集成电路制造用溅射靶材

溅射靶材常用于半导体产业、记录媒体产业和先进显示器产业。在不同产业中,半导体集成电路制造业对溅射靶材的质量要求最高。对用于集成电路制造的溅射靶材的材质类型、纯度要求、外形发展进行了阐述,并讨论了溅射靶材微观组织对溅射薄膜性质的影响,以及靶材中夹杂物、晶粒尺寸、晶粒取向的控制方法。     

钼靶材变形量及热处理对薄膜微观组织及性能的影响

通过研究靶材变形量及热处理工艺对溅射薄膜的微观组织、表面粗糙度及晶形的影响,结果表明:变形量为80%的钼靶材溅射制备的薄膜晶化程度优于变形量小的靶材溅射薄膜;溅射相同的薄膜厚度,随着靶材变形量的增大,溅射薄膜的方阻越大;1 100℃退火靶材溅射薄膜的粗糙度最小,表面颗粒最细小均匀,晶粒取向明显。     

LCD溅射靶材用大尺寸钼板工艺、组织、织构与性能研究

进行了烧结、轧制工艺对比试验,研究了粉末粒度、形貌和烧结工艺对大型钼烧结板坯组织和性能的影响;轧制方式对LCD溅射靶材用大尺寸钼板微观组织、织构以及性能的影响,探讨了影响LCD溅射靶材用大尺寸钼板组织、织构及性能的主要因素。结果表明：制备大型烧结钼板坯可选用颗粒大小较为均匀、分布疏松、粗细搭配合理的中等粒度钼粉;相比普通钼板坯而言,通过延长保温时间,1900℃高温氢气中频烧结,可制备轧制大尺寸钼靶材用大型钼板坯;LCD溅射靶材用大尺寸钼板轧制总加工率需大于70％;采用1火次多道次单向轧制工艺,正常轧制的LCD溅射靶材用长条形钼板再结晶退火后可得到均匀细小的等轴晶粒组织;由于纵向开坯轧制阶段的不均匀变形（非正常轧制）,导致包覆横轧得到的LCD溅射靶材用宽幅矩形钼板再结晶退火后组织不均匀,细晶粒和粗大晶粒并存;单向正常轧制的LCD溅射靶材用长条形钼板再结晶退火后近表层无明显优先织构取向。纵向开坯轧制,然后用包覆换向横轧得到的LCD溅射靶材用宽幅钼板再结晶退火后近表层存在较强的{0,0,1}〈1,-1,0〉、{0,0,1}〈6,-1,0〉和{0,1,1}〈1,0,0〉织构。     

铝铜合金靶材的微观结构对溅射沉积性能的影响

磁控溅射中高沉积速率有利于获得高纯度薄膜,节省镀膜时间;高沉积效率的靶材可制备出更多数月的晶圆.通过建立平面靶的溅射模型研究了Al-Cu合金靶的品粒取向和品粒尺寸对溅射速率、沉积速率和沉积效率的影响.实验结果显示,溅射速率与靶材的原子密排度成正比关系,靶材的原子密排度受品粒取向和晶粒尺寸的影响,有特定的变化范围,因此溅射速率也只在一个范围内变化.沉积速率和沉积效率受靶材表面窄间内原子密排方向分布的影响,原子密排方向分布则由靶材的晶粒取向和晶粒尺寸决定.     

热处理温度对钼靶材微观组织和性能的影响

通过定量金相技术和显微硬度测试等方法,研究了热处理温度对钼溅射靶材的微观组织、硬度及I-U曲线的影响规律。研究结果表明,钼靶材晶粒尺寸随着热处理温度的升高而增大,而靶材硬度随之呈下降趋势。钼靶材在1200℃进行1 h热处理,晶粒尺寸分布最均匀。所研究钼靶材的I-U曲线均符合Thornton经验公式,热处理温度为1200℃的靶材具有最佳的磁控溅射放电性能。     

高纯铜溅射靶材的发展及现状

简要介绍了高纯铜溅射靶材目前的市场情况、现状、应用领域和未来高纯铜溅射靶材发展趋势；并对高纯铜溅射靶材的特性要求以及微观组织控制做了简单的阐述。     

钼及钼合金溅射靶材的研究现状与发展趋势

钼及钼合金具有熔点高、导电导热性好、热膨胀系数低、耐腐蚀性能好及环境友好等优点,利用钼及钼合金加工制备的溅射靶材已广泛应用于电子电器、太阳能电池及玻璃镀膜等领域。本文介绍了对钼及钼合金溅射靶材的基本要求及制备方法,系统综述了目前国内外对钼、钼钛、钼钠、钼铌合金靶材的研究现状,并对钼及钼合金溅射靶材未来的发展趋势进行了展望。     

高纯铜溅射靶材的发展及现状

溅射靶材主要应用于电子及信息产业，如集成电路、信息存储、液晶显示屏、激光存储器、电子控制器件等，也应用于玻璃镀膜领域和耐磨材料、高温耐蚀、高档装饰用品等行业.由于集成电路、信息存储及平面显示器等产业规模越来越大，这些高技术产业对各种超高纯金属及合金溅射靶材的需求也愈来愈多。本文简要介绍了高纯铜溅射靶材目前的市场情况、现状、应用领域和未来高纯铜溅射靶材发展趋势；并对高纯铜溅射靶材的特性要求以及微观组织控制做了简单的阐述。     

难熔金属溅射靶材的应用及制备技术

应用于微电子、集成电路、光伏电池、平面显示器、装饰镀膜玻璃等行业的溅射靶材需求量逐年增大,这些行业对溅射用难熔金属靶材的纯度、致密度、尺寸精度、微观组织、结晶取向等性能提出了更高的要求。综述了磁控溅射用W、Mo、Ta、Nb靶材的主要应用研发生产单位和制备技术,介绍了靶材组织、纯度等因素对薄膜性质的影响。     

钌金属溅射靶材烧结工艺研究

采用热压、放电等离子烧结及直接热压等粉末冶金工艺制备了钌金属溅射靶材,通过对致密度、晶粒度与氧含量分析研究了工艺过程对钌金属靶材制备的影响,并对比分析了三种方法制备钌靶的特点。结果表明:通过工艺优化利用三种方法均能制备出相对密度达到99%以上的高密度钌靶;随着制备温度的升高,钌靶氧含量降低,晶粒尺寸增大;热压工艺制备周期最长,钌靶表面有晶粒粗大层;放电等离子烧结与直接热压工艺都具有快速、近净成形的特点。     

THE CONTROL OF GRAIN SIZE IN THE MANUFACTURE OF SINTERED HARD-METAL

Abstract

In sintered hard-metals grain-size control is of exceptional importance because the basic properties of wear-resistance and strength are critically dependent upon it. In some applications a change in average grain size from 5·0 to 1·0 μm can increase wear-resistance by as much as twenty times, while the same change can halve the transverse rupture strength.

Each step in manufacture, from the chemical processing of the ore to the final sintering operation, can influence the final grain size. The factors operating at each stage are not yet completely understood. However, the most important processes of tungsten reduction and carburizing have been closely studied and these are chosen to control and monitor grain size during manufacture. The factors influencing grain size during these operations are discussed in some detail. The difficulty of relating powder-particle size and sintered-product grain size is mentioned. This is largely due to the weaknesses of conventional methods of measurement. Size changes in reduction, carburizing, and milling have been examined by metallographic means, and this has shown clearly the effect of aggregation and of polycrystalline particles in confusing the relationship between powder-particle size and sintered grain size.

The metallographic method of mounting products in copper has been especially informative with products with a grain size of > 1·5 μm, but optical limitations make the results less clear with a finer size. However, inferences drawn from this work have been largely confirmed by the scanning micrograph.     

石灰石晶粒度对石灰活性度的影响

石灰活性度与石灰石矿的晶粒度、焙烧温度和恒温时间密切相关,不同晶粒度的石灰石矿应采用不同的焙烧制度;石灰石矿中晶粒度大小均一,则活性度与熔烧参数呈线性关系,反之则有峰值出现。     

铁道车辆用LZW车轴钢晶粒度研究

研究了铝、钒、氮等微量元素对LZW车辆钢奥氏体晶粒度粒度的影响。研究结果明：为保证LZW车轴钢坯奥氏体晶粒度符合标准要求,应将钢中酸溶铝控制在适当含量范围,钢中加入微量钒可明显细化奥氏体晶粒,提高奥氏体晶粒粗化温度,转炉炼LZW车辆钢在高真空度下时间脱气处理对奥氏体晶粒度不利。     

Q235钢亚态再结晶模型的建立

在物理冶金基本模型基础上，通过实验数据进行回归，建立了Ｑ２３５普碳钢的亚态再结晶及晶粒长大模型，模型和实验所测结果相吻合，采用双道次进行压缩实验，条件为变形速率０．０１－０．１ｓ＾－１，变形温度９５－１１００℃，初始晶粒尺寸５６－８５μｍ。     

A STUDY OF THE FACTORS CONTROLLING GRAIN SIZE IN SINTERED HARD-METAL

Abstract

Previous experimental work concerning the grain growth observed during the sintering of tungsten carbide–cobalt alloys is reviewed. Particle-sizing methods suitable for the examination of hard-metal powders are described, and techniques for the evaluation of the carbide grain size in the sintered compacts are discussed.

By using a Model A Coulter Counter to examine the size distribution of the carbide grains (obtained from the milled hard-metal powders by dissolution of the cobalt with hydrochloric acid), and by counting techniques on electron photomicrographs of carbon replicas of the sintered compacts, it has been established that the increase in grain size during sintering is quantitatively related to the carbon content of the material after pre-heating. The results presented indicate that the cobalt content exerts little influence on the average grain size of the sintered structures A cobalt content >10% by weight is shown to exert a strong damping effect on the rate of comminution during milling.

The linear relationships between the specific surface area of the carbide grains in milled powders (obtained using a Perkin–Elmer Sorptometer) and the specific surface of the carbide phase in sintered compacts are given. The influence of sintering temperature and time on average grain size and contiguity in a commercial alloy is shown. Some preliminary work indicates that the morphologies of the initial carbide powders may be important factors with respect to the grain size of sintered hard-metal.     

溅射电流和时间对钼薄膜电学性能的影响

钼薄膜作为电极和布线材料在太阳能电池和薄膜晶体管的制造中具有重要应用价值。磁控溅射作为一种制备钼薄膜的主要手段,其溅射工艺对钼薄膜的性能有着重要的影响。本文通过改变溅射电流和时间制备了具有不同形貌的钼薄膜,并对其电学性能进行了比较,从而得到了较为适合的钼薄膜溅射工艺。     

二钼酸铵性能及还原工艺对钼粉粒度的影响

以3种不同二钼酸铵（ADM）做原料,采用氢气做还原剂的两段还原法制取钼粉,研究了在相同实验条件下,不同物理特性的ADM对钼粉粒度的影响及在原料相同情况下,还原温度、氢气流量、炉管气氛等工艺因素对钼粉粒度的影响。