散粒噪声用于纳米电子器件与结构的量子效应表征

论述了纳米电子器件与结构中散粒噪声的产生机理和影响因素,表明散粒噪声与输运过程密切相关,按照噪声功率谱的幅值大小将散粒噪声分为泊松散粒噪声、亚泊松散粒噪声和超泊松散粒噪声四类。将散粒噪声的这些规律应用于纳米电子器件和结构,可表征不同器件与结构中的量子效应。利用散粒噪声已经成功检测到无序导线中的开放通道与量子点混沌腔中的波动性,测量出超导体与分数量子霍尔效应中的准粒子电荷。将散粒噪声用于检测纠缠态对量子计算具有重要的意义,自旋相干输运的检测是自旋电子学的重要研究课题。     

20 nm金属氧化物半导体场效应晶体管的噪声特性分析北大核心CSCD

传统短沟道的纳米MOSFET噪声主要为受抑制的散粒噪声,其次为热噪声;在建立器件的噪声模型时,并没有考虑栅极噪声源与源极噪声源二者之间的电荷耦合,其耦合效应会形成互相关噪声。实验测试了20 nm MOSFET的噪声,结果分析得到短沟道MOSFET的噪声主要为散粒噪声、热噪声和互相关噪声。其次,根据MOSFET的器件物理结构及特性推导了纳米MOSFET的互相关噪声公式。在此基础上,比较受抑制的散粒噪声、热噪声和互相关噪声随沟道长度、温度、源漏电压和栅极电压的变化关系,所得结论有助于提高MOSFET器件的工作效率、可靠性及寿命。     

纳米电子器件中的噪声及其应用研究

对多种纳米材料和纳米器件的噪声进行了比较详细的研究,对纳米器件中几种常用的噪声测量方法进行了探讨。讨论了利用噪声(主要是散粒噪声)进行介观电学机制探测的方法,并提出了用于解决单电子晶体管中背景电荷噪声的有效方法,揭示了双势垒共振隧穿二极管在负微分电阻区的散粒噪声大于Poisson值的本质。     

短沟道MOSFET散粒噪声测试方法研究

针对MOSFET散粒噪声难以测量的特点,提出了一种低温散粒噪声测试方法。在屏蔽环境下,将被测器件置于低温装置内,有效抑制了外界电磁波和热噪声的干扰,采用背景噪声足够低的放大器以及偏置器、适配器等,建立低温散粒噪声测试系统。应用本系统对短沟道MOSFET器件进行噪声测试,分析该器件散粒噪声的特性。     

纳米MOSFET器件电流噪声测试方法研究

针对常规纳米尺度电子元器件的噪声特性,研究其噪声的基本测试条件,并建立测试系统。在屏蔽条件下采用低温装置和超低噪声前置放大器,能有效抑制外界干扰。应用该系统对实际纳米MOSFET器件进行噪声测试得到其电流噪声,在测试基础上通过计算分别得到热噪声和散粒噪声,同时分析器件工作在亚阈区和反型区下的电流噪声随源漏电压和电流的变化关系。结果表明测试结果与理论分析吻合,验证了测试系统的准确性。     

凝视成像三维激光雷达噪声分析

增强型电荷耦合器件(ICCD)是凝视成像三维激光雷达的关键器件之一。测量了在不同输入光强和不同像增强器增益电压条件下的光强以及噪声。根据光电探测过程,用泊松随机过程理论和最小二乘拟合法对测得的光强噪声数据进行了分析,发现噪声主要由来自于像增强器的等效光电子散粒噪声和电荷耦合器件(CCD)的光电子散粒噪声组成。尽管像增强器对光信号进行了放大,在大部分情况下,CCD的光电子散粒噪声也不可忽略。建立了双随机变量泊松过程的三维成像噪声模型,利用该模型给出了测距误差最小意义下的最优增益距离调制函数。     

PN结二极管散粒噪声测试方法研究

针对散粒噪声难以测量的特点,提出了一种低温散粒噪声测试方法。在屏蔽环境下,将被测器件置于低温装置内,有效抑制了外界电磁波和热噪声的干扰,采用背景噪声充分低的放大器以及偏置器、适配器等,建立低温散粒噪声测试系统。应用该系统对PN结二极管进行散粒噪声测试,得到了很好的测试结果。     

超分辨率图像重建引起的噪声放大与滤波

总结了图像序列相位关系对超分辨率图像重建效果的影响规律,对超分辨率图像重建引起的高斯噪声和散粒噪声的放大予以研究.通过叠加不同方差的高斯噪声的图像序列重建实验,得到结论维纳滤波可以有效地滤除放大后的高斯噪声,但是超分辨率图像重建后散粒噪声放大成为"波纹"形状的噪声,传统的中值滤波法不能有效地滤除放大后的"波纹"形状噪声...     

碲镉汞光伏探测器的变面积表面钝化研究

利用同一片碲镉汞材料制备了由单层ZnS和双层CdTe/ZnS作钝化膜的变面积光伏探测器,对两种钝化膜结构的变面积器件进行了对比研究.通过分析两种器件的电流-电压(I-V)特性曲线以及零偏电阻-面积乘积(RoA)与周长-面积比(p/A)的关系曲线,发现ZnS钝化的器件具有较大的表面漏电流;通过分析两种器件的电流噪声与暗电流的关系,发现ZnS钝化的器件的噪声特性较接近散粒噪声,CdTe/ZnS双层钝化的器件则表现出较好的基本1/f噪声特性,使得器件噪声要小于单层ZnS钝化的器件.     

碲镉汞光伏探测器的变面积表面钝化研究

利用同一片碲镉汞材料制备了由单层ZnS和双层CdTe/ZnS作钝化膜的变面积光伏探测器,对两种钝化膜结构的变面积器件进行了对比研究.通过分析两种器件的电流-电压(I-V)特性曲线以及零偏电阻-面积乘积(RoA)与周长-面积比(p/A)的关系曲线,发现ZnS钝化的器件具有较大的表面漏电流;通过分析两种器件的电流噪声与暗电流的关系,发现ZnS钝化的器件的噪声特性较接近散粒噪声,CdTe/ZnS双层钝化的器件则表现出较好的基本1/f噪声特性,使得器件噪声要小于单层ZnS钝化的器件.     

A Quantum Study of Multibit Phase Coding for Optical Storage

We propose a scheme which encodes information in both the longitudinal and spatial transverse phases of a continuous-wave optical beam. A split detector-based interferometric scheme is then introduced to optimally detect both encoded phase signals. In contrast to present day optical storage devices, our phase coding scheme has an information storage capacity which scales with the power of the read-out optical beam. We analyze the maximum number of encoding possibilities at the shot noise limit (SNL). In addition, we show that using squeezed light, the SNL can be overcome and the number of encoding possibilities increased. We discuss a possible application of our phase-coding scheme for increasing the capacities of optical storage devices     

Simulation and Measurement of Shot Noise in Resonant Tunneling Structures

We present numerical simulations and measurements of shot noise in resonant tunneling structures. We show that when electron-electron interaction through Coulomb force and Pauli exclusion is properly taken into account, the main features of noise behavior of such devices can be correctly predicted. Electron-electron interaction is shown to be responsible for the suppression of shot noise in the positive differential resistance region of the I-V curve, and for the enhancement of shot noise in the negative differential resistance region.     

Modified quadratic congruence codes for fiber Bragg-grating-basedspectral-amplitude-coding optical CDMA systems

We have constructed a series of new code families for the spectral-amplitude-coding optical code-division multiple-access (CDMA) system, and proposed new transmitter and receiver structures based on tunable chirped fiber Bragg gratings (FBGs). The proposed system has been analyzed by taking into account the effects of phase-induced intensity noise, shot noise, and thermal noise. We have also compared the performance of this system with that of a former system where a Hadamard code is used. It has been shown that the new code families can suppress the intensity noise effectively and improve the system performance significantly. When the effective power is large (i.e., >-10 dBm), the intensity noise is the main factor that limits the system performance. When the effective power is not sufficiently large, thermal and shot noise sources become the main limiting factors and the effect of thermal noise is much larger than that of shot noise     

Low frequency gate noise in a diode-connected MESFET: measurementsand modeling

The low frequency Schottky diode noise has been investigated in GaAs power MESFETs. For those devices, gate noise spectra are generally composed of 1/f and shot noise contributions. We have observed an increase by two orders of magnitude of the noise level when MESFETs are submitted to rf life-test. The increase of the 1/f noise can be explained by a modification of the gate space charge region extension. This interpretation is sustained by a reduction of the drain current transient magnitude and the inherent active trap density. A correlation is assumed between the increase of the shot noise level after rf life-test and a micro-plasma formation. Both 1/f noise and shot noise evolution might originate in a local increase of the electric field in the vicinity of the gate in drain access region. We have demonstrated that LF gate current noise is an early indicator of damage mechanisms occurring at the gate-semiconductor and passivation-semiconductor interfaces of the devices     

Noise characteristics of GaAs-AlGaAs heterojunction punch-throughphototransistors

Novel GaAs-AlGaAs heterojunction phototransistors with a δ-doped base have been fabricated. Very high gain and low output noise have been measured. The measured noise is composed of shot noise associated with collector quiescent bias current and amplified shot noise due to collector leak current for nonpassivated devices. The high gain and low intrinsic noise characteristics of these transistors make them very promising in weak light detection     

Noise in phototransistor optical isolators

Noise measurements were performed on several commercially available phototransistor optical isolators in order to examine the signal detection limits of typical devices. It was found that, in general, phototransistor optical isolators are very noisy devices exhibiting all of the common types of noise usually found in bipolar junction transistors. A large number of devices exhibited burst noise which dominated their low-frequency noise performance. The noise performance of devices without burst noise was dominated by 1/f noise or flicker noise at low frequencies and by shot noise at high frequencies. Experimental data indicates that in most cases the electrical noise contribution of the LED is negligible and that the dominant source of noise is the phototransistor.     

长波长PIN／HBT集成光接收机前端噪声分析

文章研究磷化铟(InP)基异质结双极晶体管(HBT)和PIN光电二极管(PIN-PD)单片集成技术,利用器件的小信号等效电路详细计算了长波长PIN/HBT光电子集成电路(OEIC)光接收机前端等效输入噪声电流均方根(RMS)功率谱密度.分析表明:对于高速光电器件,当频率在100 MHz～2 GHz范围内时,基极电流引起的散粒噪声和基极电阻引起的热噪声起主要作用;频率大于5 GHz时,集电极电流引起的散粒噪声和基极电阻引起的热噪声起主要作用.在上述结论的基础上,文章最后讨论了在集成前端设计的过程中减小噪声影响的基本方法.     

Noise in solid-state devices and lasers

A survey is given of the most important noise problems in solid-state devices. Section II discusses shot noise in metal-semiconductor diodes, p-n junctions, and transistors at low injection; noise due to recombination and generation in the junction space-charge region; high-level injection effects; noise in photodiodes, avalanche diodes, and diode particle detectors, and shot noise in the leakage currents in field-effect transistors (FETs). Section III discusses thermal noise and induced gate noise in FETs; generation-recombination noise in FETs and transistors at low temperatures; noise due to recombination centers in the space-charge region(s) of FETs, and noise in space-charge-limited solid-state diodes. Section IV attempts to give a unified account of 1/f noise in solid-state devices in terms of the fluctuating occupancy of traps in the surface oxide; discusses the kinetics of these traps; applies this to flicker noise in junction diodes, transistors, and FETs, and briefly discusses flicker noise in Gunn diodes and burst noise in junction diodes and transistors. Section V discusses shot noise in the light emission of luminescent diodes and lasers, and noise in optical heterodyning. Section VI discusses circuit applications. It deals with the noise figure of negative conductance amplifiers (tunnel diodes and parametric amplifiers), and of FET, transistor, and mixer circuits. In the latter discussion capacitive up-converters, and diode, FET, and transistor mixers are dealt with.     

太赫兹肖特基二极管噪声电压的理论研究

在太赫兹焦平面成像等系统中,GaAs肖特基二极管作为太赫兹检测的核心器件,其噪声特性直接影响太赫兹探测系统的灵敏度。讨论了GaAs肖特基二极管在不同直流偏压下加载给负载的热噪声电压、散粒噪声电压、总噪声电压,并给出了相应的解析解。同时,建模模拟了太赫兹混频前端,并利用谐波平衡法对理论公式进行了对比验证。对太赫兹像元与阵列芯片的噪声机理以及提高芯片的噪声性能研究,改善芯片噪声特性,从而提高太赫兹焦平面成像系统灵敏度具有重要意义和作用。