High-speed 1 ?m GaAs m.e.s.f.e.t.

By minimising parasitic series resistances, a GaAs m.e.s.f.e.t. with 1 ?m gate length was fabricated, possessing the highest known r.f. power gain, measured up to 18 GHz, for GaAs m.e.s.f.e.t.s.     

New estimate of the minimum noise figure of a m.e.s.f.e.t.

New estimates of the drain and gate noise multiplication parameters, the correlation coefficient and the minimum noise figure for a m.e.s.f.e.t. are advanced. For an uncooled GaAs m.e.s.f.e.t. having a 1 ?m gate length, a minimum possible noise figure of 1 dB at 10 GHz is predicted. InP is only marginally better.     

Microwave power amplification with InP f.e.t.s

InP f.e.t.s were fabricated from v.p.e. layers, with an Al gate of 1.5 ?m × 308 ?m. The power output at 9 GHz, with 4 dB gain, was 1.15 W/mm gate width. This result is believed to be higher than the best published results obtained with equivalent GaAs f.e.t. structures.     

U.H.F. low-noise GaAs m.e.s.f.e.t. amplifier for colour t.v. broadcasting translator

Low-noise amplifiers for u.h.f. colour t.v. broadcasting translator use have been successfully developed by using 1 ?m gate GaAs m.e.s.f.e.t.s. The obtained performances revealed that a GaAs m.e.s.f.e.t. has low-noise and low intermodulation distortion characteristics, even in the 500?800 MHz frequency range, compared with a Si bipolar transistor.     

X and Ku band GaAs m.e.s.f.e.t.

A GaAs Schottky-barrier f.e.t. (m.e.s.f.e.t.) with a 1 ?m gate has been built, which is suitable for X band and Ku band applications. The unilateral power gain over the X band is above 9 dB and the noise figure is only 5 dB at 10 GHz.     

High-yield self-alignment method for submicrometre GaAs m.e.s.f.e.t.s

A high-yield self-alignment technique for submicrometer GaAs m.e.s.f.e.t.s is described. This method allows the production of submicrometre gate lengths and source-drain spacings by means of standard contact photolithography without requiring a particularly fine geometry on the masks. A 0.5 ?m long gate and a source-drain spacing of 2 ?m were obtained.     

Enhancement-mode GaAs m.o.s.f.e.t. on semi-insulating substrate using a self-aligned gate technique

A self-aligned gate notched channel GaAs m.o.s.f.e.t. structure on semi-insulating substrate is presented. Device operation is mainly in enhancement mode. The transconductance is comparable to enhancement-mode m.e.s.f.e.t.s, j.f.e.t.s and s.i.g.f.e.t.s; however, the output-current capability is essentially increased.     

GaAs power f.e.t.s with semi-insulated gates

GaAs semi-insulated-gate f.e.t.s (s.i.g.f.e.t.s) have been fabricated by Ar+ bombardment in the gate region. The d c. characteristics and microwave performance are compared with those of conventional power m.e.s.f.e.t.s fabricated from the same slice. Up to 2.9W output power with 4dB gain has been obtained from s.i.g.f.e.t. devices at 8 GHz.     

Dual gate GaAs m.e.s.f.e.t. phase shifter with gain at 12 GHz

A dual gate m.e.s.f.e.t. phase shifter is described with 4 dB insertion gain at 12 GHz and more than 100° linear continuous phase shift as a function of the d.c. voltage applied to the controlling gate electrode.     

Modelling the m.e.s.f.e.t. output nonlinearity

Conditions governing the modelling of transductance and drain-conductance nonlinearities from measured data are investigated. A simple representation for regions close to pinch-off, corresponding to mixer operation, is obtained. Results of the modelling are compared to measurements on a typical 1 ?m gate length m.e.s.f.e.t.     

Dual-gate m.e.s.f.e.t. self-oscillating X-band mixers

GaAs dual-gate m.e.s.f.e.t.s have been successfully used as self-oscillating down-convertors in X-band. A single device replaces the preamplifier, mixer and local oscillator. The best conversion gain achieved by mixing from 10 GHz down to 1 GHz was 12 dB. The input (gate 1) to output (drain) port isolation amounted to 16 dB. Slug-tuner and `disc?-resonator circuits were tested and showed comparable gain and noise performance. Best d.s.b. noise figures of 5.5 dB could be realised at an i.f. of 1 GHz with an associated conversion gain of 4 dB.     

Bit synchronisation in Gbit/s range using dual gate GaAs m.e.s.f.e.t.s

Bit synchronisation at 1 and 2 Gbit/s including pulse width reduction is achieved using dual gate GaAs m.e.s.f.e.t.s. Circuits and time behaviour of input-, clock- and output signals are shown.     

GaAs m.e.s.f.e.t. prepared by organometallic chemical vapour deposition

GaAs m.e.s.f.e.t.s with gate dimensions of 1.5 ?m × 300 ?m were fabricated in the epitaxial layers grown by organometallic chemical vapour deposition (o.m.c.v.d.) technique. The average saturation velocity in the channel was deduced to be 1.3 × 107 cm/s and is equal to that of epitaxial layers grown by AsCl3 chemical vapour deposition (c.v.d.). The velocity degraded region was confined to within about 350 ? of the interface. A gain of 10 dB and a noise figure of 3 dB with an associated gain of 5.5 dB at 8 GHz were measured.     

n-channel inversion-mode InP m.i.s.f.e.t.

Capacitance/voltage and m.i.s.f.e.t. inversion-mode f.e.t. data are reported for p-type InP. It is shown that the surface of this material appears to be inverted at zero gate bias and that good inversion-mode (normally-off) device behaviour is possible.     

Large signal GaAs m.e.s.f.e.t. model and distortion analysis

A simple large signal model, derived from small signal measurements over a range of bias points, is presented for a 2 ?m gate length GaAs m.e.s.f.e.t. Its accuracy is verified by comparing model-predicted second harmonic distortion via time domain and Volterra analyses, with measurements to input frequencies of 4.5 GHz.     

Equivalent circuit for the conductance of an m.o.s.f.e.t.

A simple equivalent circuit is proposed to cover the deviation of the conductance of an m.o.s.f.e.t. from a linear function of gate voltage.     

n-channel formation on semi-insulating InP surface by m.i.s.f.e.t.

InP m.i.s.f.e.t.s using Fe-doped semi-insulating material surface have been fabricated. The devices, composed of sulphur-diffused n-type source and drain and c.v.d. Al2O3 gate insulator, exhibited n-channel normally-off behaviour and a source drain capacitance two orders of magnitude smaller than that of p-InP m.i.s.f.e.t.s with the same dimensions.     

Silicon-on-sapphire m.o.s.f.e.t.s fabricated by back-surface laser-anneal technology

Self-aligned aluminium-gate silicon-on sapphire (s.o.s.) m.o.s.f.e.t.s have been fabricated by applying laser-anneal technology from the back surface for activation of the ion-implanted channel layer. The threshold voltage and surface electron mobility were similar to the conventional silicon-gate m.o.s.f.e.t.s, but the low resistivity of gate and interconnection electrodes using aluminium is advantageous for high switching speed m.o.s. l.s.i.     

Effects of capacitance at crossover wirings in power GaAs m.e.s.f.e.t.s.

Power GaAs f.e.t.s. with an air-bridge crossover were compared with those of SiO2 crossover to find the effect of the capacitance at the crossover points. The capacitance of SiO2 crossover points is much smaller than that of the gate pad or the gate busbar in power GaAs f.e.t.s, and deterioration of the microwave performance due to that capacitance is negligible.     

GaAs power f.e.t.s with electron-beam-defined gates

The fabrication of GaAs power f.e.t.s having 1 ?m electron-beam-defined gates with 4800 ?m total gatewidth is described. The microwave performance at X-band is compared with that of conventionally defined devices having 2 ?m gate lengths.