Dependence of Threshold Voltage of a-Si:H TFT on a-SiNx:H Film^①

The relation between threshold voltage for hydrogenated amorphous silicon thin film transistors(a-Si:HTFTs)and deposition conditions for hydrogenated amorphous silicon nitride(a-SiNx:H)films is investigated.It is observed that the threshold voltage,Vth,of a-Si:HTFT increases with the increase of the thickness of a-SiNx:H film,and the threshold voltage is reduced apparently with the increase of NH3/SiH4 gas flow rate ratio.     

Influence of growth time on crystalline structure,conductivity and optical properties of ZnO thin films

This paper examines the growth of ZnO thin films on glass substrate at 350℃using an ultrasonic spray technique.We have investigated the influence of growth time ranging from 1 to 4 min on structural,optical and electrical properties of ZnO thin films.The as-grown films exhibit a hexagonal structure wurtzite and are(002) oriented.The maximum value of grain size G = 63.99 nm is attained for ZnO films grown at 2 min.The average transmittance is about 80%,thus the films are transparent in the visible region.The optical gap energy is found to increase from 3.26 to 3.37 eV with growth time increased from 1 to 2 min.The minimum value of electrical resistivity of the films is 0.13Ω·cm obtained at 2 min.A systematic study on the influence of growth time on the properties of ZnO thin films deposited by ultrasonic spray at 350℃has been reported.     

Influence of growth time on crystalline structure, conductivity and optical properties of ZnO thin films

This paper examines the growth of ZnO thin films on glass substrate at 350 ℃ using an ultrasonic spray technique. We have investigated the influence of growth time ranging from 1 to 4 min on structural, optical and electrical properties of ZnO thin films. The as-grown films exhibit a hexagonal structure wurtzite and are (002) oriented. The maximum value of grain size G = 63.99 nm is attained for ZnO films grown at 2 min. The average transmittance is about 80%, thus the films are transparent in the visible region. The optical gap energy is found to increase from 3.26 to 3.37 eV with growth time increased from 1 to 2 min. The minimum value of electrical resistivity of the films is 0.13 Ω·cm obtained at 2 min. A systematic study on the influence of growth time on the properties of ZnO thin films deposited by ultrasonic spray at 350 ℃ has been reported.     

Selected area laser-crystallized polycrystalline silicon thin films by a pulsed Nd:YAG laser with 355 nm wavelength

Selected area laser-crystallized polycrystalline silicon(p-Si) thin films were prepared by the third harmonics (355 nm wavelength) generated by a solid-state pulsed Nd:YAG laser.Surface morphologies of 400 nm thick films after laser irradiation were analyzed.Raman spectra show that film crystallinity is improved with increase of laser energy.The optimum laser energy density is sensitive to the film thickness.The laser energy density for efficiently crystallizing amorphous silicon films is between 440-634 mJ/cm2 for 300 nm thick films and between 777-993 mJ/cm~2 for 400 nm thick films.The optimized laser energy density is 634,975 and 1571 mJ/cm~2 for 300,400 and 500 nm thick films,respectively.     

应力和电阻率可控的适用于高品质因子MEMS器件的原位掺硼LPCVD多晶硅薄膜

The simultaneous control of residual stress and resistivity of polysilicon thin films by adjusting the deposition parameters and annealing conditions is studied. In situ boron doped polysilicon thin films deposited at 520 ℃ by low pressure chemical vapor deposition （LPCVD） are amorphous with relatively large compressive residual stress and high resistivity. Annealing the amorphous films in a temperature range of 600-800 ℃ gives polysilicon films nearly zero-stress and relatively low resistivity. The low residual stress and low resistivity make the polysilicon films attractive for potential applications in micro-electro-mechanical-systems （MEMS） devices, especially in high resonance frequency （high-f） and high quality factor （high-Q） MEMS resonators. In addition, polysilicon thin films deposited at 570 ℃ and those without the post annealing process have low resistivities of 2-5 mΩ·cm. These reported approaches avoid the high temperature annealing process （〉 1000 ℃）, and the promising properties of these films make them suitable for high-Q and high-f MEMS devices.     

Influence of Cu_xS back contact on CdTe thin film solar cells

We present a detailed study on CuxS polycrystalline thin films prepared by chemical bath method and utilized as back contact material for CdTe solar cells.The characteristics of the films deposited on Si-substrate are studied by XRD.The results show that as-deposited CuxS thin film is in an amorphous phase while after annealing,samples are in polycrystalline phases with increasing temperature.The thickness of CuxS thin films has great impact on the performance of CdS/CdTe solar cells.When the thickness of the film is about 75 nm the performance of CdS/CdTe thin film solar cells is found to be the best.The energy conversion efficiency can be higher than 12.19%,the filling factor is higher than 68.82% and the open-circuit voltage is more than 820 mV.     

Electrical properties of silver Schottky contacts to ZnO thin films

ZnO thin films are deposited on Al/Si substrates by the pulsed laser deposition （PLD） method. The XRD and SEM images of films are examined. Highly c-axis oriented ZnO thin films which have uniform compact surface morphology are fabricated. The size of surface grains is about 30 nm. The Schottky barrier ultraviolet detectors with silver Schottky contacts are made on ZnO thin films. The current-voltage characteristics are measured. The ideality contact factor between Ag and ZnO film is 1.22, while the barrier height is 0.908 e V. After annealing at 600 ℃ for 2h, the ideality factor is 1.18 and the barrier height is 0.988 eV. With the illumination of 325 nm wavelength UV-light, the photocurrent-to-dark current ratios before and after annealing are 140.4 and 138.4 biased at 5 V, respectively. The photocurrents increase more than two orders of magnitude over the dark currents.     

RF功率对非晶铟镓锌氧薄膜和器件电学特性的影响

The influence of radio frequency(RF) power on the properties of magnetron sputtered amorphous indium gallium zinc oxide(a-IGZO) thin films and the related thin-film transistor(TFT) devices is investigated comprehensively.A series of a-IGZO thin films prepared with magnetron sputtering at various RF powers are examined.The results prove that the deposition rate sensitively depends on RF power.In addition,the carrier concentration increases from 0.91 x 1019 to 2.15 x 1019 cm-3 with the RF power rising from 40 to 80 W,which may account for the corresponding decrease in the resistivity of the a-IGZO thin films.No evident impacts of RF power are observed on the surface roughness,crystalline nature and stoichiometry of the a-IGZO samples.On the other hand,optical transmittance is apparently influenced by RF power where the extracted optical band-gap value increases from 3.48 to 3.56 eV with RF power varying from 40 to 80 W,as is supposed to result from the carrierinduced band-filling effect.The rise in RF power can also affect the performance of a-IGZO TFTs,in particular by increasing the field-effect mobility clearly,which is assumed to be due to the alteration of the extended states in a-IGZO thin films.     

MFM Study： the Air Damping Effect on Magnetic Imaging of CoNbZr Thin Film

This paper studies the CoNbZr soft magnetic thin film by magnetic force microscopy （MFM）. By measuring in atmosphere circumstance, the magnetic force images display some clear dark dots which are corresponding to the clusters in the topography images welL Then the dark dots disappear in magnetic force images, scanning in high vacuum. This indicates that the dark dots are caused by air damping between the vibrating tip and the sample. An interpretation for the above observation is given.     

Preparation of n-type semiconductor SnO2 thin films

We studied fluorine-doped tin oxide on a glass substrate at 350℃using an ultrasonic spray technique. Tin（Ⅱ） chloride dehydrate,ammonium fluoride dehydrate,ethanol and NaOH were used as the starting material, dopant source,solvent and stabilizer,respectively.The SnO₂:F thin films were deposited at 350℃and a pending time of 60 and 90 s.The as-grown films exhibit a hexagonal wurtzite structure and have（101） orientation.The G = 31.82 nm value of the grain size is attained from SnO₂:F film grown at 90 s,and the transmittance is greater than 80%in the visible region.The optical gap energy is found to measure 4.05 eV for the film prepared at 90 s, and the increase in the electrical conductivity of the film with the temperature of the sample is up to a maximum value of 265.58（Ω·cm）^-1,with the maximum activation energy value of the films being found to measure 22.85 meV,indicating that the films exhibit an n-type semiconducting nature.     

Dark conductivity and photoconductivity of amorphous Hg0.78Cd0.22Te thin films

This paper reports the dark conductivity and photoconductivity of amorphous Hg0.78Cd0.22 Te thin films deposited on an Al2O3 substrate by RF magnetron sputtering.It is determined that dark conduction activation energy is 0.417 eV for the as-grown sample.Thermal quenching is absent for the as-grown sample during the testing temperature zone,but the reverse is true for the polycrystalline sample.Photosensitivity shows the maximum at 240 K for amorphous thin films,while it is higher for the as-grown sample than for polycrystalline thin films in the range from 170 to 300 K.The recombination mechanism is the monomolecular recombination process at room temperature,which is different from the low temperature range.Theμτ-product is low in the range of 10-11-10-9 cm2/V,which indicates that some defect states exist in the amorphous thin films.     

在二氧化硅衬底上制备磁光Ce：YIG薄膜用于磁光波导型器件

对Ce1YIG磁光薄膜的制备过程及磁光性能进行了详细的研究．用RF磁控溅射法在二氧化硅的基片．上淀积Ce1YIG薄膜，再对此薄膜进行晶化处理，以得到具有磁光性能的Ce1YIG薄膜．本文讨论了晶化过程中，Ce1YIG薄膜微观结构的变化对其磁光性能的影响．结果表明：采用波长为630nm的可见光测量，薄膜的饱和法拉第旋转系数θF为0．8deg／μm．同时，晶化薄膜易磁化方向为平行于膜面方向，其居里温度点为220℃．所得Ge1YIG薄膜的参数表明：所制备的薄膜适宜于制备波导型磁光隔离器．     

薄层SOS薄膜材料外延生长及其器件应用

亚微米CMOS/SOS器件发展对高质量的100-200纳米厚度的薄层SOS薄膜提出了更高的要求.实验证实;采用CVD方法生长的原生SOS薄膜的晶体质量可以通过固相外延工艺得到明显改进.该工艺包括:硅离子自注入和热退火.X射线双晶衍射和器件电学测量表明:多晶化的SOS薄膜固相外延生长导致硅外延层晶体质量改进和载流子迁移率提高.固相外延改进的薄层SOS薄膜材料能够应用于先进的CMOS电路.     

MBE-grown ZnSSe thin films on ITO substrates for liquid-crystal light valve applications

The MBE growth of ZnSSe alloy thin films on ITO substrates using ZnS and Se sources was studied and various structural and opto-electronic properties of the as-grown thin films were characterised. The XRD rocking curves resulting from these films indicate that the as-grown polycrystalline ZnSSe thin films have a preferred orientation along (1 1 1) direction. The evaluated crystal sizes as deduced from the FWHM of the XRD layer peaks were found to show a strong growth temperature dependence with the optimised temperature at about 290°C. TEM measurements done on these thin films also indicate a similar growth temperature dependence. The TEM cross-sectional micrograph of the sample grown at the optimised temperature shows a well-defined columnar structure whose nucleation seems to be highly correlated with the ITO grains. UV responsivity as high as 0.01 A/W and more than three orders of magnitude in rejection power for wavelengths longer than 450 nm have been achieved. It was also found that the sample grown at the optimised temperature has the lowest resistivity of 4.3×10¹¹ Ω cm, which provides a good match with that of a liquid-crystal layer. These results indicate that MBE-grown ZnSSe thin film is a promising candidate as the photoconductive material of liquid-crystal light valves for UV imaging applications.     

C元素对N型a-Si:H薄膜微结构及电学特性的影响

采用等离子增强化学气相沉积(PECVD)工艺,制备了P-C二元复合掺杂氢化非晶硅(a-Si:H)薄膜,研究了C元素对N型a-Si:H薄膜暗电导率(σ)及电导激活能(Ea)的影响;利用激光拉曼光谱研究了C元素对薄膜微结构的影响,讨论了P-C二元复合掺杂a-Si:H薄膜电学性能与微结构之间的相互影响关系.结果表明:随着C掺杂量的增加,a-Si:H薄膜的短程有序度降低,中程有序度基本保持不变,缺陷逐渐减少;一定程度的C掺杂可使N型a-Si:H薄膜电导激活能降低而使薄膜的暗电导率升高,但过量的C掺杂使N型a-Si:H薄膜非晶网络结构有序度严重恶化,电导率出现明显下降趋势.

Abstract：

Hydrogenated amorphous silicon (a-Si:H) thin films doped with P and C were deposited by plasma enhanced chemical vapor deposition (PECVD).The influence of carbon on the dark conductivity,activation energy and mirostructure of the P-doped a-Si:H films was investigated by means of electrical measurment and Raman spectroscopy,and the relationship between electrical properties and microstructure of the films was also analyzed.It is shown from Raman spectra that the degree of short-range order and the defects of the films decreae with the increase of carbon doping,while the degree of intermediate-range order remains unchanged.A small amount of carbon can reduce the activation energy and enhance the dark conductivity of the P-doped a-Si : H thin films.However,excessive carbon makes the structural order of the amouphous network get worse which leads to a decline of dark conductivity.     

Etch damage evaluation on (Bi4−xLax)Ti3O12 thin films during the etch process using inductively coupled plasma sources

The etching mechanism of (Bi_4−xLa_x)Ti₃O₁₂ (BLT) thin films in Ar/Cl₂ inductively coupled plasma (ICP) and plasma-induced damages at the etched surfaces were investigated as a function of gas-mixing ratios. The maximum etch rate of BLT thin films was 50.8 nm/min of 80% Ar/20% Cl₂. From various experimental data, amorphous phases on the etched surface existed on both chemically and physically etched films, but the amorphous phase was thicker after the 80% Ar/20% Cl₂ process. Moreover, crystalline “breaking” appeared during the etching in Cl₂-containing plasma. Also the remnant polarization and fatigue resistances decreased more for the 80% Ar/20% Cl₂ etch than for pure Ar plasma etch.     

Photoelectrochemical performance of La3+-doped TiO2

La-doped TiO₂ thin films on titanium substrates were prepared by the sol-gel method with titanium tetrachloride as a precursor and La₂O₃ as a source of lanthanum. The heat-treatment temperature dependence of the photoelectrochemical performance of the La-doped TiO₂ film in 0.2 mol/L Na₂SO₄ was investigated by the Mott-Schottky equation, electrochemical impedance spectroscopy, and the open-circuit potential test. The results from the Mott-Schottky curves show that the obtained films all were n-type semiconductors, and the film at 300 ℃ had the highest conduction band position and the widest space charge layer. The electrochemical impendence spectroscopy (EIS) tests of the 300 ℃ film decreased most during the change from illuminated to dark. The potential of the La-TiO₂ thin film electrode was the lowest after the 300 ℃ heat treatment. The open-circuit potential indicated that the photoelectrical performance of the La-TiO₂ films was enhanced with the addition of the La element and the largest decline (837.8 mV) in the electrode potential was achieved with the 300 ℃ heat treatment.     

Various effects of silicidation on shallow p+ junctionsformed by BF2+ implantation into thin poly-Sifilms on Si substrates

Various effects of silicidation on shallow p⁺ n junctions formed by the scheme that implants BF₂⁺ ions into thin poly-Si films on Si substrates are described. A post-Ni silicidation just slightly improves the preformed junctions of the annealed sample. However, as the sample is first deposited with thin Ni films after the implantation and then annealed, the resulting junctions are much better than the preformed ones. Moreover, as the sample is deposited with Ti films, the resultant junctions are just slightly better the preformed ones     

Bi_(1.5)Mg_(1.0)Nb_(1.5)O_7薄膜的介电损耗机理研究

采用射频磁控溅射法在Al2O3基片上沉积了铌酸铋镁(Bi1.5Mg1.0Nb1.5O7,BMN)薄膜,研究了不同退火条件下BMN薄膜的介电损耗机理。结果表明,充分的退火能够减小氧空位缺陷密度,并降低介电损耗。氧气气氛下退火能够有效补偿BMN薄膜中的氧空位,使得介电损耗进一步降低。这说明氧空位导致的带电缺陷损耗是BMN薄膜材料主要的介电损耗机制。此外,BMN薄膜中也存在晶界损耗机制。     

Thin RF sputtered and thermal Ta2O5 on Si for high density DRAM application

Tantalum pentoxide thin films on Si prepared by two conventional for modern microelectronics methods (RF sputtering of Ta in Ar + O₂ mixture and thermal oxidation of tantalum layer on Si) have been investigated with respect to their dielectric, structural and electric properties. It has been found that the formation of ultra thin SiO₂ film at the interface with Si, during fabrication implementing the methods used, is unavoidable as both, X-ray photoelectron spectroscopy and electrical measurements, have indicated. The initial films (as-deposited and as-grown) are not perfect and contain suboxides of tantalum and silicon which act as electrical active centers in the form of oxide charges and interface states. Conditions which guarantee obtaining high quality tantalum oxide with dielectric constant of 32–37 and leakage current density less than 10⁻⁷ A/cm² at 1.5 V applied voltage (Ta₂O₅ thickness equivalent to about 3.5 nm of SiO₂) have been established. These specifications make the layers obtained suitable alternative to SiO₂ for high density DRAM application.