合金元素对Sn-9Zn基无铅钎料润湿性和组织的影响

研究了分别添加混合轻稀土、磷和铋对Sn-9Zn共晶合金在铜基上的润湿性能及对钎料内部显微结构和钎料/铜界面的影响。研究结果表明:Bi、RE和P都能有效地改善Sn-9Zn基合金钎料在铜基上的润湿性;且添加RE和P对钎料/铜界面无明显的影响,也不改变Sn-9Zn钎料内部的扫把状共晶结构;而添加Bi促进了Sn-9Zn合金中锌的富集析出。     

添加微量稀土元素对Sn-Ag-Cu系无铅焊料性能的影响

以Sn-3．0Ag-0．5Cu（质量分数，％）焊料为母合金，探讨了微量稀土元素Ce、Er、Y和Sc对Sn—Ag—Cu合金物理性能、润湿性能以及力学性能的影响。试验结果表明：稀土元素对焊料的性能有不同的影响，添加微量Ce元素可以更好地改善焊料综合性能。     

Effect of Rare Earths on Solidification Microstructure and High Temperature Mechanical Property of Sn60-Pb40 Solder alloy

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Solidification Condition Effects on Microstructures and Creep Resistance of Sn-3.8Ag-0.7Cu Lead-Free Solder

Metallurgical, mechanical, and environmental factors all affect service reliability of lead-free solder joints and are under extensive study for preparation of the transition from Sn-Pb eutectic soldering to lead-free soldering in the electronic industry. However, there is a general lack of understanding about the effects of solidification conditions on the microstructures and mechanical behavior of lead-free solder alloys, particularly on the long-term reliability. This study attempts to examine the creep resistance of the Sn-Ag-Cu eutectic alloy (Sn-3.8Ag-0.7Cu, SAC387) with a variety of solidification conditions with cooling rates ranging from 0.3 °C/s to 17 °C/s. Results indicate that solidification conditions have a major influence on the creep resistance of SAC387 alloy; up to two orders of magnitude change in the steady-state creep rates were observed at low stress levels. An understanding of the mechanical property change with microstructures, which are determined by the solidification conditions, should shed some light on the fundamental deformation and fracture mechanisms of lead-free solder alloys and can provide valuable information for long-term reliability assessment of lead-free solder interconnections. This article is based on a presentation made in the symposium entitled “Solidification Modeling and Microstructure Formation: in Honor of Prof. John Hunt,” which occurred March 13–15, 2006 during the TMS Spring Meeting in San Antonio, Texas, under the auspices of the TMS Materials Processing and Manufacturing Division, Solidification Committee.     

Effect of erbium on microstructures and properties of Mg-Al intermetallic

The effect of the rare earth element Er on the microstructures and properties of Mg-Al intermetallic were studied in this experiment. Metallographic and X-ray diffraction（XRD） results showed that the microstructures of Mg-Al-Er alloys varied with Er content. The Mg-44Al-0.5Er and Mg-43.8Al-1.0Er alloys were both composed of Mg17Al12 matrix and Al3 Er phase, whereas Mg-43Al-3.0Er and Mg-42Al-5.0Er were composed of Mg17Al12 matrix, Al3 Er phase, and Mg-Mg17Al12 eutectic. The Mg-42Al-5.0Er alloy showed the highest microhardness, and the values remained nearly stable as Er content increased from 1.0 wt.% to 5.0 wt.%. The dispersed second phase Al3 Er caused the grain refinement of the Mg-Al-Er alloy, which was the main reason for the improvement in microhardness. The corrosion resistance of the Er-containing alloys initially increased and then decreased with increasing Er content. All the Er-containing alloys had the ability to suppress hydrogen evolution, which was the main reason for the higher corrosion resistance of the modified alloys than that of the Mg-44.3Al alloy. Considering the higher hardness and dispersity of the Al3 Er phase, Mg-43.8Al-1.0Er exhibited higher wear resistance than the as-cast Mg-44.3Al alloy.     

Effects of Cu,Bi, and In on microstructure and tensile properties of Sn-Ag-X(Cu,Bi, In) solders

Effects of minor additions of Cu, Bi, and In on microstructure, melting temperature, and tensile properties of Sn-Ag-based lead-free solders were investigated. It was found that the intermetallic compounds (IMCs) Ag₂In and Cu₆Sn₅ are formed in In- and Cu-containing solders, respectively. At low concentration, Bi dissolved in the Sn matrix and tended to precipitate pure Bi particles at the solubility limit of 4 wt pct Bi. The formation of large Ag₃Sn precipitates from the solder matrix was suppressed when alloying bismuth into the Sn-Ag alloy. The Bi addition resulted in a significant linear increase of the ultimate tensile strength (UTS) of solders, which is attributed to a solid-solution hardening mechanism. Solder strengthening due to In and Cu is less pronounced and attributed to a dispersion strengthening mechanism. The additions of Cu, Bi, and In all depressed the melting temperatures of Sn-Ag-based solders; however, In is the most effective one.     

Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments

Effect of small addition of rare earth on Sn-Ag-Cu solder was investigated by finite element method based on creep model of low stress and high stress and experiments respectively. It was found that addition of rare earths evidently improved the resistance to creep deformation of the solder, so that the reliability of Sn-Ag-Cu-Ce solder joint could be improved remarkably. Mechanical testing and microstructural analysis results showed that, mechanical properties of alloys bearing Ce were better than that of the original alloy, and the optimum content of Ce was about 0.03wt.%. After aging intermetallic compound between solder joint and Cu substrate was observed and analyzed by X-ray diffraction (XRD), scanning electron micrographs (SEM) and energy dispersive X-ray fluorescence spectrometer (EDX). Results showed that the thickness of intermetallic compound layer would became thinner when the addition of Ce was about 0.03wt.%, and the grains of intermetallic compound became finer, and the microstructure was more homogeneous than that in the original Sn-Ag-Cu/Cu interface.     

Effect of erbium on properties and microstructure of Al-Si eutectic alloy

Eutectic Al-12.6 wt.%Si alloys with various contents of the rare earth dement Er were prepared by the conventional casting technique.The effect of Er on the microstructure and properties of the eutectic Al-Si alloys was investigated using optical microscopy,scanning electron microscopy as well as the friction and wear tests.It was found that the addition of Er obviously improved the anti-wear properties,and reduced the friction coefficient of the alloys.The appropriate addition of Er would change the size and shape of the eutectic silicon,and thereby refine the microstructure of the Al-Si alloys.The refinement mechanism was also discussed.     

Effect of Microalloying on Wettability, Oxidation and Solidification Morphology of Sn-9Zn Alloy

EutecticorcloseneareutecticSn Pballoysare extensivelyusedinelectronicinterconnectionand packagingbecauseoftheirlowmeltingtemperatures, excellentwettabilitytocoppersubstratesandlow cost.Existingproductionlinesaredesignedonbasis ofSn Pbsolders.Withtheaccele…     

建筑用钎焊接头组织与力学性能的研究

采用OM、XRD、SEM和拉力试验机,研究了钎焊工艺参数对SnAg0.5CuZn0.1Ni/Cu无铅微焊点界面金属间化合物(IMC)和力学性能的影响。结果表明:添加0.1%Ni(质量分数)能显著细化SnAg0.5CuZn钎料合金的初生β-Sn相和共晶组织;钎焊温度为270℃、钎焊时间为240 s时,钎焊接头的剪切强度达到最大值47 MPa。     

微量Ga元素对低银系无铅钎料抗氧化性能的影响

电子封装波峰焊从有铅到无铅的转换过程中,由于无铅钎料中锡含量比传统Sn37Pb钎料高,导致波峰焊过程中氧化渣的产生量很大。其不仅造成生产中的浪费,还会影响焊接质量。控制钎料氧化渣的产生量是当前无铅波峰焊技术必须要解决的一个重要问题。研究了目前常用的Sn-0.3Ag-0.7Cu无铅钎料在模拟波峰炉中的抗氧化情况。主要研究了微量Ga元素的加入对该钎料抗氧化性的影响。通过钎料的润湿实验和氧化锡渣的产出量的比较可以发现微量Ga元素的加入可以提高钎料的抗氧化性能,Ga元素的最佳含量是0.02%(质量分数),Sn-0.3Ag-0.7Cu-0.020Ga的抗氧化有效温度范围是320℃以下,有效时间控制在120 min以下。利用俄歇能谱AES分析表明,微量元素Ga在焊料表面富集,O原子浓度的降低。热力学分析表明:Ga元素会在合金中优先氧化,阻碍钎料的进一步氧化;动力学分析表明:在保护膜内高价Ga离子使表面层离子排列空位增加并使电导率降低,是产生抗氧化性的原因。     

合金元素Cr,Al对Sn-Ag-Cu基无铅钎料高温抗氧化和润湿性的影响

研究了少量合金元素Cr，Al对Sn-3．0Ag-0．5Cu（305）无铅钎料高温抗氧化性的影响。钎料在液态下的表面颜色变化以及热重分析表明，Cr，Al能明显改善305合金钎料的抗氧化性能。通过合金元素Cr，AI的抗氧化机制和X射线衍射分析得出：Al和Cr在钎料表面形成致密氧化膜，形成“阻挡层”，抑制了钎料的氧化。同时也比较了合金元素Cr，Al对305钎料润湿性能的影响，结果表明：单独加Al不利于钎料的铺展，少量的Cr和Al同时加入对钎料的铺展没有太大的影响。实验证实：Cr和Al的共同作用明显提高了Sn-3．0Ag-0．5Cu钎料的高温抗氧化性，同时对钎料的润湿性也没有恶化作用。     

Directional solidification in a AgCuSn eutectic alloy

An experimental study of microstructures in a directionally solidified, near-eutectic Ag-Cu-Sn alloy has been completed. This material is an important candidate for use as a lead-free solder, and the studies show the origin and velocity dependence of some of the microstructures seen in solder joints. Quantitative stereology and microstructural observation were completed for directional solidification experiments where the sample was moved through a gradient furnace at velocities between 0.826 and 500 μm/s.     

Effect of Lanthanum on Driving Force for Cu6Sn5 Growth and Improvement of Solder Joint Reliability

By means of adding low content of rare earth element La into Sn6(bPb40 solder alloy, the growth of Cu6Sn5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu6Sn5 growth is lowered by adding small content of La in Sn60-Pb40 solder alloy. Meanwhile, there is aneffective local mole fraction range of La, in which, 0.18% is the limited value and 0.08% is the best value.     

Microstructure and mechanical properties of A356 alloy with yttrium addition processed by hot extrusion

The effects of the rare earth element yttrium(Y) and hot extrusion on the microstructure and mechanical properties of A356 alloy were investigated by mechanical properties testing and microstructure observation. The results indicate that the addition of Y improves the microstructure of the as-cast alloy. The distribution of primary α-Al is uniform and orderly. The long needle-like eutectic Si phases and β-Fe phases turn to strips and short rods. When the content of Y increases to 0.2 wt%, the mean diameter of aAl(40.3 μm) and the aspect ratio of the eutectic Si phase(2.3) reach the minimum values, which are68.9% and 86.1% lower, respectively, than that of the alloy without Y addition. Under extrusion stress, the shape of the eutectic Si phase is changed from long rod-like to near grain-like after solution treatment.The size of the eutectic Si phase is significantly reduced. The needle-like β-Fe phases are squeezed and broken. The mechanical properties of the as-extruded alloy are significantly improved compared to the as-cast alloy. When the rare earth content is 0.2 wt%, the ultimate tensile strength, hardness and elongation of the alloy reach the maximum values, which are 328.2 MPa, 110.4 HV and 21.3%, respectively, and increase by 42.01%, 37.71% and 481.91%, respectively, in comparison to the as-cast alloy without Y addition.     

Effects of cerium and phosphorus on microstructures and properties of hypereutectic AI-21% Si alloy

The influences of P and rare earth (RE) complex modifier on the microstructure and mechanical properties of hypereutectic Al-21%Si alloy were studied. The ingots were made by metal mold casting and the proportion of Ce+P ingredient was different. The result showed that the size of grains could be refined obviously by the Ce+P modifier and the effect of phosphorus was more intensive. The primary silicon crystal was refined, while the needle-like eutectic silicon was turned fibrous or short. The alloy mechanical properties had the best performance when 0.08%P and 0.6%Ce were added. The modification of primary silicon grains mainly depended on the heterogeneous nucleation mechanism, and the metamorphic mechanism of eutectic silicon was explained by adsorbing-twinning theory. The strengthening mechanism of experimental alloy was also discussed. The σb, 20 ℃ increases from 236.2 to 287.6 MPa and σb , 300 ℃ increases from 142.5 to 210 MPa.     

Effects of Indium Content on Microstructural,Mechanical Properties and Melting Temperature of SAC305 Solder Alloys

The present study investigated the effects of indium (In) addition on the microstructure, mechanical properties, and melting temperature of SAC305 solder alloys. The indium formed IMC phases of Ag₃(Sn,In) and Cu₆(Sn,In)₅ in the Sn-rich matrix that increased the ultimate tensile strength (UTS) and the hardness while the ductility (% EL) decreased for all In containing solder alloys. The UTS and hardness values increased from 29.21 to 33.84 MPa and from 13.91 to 17.33 HV. Principally, the In-containing solder alloys had higher UTS and hardness than the In-free solder alloy due to the strengthening effect of solid solution and secondary phase dispersion. The eutectic melting point decreased from 223.0°C for the SAC305 solder alloy to 219.5°C for the SAC305 alloy with 2.0 wt% In. The addition of In had little effect on the solidus temperatures. In contrast, the liquidus temperature decreased with increasing In content. The optimum concentration of 2.0 wt % In improved the microstructure, UTS, hardness, and eutectic temperature of the SAC305 solder alloys.     

Solidification of Sn-0.7Cu-0.15Zn Solder: In Situ Observation

High resolution time-resolved X-ray imaging with synchrotron radiation was used for in situ observation of four distinct events during solidification of a Sn-0.7Cu-0.15Zn solder despite small composition and density differences. These included βSn dendrite growth, Sn-Cu₆Sn₅ univariant eutectic growth, microporosity formation, and a polyphase reaction in the last stages of freezing. The development of microstructure was described quantitatively by tracking the loci of dendrite tips during grain growth. The results have implications for microstructure control and the understanding of structure–property relationships in Sn-Cu-Zn lead-free solders.     

超磁致伸缩材料的研究新进展

近年来,稀土超磁致伸缩TbDyFe材料的研究进展迅速,既有新的研究方向如材料力学性能、合金的凝固过程、磁畴取向的分布、组分处于准同型相界的合金的性能等,也有传统的如热处理时施加高磁场及应力处理、新热处理方法等方面。此外,科研人员不断开发出新的稀土超磁致伸缩材料合金体系,即不同元素对TbDyFe体系的部分取代与添加,主要有Pr、Nd、Sm、Gd、Ho和Er等稀土元素及第八族的Co元素。