density of grooves and holes were observed in the surface of the 2-μm-thick GaN layers. Defect structures in the GaN layers grown on the TiN layers were remarkably changed on reduction of TiN layer thickness from 5 nm to 2 nm. GaN growth was found to be sensitive to the TiN layer thickness between 2 nm and 5 nm.     

不同插入层对抑制Mg掺杂p-GaN的记忆效应

研究了低温(LT) GaN和AlN不同插入层对抑制Mg掺杂p-GaN金属有机化学气相沉积外延中存在的记忆效应的影响,外延生长p-GaN缓冲层,制作具有该缓冲层的AlGaN/GaN高电子迁移率晶体管(HEMT),并对该器件进行电学测试.二次离子质谱仪测试表明p-GaN上10 nm厚的LT-GaN插入层相比于2 nm厚的AlN插入层能更好地抑制Mg扩散.霍尔测试表明,2 nm厚的AlN插入层的引入和GaN存在较大的晶格失配会引入位错,进而会降低AlGaN/GaNHEMT的电子迁移率以及增加其方块电阻;含有10 nm厚的LT-GaN插入层的p-GaN作为缓冲层的AlGaN/GaN HEMT,其方块电阻、电子迁移率以及二维电子气(2DEG)密度分别为334.9 Ω/口,1 923 cm2/(V·s)和9.68×1012 cm-2.器件具有很好的直流特性,其饱和电流为470 mA/mm,峰值跨导为57.7 mS/mm,电流开关比为3.13×109.     

CW blue-green light emission from GaN and SiC by sum-frequency generation and second harmonic generation

Continuous wave (CW) back-scattered sum-frequency generation (SFG) and second harmonic generation (SHG) have been obtained from GaN and SiC. GaN samples were obtained from GaN films grown by molecular-beam epitaxy (MBE), metalorganic chemical-vapor deposition and hydride vapor-phase epitaxy. The SiC samples were obtained from 3C SiC/Si grown by chemical vapor deposition (CVD), 4H and 6H single crystal SiC substrates. The samples were optically excited with two CW lasers at the red (840 nm) and the infrared (1.0 μm). SHG at 420 nm and 500 nm and SFG at 455 nm were observed. SFG and SHG were verified by measuring their relative intensities against the pumping laser power. The SHG signals from GaN and SiC samples are compared with that from KH₂PO₄ (KDP).     

Effects of p-type GaN thickness on optical properties of GaN-based light-emitting diodes

The influence of p-type Ga N(p Ga N) thickness on the light output power(LOP) and internal quantum efficiency(IQE) of light emitting diode(LED) was studied by experiments and simulations. The LOP of Ga N-based LED increases as the thickness of p Ga N layer decreases from 300 nm to 100 nm, and then decreases as the thickness decreases to 50 nm. The LOP of LED with 100-nm-thick pG a N increases by 30.9% compared with that of the conventional LED with 300-nm-thick p Ga N. The variation trend of IQE is similar to that of LOP as the decrease of Ga N thickness. The simulation results demonstrate that the higher light efficiency of LED with 100-nm-thick p Ga N is ascribed to the improvements of the carrier concentrations and recombination rates.     

Simulation of electrical properties of InxAl1-xN/AlN/GaN high electron mobility transistor structure

Electrical properties of In_x Al_1-xN/AlN/GaN structure are investigated by solving coupled Schr（o|¨）dinger and Poisson equations self-consistently.The variations in internal polarizations in In_xAl_1-xN with indium contents are studied and the total polarization is zero when the indium content is 0.41.Our calculations show that the twodimensional electron gas（2DEG） sheet density will decrease with increasing indium content.There is a critical thickness for AIN.The 2DEG sheet density will increase with In_xAl_1-xN thickness when the AIN thickness is less than the critical value.However,once the AIN thickness becomes greater than the critical value,the 2DEG sheet density will decrease with increasing barrier thickness.The critical value of AIN is 2.8 nm for the lattice-matched In_0.18Al_0.82N/AlN/GaN structure.Our calculations also show that the critical value decreases with increasing indium content.     

AlGaN/GaN横向肖特基势垒二极管的仿真与制作

基于GaN横向肖特基势垒二极管(SBD)的频率特性和应用的需要,设计了一种基于AlGaN/GaN异质结的横向SBD.利用Silvaco Atlas软件研究了 AlGaN势垒层的厚度和Al摩尔组分对异质结AlχGaN1-χ/GaN SBD电学性能的影响.仿真结果表明,SBD器件截止频率随Al摩尔组分的增加先增大再减小,当AlχGaN,1-χ层中Al摩尔组分为0.2～0.25,其厚度为20～30nm时,AlGaN/GaN SBD器件的频率特性最好.在仿真的基础上,设计制作出了肖特基接触直径为2 μm的非凹槽和凹槽型AlGaN/GaN横向空气桥SBD.通过直流I-V[测试和射频S参数测试,提取了两种SBD器件的理想因子、串联电阻、结电容、截止频率和品质因子等关键参数,该平面 SBD可应用于片上集成和混合集成的太赫兹电路的设计与制造.     

AlGaN/GaN/AlGaN双异质结材料生长及性质研究

基于能带理论设计并利用MOCVD技术在76.2 mm蓝宝石衬底上生长了不同GaN沟道层厚度的AlGaN/GaN/AlGaN双异质结材料.室温霍尔测试结果表明:双异质结材料的二维电子气面密度随沟道层厚度增加有所升高并趋于饱和;二维电子气迁移率则随沟道厚度增加明显升高.200 nm厚GaN沟道的双异质结材料方块电阻平均值3...     

Specifics of MOCVD formation of InxGa1−x N inclusions in a GaN matrix

MOCVD-grown heterostructures with one or several In_xGa_1?x N layers in a GaN matrix have been studied by transmission electron microscopy. In heterostructures with thick InGaN layers, a noncoherent system of domains with lateral dimensions (～50 nm) on the order of the layer thickness (～40 nm) is formed. In the case of ultrathin InGaN inclusions, nanodomains coherent with the GaN matrix are formed. The content of indium in nanodomains, determined by the DALI method, is as high as x≈0.6 or more, substantially exceeding the average In concentration. The density of the nanodomains formed in the structures studied is n≈(2–5)×10¹¹ cm^?2. In the structures with ultrathin InGaN inclusions, two characteristic nanodomain sizes are observed (3–6 and 8–15 nm).     

掺铒石英光纤中的受激拉曼散射及受激四光子混频

报道了掺铒光纤受激拉曼散射（ＳＲＳ）和受激四光子混频（ＳＦＰＭ）的实验研究。所用光纤长为１０ｍ，泵浦源为ＮｄＹＡＰ倍频５３９．７ｎｍ脉冲激光，脉冲能量为０．１Ｊ，脉宽为５０ｎｓ，获得了从５５２．１～６２２．８ｎｍ的６级受激拉曼散射谱和受激四光子混频的Ｓｔｏｋｅｓ（５４２．９ｎｍ）及反Ｓｔｏｋｅｓ（５３７ｎｍ）谱线。