InGaAs/InP材料的Zn扩散技术

使用MOCVD反应室进行了InGaAs和InP材料上的Zn扩散工艺条件研究.通过控制扩散温度、扩散源浓度和扩散时间三个主要工艺参数,研究了InGaAs/InP材料的扩散系数和扩散规律,获得了优化的扩散条件.试验表明,该扩散工艺符合原子扩散规律,扩散现象可以用填隙-替位模型解释.样品经过快速退火过程,获得了极高的空穴浓度.InP的空穴浓度达到7.7×1018/cm3,而InGaAs材料达到7×1019/cm3.在优化的扩散条件下,Zn扩散的深度和浓度精确可控,材料的均匀性好,工艺重复性好,能够应用于光电探测器或其他器件.     

In0.53Ga0.47As/InP高速光电二极管材料生长及光电性能

利用低压MOCVD技术制备PIN结构的InP基InGaAs外延材料。采用分层吸收渐变电荷倍增(SAGCM)结构,通过两次Zn扩散、多层介质膜淀积、Au/Zn p型欧姆接触、Au/Ge/Ni n型欧姆接触等标准半导体平面工艺,设计制造正入射平面In_(0.53)Ga_(0.47)As/InP雪崩光电二极管器件。该器件采用与InP衬底晶格匹配的In_(0.53)Ga_(0.47)As材料做吸收层,InP材料做倍增层,同时引入InGaAsP梯度层。探测器件光敏面直径50μm,器件测试结果表明该器件光响应特性正常,击穿电压约43 V,在低于击穿电压3 V左右可以得到大约10 A/W的光响应度,在0 V到小于击穿电压1 V的偏压范围内,暗电流只有1 nA左右。光电二极管在8 GHz以下有平坦的增益,适用于5 Gbit/s光通信系统。     

一种硅基雪崩光电探测器的研究

硅基雪崩光电探测器（Si-APD）性能参数的研究可以优化改进器件结构的设计,而结构设计直接影响雪崩光电探测器的光电特性。本文针对Si基雪崩光电探测器的性能参数和器件结构进行研究,提出了改善器件性能参数的工艺方法,最终设计了一种硅基雪崩光电探测器结构。     

硅基IV族光电器件研究进展(二)——光电探测器

基于Ge、GeSn等IV族材料的硅基探测器与Si CMOS工艺兼容性好,成本低廉,并且易于与硅基波导器件集成,因而具有非常重要的应用价值。介绍了中国科学院半导体研究所在相关硅基IV族合金材料外延制备及相关器件方面的研究,重点介绍在硅基Ge面入射探测器、波导型探测器、吸收电荷倍增分离型(SACM)结构雪崩光电探测器以及GeSn光电探测器方面的一些研究进展。     

一种低暗电流高响度InGaAs/InP pin光电探测器

分析了InGaAs/InP pin光电探测器暗电流和响应度的影响因素,并对MOCVD外延工艺以及器件结构进行优化,从而提高器件响应度和降低暗电流。采用低压金属有机化学气相沉积设备(LP-MOCVD)成功制备了InGaAs/InP pin光电探测器,得到了高质量的晶体材料,InGaAs吸收层的背景浓度低于4×1014 cm-3。利用扩Zn工艺制作出感光区直径为70μm的平面光电探测器。测量结果显示,在反偏电压为5 V时,暗电流小于0.05 nA,电容约为0.4 pF。此外,在1 310 nm激光的辐照下,器件的响应度可达0.96 A/W以上。     

氮化镓基雪崩光电二极管的研制

文章简单回顾了氮化镓基雪崩光电二极管的发展现状,从制作高响应率、低漏电流的雪崩器件出发,详细阐明了制作氮化镓基雪崩光电二极管的工艺过程,特别考虑了干法刻蚀带来的物理损伤以及后续的消除损伤处理.由于雪崩器件对于材料的质量具有较苛刻的要求,因此特别对材料进行了必要的筛选.通过一系列工艺上的改进,成功地制作出国内第一只氮化镓基雪崩光电二极管,器件的光敏面直径是40μm;并对其进行了光电性能测试.测试结果表明,当反向偏压是58V时,漏电流大约是1.18×10-7 A,雪崩增益是3.     

InP中低温Zn扩散的研究

一、引言随着长波长光纤通信的迅速发展,InGaAsP/InP双异质结发光器件和探测器件已被人们所重视。Zn向InP中的扩散技术,对InGaAsP/InP光源和探测器件的制备是有重要影响的工艺。近年来已有许多研究。为了制备InGaAsP/InP双异质结发光管的需要,我们研究了InP中Zn的低温扩散技术。本文报导的低温双温区扩散工艺,可得到表面光亮,Zn浓度分布均匀,重复性好,无损伤的高浓度表面层。讨论了Zn在InP中扩散时的行为,解释了扩散过程中的异常现象。     

LPE制作平面型InGaAs/InP APD

叙述了用液相外延(LPE)制作 InGaAsP/InP 雪崩光电二极管(APD)的物理性能。分析了该器件的设计参数。介绍了器件结构、器件制作中 LPE 生长条件及器件性能。最后,评述了器件发展水平及改进意见。     

带缓冲层的新型InGaAs异质结构APD

<正> 日本KDD研究和发展实验室提出了一种新型异质结构雪崩光电二极管,并且已用液相外延和锌扩散方法成功地制造了这种器件。这种器件是由InP衬底上连续生长三层的外延片所构成,即In_(0.53)Ga_(0.47)As光吸收层、InGaAsP缓冲层和InP雪崩倍增层。器件在0.9V_B下暗电流密度达到1×10~(-4)A/cm~2,当用1.15μm的光照时,二极管的最大倍增增益为880,外量     

InGaAs/InP雪崩光电探测器异质结结构优化分析

根据一个吸收层、电荷层和倍增层分立结构(SACM)的InGaAs/InP雪崩光电探测器,减薄电荷层的厚度而引入渐变层,保持材料与厚度不变,改进成吸收层、电荷层、过渡层与倍增层分立结构(SAGCM)的雪崩光电探测器,优化了吸收层与倍增层间材料的异质结结构.采用APSYS软件对其能带结构、电场分布以及暗电流和1.55μm的脉冲光响应电流、增益等进行仿真与计算.对比两种器件的性能,结果分析表明,改进后的器件获得更低的穿通值电压,降低探测器在低偏压下的漏电流,同时得到更大的增益.     

Optical properties of Zn-diffused InP layers for the planar-type InGaAs/InP photodetectors

Zn diffusion into InP was carried out ex-situ using a new Zn diffusion technique with zinc phosphorus particles placed around InP materials as zinc source in a semi-closed chamber formed by a modified diffusion furnace.The optical characteristics of the Zn-diffused InP layer for the planar-type InGaAs/InP PIN photodetectors grown by molecular beam epitaxy (MBE) has been investigated by photoluminescence (PL) measurements.The temperature-dependent PL spectrum of Zn-diffused InP samples at different diffusion temperatures showed that band-to-acceptor transition dominates the PL emission,which indicates that Zn was commendably diffused into InP layer as the acceptor.High quality Zn-diffused InP layer with typically smooth surface was obtained at 580 ℃ for 10 min.Furthermore,more interstitial Zn atoms were activated to act as acceptors after a rapid annealing process.Based on the above Zn-diffusion technique,a 50μm planar-type InGaAs/InP PIN photodector device was fabricated and exhibited a low dark current of 7.73 pA under a reverse bias potential of-5 V and a high breakdown voltage of larger than 41 V (I ＜ 10 μA).In addition,a high responsivity of 0.81 A/W at 1.31 μm and 0.97 A/W at 1.55 μm was obtained in the developed PIN photodetector.     

InP/In_xGa_(1-x)As异质结构中Zn元素的扩散机制

采用闭管扩散方式实现了Zn元素在晶格匹配InP/In_(0.53)Ga_(0.47)As及晶格失配InP/In_(0.82)Ga_(0.18)AS两种异质结构材料中的P型掺杂,利用二次离子质谱(SIMS)以及扫描电容显微技术(SCM)对Zn在两种材料中的扩散机制进行了研究.SIMS测试表明:Zn元素在晶格失配材料中的扩散速度远大于在晶格匹配材料中的扩散速度,而SCM测试表明:两种材料中的实际PN结深度与SIMS测得的Zn扩散深度之间存在一定的差值,这是由于扩散进入材料中的Zn元素并没有被完全激活,而晶格失配材料中Zn的激活效率相对更低,使得晶格失配材料中Zn元素扩散深度与PN结深度的差值更大.SCM法是一种新颖快捷的半导体结深测试法,对于半导体器件工艺研究具有重要的指导意义.     

闭管扩散Zn对InP表面性质的影响

利用闭管扩散方法以Zn3P2为扩散源，在不同扩散温度和扩散时间下对非故意掺杂InP (100）晶片进行扩散. 用电化学C-V法（ECV）和二次离子质谱法(SIMS)分别测出了空穴浓度和Zn的浓度随深度的分布曲线. 结果表明扩散后InP表面空穴和Zn的浓度在扩散结附近突然下降，InP表面空穴浓度主要取决于扩散温度，扩散深度随着扩散时间的增长而变大，InP表面Zn浓度一般比空穴浓度高一个数量级. 另外对扩散后的样品进行光致发光（PL) 测试，表明在保证表面载流子浓度的同时，适当降低扩散温度和增加扩散时间能减小对InP表面性质的影响.     

Effects of S,Si, or Fe dopants on the diffusion of Zn in InP during MOCVD

Diffusion of Zn in InP during growth of InP epitaxial layers has been investigated in layer structures consisting of Zn-InP epilayers grown on S-InP and Fe-InP substrates, and on undoped InP epilayers. The layers were grown by metalorganic chemical vapour deposition (MOCVD) atT = 625° C andP = 75 Torr. Dopant diffusion profiles were measured by secondary ion mass spectrometry (SIMS). At sufficiently high Zn doping levels ([Zn] ≥8 × 10¹⁷ cm⁻³) diffusion into S-InP substrates took place, with accumulation of Zn in the substrate at a concentration similar to [S]. Diffusion into undoped InP epilayers produced a diffusion tail at low [Zn] levels, probably associated with interstitial Zn diffusion. For diffusion into Fe-InP, this low level diffusion produced a region of constant Zn concentration at [Zn] ≈ 3 × 10¹⁶ cm⁻³, due to kick-out of the original Fe species from substitutional sites. We also investigated diffusion out of (Zn, Si) codoped InP epilayers grown on Fe-InP substates. The SIMS profiles were characterised by a sharp decrease in [Zn] at the epilayer-substrate interface; the magnitude of this decrease corresponded to that of the Si donor level in the epilayer. For [Si] ≫ [Zn] in the epilayer no Zn diffusion was observed; Hall measurements indicated that the donor and acceptor species in those samples were electrically active. All these results are consistent with the presence of donor-acceptor interactions in InP, resulting in the formation of ionised donor-acceptor pairs which are immobile, and do not contribute to the diffusion process.     

Ⅲ-Ⅴ族半导体化合物快速热退火扩Zn方法研究

以GaAs和InP材料为例,对化合物半导体材料中的快速热退火扩Zn可行性进行比较分析,研究表明,化合物半导体材料中快速热退火扩Zn可行性与化合物半导体材料的分解温度有着密切关系。化合物半导体材料分解温度越低,对扩散源、帽层和阻挡层要求越高。针对InP材料高于360℃就分解、低温Zn扩散困难的特点,提出了直接溅射Zn层在410℃低温扩散的方法。对InP快速热退火扩散结果进行分析,初步分析表明其掺杂机理是形成合金结。     

Impurity-induced disordering of AIGalnAs quantum wells by low temperature Zn diffusion

We investigated impurity-induced disordering (IID) in AIGalnAs multi-quantum wells (MQWs) on InP substrate by Zn diffusion under low temperature conditions. Blue-shift of band-gap energy of lattice-matched AIGalnAs MQW on InP strongly depended on the temperature of Zn diffusion. The lattice-matched MQW was not completely disordered below 500°C. On the other hand, photoluminescence spectra from compressively strained AIGalnAs MQW, after disordering was independent of the temperature of Zn diffusion. Considerable disordering was observed in the strained MQW, which was saturated even at the low temperature of 400°C. The measured hole concentration of the Zn diffused layer at 400°C was as low as 3 × l0¹⁸cm⁻³ The IID lasers were also fabricated and characterized. No significant increase in the optical loss due to the Zn diffusion was observed in these lasers. On leave from Toshiba Co., Japan.     

Low-temperature Zn- and Cd-diffusion profiles in InP and formation of guard ring in InP avalanche photodiodes

Zn and Cd diffusion in InP were studied in the wide temperature range of 350-580°C to realize a guard ring in InP avalanche photodiodes (APD's). Hole-concentration profiles for Zn and Cd diffusions at various temperatures were found to be expressed by a unified empirical curve, which decreases exponentially with the distance from the surface, and abruptly decreases at the diffusion front. A graded junction can be formed by diffusion at temperatures lower than 500°C for the n-InP background carrier concentration of 1016cm-3, while an abrupt junction can be formed by higher temperature diffusion. Breakdown voltages for the graded-junction diodes formed by low-temperature diffusion were confirmed to be higher than those for the abrupt-junction diodes formed by the higher temperature diffusion. A guard ring formed by the low-temperature Cd diffusion enabled planar-type InP and InGaAs/InP APD's to have uniform multiplication in the photosensitive area without any edge breakdown.     

Neural network based modeling of diffusion process for high-speed avalanche photodiodes fabrication

This paper presents the modeling methodology of Zn diffusion process utilized for high-speed avalanche photodiode fabrication using neural networks. The modeling scheme can characterize the effects of diffusion process conditions on the performance metrics of diffusion process. Three different InP-based test structures with different doping concentrations in diffused layer are explored. Three input factors (sealing pressure, amount of Zn₃P₂ source per volume, and doping concentration of diffused layer) are examined with respect to the two performance metrics (diffusion-rate and Zn doping concentration) by means of D-optimal design experiment. Diffusion rate and Zn doping concentration in diffused layer are characterized by a response model generated by training feed-forward error back-propagation neural networks. It is observed that the neural network based process models developed here exhibit good agreement with experimental results.     

Ultra-low dark count InGaAs/InP single photon avalanche diode

A low noise InGaAs/InP single photon avalanche diode (SPAD) is demonstrated. The device is based on planar type separate absorption, grading, charge and multiplication structure. Relying on reasonably designed device structure and low-damage Zn diffusion technology, excellent low-noise performance is achieved. Due to its importance, the physical mechanism of dark count is analyzed through performance characterization at different temperatures. The device can achieve 20% single photon detection efficiency and 320 Hz dark count rate (DCR) with a low after pulsing probability of 0.57% at 233 K.