碳纳米管-膨胀石墨/环氧树脂复合材料的导热性能

在环氧树脂中添加多壁碳纳米管和膨胀石墨作为填料,以提高环氧树脂的导热性能. 结果表明,添加0.5wt%多壁碳纳米管时,环氧树脂的最佳导热系数为0.3448 W/(m?K),比不添加时提高30%;添加0.75wt%羧基改性多壁碳纳米管时,环氧树脂的最佳导热系数为0.3813 W/(m?K),比添不加时提高40%;同时添加多壁碳纳米管和膨胀石墨后,环氧树脂导热系数可进一步提高到0.4039 W/(m?K),表明在环氧树脂中添加混合填料,二者可在环氧树脂中形成有效的导热网络,能进一步提高聚合物的导热性能.     

氰酸酯/环氧树脂/碳纳米管复合材料的制备与性能研究

采用熔融浇铸法制备了氰酸酯/环氧树脂/多壁碳纳米管(MWCNTs)复合材料,通过导热系数测试、热重分析(TG)、扫描电子显微镜(SEM)对复合材料进行了分析和表征。结果表明:加入MWCNTs可以有效提高复合材料的导热性能,其中MWCNTs用量为3%的复合材料导热系数为0.35 W/(m·K),比纯树脂材料的导热系数提高了30%;MWCNTs的加入能够提高氰酸酯基复合材料的断裂韧性。     

高导热苯乙烯丙烯酸树脂复合材料制备及导热性能

苯乙烯丙烯酸树脂为墨粉主要组分,其导热性能提升可显著提高墨粉导热性能,进而延长打印、复印机使用寿命。通过在苯乙烯丙烯酸树脂中添加碳纳米管、石墨烯高导热单一或复合填料,在苯乙烯丙烯酸树脂构建连通导热网络以提高其导热性能。当苯乙烯丙烯酸树脂中添加0.75wt%多壁碳纳米管时,其导热系数可提高至0.1644 W/(m?K),增幅为31.31%;添加1.0wt%羧基改性多壁碳纳米管时,苯乙烯丙烯酸树脂导热系数可提高至0.1751 W/(m?K),增幅为39.86%;在苯乙烯丙烯酸树脂添加多壁羧基改性碳纳米管和石墨烯混合填料时,苯乙烯丙烯酸树脂导热系数可提升至0.2093 W/(m?K),增幅达到67.17%。表明碳纳米管和石墨烯混合填料可在苯乙烯丙烯酸树脂中形成有效的导热网络,从而显著提高苯乙烯丙烯酸树脂导热性能。     

氮化硼/蚕丝导热复合材料的制备及其性能研究

针对传统导热材料基体难以自然降解的问题,选择更加环保的蚕丝蛋白为基体材料,采用球磨共混-热压成型制备了氮化硼/蚕丝蛋白导热复合材料,考察了复合材料的形貌结构和导热性能。结果表明,氮化硼在复合材料中沿水平方向分布,导致复合材料表现出明显的导热各向异性。复合材料的导热系数随着氮化硼质量分数的增加而提高。当氮化硼质量分数为50%时,复合材料的水平方向导热系数为12.42 W/(m·K),垂直方向导热系数为0.41 W/(m·K)。红外热成像结果表明,氮化硼/蚕丝蛋白复合材料具有优异的传热性能。     

碳纤维的表面改性对导热顺丁橡胶性能的影响

研究了碳纤维的表面改性方法对碳纤维/顺丁橡胶(BR)复合材料的硫化特性、门尼粘度、导热性能和力学性能的影响.实验结果表明,碳纤维/顺丁橡胶复合材料与顺丁橡胶空白样相比,其硫化速度、导热系数与力学性能都有明显的提高.而碳纤维的表面改性对碳纤维/顺丁橡胶复合材料的硫化特性数据、门尼粘度和导热系数影响并不明显,加入碳纤维后的未改性的碳纤维/顺丁橡胶复合材料的导热性能最佳,其导热系数为0.527 W/(m·K),为顺丁橡胶空白样的1.7倍;经过高温氧化后碳纤维填充复合材料力学性能有所提高,其拉伸强度为2.39 MPa.     

高导热沥青基碳纤维/环氧树脂复合材料的制备及导热性能研究

利用液相浸渍/排布-铺层-热压制备工艺制备了高导热沥青基碳纤维/环氧树脂复合材料。研究了沥青基碳纤维种类、碳纤维排布方向、温度变化对碳纤维/环氧复合材料导热性能的影响。结果表明,制备的山西煤化所沥青基碳纤维/环氧复合材料的导热系数达到了322 W/(m·K),远高于常规碳纤维复合材料的导热系数。另外,碳纤维复合材料纤维轴向的导热系数远远高于垂直于纤维轴向的导热系数。温度对碳纤维复合材料也有一定的影响。研究结果将为碳纤维复合材料的制备和应用提供借鉴。     

导热尼龙66复合材料的制备与性能研究

用共混挤出法制备导热尼龙(PA)66复合材料,研究了导热填料种类、含量及与玻璃纤维复配对复合材料导热系数的影响。结果表明,在选用的3种导热填料中以Al填充PA66的效果最好;当复合材料中填料粒子用量达到一定含量时,填料之间形成特殊的导热通路,提高复合材料的导热性能;随着填料含量的增加,复合材料的导热性能上升,当Al含量为45%时,复合材料的导热系数为0.778 W/(m·K);玻璃纤维与导热填料的共同作用使体系导热系数有一定提高。     

碳纳米管/氮化硼导热硅脂的制备及其导热性能研究

以甲基硅油为基础油、无水乙醇为分散剂、BN(氮化硼)或CNTs(多壁碳纳米管)/BN混杂物为导热填料,制备BN导热硅脂和CNTs/BN复合导热硅脂。研究结果表明:当w(BN)=50%和w(CNTs)=2%(相对于BN导热硅脂总质量而言)时,复合导热硅脂的热导率[为0.699 4 W/(m·K)]比BN导热硅脂提高了14.3%,体积电阻率为5.11×1011Ω·cm、接触电阻为88.6μΩ,说明CNTs/BN的协同作用,使复合导热硅脂既具有良好的导热性能,又具有优良的绝缘性能;采用修正的Burggeman非对称模型对复合导热硅脂的上述性能进行预测,所得实测值与理论值基本相符。     

PEEK高强耐磨复合材料的制备与性能

采用微型注塑机制备了聚醚醚酮/玻璃纤维/碳纳米管(PEEK/GF/CNTs)复合材料,对PEEK/GF/CNTs复合材料的力学性能、导热性能、摩擦性能进行了研究。结果表明:室温(25℃)下,GF的加入使PEEK材料的拉伸强度提高了43.37%;随着温度的升高,PEEK及其复合材料的拉伸强度逐渐下降;随着CNTs用量的增加,PEEK/GF/CNTs复合材料的拉伸强度呈先增大后减小的趋势;在1 000N的载荷下,PEEK/GF/CNTs复合材料的耐摩擦性能最佳;CNTs的加入提高了PEEK材料的耐热性能;当CNTs质量分数为8%时,PEEK/GF/CNTs复合材料拉伸强度为168.64 MPa,导热系数为0.416 2 W/(m·K),结晶度为16.18%,综合性能最佳。     

高密度聚乙烯/石墨/碳纤维导热复合材料性能的研究

采用高密度聚乙烯(HDPE)、石墨、碳纤维制备高导热、高强度的复合材料。通过SEM照片考察高密度聚乙烯/石墨/碳纤维复合体系的微观结构;研究石墨及碳纤维的加入是否可以形成导热通道以及随着石墨的添加量的提高,复合材料的导热性能及其力学性能的变化。结果表明:当石墨的质量分数为60%,碳纤维的质量分数为5%时,复合材料的导热系数达到7.938 W/(m.K),是纯HDPE的20倍。     

A comparative study on the influences of whisker and conventional carbon nanotubes on the electrical and thermal conductivity of polyether ether ketone composites

In this study, the electrical and thermal conductivity of polyether ether ketone (PEEK)/carbon nanotubes (CNTs) with different types, namely whisker CNTs (Wh-CNTs) and conventional CNTs were compared. PEEK/CNTs composites were melt mixed in PEEK via two screw extrusion technology. Moreover, the effects of different methods for mixing of PEEK/Wh-CNTs, namely, dry mixing, wet mixing and melt mixing, were compared. The electrical and thermal properties were analyzed. A high thermal conductivity value of about 0.741 W/(m K) could be obtained upon loading with 10 wt% Wh-CNTs and the PEEK/Wh-CNTs composites had low volume resistivity value of 10.96 Ω cm at 10 wt% loading via melt mixing. Thermal conductivity values of 1.066 W/(m K) (out-of-plane) and 1.50 W/(m K) (in-plane) were achieved with 10 wt% loading by wet mixing. Experimental results of out-of-plane thermal conductivity were more consistent with the Nan model. PEEK/Wh-CNTs composites prepared by wet mixing exhibited higher thermal conductivity than the composites mixed using the two other methods. As the content of Wh-CNTs in wet mixed PEEK/Wh-CNTs nanocomposites increased, electromagnetic interference (EMI) shielding effectiveness (SE) was improved. The PEEK/Wh-CNTs composites were 0.6 mm thick and showed an EMI SE of 21.5 dB.     

EP/GNs/MWCNTs复合材料的导热性能

以多壁碳纳米管(MWCNTs)和石墨烯纳米微片(GNs)为导热填料,环氧树脂(EP)为基体采用溶剂和超声分散法,制备了EP/GNs/MWCNTs导热复合材料,并与EP/MWCNTs及EP/GNs复合材料的导热性能进行了对比。采用透射电子显微镜观察其微观结构,采用Hot Disk热导率测试仪测试其导热性能,采用差示扫描量热法和热重分析仪测试其耐热性及热稳定性。结果表明,MWCNTs和GNs共同作为EP导热填料时,相比于单组分填料(MWCNTs或GNs)更易形成导热网络;EP的热导率、玻璃化转变温度(Tg)和热分解温度均随着MWCNTs或GNs含量的增加而提高,其中,GNs更有利于提高EP的热导率和热分解温度,MWCNTs更有利于提高EP的Tg。在相同的导热填料含量下,相对于其中的任一单一填料,MWCNTs/GNs共同作用时,对热导率的提高有更显著的效果,且随着其中GNs比例的增加,热导率逐渐增大。当GNs和MWCNTs的体积分数分别为0.6%和0.4%时,EP/GNs/MWCNTs复合材料的热导率、Tg和起始分解温度分别为0.565 W/(m·K),152℃和316℃,分别比纯EP提高了132.5%,34.5%和8.2%。     

线形低密度聚乙烯/碳纤维复合材料的热导率

用模压方式制备了线形低密度聚乙烯(PE-LLD)/CF(CF)复合材料,研究了CF表面偶联剂处理、分散方式及含量对复合材料热导率的影响。结果表明,用偶联剂处理过的CF填充PE-LLD复合材料热导率提高。用超声分散法制备的试样热导率优于球磨混合法和熔融混炼法制备的试样。随着CF含量的增加,PE-LLD/CF复合材料热导率提高,同时保持了良好的力学性能。当CF含量为10 %（质量分数,下同）时,用超声分散法制备的复合材料热导率达1.4 W/(m·K),是纯PE-LLD的6倍多。     

Effect of heat transfer channels on thermal conductivity of silicon carbide composites reinforced with pitch-based carbon fibers

In this study, silicon carbide (SiC) composites reinforced with pitch-based carbon fibers and composed of heat transfer channels were fabricated by combining chemical vapor infiltration and reactive melting infiltration method. It was observed that the internal heat conduction skeleton of pitch-based carbon fibers was sequentially formed. The thermal conductivities from room temperature to 500 °C along through-thickness direction and in-plane direction were investigated. The results showed that C_pf/SiC composites with heat transfer channels possessed excellent thermal conductvity in two directions, and the thermal conductivity increased with increasing volume content of heat transfer channels. The thermal conductivity in through-thickness direction reached 38.89 W/(m·K), and that for in-plane direction reached 112.42 W/(m·K). Theoretical calculations were empolyed to study the temperature dependence of the C_pf/SiC composites. The variations in slope A′ and intercept B′ values of fitted curves were in good agreement with the experimental results. To verify the reliablilty of the theoretical model, the C_pf/SiC composites were heated at 1650 °C for 2 h and the thermal conductivity exhibited further improvement due to the formation of more perfect crystalline structure. Thermal conductivity through thickness direction improved to 43.49 W/(m·K), and that in in-plane direction improved to 142.49 W/(m·K), which could be identified by the theoretical model. Finally, the leading edge model was established by using ABAQUS finite element analysis software to evaluate the potential application of the composites. Owing to the outstanding thermal conductivity, the leading edge obtained by using C_pf/SiC composites in this study exhibited lower temperature gradient and a more uniform temperature distribution. Moreover, less thermal stress and displacement were generated during heating process.     

Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero-structured GF/BN networks

Due to the rapid development of multifunctional and miniaturized electronic devices, the demand for polymer composites with mechanical properties, high-thermal conductivity, and dielectric properties is increasing. Therefore, the heat dissipation capacity of the composite must be improved. To solve this problem, we report a glass fabric (GF)/boron nitride (BN) network with a highly thermally conductive hetero-structured formed using polyvinyl alcohol (PVA) as an adhesive. The GF and BN are furtherly modified by (3-aminopropyl)triethoxysilane (APTES) for better thermal conductivity enhancement. When the BN content is 30%, the thermal diffusion coefficient and thermal conductivity of obtained PVA-mBN@mGF (PBG) are 2.843 mm²/s and 1.394 W/(m K), respectively. Epoxy (EP) resin is then introduced to prepare PBG/mBN/EP laminated composites via the hot pressing method as applied as thermal conductive composites. A highest thermal conductivity of 0.67 W/(m K) of PBG/mBN/EP laminated composites is obtained, three times higher than that of pure EP. In addition, the PBG/mBN/EP laminated composites also present favorable mechanical, electrically insulating, and dielectric properties.     

环氧树脂/碳纳米管导热复合材料的制备与性能研究

采用先酸化再空气氧化的方法对碳纳米管（CNTs）进行了纯化处理,并制备了2种环氧树脂(EP)/CNTs导热复合材料。研究了不同含量的CNTs及纯化CNTs对复合材料的导热性能、冲击性能及弯曲性能的影响。结果表明,纯化处理后,CNTs表面的催化剂粒子和无定形碳被去除,得到了纯净CNTs;当纯化CNTs含量为1.5 %时(质量分数,下同),材料的冲击强度和弯曲强度最高,分别为24.95 kJ/m2、127.2 MPa;当纯化CNTs含量为1.5 %时,复合材料的热导率可达1.237 W/（m·℃）。     

炭前驱体形态对C/C复合材料导热系数的影响

利用热塑性中间相沥青为黏结剂,短炭纤维.增强体,一步热压成型制备C/C导热复合材料.采用SEM和偏光显微镜观察等分析手段,研究了2∶1,2.5∶1和3∶1三种不同管径比对C/C复合材料的影响.结果表明:通过热压模具空腔结构的改变可以引起炭前驱体挤出形态的变化,使得轴向基体炭有序生长与短炭纤维增强体呈现有序排列,其中间相液晶分子垂直和平行于模压压力方向均排列成纤维状长程有序结构,短切纤维呈现出与压力平行方向排布.当空腔管径比为3:1,轴向导热系数由86.2 W/(m·K)增大至115.5 W/(m· K),各向异性比由1.6减小为1.2.由此所得块体C/C复合材料具有显著的二维取向结构,轴径向导热系数趋于平衡.     

Effect of N–Ni coordination bond on the electrical and thermal conductivity of epoxy resin/nickel-coated graphite

The agglomeration of nickel-coated graphite (NCG) in epoxy resin (EP) composites leads to low electrical conductivity of EP composites, which limits their development in electronic devices and multilayer circuits. In order to improve the electrical and thermal conductivity of NCG/EP composites, ethylenediamine (EDA) was used to modify NCG and compared with pure NCG-filled EP composites. It was found that the conductive effect of modified composites with 20 wt% filler is better than that of unmodified composites with 40 wt% filler. The results of Fourier transform infrared spectroscopy and thermogravimetric analysis of EDA-modified NCG (ENCG) showed that a coordination adsorption reaction occurred between EDA and NCG, forming N–Ni coordination bonds. When the filling amount of ENCG was 40 wt%, the conductivity and thermal conductivity of the composite are improved most significantly. The volume resistivity was reduced from 2.636 to 0.109 Ω cm, a decrease of 95.85%, and the thermal conductivity was improved from 0.517 to 0.968 W/(m K), an increase of 87.23%, respectively. Meanwhile, ENCG has better dispersion in the EP matrix than NCG.