共查询到19条相似文献,搜索用时 93 毫秒
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Sn-Zn无铅焊料由于熔点接近Sn-Pb,价格低廉、无毒性、力学性能优良等特点,倍受人们的关注。然而由于Zn的表面活性高,在钎焊过程中焊料容易氧化,导致了润湿性能下降。本文综述合金元素对Sn-Zn无铅焊料氧化性能、润湿性的影响。并对Sn-Zn焊料今后的研究方向进行了简要分析。 相似文献
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从专利角度探讨Sn-Zn无铅焊料研究现状 总被引:1,自引:1,他引:0
无铅焊料的研发及专利权的保护是我国电子行业亟待解决的问题。文中结合中国专利权的特点,描述了世界各国在无铅焊料专利上的竞争以及Sn-Zn无铅焊料的专利申请状况,并据此分析了Sn- Zn无铅焊料的研发及应用状况、专利Sn-Zn无铅焊料的特点以及应用障碍,以期对我国自主知识产权的Sn-Zn无铅焊料的研发及无铅专利保护有所帮助。 相似文献
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无铅焊料在清华大学的研究与发展 总被引:2,自引:0,他引:2
清华大学材料科学与工程系电子材料与封装技术研究室研制了6个系列的无铅焊料:Sn-3.5Ag添加Cu或Bi; Sn-3.5Ag-1.0Cu添加In或Bi; Sn-Ag-Cu-In添加Bi; Sn-Ag-Cu添加Ga; Sn-Zn添加Ga; Sn-Zn添加多种元素。重点介绍了Sn-Zn添加多种元素。对6个系列无铅焊料的研究取得了较好的实验结果,得到比较理想的低温焊料体系,有的合金熔点已非常接近铅锡共晶焊料熔点183℃。 相似文献
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随着人们环保意识的提高,无铅焊料替代传统的锡铅焊料成为电子行业的必然趋势。Sn-Zn系无铅焊料因为熔点接近传统锡铅焊料,且具有优良的力学性能而被广泛关注,有望替代传统焊料。目前Sn-Zn系无铅焊料在润湿性、抗氧化性、抗腐蚀性等方面存在一定的问题。其中,焊料的抗腐蚀性对电子产品的寿命和安全起着决定性作用,因此,具有良好的抗腐蚀性能是开发无铅焊料的关键之一。就当下研究比较成熟的Sn-Zn系焊料的抗腐蚀性能进行研究。指出了元素合金化对Sn-Zn焊料的影响,并对抗腐蚀机理进行阐述。 相似文献
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Sn-Zn-Bi-In-P新型无铅焊料性能研究 总被引:1,自引:1,他引:0
新型无铅焊料Sn-4.5Zn-2Bi-In-P、Sn-9Zn-2.5Bi-In-P具有优异的抗氧化、抗腐蚀性能,弥补了Sn-Zn系焊料润湿性能方面的不足,具有极大的实用性。测量了共晶Sn-9Zn、两种新型Sn-Zn系无铅焊料和传统的Sn-37Pb焊料的各项物理性能:密度、熔点、线膨胀系数、电阻率及对铜基体的润湿角。实验结果表明,新型Sn-Zn系无铅焊料的密度约为传统Sn-37Pb焊料的3/4;熔点(依次为194℃,191.9℃)接近Sn-37Pb焊料,熔程仅为8℃;在25~100℃,新型Sn-Zn焊料线膨胀系数依次为20.8×10–6/℃、16.9×10–6/℃,优于Sn-37Pb焊料(21.2×10–6/℃);新型Sn-Zn焊料的电阻率依次为1.73×10–6Ω·m、1.79×10–6Ω·m,优于Sn-37Pb焊料(1.96×10–6Ω·m);新型Sn-Zn焊料对Cu基体的润湿角接近30°,满足实用化的最低要求。 相似文献
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Sn-Ag和Sn-Zn及Sn-Bi系无铅焊料 总被引:24,自引:5,他引:19
随着微电子组装技术的发展,研制新型的和实用的无铅焊料替代传统的Sn-Pb焊料已成为近年的研究热点。介绍了目前最常见的Sn-Ag、Sn-Zn和Sn-Bi为基体的无铅焊料并与传统的Sn-Pb焊料的性能进行了比较。 相似文献
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无铅可焊性镀层及其在电子工业中的应用 总被引:4,自引:0,他引:4
在电子工业中 ,为消除铅的污染 ,探讨了各种替代Sn-Pb合金的无铅可焊性镀层。论述了电镀Sn -Zn、Sn-Ag、Sn-Bi合金的方法及其镀层的可焊性能。 相似文献
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The Sn-Zn alloy exhibits the closest eutectic temperature to the eutectic Sn-Pb solder, although it suffers an easy oxidation
characteristic. A novel alloy based on the Sn-Zn eutectic alloy was developed and found promising as a drop-in replacement
for the eutectic Sn-Pb solder. This alloy, consisting of a Sn-Zn-Ag-Al-Ga combination, was developed, showing promising properties.
Differential scanning calorimetry (DSC) investigation reveals that the investigated solder exhibits a eutectic temperature
of around 199°C. The thermal gravimetric analysis (TGA) study shows it attains much better oxidation resistance than the eutectic
Sn-Pb solder does at 250°C. The stress-strain curve indicates that this solder also possesses a higher ultimate tensile strength
(UTS) and a better ductility than the eutectic Sn-Pb solder. A wetting time, on Cu, of less than 1 sec was found for this
solder with a suitable, organic acid-activated flux. Gallium tended to enhance wetting behavior. The cost of this solder was
also estimated and was found to be comparable with the Sn-Pb solder. 相似文献
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Leonardo R. Garcia Wislei R. Osório Leandro C. Peixoto Amauri Garcia 《Journal of Electronic Materials》2009,38(11):2405-2414
A comparative experimental study of the main features of the eutectic Sn-Pb alloy and Sn-Zn alloys was carried out with a
view to application of the latter alloys as alternative solder materials. The resulting microstructures, mechanical properties
(ultimate tensile strength and elongation), and wettability behavior (spreading area and contact angle) of a hypoeutectic
Sn-Zn (Sn-4wt.%Zn), a hypereutectic Sn-Zn (Sn-12wt.%Zn), and the eutectic Sn-9wt.%Zn alloy were examined and compared with
the corresponding results of the conventional Sn-40wt.%Pb solder alloy. It was found that, of the Sn-Zn alloys examined, the
eutectic Sn-9wt.%Zn alloy offers a compromise between lower wettability and higher mechanical strength. 相似文献
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Thermodynamic prediction of interface phases at Cu/solder joints 总被引:1,自引:0,他引:1
A thermodynamic method to predict the intermetallic compound which forms first at the substrate/solder interface during the
soldering process has been suggested through calculations of metastable phase equilibria between the substrate and the liquid
solder and by comparison of the driving forces of formation of individual intermetallic compound phases. It has been applied
to the interfacial reaction between Cu substrate and Sn-Ag, Sn-Zn eutectic solders. The prediction from thermodynamic calculations
was in good agreement with observed experimental results. The solid-state growth behavior of compound phases formed at the
interface of Cu/Sn-Zn and Cu/Sn-Ag eutectic solder joints was explained and a schematic diffusion path suggested through calculated
ternary phase diagrams. 相似文献
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In the electronic packaging field, the Sn-Zn alloy system has been recommended as a high-temperature Pb-free solder. There
is a need for thermodynamic data on the Sn-Ni-Zn ternary system. Such data would serve as a basis for understanding the interfacial
reaction between Sn-Zn high-temperature solder and Ni substrates and for thermodynamically evaluating the proper composition
level of Ni and Zn in Sn-based solder. This study has investigated the phase equilibria of the Sn-Ni-Zn ternary system at
800°C, 500°C, and 200°C (for Ni composition of less than 60 at.%). Scanning electron microscopy (SEM), x-ray diffraction (XRD),
and electron probe microanalysis (EPMA) were used to identify the equilibrium phases. On the basis of the experimental data
and thermodynamic parameters, the isothermal sections of the Sn-Ni-Zn ternary system have been described, considering the
ternary solubility in the binary phases and newfound ternary phases τ1 (Sn3Ni4Zn3) and τ2 (Sn4Ni4Zn2). 相似文献