太赫兹InP HEMTs的神经网络建模方法

包含新技术、新材料的非传统器件的不断涌现使现有的模型已不能完全表征THz器件的特性。而采用神经网络建模的方法,可极大地提高建模的效率和精确度,解决一系列传统模型所无法解决的问题,是一种新型的CAD建模方法。本文采用神经网络空间映射的方法,在传统的粗模型的基础上对输入信号进行有效地修正,从而得到适合太赫兹器件的精确模型,器件的截止频率Ft和最高振荡频率Fmax分别为220GHz和310GHz。模型在直流IV和1-110GHz范围内的S参数与测试结果吻合较好,比传统粗模型的精度有了较大的提高。     

基于版图级综合的频率部分空间映射神经 网络建模技术及其在LTCC射频电路中的应用

提出了基于电路版图级综合的频率部分空间映射神经网络建模的微波电路设计方法.将空间映射技术应用在神经网络建模中降低了神经网络的复杂程度,频率部分空间映射技术仅建立部分设计参数的映射,在确保一定准确度的前提下可以提高建模效率,减小神经网络拓扑结构的复杂性,使粗模型的参数提取时间以及神经网络的训练时间减少.空间映射技术中粗模型由版图级综合得到,基于全波分析的集总电路建模考虑寄生效应,具有一定的准确性和快速性,作为频率部分空间映射神经网络建模技术高质量的粗模型,从而提高了建摸的准确性和速度,增强建模的灵活性.在细模型的扫频中,采用S-B自适应采样技术可以进一步减少建模时间.本文用此方法设计低温共烧陶瓷滤波器,证明用这种方法建模快速、准确.     

太赫兹InP HEMT器件的建模

采用减小栅长(Lg)的方法可以显著提高磷化铟基高电子迁移率晶体管(InP HEMT)器件的直流和微波性能,并使器件的工作频率上升到太赫兹频段。采用T形栅工艺制备了70 nm栅长的InP HEMT器件,器件的直流跨导达到了2.87 S/mm,截止频率ft和最大振荡频率fmax分别为230 GHz和310 GHz。对器件的寄生参数进行了提取和去嵌入,得到了器件的本征S参数。采用经典的9参数模型拓扑结构对器件进行了小信号建模,模型仿真与测试结果拟合良好。针对电流的短沟道效应,采用电流分段的方法来拟合I-V曲线,取得了较好的拟合结果。最后采用Angelov模型对器件的电容进行建模,并最终建立了器件的大信号模型。     

基于PSO_SVM的射频功率放大器模型研究

针对神经网络和支持向量机在射频功率放大器建模领域存在的优缺点,提出一种利用PSO_SVM算法对射频功率放大器进行建模的方法.从理论上分析了支持向量机(SVM)及粒子群优化(PSO)算法的相关原理,并将PSO_SVM算法应用到功放器件建模中.仿真结果表明,基于PSO_SVM的射频功放模型在模型精度、小样本学习和逼近能力方面均优于传统SVM模型和BP神经网络(BPNN)模型.     

一种鱼骨型GaN HEMT分布式模型

基于传输线理论,推导了GaN HEMT沟道分布式等效电路模型,为有效提取GaN HEMT小信号模型参数提供了依据。设计了一种新颖的鱼骨型GaN HEMT器件结构,由于采用了较短的栅指,非常有利于纵向散热,与常规型HEMT器件结构相比,热阻有了明显改善,但也增加了建模的复杂度。采用分布式建模技术,为鱼骨型器件建立了一种分布式等效电路模型,模型在1~20 GHz内与实测S参数吻合较好,表明分布式建模技术可以用于准确地模拟鱼骨型GaN HEMT器件的高频特性。     

一种基于神经网络的微波器件快速建模方法北大核心CSCD

随着微波器件结构复杂度的增长和产品性能要求的提高,微波器件建模不仅要能够描述其理想电磁特性,还要能快速准确反映多物理参数对器件性能的影响。虽然神经网络已经被引入到微波器件领域,但是将其应用于器件的多物理特性建模的研究还比较少。文章提出了一种基于人工神经网络的多物理参数建模方法来表示输入输出变量之间的非线性关系。提出了一种高效的神经网络多物理参数模型,并针对该模型引入了一种新的训练算法。所提出的模型可以快速准确地预测微波器件的多物理响应,如滤波器的S参数特性曲线、离子敏感场效应晶体管的输出特性曲线等。与有限元方法相比,此方法可以节省约98%的计算成本与99%的计算时间,为实现快速高效的微波器件行为级建模提供一种可行方法。     

毫米波GaN HEMT器件大信号模型

介绍了一种毫米波GaN基HEMT器件大信号等效电路模型。该模型采用SDD的建模方法。提出了I-V及C-V表达式,完成了直流及S参数的拟合,并分析了拟合结果。与18GHz的在片loadpull测试结果比较,模型仿真结果显示输出功率及效率与实测数据基本一致。     

一种用于InGaP/GaAs HBT的简化的VBIC模型

提出一个应用于InGaP/GaAs HBT的简化的VBIC模型,描述了模型参数的提取方法,并把此模型应用于单、多指InGaP/GaAs HBT器件的建模.对器件的I-V特性及50MHz～15GHz频率范围内S参数进行了测量和仿真.结果表明,50MHz～9GHz频率范围内,简化后模型可对InGaP/GaAs HBT交流小信号特性进行较好的表征.     

用于太赫兹InP基PHEMTs 1~110GHz全频段在片测试的系统校准方法的对比研究

本文分别采用Multiline-TRL (Thru-Reflect-Line)和LRM (Line-Reflect-Match) 在片系统校准方法,与传统的SOLT (Short-Open-Load-Thru) 校准方法在InP基PHEMTs片上S参数测试方面进行定量的对比。首次在70 KHz~110 GHz全频段实现一次校准,减小了传统的分段测试多次校准带来的系统误差,校准更加方便简单。对比结果表明,基于Multiline-TRL校准和LRM校准后测量的S参数一致,且均优于传统的SOLT校准方法,尤其是在高频段结果更加准确。首次基于拐点进行外推,且器件展现了优良的射频特性,包括最大电流增益截止频率ft= 247 GHz,最大振荡频率fmax= 392 GHz,其准确度高于传统的基于无拐点进行的外推。首次基于LRM校准测得器件的1~110 GHz全频段S参数,建立了器件的1~110 GHz全频段小信号模型,而非基于传统的通过低频测试数据外推获得。     

RF-LDMOS器件宏模型研究

射频器件模型是射频电路仿真的基本要素之一。为了解决射频横向双扩散金属氧化物半导体晶体管（RF-LDMOS）缺乏准确SPICE模型的问题。此处提出了一种适用于带封装结构的RF-LDMOS器件宏模型建模及提模方法,并采用MBP软件进行验证分析。结果表明该宏模型建模方法能够很好的实现数据拟合,直流特性和射频特性的误差均在5%范围内,能够准确地反映器件的电学特性。     

InP high electron mobility transistors for submillimetre wave and terahertz frequency applications: A review

This paper reviews the rapid advancements being made in the development of high electron mobility transistors (HEMTs) on InP substrates for future sub-millimetre wave (30–300 GHz) and terahertz (300 GHz to 3.5 THz) frequency applications. The InP HEMTs exhibits outstanding 2-DEG properties in InAlAs/InGaAs heterostructure. This paper highlights the rapid growths in the developments of enhancement mode (E-Mode) and depletion mode (D-Mode) InP HEMTs over the last 40 years, the use of InP HEMTs for cryogenic applications, reliability issues and kink effects in InP HEMTs in detail and it also highlights the impact of geometrical dimensions and their scaling on the performance of InP HEMTs. Their uniqueness in terms of low noise, low power dissipation, high gain and high frequency of operation has fuelled the incorporation of InP HEMTs in a wide variety of applications such as high speed wireless and optical communication systems, sub-millimetre wave (S-MMW) and THz receivers and transmitters, radio astronomy and radiometry, flight communications and sensing applications, material spectroscopy, active and passive imaging applications, biomedical instrumentation applications and high speed ICs such as low noise amplifiers (LNAs), multiplier chains, switches, multiplexers and flip-flops.     

Comparison of 80-200 nm gate lengthAl0.25GaAs/GaAs/(GaAs:AlAs), Al0.3GaAs/In0.15GaAs/GaAs, and In0.52AlAs/In0.65GaAs/InPHEMTs

In this paper we present a comparative study of the high frequency performance of 80-200 mm gate length Al_0.25GaAs/GaAs/(GaAs:AlAs) superlattice buffer quantum well (QW) HEMTs, Al_0.3GaAs/In_0.15GaAs/GaAs pseudomorphic HEMTs and In_0.52AlAs/In_0.65GaAs/InP pseudomorphic HEMTs. From an experimental determination of the delays associated with transiting both the intrinsic and parasitic regions of the devices, effective electron velocities in the intrinsic channel region under the gate of the HEMT's were extracted. This analysis showed no evidence of any systematic increase in the effective channel velocity with reducing gate length in any of the devices. The effective electron velocity in the channel of the pseudomorphic In_0.65GaAs/InP HEMTs, determined to be at least 2.5×10⁵, was was around twice that of either the Al_0.25GaAs/GaAs quantum well or pseudomorphic In_0.15GaAs/GaAs HEMTs, resulting in 80 nm gate length devices with f_T's of up to 275 GHz. We also show that device output conductance is strongly material dependent. A comparison of the different buffer layers showed that the (GaAs:AlAs) superlattice buffer was most effective in confining electrons to the channel of the Al_0.25GaAs/GaAs HEMTs, even for 80 nm gate length devices. We propose this may be partly due to the presence of minigaps in the superlattice which provide a barrier to electrons with energies of up to 0.6 eV. The output conductance of pseudomorphic In_0.65GaAs/InP HEMTs was found to be inferior to the GaAs based devices as carriers in the channel have greater energy due to their higher effective velocity and so are more difficult to confine to the 2DEG     

Lattice-Matched InP-Based HEMTs with fT of 120GHz

Lattice-matched InP-based InAlAs/InGaAs HEMTs with 120GHz cutoff frequency are reported.These devices demonstrate excellent DC characteristics:the extrinsic transconductance of 600mS/mm,the threshold voltage of －1.2V,and the maximum current density of 500mA/mm.     

The optical response of epitaxial lift-off HEMT's to 140 GHz

We present measurements on the optical frequency response of epitaxial lift-off (ELO) 1.0-μm InP high-electron mobility transistors (HEMTs) to 140 GHz using electrooptic sampling and heterodyne techniques. Our picosecond sampling measurements established that the lift-off devices exhibited substantial optical response to 140 GHz. Heterodyne measurements made at 60 and 94 GHz later confirmed these findings. A novel three wave mixing technique was used to extend the heterodyne bandwidth to 130 GHz. In these experiments, millimeter waves were generated in our optically driven HEMT's and launched into waveguides. These lift off devices can be major additions to future millimeter wave integrated optoelectronic systems either as high frequency optical detectors or as optically driven tunable millimeter wave sources     

Novel T-gate fabrication and high frequency performance for 0.1 mu m-gate InAlAs/InGaAs HEMT

Cutoff frequencies are measured for sub-0.25 mu m-gate InAlAs/InGaAs/InP HEMTs fabricated with a novel T-gate process using ion-beam etching in conjunction with both electron-beam lithography and photolithography. The cutoff frequency of 200 GHz is demonstrated by 0.12 mu m-gate HEMT.<>     

0.1-μm T-gate Al-free InP/InGaAs/InP pHEMTs for W-bandapplications using a nitrogen carrier for LP-MOCVD growth

We report on the DC and RF performance of HEMTs based on the Al-free material system InP/InGaAs/InP. These structures were grown by LP-MOCVD using a nitrogen carrier. The influence of gate length and channel composition on the performance of these devices is investigated. We demonstrate that optimum DC and RF performance using highly strained channels can be obtained only if additional composite channels are grown. The cutoff frequencies f_T=160 GHz and f_max=260 GHz for a 0.1-μm T-gate device indicate the suitability of our devices for W-band applications     

An improved large signal model of InP HEMTs

An improved large signal model for InP HEMTs is proposed in this paper.The channel current and charge model equations are constructed based on the Angelov model equations.Both the equations for channel current and gate charge models were all continuous and high order drivable,and the proposed gate charge model satisfied the charge conservation.For the strong leakage induced barrier reduction effect of InP HEMTs,the Angelov current model equations are improved.The channel current model could fit DC performance of devices.A 2 × 25μm × 70 nm InP HEMT device is used to demonstrate the extraction and validation of the model,in which the model has predicted the DC I-V,C-Vand bias related S parameters accurately.     

太赫兹波的几个基本问题

介绍了用于加工太赫兹波元件的微机械加工技术(铣削、放电加工、电铸、湿法腐蚀Si、干法腐蚀Si、厚光刻胶:SU-8和LIGA)及其最新结果。重点描述了应用于太赫兹波的器件和集成电路,如将可用于太赫兹波的各种新颖二极管、半导体纳米器件、新的高电子迁移率晶体管、毫米波集成电路、量子器件、红外器件、量子级联激光器(单极级间跃迁激光器)。基于带间跃迁量子机理的半导体器件(譬如量子级联激光器)的频率极限高于与半导体能带隙相关器件的频率,其大多数体半导体的频率可以达到10THz以上。但是,基于经典的电子扩散传输机理的二极管、三极管的高频极限则受限于渡越时间和寄生参数RC时间常数。     

94 GHz InP MMIC five-section distributed amplifier

A single-stage 94 GHz InP MMIC amplifier with 6.4 dB gain at 94 GHz has been developed, which is the highest-frequency MMIC amplifier reported to date. Lattice-matched GaInAs/AlInAs HEMTs with 0.1 mu m mushroom gates were the active devices. The CPW MMIC chip dimensions are 500 mu m*670 mu m.<>     

Generation of Submillimeter-Wave Radiation with GaAs Tunnett Diodes and InP Gunn Devices in a Second or Higher Harmonic Mode

Efficient second-harmonic power extraction was demonstrated recently with GaAs tunnel injection transit-time (TUNNETT) diodes up to 235 GHz and with InP Gunn devices up to 325 GHz. This paper discusses the latest theoretical and experimental results from second-harmonic power extraction at submillimeter-wave frequencies and explores the potential of using power extraction at higher harmonic frequencies to generate continuous-wave radiation with significant power levels at frequencies above 325 GHz. Initial experimental results include output power levels of more than 50 μW at 356 GHz from a GaAs TUNNETT diode in a third-harmonic mode and at least 0.2–5 μW in the frequency range 400–560 GHz from InP Gunn devices in a third or higher harmonic mode. The spectral output of these submillimeter-wave sources was analyzed with a simple Fourier-transform terahertz spectrometer and, up to 426 GHz, with a spectrum analyzer and appropriate harmonic mixers. Initial experimental results from a GaAs/AlAs superlattice electronic device at D-band (110–170 GHz) and J-band (170–325 GHz) frequencies are also included.