超声辅助钛合金激光沉积成形试验研究

借鉴超声振动在铸造、焊接、熔覆等领域中的作用,将超声振动引入钛合金激光沉积成形系统中,利用超声作用细化晶粒,均匀组织成分,减小试件的残余应力,从而解决成形件变形开裂的难题。针对成形系统的结构特点,搭建了超声振动系统,进行了超声振动辅助钛合金沉积成形试验。通过观察沉积试件的微观组织和对试件残余应力的测试,发现超声振动使试件熔覆层中的晶粒得到细化,使功能梯度材料试件中的TiC硬质相弥散均匀;并且能够减小试件的残余应力。测试结果表明超声空化或机械效应可以打碎由初生枝晶交错连接形成的固态结晶网,从而细化了晶粒,同时使继续结晶时熔体得到补充,减小了枝晶间产生的拉应力;另外超声波在熔池中的搅拌声流将使硬质相运动到熔池各处,使之分布更为均匀,在一定程度上减少了相与相之间凝固收缩应力的不同而产生的凝固应力。     

超声场下激光沉积TA15钛合金的组织和力学性能

为提高激光沉积TA15钛合金力学性能,采用ANSYS有限元动力学分析中的谐响应分析,对超声场下激光沉积修复梯形槽底部表面振幅分布及质点振动情况进行了数值模拟,并对模拟结果进行了实验验证,最后对超声场下激光沉积修复试样的综合力学性能进行了实验研究。结果表明:超声场下梯形槽底部表面各质点呈现周期性运动特点,最大振幅在1.6 m左右,对质点振幅进行测量,与模拟结果吻合较好。进行了超声场下激光沉积实验,沉积区硬度略有提高,修复试样抗拉强度提高3.2%,屈服强度提高7.1%,超声场下显微组织进行观察发现片层变短。     

激光沉积修复ZL114A铝合金的显微组织及显微硬度研究

为了研究激光沉积技术修复ZL114A铝合金构件的工艺及性能，采用多参数组合激光沉积工艺实验制备了单道单层试样，在分析了其表面形貌、气孔等缺陷产生的原因的基础上，得到了一组相对优化的工艺参数，制备了无缺陷的块状修复试样，并对试样进行了组织分析及硬度检测。结果表明:铝合金修复试样修复区与基材形成良好的冶金结合，沉积层底部为以熔池边缘为起点外延生长的柱状树枝晶，且一次枝晶间距18。38 m，二次枝晶间距9。55 m，在沉积层顶层顶部出现-Al柱状枝晶转变为等轴枝晶现象。层带区域Si相脱溶析出并趋于粒状化。由于晶粒细化和固溶强化作用，沉积区显微硬度较基材提高25。8%。     

超声波对铝合金激光-电弧复合焊接影响的研究

为了解决传统铝合金焊接接头气孔数量多、晶粒粗大及力学性能差的问题，以5083-O铝合金为研究对象，进行了超声振动辅助激光-电弧复合焊接试验。研究了超声振动对铝合金焊缝气孔数量、微观组织及抗拉强度的影响，并探讨了超声波在焊接熔池中对气孔排出和组织细化的作用机理。结果表明，超声辅助焊接的焊缝气孔数量显著降低，主要归功于超声空化效应降低了铝合金熔体中的氢浓度，并促进气泡的快速逸出；超声波的空化效应和声流效应改变了熔体的压力、温度以及流动状态，使熔池的结晶条件发生改变，从而通过提高形核率和破碎枝晶细化了焊缝晶粒组织；施加超声振动后的焊缝平均拉伸强度由242.9MPa提高到270MPa，且断裂位置发生在热影响区，主要是因为焊缝区气孔减少和组织细化。此研究对深入理解铝合金焊接过程中缺陷形成机理及提高接头强度是有帮助的。     

电磁搅拌辅助钛合金激光沉积修复的电磁场模拟与验证

利用自行研制的电磁搅拌装置辅助钛合金激光沉积修复,通过有限元软件ANSYS进行数值模拟,并与试验相结合,研究了钛合金激光熔池内磁-电-力的相互作用关系。结果表明,在旋转磁场的作用下,激光熔池内的液体表面磁感应强度与激励电流成正比,与频率成反比;激光熔池受到径向力和切向力的作用,但是前者较小,可以忽略不计,液体横截面上电磁力密度最大值与激励电流成正比。在旋转磁场的作用下激光沉积修复件表面两侧凸起且修复层内部组织/片层长径比减小。     

体激光能量密度对选区激光熔化316L不锈钢各向异性的影响

在激光旋转角度为73°,粉层厚度为30μm的条件下,采用选区激光熔化工艺快速成形316L不锈钢,研究了体激光能量密度及成形方向对成形件组织、性能各向异性的影响。结果表明:成形方向对力学性能的影响极大,力学性能的各向异性随组织的各向异性而变;随着体激光能量密度增加,熔池表面趋于平整,x和y向成形件的晶粒生长方向单一,z向成形件的晶粒生长取向明显;当体激光能量密度为65~85 J·mm^-3时,晶体生长方向与堆积方向一致,抗拉强度和断后伸长率最佳。可以利用体激光能量密度控制成形件的组织及性能。     

感应预热对激光沉积修复TA15钛合金显微组织和残余应力的影响

利用6 kW光纤激光器的激光沉积修复系统和电磁感应加热设备,采用TA15钛合金粉末在基板未预热和预热到200℃、400℃时分别进行激光沉积修复实验。利用光学显微镜、显微硬度计、压痕法应力测试仪对激光沉积修复试样的显微组织、显微硬度、残余应力进行测试分析,得到不同预热温度对激光沉积修复显微组织、显微硬度、残余应力的影响规律。结果表明:随着感应预热温度的升高,片层组织变得粗大,初生相生长更加充分;组织分布均匀化,显微硬度轻微降低;残余应力明显减小。为感应加热辅助激光沉积修复提供指导依据。     

超声对激光熔覆WC颗粒强化涂层耐磨防腐性能的影响(特邀)

面向海洋、矿山等领域机械部件表面耐磨防蚀涂层制备需求,针对陶瓷颗粒强化涂层高耐磨性能与高耐腐蚀性能难以兼容的问题,搭建了超声辅助激光熔覆试验平台,制备了有无超声作用下的碳化钨(WC)颗粒强化涂层。研究了超声对复合涂层微观组织形貌、元素分布、WC表面合金层厚度的影响规律,并进一步开展了有无超声试样硬度、摩擦磨损与耐蚀性能测试。结果表明：超声振动能够细化晶粒,平均晶粒尺寸从101.0μm降至59.6μm,抑制偏析,促使WC表面合金层溶解与熔覆层元素的均匀分布;超声作用下,试样平均显微硬度由310 HV0.1提升至425 HV0.1,同时超声作用下WC颗粒周围硬度分布更加均匀;有无超声作用下试样失重量分别为6.5 mg和8.8 mg,试样磨损率分别为0.032 3 mg/m和0.043 8 mg/m,试样磨损率降低了26.2%;超声作用下试样腐蚀电流密度由5.20μA/cm²降低为2.13μA/cm²,同时电化学阻抗谱表明超声作用下试样表面具有更大的电容阻抗环、阻抗模量与相角值。     

激光沉积修复BT20合金试验研究

采用激光沉积技术对BT20钛合金锻件加工超差及服役损伤进行修复,对修复过程中气孔和熔合不良等缺陷的形成进行了原因分析,并采用了优化工艺参数,对激光熔池施加超声外场等手段,获得无缺陷的修复试样。考察了试样的微观组织和主要合金元素的分布,测量了激光沉积层的显微硬度。结果表明:优化工艺参数后得到的修复组织和基体形成致密的冶金结合,而施加超声外场使修复区的气孔率明显下降;修复试样整体无合金元素的偏析,显微硬度分布从基材到修复区呈递增趋势。     

GH738合金激光沉积修复试验研究

通过正交试验研究了激光功率、扫描速度、送粉速度对GH738合金激光沉积修复单道熔高、熔宽、熔深等特征尺寸的影响规律,优化了工艺参数,获得无缺陷显微组织;分析了多道多层沉积试样熔合不良、裂纹等缺陷产生的原因及组织、硬度分布特点。结果表明:沉积区呈典型的外延生长柱状枝晶,枝晶间析出少量碳化物;相对于基体,热影响区碳化物明显减少,同时热影响区'相尺寸明显增大;沉积区硬度为350~470 HV0.3,热影响区硬度为450~480 HV0.3,均明显低于基体硬度480~510 HV0.3;且沿沉积高度方向硬度逐渐降低。     

A microstructural comparison of the initial growth of AlN and GaN layers on basal plane sapphire and sic substrates by low pressure metalorganic chemical vapor deposition

The initial growth by low pressure metalorganic chemical vapor deposition and subsequent thermal annealing of A1N and GaN epitaxial layers on SiC and sapphire substrates is examined using high resolution transmission electron microscopy and atomic force microscopy. Growth under low pressure conditions on sapphire substrates is significantly different from that reported for conventional (atmospheric pressure) conditions. Smooth, single crystal A1N and GaN layers were deposited on sapphire in the initial low temperature (600°C) growth step. Interfacial bonding and not lattice mismatch was found to be the determin ing factor for obtaining good crystallinity for the epitaxial layers as indicated by the growth results on SiC substrates.     

CVDZnS微观缺陷分析

微缺陷对化学气相沉积硫化锌(CVDZnS)的光学及力学性能有显著影响。对沉积工艺进行了介绍，通过SEM、TEM及金相对CVDZnS中的微缺陷如异常大晶粒、柱状晶、微裂纹、微孔及杂质的结构形态进行了观测，并对形成原因进行了分析:高的沉积生长速率是生成异常大晶粒的主要原因；反应物浓度高加之衬底表面的屏蔽效应及Zn/ H2S1形成结构疏松的柱状晶组织；沉积温度较低加大沉积生长应力，宏观上产生材料的起拱，微观上造成晶粒的弯曲形变，并在晶体内产生大量微裂纹；沉积室局部反应物浓度高导致微孔及杂质的产生，须改善沉积室气体流形提高反应物浓度的均匀性。     

Liquid‐selenium‐enhanced grain growth of nanoparticle precursor layers for CuInSe2 solar cell absorbers

Large‐grained CuInSe₂ absorber layers are synthesized using a non‐vacuum process based on nanoparticle ink precursors and selenization by rapid thermal processing (RTP). The use of hydroxide‐based particles in organic solvents allows for the conversion with elemental selenium without the need to employ explosive and/or toxic H₂ or H₂Se gasses. Lateral grain sizes up to 4 µm are obtained through a novel RTP route, overcoming the inherently high layer porosity for previous nanoparticle processes. Morphological and elemental characterization at interrupted selenization steps suggests that liquid selenium can play a beneficial role in promoting layer densification and grain growth. Long carrier collection lengths in CuInSe₂ enable notable conversion efficiencies, despite the low minority carrier lifetimes of below 1 ns. Record efficiencies up to 8.73% highlight the potential of low‐cost, non‐vacuum deposition of chalcopyrite absorber layers with safe and simple precursors and processing routes. Copyright © 2014 John Wiley & Sons, Ltd.     

Modeling of copper wire bonding process on high power LEDs

In this paper, a couple thermal mechanical transient dynamic finite element framework of copper wire bonding process on high power lighting emitting diodes (LEDs) is developed, which considers the thermal heating effects of friction and plastic deformation. The whole wire bonding process is simplified to consist of impact and ultrasonic vibration stages. Parametric studies are also carried out to examine the effects of ultrasonic vibration amplitude and bonding force on stress/strain distribution and friction thermal heating effect during wire bonding process. Different friction coefficients of interface between the free air ball (FAB) and the bond pad are taken in the simulation to examine the effects of friction on the stress and strain level of electrode structure. Modeling results show that the stress/strain distribution and temperature evolution of wire bonding system are significant influenced by the ultrasonic vibration amplitudes, bonding forces and friction coefficients. Discussion and comparison are conducted between the copper and the gold wire bonding processes on the high power LEDs by numerical simulation. The results have disclosed that higher stress/strain in the bond pad and the ohmic contact layer is induced during the copper wire bonding process. Therefore, the process parameters of copper wire bonding should be controlled carefully. This numerical simulation work may provide guidelines for the copper wire bonding process virtual window development of high power LEDs packaging.     

Selective Growth of CdTe on Nano-patterned CdS via Close-Space Sublimation

Selective-area deposition of CdTe on CdS via close-space sublimation is used to study the effect of window size (2 μm and 300 nm) on grain growth. The basic fabrication procedures for each of the layers (CdS, SiO₂, and CdTe) and for achieving selective-area growth are presented. Selective-area growth of both micro- and nano-scale CdTe islands on CdS substrates using close-spaced sublimation is demonstrated. Scanning electron microscopy and electron backscatter diffraction microstructure analysis show that the micro-scale CdTe islands remain polycrystalline. However, when the island size is reduced to 300 nm, single crystal CdTe can be achieved within the windows. The CdTe grains were most often in the (101) orientation for both the micro- and nano-sized CdTe islands.     

激光热力强化电化学沉积试验研究

为了进一步揭示激光的热力效应对电化学沉积的强化作用,构建了激光电化学复合沉积试验系统,进行了理论分析和实验验证。采用激光循环往复的扫描方式照射沉积区域制备沉积层试样,对沉积过程中的力效应和热效应进行测试,最后采用扫描电子显微镜对沉积层的表面形貌和截面形貌进行观察对比。结果表明,激光的热力效应能加快金属离子的还原反应,促进晶核形成和晶粒细化,在激光能量为0.2mJ（20kHz）时,能获得良好的沉积速率（0.198mg/min）;在激光能量为0.4mJ（20kHz）时,沉积层的拉伸强度性能较好,达到256.38 MPa。此研究结果对电解加工技术的发展是有一定帮助的。