共查询到19条相似文献,搜索用时 78 毫秒
1.
2.
3.
4.
5.
6.
7.
8.
石墨/环氧树脂导电胶的研究 总被引:2,自引:1,他引:1
研究了以石墨、环氧树脂、三乙醇胺及其它添加剂组成的导电胶体系。分别以鳞片石墨、还原石墨、鳞片石墨/铝粉作导电介质制备石墨导电胶。通过多种分析手段对三种石墨导电胶的导电性能、力学性能和热学性能等进行了考察三种石墨导电胶的性能参数为:当w(石墨)=35份时,鳞片石墨导电胶鳞片石墨/铝粉导电胶和还原石墨导电胶的体积电阻率分别为0.05690.48830.2794Ω·cm,剪切强度分别为6.211.19.3MPa,热失重速率分别为-8.7-4.7-7%/min[当w(石墨)=30份、升温速率为8℃/min时]。石墨导电胶具有良好的工业应用前景。 相似文献
9.
10.
11.
12.
抗静电环氧树脂胶粘剂的制备与性能研究 总被引:1,自引:1,他引:0
以导电碳黑和银粉为导电填料制备了抗静电环氧树脂(EP)胶粘剂,考察了导电填料的种类和用量对胶粘剂导电性能和力学性能的影响。研究结果表明,导电填料的种类对胶粘剂导电性能和力学性能的影响显著不同;以导电碳黑作为导电填料时,当w(导电碳黑)=5.0%时EP胶粘剂开始具备抗静电能力,当w(导电碳黑)≈7.1%时胶粘剂的体积电阻率发生突跃式下降;而以银粉作为导电填料时,当w(银粉)=0~38%时EP胶粘剂不具备抗静电能力。EP胶粘剂的拉伸强度和剪切强度随着导电碳黑用量的增加呈线性下降的趋势,而随着银粉用量的增加则呈线性上升的趋势。 相似文献
13.
综述了导热胶粘剂的导热机理、导热模型以及提高胶粘剂导热性能的途径;详细介绍了非绝缘导热胶粘剂和绝缘导热胶粘剂的技术研究与应用,最后对导热胶粘剂的发展前景作了展望。 相似文献
14.
还原纳米石墨/聚氨酯导电胶的制备与性能研究 总被引:6,自引:4,他引:2
利用异氰酸酯与多元醇在不同的反应条件下制取三种性能不同的聚氨酯(PU)预聚体(PUⅠ、PUⅡ和PUⅢ),然后分别与还原纳米石墨(RNG)、三羟甲基丙烷(TMP)混合制备三种RNG/PU导电胶(RNG/PUⅠ、RNG/PUⅡ和RNG/PUⅢ)。运用多种检测手段对导电胶的导电性能、力学性能和热稳定性能进行了分析。结果表明:随着RNG质量分数的增加,三种导电胶的导电性能均增强,其导电逾渗阀值分别为10.0%、16.7%和20.0%;导电胶的拉伸剪切强度随RNG质量分数的增加呈先升后降的趋势,当w(RNG)=20%时导电胶的拉伸剪切强度为1.37~4.40MPa;RNG的加入使导电胶的热稳定性能明显提高。 相似文献
15.
Electrically conductive adhesives (ECAs) have been explored as a tin/lead (Sn/Pb) solder alternative for attaching encapsulated surface mount components on rigid and flexible printed circuits. However, limited practical use of conductive adhesives in surface mount applications is found because of the limitations and concerns of current commercial ECAs. One critical limitation is the significant increase of joint resistance with Sn/Pb finished components under 85°C/85% relative humidity (RH) aging. Conductive adhesives with stable joint resistance are especially desirable. In this study, a novel conductive adhesive system that is based on epoxy resins has been developed. Conductive adhesives from this system show very stable joint resistance with Sn/Pb‐finished components during 85°C/85% RH aging. One ECA selected from this system has been tested here and compared with two popular commercial surface mount conductive adhesives. ECA properties studied included cure profile, glass transition temperature (Tg), bulk resistivity, moisture absorption, die shear adhesion strength, and shift of joint resistance with Sn/Pb metallization under 85°C/85% RH aging. It was found that, compared to the commercial conductive adhesives, our in‐house conductive adhesive had higher Tg, comparable bulk resistivity, lower moisture absorption, comparable adhesion strength, and most importantly, much more stable joint resistance. Therefore, this conductive adhesive system should have better performance for surface mount applications than current commercial surface mount conductive adhesives. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 399–406, 1999 相似文献
16.
17.
简要介绍了一种高导电率导电胶的研制方法,论述了导电促进剂对性能的影响。实验结果证明,此国产导电胶性能良好,完全可以替代进口导电胶应用于石英晶体谐振器生产中。 相似文献
18.
19.
Amit Kumar Singh Bishnu Prasad Panda Smita Mohanty Sanjay Kumar Nayak Manoj Kumar Gupta 《Polymer-Plastics Technology and Engineering》2018,57(9):903-934
The development of new polymer-based conductive adhesives with specific performances and improved conductivity are increasingly critical for thermally interface material (TIM). Epoxy resins have been widely used as a common interface material for conductive adhesives due to its well-known ability to accept wide range of fillers possibly derived from carbon, metallic or ceramic sources. These conductive fillers with high inherent thermal conductivity, together with a possibility to characterize and manipulate the system, leads to the production of thermally conductive adhesives with higher knowledge content for a number of electronics applications. 相似文献