Large signal and noise properties of heterojunction AlxGa1-xAs/GaAs DDRIMPATTs

Simulation studies are carried out on the large signal and noise properties of heterojunction (HT) Al_xGa_1-xAs/GaAs double drift region (DDR) IMPATT devices at V-band (60 GHz). The dependence of Al mole fraction on the aforementioned properties of the device has been investigated. A full simulation software package has been indigenously developed for this purpose. The large signal simulation is based on a non-sinusoidal voltage excitation model. Three mole fractions of Al and two complementary HT DDR structures for each mole fraction i.e., six DDR structures are considered in this study. The purpose is to discover the most suitable structure and corresponding mole fraction at which high power, high efficiency and low noise are obtained from the device. The noise spectral density and noise measure of all six HT DDR structures are obtained from a noise model and simulation method. Similar studies are carried out on homojunction (HM) DDR GaAs IMPATTs at 60 GHz to compare their RF properties with those of HT DDR devices. The results show that the HT DDR device based on N-Al_xGa_1-xAs/p-GaAs with 30% mole fraction of Al is the best one so far as large signal power output, DC to RF conversion efficiency and noise level are concerned.     

SiC/GaN IMPATT二极管的交流性能研究

利用p型宽带隙材料SiC替代p型GaN,制作了一种p-SiC/n-GaN异质结双漂移(DDR)IMPATT二极管.对器件的交流大信号输出特性进行数值模拟仿真.结果表明,相比传统GaN单漂移(SDR)IMAPTT二极管,p-SiC/n-GaN新结构DDR器件的击穿电压、最佳负电导、交流功率密度和直流-交流转换效率都获得了...     

高抑制比背照式AlxGa1-xN pin日盲紫外探测器研究

利用现有外延材料生长技术和器件工艺技术,生长了背照式AlxGa1-xN pin外延材料,并用生长的材料制作了日盲紫外探测器,测试结果表明器件在0V偏压下抑制比达到了6 400。在此基础上,较详细地分析了偏置电压、p-AlxGa1-xN载流子浓度和Al组分、极化效应对背照式AlxGa1-xN pin日盲紫外探测器抑制比的影响及非日盲光生载流子的限制机制。分析表明,提高p-AlxGa1-xN载流子浓度和GaN/AlxGa1-xN异质结极化强度是现有技术条件下提高器件抑制比的有效途径。     

Electrical and growth characteristics of Au/Al0.15Ga0.85N:Si structures with various Si incorporations

We have investigated the growth characteristics of n-Al_0.15Ga_0.85N:Si/GaN and the electronic properties of Au/n-Al_0.15Ga_0.85N:Si diode structures grown by metal-organic chemical vapor deposition (MOCVD) with various Si incorporations. The Al_0.15Ga_0.85N:Si layers were grown on undoped GaN/sapphire (0001) epitaxial layers in a horizontal MOCVD reactor at the reduced pressure of 300 torr. The mirrorlike surface, free of defects, such as cracks or hillocks, can be seen in the undoped Al_0.15Ga_0.85N epilayer, which was grown without any intentional flow of SiH₄. However, many cracks are observed in the n-Al_0.15Ga_0.85N:Si, which was grown with Si incorporation above 1.0 nmol/min. While Au/n-Al_0.15Ga_0.85N:Si diodes having low incorporation of Si showed retively good rectifying behavior, the samples having high Si incorporation exhibited leaky current-voltage (I-V) behavior. Particularly, the Au/n-Al_0.15Ga_0.85N:Si structure grown with Si incorporation above 1.0 nmol/min cannot be used for electrical rectification. Both added tunneling components and thermionic emission influence the current transport at the Au/n-Al_0.15Ga_0.85N:Si barrier when Si incorporation becomes higher.     

Potentials of GaP as millimeter wave IMPATT diode with reference to Si, GaAs and GaN

This paper presents the simulation results of DC,small-signal and noise properties of GaP based Double Drift Region( DDR) Impact Avalanche Transit Time( IMPATT) diodes. In simulation study we have considered the flat DDR structures of IMPATT diode based on GaP,GaAs,Si and GaN( wurtzite,wz) material. The diodes are designed to operate at the millimeter window frequencies of 94 GHz and 220 GHz. The simulation results of these diodes reveal GaP is a promising material for IMPATT applications based on DDR structure with high break down voltage( V_B) as compared to Si and GaAs IMPATTs. It is also encouraging to worth note GaP base IMPATT diode shows a better output power density of 4. 9 × 10~9 W/m~2 as compared to Si and GaAs based IMPATT diode. But IMPATT diode based on GaN( wz) displays large values of break down voltage,efficiency and power density as compared to Si,GaAs and GaP IMPATTs.     

AlxGa1−xN/GaN multi-quantum-well ultraviolet detector based on p-i-n heterostructures

We report on characterization of a set of AlGaN/GaN multiple-quantum-well (MQW) photodetectors. The model structure used in the calculation is the p-i-n heterojunction with 20 AlGaN/GaN MQW structures in i-region. The MQW structures have 2 nm GaN quantum well width and 15 nm Al_xGa_1−xN barrier width. The cutoff wavelength of the MQW photodetectors can be tuned by adjusting the well width and barrier height. Including the polarization field effects, on increasing Al mole fraction, the transition energy decreases, the total noise increases, and the responsivity has a red shift, and so the detectivity decreases and has a red shift.     

1.0 THz GaN IMPATT Source: Effect of Parasitic Series Resistance

The degradation of high-frequency characteristics of a 1.0-THz double-drift region (DDR) impact avalanche transit time (IMPATT) diode based on wurtzite gallium nitride (Wz-GaN), due to the influence of parasitic series resistance, has been investigated. A two-dimensional (2-D) large-signal (L-S) simulation method based on a non-sinusoidal voltage excitation (NSVE) model has been used for this purpose. A comprehensive model of series resistance has been developed by considering the influence of skin effect, and the said model has been incorporated in the 2-D L-S simulation for studying the effect of RF power output and DC to RF conversion efficiency of the device. Results indicate 24.2–35.9% reduction in power output and efficiency due to the RF power dissipation in the positive series resistance. However, the device can still deliver 191.7–202.9 mW peak RF power to the load at 1.0 THz with 8.48–6.41% conversion efficiency. GaN IMPATT diodes are capable of generating higher RF power at around 1 THz than conventional diodes, but the effect of parasitic series resistance causes havoc reduction in power output and efficiency. The nature of the parasitic resistance is studied here in the level of device fabrication and optimization, which to our knowledge is not available at present.     

High-quality n-type aluminum gallium nitride thin films grown by interrupted deposition and in-situ thermal annealing

High quality Si-doped n-Al_0.6Ga_0.4N thin films were grown on sapphire substrates by molecular beam epitaxy (MBE) by interrupted deposition and subsequent in-situ thermal annealing (IDTA). High-resolution X-ray diffraction, scanning electron microscope, atomic force microscope, photoluminescence and Hall-effect measurements were carried out to characterize the structural, electrical and optical properties. The results showed that the full width at half-maximum of the Si-doped Al_0.6Ga_0.4N (0002) was as low as 160 arcsec. The threading dislocation density decreases two orders of magnitude to 6×110⁷ cm⁻² by using the IDTA technology. The carrier density and mobility reached at 1.1×10¹⁹ cm⁻³ and 4.8 cm²/V s, respectively. Si still acted as a shallow donor even for the heavily doped Al_0.6Ga_0.4N.     

Impact of strain relaxation of AlmGa1−mN layer on 2-DEG sheet charge density and current voltage characteristics of lattice mismatched AlmGa1−mN/GaN HEMTs

An accurate charge control model to investigate the effect of aluminum composition, strain relaxation, thickness and doping of the Al_mGa_1−mN barrier layer on the piezoelectric and spontaneous polarization induced 2-DEG sheet charge density, threshold voltage and output characteristics of partially relaxed Al_mGa_1−mN/GaN HEMTs is proposed. The strain relaxation of the barrier imposes an upper limit on the maximum 2-DEG density achievable in high Al content structures and is critical in determining the performance of lattice mismatched Al_mGa_1−mN/GaN HEMTs. The model incorporates the effects of field dependent mobility, parasitic source/drain resistance and velocity saturation to evaluate the output characteristics of Al_mGa_1−mN/GaN HEMTs. Close proximity with published results confirms the validity of the proposed model.     

Characterizations of InxAlyGa1−x−yN alloy systems grown on GaN substrates by molecular-beam epitaxy

In_0.05Al_0.10Ga_0.85N epilayers and Al_0.10Ga_0.90N epilayers have been grown on bulk GaN single crystals and GaN templates by radio-frequency (RF) molecular-beam epitaxy (MBE). Photoluminescence (PL) spectra at different temperatures ranged from 8 to 300 K were measured for these epilayers. The decreasing rates of PL peak intensity of the In_0.05Al_0.10Ga_0.85N epilayers were smaller than those of the Al_0.10Ga_0.90N epilayers. The fluctuations of emission intensities were not observed in the In_0.05Al_0.10Ga_0.85N epilayers by cathodoluminescence observations at 77 K. Our results indicate that In-related effects exist in InAlGaN quaternary alloys on substrates with low-dislocation densities, however, expect that the localization effect related to In-segregation is weak.     

Room-Temperature Quantum Cascade Laser: ZnO/Zn1−x Mg x O Versus GaN/Al x Ga1−x N

A ZnO/Zn_1?x Mg _x O-based quantum cascade laser (QCL) is proposed as a candidate for generation of THz radiation at room temperature. The structural and material properties, field dependence of the THz lasing frequency, and generated power are reported for a resonant phonon ZnO/Zn_0.95Mg_0.05O QCL emitting at 5.27 THz. The theoretical results are compared with those from GaN/Al _x Ga_1?x N QCLs of similar geometry. Higher calculated optical output powers [ $ {P}_{\rm{ZnMgO}} $  = 2.89 mW (nonpolar) at 5.27 THz and 2.75 mW (polar) at 4.93 THz] are obtained with the ZnO/Zn_0.95Mg_0.05O structure as compared with GaN/Al_0.05Ga_0.95N QCLs [ $ {P}_{\rm{AlGaN}} $  = 2.37 mW (nonpolar) at 4.67 THz and 2.29 mW (polar) at 4.52 THz]. Furthermore, a higher wall-plug efficiency (WPE) is obtained for ZnO/ZnMgO QCLs [24.61% (nonpolar) and 23.12% (polar)] when compared with GaN/AlGaN structures [14.11% (nonpolar) and 13.87% (polar)]. These results show that ZnO/ZnMgO material is optimally suited for THz QCLs.     

Optimized breakdown probabilities in Al/sub 0.6/Ga/sub 0.4/As-GaAs heterojunction avalanche photodiodes

Recently, it has been shown that the noise characteristics of heterojunction Al/sub 0.6/Ga/sub 0.4/As-GaAs avalanche photodiodes (APDs) can be optimized by proper selection of the width of the Al/sub 0.6/Ga/sub 0.4/As layer. Similar trends have also been shown theoretically for the bandwidth characteristics. The resulting noise reduction and potential bandwidth enhancement have been attributed to the fact that the high bandgap Al/sub 0.6/Ga/sub 0.4/As layer serves to energize the injected electrons, thereby minimizing their first dead space in the GaAs layer. We show theoretically that the same optimized structures yield optimal breakdown-probability characteristics when the APD is operated in Geiger mode. The steep breakdown-probability characteristics, as a function of the excess bias, of thick multiplication regions (e.g., in a 1000-nm GaAs homojunction) can be mimicked in much thinner optimized Al/sub 0.6/Ga/sub 0.4/As-GaAs APDs (e.g., in a 40-nm Al/sub 0.6/Ga/sub 0.4/As and 200-nm GaAs structure) with the added advantage of having a reduced breakdown voltage (e.g., from 36.5 V to 13.7 V).     

Nitride-based near-ultraviolet multiple-quantum well light-emitting diodes with AlGaN barrier layers

The In_0.05Ga_0.95N/GaN, In_0.05Ga_0.95N/Al_0.1Ga_0.9N, and In_0.05Ga_0.95N/Al_0.18Ga_0.82N multiple-quantum well (MQW) light-emitting diodes (LEDs) were prepared by metal-organic chemical-vapor deposition. (MOCVD). It was found that the 20-mA electroluminescence (EL) intensity of the InGaN/Al_0.1Ga_0.9N MQW LED was two times larger than that of the InGaN/GaN MQW LED. The larger maximum-output intensity and the fact that maximum-output intensity occurred at a larger injection current suggest that Al_0.1Ga_0.9N-barrier layers can provide a better carrier confinement and effectively reduce leakage current. In contrast, the EL intensity of the InGaN/Al_0.18Ga_0.82N MQW LED was smaller because of the relaxation that occurred in the MQW active region of the sample.     

Electronic near-surface defect states of bare and metal covered n-GaN films observed by cathodoluminescence spectroscopy

Depth-dependent low energy cathodoluminescence spectroscopy (CLS) has been used to investigate the near-surface optical properties of n-type GaN epelayers grown under various growth conditions. Both bare and reacted-Mg/n-GaN and Al/n-GaN (annealed to 1000°C) surfaces were investigated. We find enhanced emission at ∼1.4, 1.6, and 2.2eV from states within then-type GaN bandgap near the interface of the reacted Mg with the semiconductor, which correlates with previous measurements of Schottky barrier formation on the same specimens. No clear evidence for p-type doping at the reacted interfacial layer is apparent. For Al on n-type GaN, CLS emission is dominated before and after metallization by “yellow” emission, which correlates only weakly with the Fermi level stabilization energy. Instead, we observe emission above the GaN band edge emission at 3.85 eV, due either to deep level emission from AlN or to the formation of the alloy Al_xGa_1-xN (x≈0.2) in the reacted near-surface region.     

Evolution of Threading Dislocation Density and Stress in GaN Films Grown on (111) Si Substrates by Metalorganic Chemical Vapor Deposition

We have studied the evolution of threading dislocations (TDs), stress, and cracking of GaN films grown on (111) Si substrates using a variety of buffer layers including thin AlN, compositionally graded Al _x Ga_1-x N (0 ≤ x ≤ 1), and AlN/Al _y Ga_1-y N/Al _x Ga_1-x N (0 ≤ x ≤ 1, y = 0 and 0.25) multilayer buffers. We find a reduction in TD density in GaN films grown on graded Al _x Ga_1-x N buffer layers, in comparison with those grown directly on a thin AlN buffer layer. Threading dislocation bending and annihilation occurs in the region in the graded Al _x Ga_1-x N grown under a compressive stress, which leads to a decrease of TD density in the overgrown GaN films. In addition, growing a thin AlN/Al _y Ga_1-y N bilayer prior to growing the compositionally graded Al _x Ga_1-x N buffer layer significantly reduces the initial TD density in the Al _x Ga_1-x N buffer layer, which subsequently further reduces the TD density in the overgrown GaN film. In-situ stress measurements reveal a delayed compressive-to-tensile stress transition for GaN films grown on graded Al _x Ga_1-x N buffer layers or multilayer buffers, in comparison to the film grown on a thin AlN buffer layer, which subsequently reduces the crack densities in the films.     

The effect of built-in electric field in GaN/AlGaN quantum wells with high AIN mole fraction

Spontaneous and piezoelectric polarization in hexagonal GaN/AlGaN heterostructures give rise to large built-in electric fields. The effect of the builtin electric field in GaN/Al_xGa_1−xN quantum wells was investigated for x=0.2 to 0.8 by photoluminescence studies. The quantum well structures were grown by molecular beam epitaxy on (0001) sapphire substrates. Cross-sectional transmission electron microscopy performed on the samples revealed abrupt interfaces and uniform layer thicknesses. The low temperature (4 K) photoluminescence peaks were progressively red-shifted due to the quantum confined Stark effect depending on the AlN mole fraction in the barriers and the thickness of the GaN quantum well. Our results verify the existence of very large built-in electric fields of up to 5 MV/cm in GaN/Al_0.8Ga_0.2N quantum wells.     

Polarization-Engineered Ga-Face GaN-Based Heterostructures for Normally-Off Heterostructure Field-Effect Transistors

Polarization-engineered Ga-face GaN-based heterostructures with a GaN cap layer and an AlGaN/p-GaN back barrier have been designed for normally-off field-effect transistors (FETs). The simulation results show that an unintentionally doped GaN cap and p-GaN layer in the buffer primarily deplete electrons in the channel and the Al_0.2Ga_0.8N back barrier helps to pinch off the channel. Experimentally, we have demonstrated a normally-off GaN-based field-effect transistor on the designed GaN cap/Al_0.3Ga_0.7N/GaN channel/Al_0.2Ga_0.8N/p-GaN/GaN heterostructure. A positive threshold voltage of 0.2 V and maximum transconductance of 2.6 mS/mm were achieved for 80-μm-long gate devices. The device fabrication process does not require a dry etching process for gate recessing, while highly selective etching of the GaN cap against a very thin Al_0.3GaN_0.7N top barrier has to be performed to create a two-dimensional electron gas for both the ohmic and access regions. A self-aligned, selective etch of the GaN cap in the access region is introduced, using the gate metal as an etch mask. The absence of gate recess etching is promising for uniform and repeatable threshold voltage control in normally-off AlGaN/GaN heterostructure FETs for power switching applications.     

MBE growth and properties of GaN and AlxGa1−xN on GaN/SiC substrates

The growth of GaN and AlGaN by molecular beam epitaxy (MBE) has been studied using GaN/SiC substrates. The GaN/SiC substrates consisted of ∼3 μm thick GaN buffer layers grown on 6H-SiC wafers by metalorganic vapor phase epitaxy (MOVPE) at Crée Research, Inc. The MBE-grown GaN films exhibit excellent structural and optical properties—comparable to the best GaN grown by MOVPE. Al_xGa_1−xN films (x ∼ 0.06-0.08) and Al_xGa_1−xN/GaN multi-quantum-well structures which display good optical properties were also grown by MBE on GaN/SiC substrates.     

Comparative study of AlGaN/GaN HEMTs robustness versus buffer design variations by applying Electroluminescence and electrical measurements

By means of step stressing tests on AlGaN/GaN HEMTs the robustness properties of devices fabricated on wafers with different buffer designs have been compared to each other (standard UID GaN buffer and UID Al_0.05Ga_0.95N back-barrier in combination with GaN channel layer). The devices with GaN buffer showed an abrupt increase of gate leakage current after reaching drain bias values in the range of 30 V while devices with Al_0.05Ga_0.95N back-barrier did not show any degradation up to 120 V drain bias. All DC-Step-Stress tests have been accompanied by Electroluminescence (EL) analysis and electrical characterization techniques before, during and after stress. It has been shown that EL at forward and reverse bias conditions can be used as an indicator of potential device degradation. Devices comprising an AlGaN back-barrier design demonstrated superior robustness.     

GaAsSb/InGaAs tunnel field effect transistor with a pocket layer

This work proposes a new GaAs_0.51Sb_0.49/In_0.53Ga_0.47As heterojunction tunnel field effect transistor (HTFET) with a 6-nm In_0.7Ga_0.3As layer (pocket) between the source and channel. Compared with InGaAs homojunction TFETs, the proposed HTFET has a steeper subthreshold swing at a higher drain current, owing to its lower source-to-channel tunnel barrier height. It has a maximum on-state current of 11.98 μA/μm at room temperature, which is more than ten times the on-state current obtained from an InGaAs homojunction TFET.