罗门哈斯推出系列新品解决电子产品制造商遇到的难题

罗门哈斯电子材料旗下印刷线路板技术事业部（CBT）日前借参展HKPCA 2008之际推出系列新品,以解决用户在电子产品生产过程中遇到的难题。为了获得品质良好的覆晶封装载板（FC-BGA）,对增层绝缘层的接着促进最佳化处理具有关键的影响。为此,CBT推出的Circuposit^TM 7800新一代环保制程提供了二个重要的功能：（1）去除盲孔底部残留的树脂，提供良好的铜结合力，确保信赖性；（2）对树脂表面做适当的粗化，提供良好的线路结合力。     

《光纤与电缆及其应用技术》杂志读者信息反馈卡（2006年第3期）

新型Flexible Noryl树脂是一种改性聚苯氧基树脂（PPO）和高耐冲击聚苯乙烯（HIPS）的互溶混合物，具有优秀的尺寸稳定性、低模压收缩、低吸水率和热环境下极小的蠕变。Flexible Noryl树脂挤出专用牌号（例如ENV105）综合了优秀的物理特性和可加工性。采用不同的牌号可以满足压力、温度的不同要求，其典型的性能包括：在较宽的温度范围内具有良好的耐冲击性，能满足无卤素元件要求的阻燃性、低毒性（CEI 20．37．2）、低腐蚀性，具有良好的电气性能。其中Noryl LS175低烟树脂能满足对低腐蚀性和低烟具有最严格要求的工业标准（例如ASTM E662标准），提供独特的成本和性能平衡。     

氰酸酯树脂的改性及其反应机理的研究

本文介绍了目前氰酸酯（CE）树脂的几种改性途径及其反应机理．包括热同性树脂、热塑性树脂、橡胶弹性体、晶须及含不饱和双键的化合物等改性方法．其中主要阐述了环氧（EP）树脂和双马来酰亚胺（BMI）树脂改性CE的机理及共聚体系的性能。     

5G功放板填孔覆盖镀层耐热性能研究

5G功放板覆盖镀层（POFV）的耐热性能直接影响印制线路板（PCB）组装之后的可靠性，因此在制作此类产品之前，重点对5G功放板填孔POFV的耐热性能的影响因子进行了研究。通过采用鱼骨图对影响因子进行梳理，找出关键的流程及影响因子，针对性对印制线路板制作的树脂填孔流程的树脂烤板参数、电镀通孔（PTH）流程除胶参数、在流程中的停留时间，以及填孔树脂本身的热膨胀（CTE）特性等影响因子进行对比实验，并对各测试结果进行总结分析。根据实验测试结果，确认了影响填孔覆盖镀层与树脂分离的主要因素是所选填孔树脂与基板CTE特性的匹配性，此外填孔后的树脂固化烤板参数、磨树脂后到电镀通孔的停留时间、电镀通孔过程中除胶条件等对POFV镀层与填孔树脂分离有少许影响。     

积层法多层板（BUM）与高密度互连（HDI）

本简要介绍了积层法多层板（ＢＣＭ）,高密度互连（ＨＤＩ）及其与之有关的一些基本概念,制作工艺等,并重点介绍了涂树脂铜箔（ＲＣＣ）。     

双马-三嗪树脂在CCL中的应用

介绍了双马-三嗪树脂（BT）的发展概况和性能特点，通过对固化反应机理的评述认为，双马-三嗪树脂在固化时主要形成互穿网络结构（IPN）聚合物，这种IPN结构限制了固化树脂的耐热性能。为了提高双马-三嗪树脂的性能，开发出具有自主知识产权的新产品，需要重点研究解决好树脂的熔、溶工艺性，以及在氰酸酯与双马来酰亚胺两种单体树脂间实现化学共聚途径等问题。     

氯化钾（KCl）晶体保护膜的镀制

用真空蒸发法在KCl晶体表面镀上聚全氟己丙烯（F46）或3M树脂保护膜层，其红外光谱透射曲线良好，抗潮解性能优良、船长期承受高能激光照射，得到了实际应用。     

最新开发的D~2BGA技术

NEC目前开发了适于高密度thl封装（芯片规模封装）之一的D勺M（ieDi。nsionBallGridA＿）,并正批量应用于208条引脚ASIC产品中。而且正在研究将其应用于高速存储器及微型计算机。D屯GA是由芯片、布线带沙【形保持树脂、焊球、增强焊接用树脂等构成。其中布线带是由与芯片的铝电极相连接的内凸点（焊点）及为密封用的粘接剂构成,采用安装、键合工艺可获得高内部连接可靠性。另一方面,采用树脂增强悍球周围,可实现与现有封装同样的基板连接可靠性。最新开发的D~2BGA技术@李世兴     

世界覆铜板新产品新技术赏析（5）——松下电工低介电常数高耐热基板材料MEGTRON4

文章简介了聚苯醚树脂的优缺点,分析了松下电工新开发的PCB基板材料MEGTRON4643诸多性能,包括高频性能、IVH充填性能、无铅兼容性能、互连应力测试和耐CAF性能,MEGTRON4具有低热膨胀、高可靠性和良好加工性,主要应用于网络设备（服务器、路由器）、测量仪器等领域。     

大尺寸有机基板的材料设计与封装翘曲控制

倒装芯片球栅阵列（FCBGA）基板具有尺寸大、层数多等特点,可以满足大尺寸芯片超高速运算的需求。随着芯片尺寸的增大,有机基板的翘曲问题变得更加突出,因此,需要对有机基板材料在热膨胀系数（CTE）、模量、树脂收缩率、应力控制等方面进行升级。对FCBGA基板使用的大尺寸有机基板材料进行研究,重点研究其关键性能参数,如CTE、模量和树脂收缩率等,进一步探讨了对树脂基体、无机填料和玻璃纤维布等材料的选择以及生产制造过程中的应力控制,并对大尺寸有机基板材料技术的发展趋势进行了展望。     

环氧树脂／氰酸酯／酚醛树脂三元体系在覆铜板中的应用研究

通过红外光谱以及示差扫描量热分析（DSC）等方法分析了环氧树脂／氰酸酯／酚醛树脂三元体系的固化反应过程,并通过该三元体系制作出了具有高耐热性、低介电常数及介质损耗、优异的耐湿热性能及阻燃性、并具有良好加工性能的覆铜板。     

含填料酚醛固化体系覆铜板用半固化片流变特性研究

含填料的酚醛固化体系是目前环氧树脂基覆铜板的主流。本文采用旋转流变仪研究了填料种类、填料形态、填料比例以及阴离子分散剂对酚醛固化体系覆铜板用半固化片流变特性的影响。     

Thermal reliability of gold–aluminum bonds encapsulated in bi-phenyl epoxy resin

Bond degradation of Au wire/Al pad has become a major problem, because of the use of molding resin with low thermal stability (e.g. bi-phenyl epoxy resin) and the use of the IC devices under high thermal environments. It is therefore important to insure the thermal reliability at Au/Al bonds. The lifetime to bond failure of bi-phenyl epoxy molding became shorter than that for cresol novolac epoxy. The failures were caused by the corrosion reaction of Au–Al intermetallics with bromine (Br) contained in the resin compounds. It was clarified that the reactive intermetallic was Au₄Al phase formed in the bond interface.The governing factors of the bond corrosion were investigated such as resin compound and gold wire material. Especially some impurities in gold wire could affect the Au–Al intermetallic growing and therefore retard the corrosion. The use of the alloyed wire was effective in improving the bond reliability.     

脱模剂(蜡)对EMC/红胶体系间密着性影响的研究

当前电子产品正趋于小型化、微型化,这对适用于小型化的表面贴装电子元器件的要求越来越高。因此,研究环氧模塑料(Epoxy Molding Compound,EMC)对改善元器件贴装的可靠性,提高最终产品的质量具有重要意义。以EMC最常用的邻甲酚型环氧树脂(OCN)和酚醛树脂(PN)为树脂系统,选用8种不同类型的蜡为单一变量设计配方合成了EMC,以所述测试方法测试了EMC与红胶的密着力,其中5种蜡符合标准,并分析得到了蜡的类型对EMC与红胶密着力的影响规律。结合离型测试,分析了不同类型的蜡在EMC生产和使用过程中的作用。结果表明,在该树脂系统中,蜡3、4、5、6为主蜡,蜡1、7、8为辅蜡。在EMC层面上解决了红胶密着力问题,同时对提高EMC生产过程中的操作性具有一定的意义。     

Deep UV photoresists I. Meldrum's diazo sensitizer

The design, synthesis, and evaluation of a new resist formulation tailored for use in the deep UV (254 nm) is described. The resist is based on use of 2,2-dimethyl-4,6-dioxo-5-diazo-1,3-dioxolane (5- diazo-Meldrum's acid) and derivatives thereof as a sensitizer for cresol formaldehyde novolac resin. The new class of sensitizers provides an intense bleachable absorbance at 254 nm and couples sensitivity with plasma etch resistance. The resist exhibits remarkable dissolution kinetics which provide for high resolution imaging devoid of standing wave phenomena. A series of experiments designed to provide understanding of the dissolution kinetics are described.     

紫外可见光谱法测量光刻胶的膜厚

在液晶显示器的制造过程中,光刻是极为重要的制造工艺过程之一。将厚的独立的负胶膜或者将光刻胶涂敷在二氧化硅衬底上以后,可以测量其膜厚,因为光刻胶膜厚决定其光刻工艺的工艺条件。能够快速地测量光刻胶的膜厚,是液晶显示器制造过程的先决性工作的一部分。文章提出了测量上述光刻胶膜厚的新方法,即利用紫外可见吸收光谱法中的Beer-Lambert定律来确定膜厚。在我们的研究中,采用acrylic负胶作为基质(resin) ,它分别具有50μm和100μm的膜厚。在350 nm时,50μm的薄膜的最大吸收为0 .728 ,而100μm的最大吸收为1 .468 5。而在正胶的研究中,采用novolac作为基质(resin)。它的膜厚通常是1 ～5μm。在紫外可见吸收光谱测膜厚的实验中,当重氮荼醌的吸收波长为403 .8 nm时,5 .93μm厚的薄膜的最大吸收为1 .757 4 ,其膜厚是由扫描电镜测得的。而另一个正胶薄膜在403 .8 nm的最大吸收为0 .982 3 ,其薄膜厚度计算得到为3 .31μm。利用这些数据,我们得到了这两种光刻胶薄膜的紫外可见吸收光强与其膜厚关系的两个校准曲线。     

Novolac-based resists

The performance of novolac–diazonaphthoquinone-based positive-working resists is discussed in terms of the molecular weight distributions and microstructures of the novolac resins and the structural variations in the photoactive dissolution inhibitor. Modelling studies leading to recent improvements allosing the delineation of 0.35 μm line and space pattens by ensuring a focal depth of 105 μm are outlined. Consideration is also given to the new problems such as pivotal shift and halation that arise in the application of high-resolution photolithography using novolac–diazonaphthoquinone resists.     

Low temperature delamination of plastic encapsulated microcircuits

Plastic encapsulated microcircuits (PEMs) are increasingly being used in applications requiring operation at temperatures lower than the manufacturer’s recommended minimum temperature, which is 0°C for commercial grade components and −40°C for industrial and automotive grade components. To characterize the susceptibility of PEMs to delamination at these extreme low temperatures, packages with different geometries, encapsulated in both biphenyl and novolac molding compounds, were subjected to up to 500 thermal cycles with minimum temperatures in the range −40 to −65°C in both the moisture saturated and baked conditions. Scanning acoustic microscopy revealed there was a negligible increase in delamination at the die-to-encapsulant interface after thermal cycling for the 84 lead PQFPs encapsulated in novolac and for both 84 lead PQFPs and 14 lead PDIPs encapsulated in biphenyl molding compound. Only the 14 lead novolac PDIPs exhibited increased delamination. Moisture exposure had a significant effect on the creation of additional delamination.     

Synthesis and characterization of Cu2ZnSnS4 from Cu2SnS3 and ZnS compounds

The Cu2ZnSnS4 (CZTS) powders are successfully synthesized by using ZnS and Cu2SnS3 as raw materials directly without any intermediate phase at 450 °C for 3 h in Ar atmosphere. The crystalline structure, morphology and optical properties of the CZTS powders are characterized by X-ray diffraction (XRD), Raman spectrum, field emission scanning electron microscopy (FESEM) and ultraviolet-visible (UV-vis) spectrophotometer, respectively. The results show that the band gap of the obtained CZTS is 1.53 eV. The CZTS film is fabricated by spin coating a mixture of CZTS powders and novolac resin with a weight percentage of 30%. The photoelectrical properties of such CZTS films are measured, and the results show an incident light density of 100 mW.cm-2 with the bias voltage of 0.40 V, and the photocurrent density can approach 9.80×10-5 A.cm2within 50 s, giving an on/off switching ratio of 1.64.     

High-speed drawing of optical fibers with pressurized coating

To make progress in high-speed drawing of optical fibers, a pressurized coating method was developed on the basis of viscous flow behavior of the coating resin. In a pressurized die, when the shear rate at the fiber surface is minimized, the pressure which is affected by the resin viscosity reaches on optimum condition, resulting in the coating diameter being dependent only on fiber and die diameters. Coating tension is given as a function of pressure so that it is closely related to the optimum pressure through the viscosity. Based on these fundamentals, a 1200-m/min drawing speed was achieved, indicating a smooth and uniform coating with good concentricity. It is clarified that fiber transmission loss does not fundamentally change in relation to the speed.