生产条件对碱式碳酸铜产率影响的研究

以硝酸铜和碳酸钠为原料生产碱式碳酸铜,通过正交法考察和研究了硝酸铜和碳酸钠的浓度、反应温度、碳酸钠与硝酸铜的配比对碱式碳酸铜产率的影响。结果表明,硝酸铜浓度为0.45 mol/L,碳酸钠浓度为0.55 mol/L,反应温度为58℃,碳酸钠与硝酸铜的摩尔配比为1.5∶1,碱式碳酸铜的产率为94.29%。     

碱式碳酸镁生产的最佳工艺条件试验研究

以氯化镁和碳酸钠为原料,利用结晶法来生产碱式碳酸镁,通过正交法来设计和安排实验,分别研究了氯化镁和碳酸钠溶液浓度、反应温度、氯化镁和碳酸钠的物质的量配比对碱式碳酸镁产率的影响,探究了一条工艺简单、成本低廉的制备方法。实验结果表明:氯化镁浓度为1.25mol/L,碳酸钠浓度为1.20mol/L,反应温度为68℃,氯化镁与碳酸钠的配比为0.81,碱式碳酸镁的产率可达94.56%。     

工艺条件对碱式碳酸锌产率影响的试验研究

以硫酸锌和碳酸钠为原料生产碱式碳酸锌,为了获得产品的最佳生产工艺条件,选用正交法与单因素法进行试验,考察了生产条件硫酸锌浓度、碳酸钠浓度、反应温度、碳酸钠与硫酸锌的摩尔配比对产品产率的影响,试验结果表明:当硫酸锌溶液浓度为0.7 mol/L,碳酸钠溶液浓度为0.7 mol/L,料液温度为40℃,物料之间的配比为1.4时...     

不同粒度纳米碱式碳酸铜的制备

以五水硫酸铜和碳酸钠为原料,采用直接沉淀法研究了纳米碱式碳酸铜的制备,考察了反应温度、反应物的浓度对其粒径的影响。结果表明,当反应温度在45～75℃,反应浓度在1～2.5 mol/L时,可以制备出不同粒径的纳米碱式碳酸铜,其平均粒径范围为16～54 nm;纳米碱式碳酸铜的粒度随反应温度的升高而减小,随反应物浓度的增大而增大。     

混合碱缓冲溶液微型实验制备碱式碳酸铜

针对大学无机化学设计实验碱式碳酸铜的制备,存在实验条件不易控制、产率低、试剂用量大、缺少酸度对反应影响的讨论等不足,探索用碳酸钠和碳酸氢钠混合碱缓冲溶液代替碳酸钠溶液与硫酸铜溶液反应制备碱式碳酸铜,研究反应物配比、温度、酸度的影响,实验表明硫酸铜与混合碱缓冲溶液的物质的量比为1:1.4,温度在50~55℃,p H在8.5~9.0,原料取量为实验教材的三分之一,制得翠绿色产品,产率为90.34%,估算实验改进前后药品用量,表明改进后可节省药品60%以上。     

碱式碳酸铜制备实验条件探讨

用硫酸铜和碳酸钠反应制备碱式碳酸铜,通过设定反应物的不同摩尔比和不同温度,分别进行几组实验,最后确定在反应物摩尔比为1︰1.2,温度为55℃产率最高,且在反应进行过程中应该保持溶液的碱性,将硫酸铜慢慢加入碳酸钠中可以得到较好的产率。     

以鸡蛋壳为原料制备柠檬酸钙工艺研究

以鸡蛋壳为钙源,制备柠檬酸钙,考察了柠檬酸浓度、NaOH浓度、HCl浓度及反应温度对产品产率的影响。结果表明,最佳工艺条件为:柠檬酸浓度为1 mol/L,NaOH溶液浓度为1 mol/L,HCl溶液浓度为1.5 mol/L,反应温度为40℃,反应时间20 min,产品产率可达68.36%以上。     

食品补钙添加剂柠檬酸钙的合成工艺研究

本文研究以鸡蛋壳为原料,低温下与柠檬酸反应直接制备柠檬酸钙的生产工艺。通过考察盐酸的浓度,氢氧化钠的浓度,柠檬酸的浓度,反应温度和固液比对柠檬酸钙产率的影响,确定了制备食品补钙添加剂柠檬酸钙的最佳工艺条件。结果表明:反应温度50℃、盐酸浓度1.5 mol/L、Na OH溶液浓度1.0 mol/L、柠檬酸溶液浓度1.0 mol/L、固液比1:20,柠檬酸钙产率最高,可达到87.09%。     

自贡地下黄卤制备高纯柠檬酸钙的工艺研究

利用卤水制盐过程中产生的碳酸钙制备高纯柠檬酸钙可实现卤水净化废物的再利用，为企业带来更大的经济效益。通过单因素实验探讨碳酸钠浓度和用量对碳酸钙产率和纯度的影响，通过正交实验探讨柠檬酸浓度、用量和反应温度对柠檬酸钙产率和纯度的影响。制备柠檬酸钙的最佳工艺条件为：碳酸钠溶液的浓度为0.2 mol/L，碳酸钠用量为卤水中钙物质的量的100%，柠檬酸浓度为2 mol/L，柠檬酸用量以碳酸钙物质的量计过量5%，反应温度为65℃。红外光谱、X射线衍射谱图和扫描电镜分析确定了最佳工艺下制得的柠檬酸钙的形貌和结构特点，产品产率为92.68%±1.09%，纯度可达97.73%，铅、砷含量及干燥质量损失符合GB 1903.14—2016《食品安全国家标准食品营养强化剂柠檬酸钙》要求。     

碱式碳酸铜生产废液的综合利用方法

<正>碱式碳酸铜生产废液的综合利用方法,涉及工业废水的处理方法领域。本发明的目的在于提供一种碱式碳酸铜生产废液的综合利用方法,特别是对废液中的碳酸氢钠再利用的方法。所述碱式碳酸铜生产废液是指酸性氯化铜溶液或者酸性硫酸铜溶液与碳酸钠溶液反应制得碱式碳酸铜后的废液,     

Oxidation of the copper alloy with pure copper plating

The oxidation failure of a copper alloy lead frame with/without a copper plating layer was investigated. The oxidation rate and adhesion strength of oxide films on copper alloy substrates were studied by measuring the thickness and by carrying out peel tests. The adhesion strength of the oxide film was mainly influenced by the composition but not the thickness of the oxide film. The highest adhesion strength was obtained when the oxide film was composed mainly of Cu₂O. When the thickness of the copper preplated layer was over 0.165?μm, the Cu atoms of the preplated copper were available for oxidation. Thus the oxidation process was within the copper preplated layer, and the main product of the oxidation was Cu₂O. It was found that the large column grain of the oxide film on the copper alloy with a copper plated layer, favored the diffusion of copper or oxygen atoms that led to the formation of Cu₂O, and lead to higher adhesion strength. This indicated that the oxidation resistance of a copper alloy lead frame can be effectively improved by electroplating copper.     

Electrodeposition of copper on copper in the presence of dithiothreitol

Studies of the -SH group effect present in dithiothreitol (DTE) with respect to morphology and electrode kinetics of copper electrodeposits on the (1 1 1) plane of a copper single crystal and polycrystalline copper from highly purified solutions of acidified copper sulphate were made. At 2.0 and 5.0 mA cm^–2 there was a truncation of pyramids to layers and ridges and then to polycrystalline growth with an increase in the concentration of DTE in the bath. At higher current densities the change was from pyramids to thin hexagonal blocks, dragged pyramids and then to polycrystalline growth. Interestingly, the above morphological changes repeated at two different concentrations of DTE corresponding to two -SH groups present in the molecule. Levelling of the grains was observed at all current densities studied on a polycrystalline substrate. The electrode kinetic parameters have been correlated with the morphological changes and transport mechanisms have been proposed for different concentrations of the additive.     

A comparison of the rate of copper deposition at mercury,copper amalgam and copper metal

The rate of reduction of Cu²⁺ ions is slower on solid copper than on mercury. The reason probably lies the adsorption of Cu²⁺ ions on mercury.     

从含铜蚀刻废液中回收硫酸铜

采用酸性蚀刻液与碱性蚀刻液混合中和沉淀铜的方法生产硫酸铜。试验结果表明，最佳工艺条件为：中和反应pH=6～7，酸解反应每100g滤渣消耗95％(质量分数)硫酸30mL，硫酸铜产率为84％，纯度为96％。混合沉淀铜后滤液中仍含有大量的氯化铵和少量的二价铜离子，实验采用水合肼还原除铜，回收滤液用于配制新的蚀刻液。水合肼还原除铜工艺条件：pH为8，滤液与水合肼体积之比为100：3，二价铜离子的去除率达到96．8％。该工艺简单可行，操作方便，成本低，是一种处理印制电路板(PCB)企业蚀刻废水、回收铜的有效方法，有一定的应用价值。     

Aspects of the synthesis of copper hydride and supported copper hydride

The synthesis of copper hydride powder is described. The material is characterised by powder X-ray diffraction and transmission electron microscopy. The hydride was precipitated in the presence of, or mechanically mixed with, catalytically interesting supports (alumina, silica, ceria and zinc oxide) provided all operations are carried out under inert atmospheres. The supported hydride may be thermally decomposed at low temperatures to yield suitably sized copper particles directly on the support. This novel route is likely to lead to catalytically active materials. It is found that copper hydride is stable on non-basic supports but decomposes on contact with strongly basic surfaces.     

铜及铜合金着色

简述了铜及铜合金着色的原理.总结了铜及铜合金着黑色、褐色、绿色、蓝色的工艺配方及操作条件,介绍了手工点涂铜绿(铜锈)、双色点蚀(先着黑色再点蚀铜绿)、套色、着土黄铜绿色等多种特殊的着色工艺.     

Preparation of copper containing methacrylic polymers and their application for the copper patterns

Copper containing methacrylic polymers were prepared by the polymerization of a copper methacrylate complex (Cu[CH₂C(CH₃)COO](COD), where COD = 1,5-cyclooctadiene) with different methylmethacrylate and methacrylic acid compositions. These polymers were found to be soluble in many organic solvents including THF and chloroform. Copper nano-networks or aggregated nanoparticles were obtained when a THF solution of the polymers was reduced using an aqueous sodium borohydride solution. When a thin film of the polymers coated on a silicon wafer was irradiated with an electron beam, nanoparticles were produced on the irradiated area, while the non-irradiated areas could be washed away with a weak base developer, such as a tetramethylammoniumhydroxyde (TMAH) aqueous solution, to produce a copper pattern through an electron beam lithography process.     

Electrocatalytic oxidation of ethanol at copper bromide modified copper electrode in comparison to bare and copper chloride modified copper electrodes

Copper bromide modified copper electrode was prepared and used to electrocatalytic oxidation of ethanol. Scanning electron microscopy and energy dispersive x-ray experiments suggested the formation of thin layer of copper bromide on the copper surface. The j₀ for copper bromide modified copper and copper chloride modified copper electrodes are 9.8 and 5.7 folds respectively higher than for that of bare copper electrode. For copper bromide modified copper electrode, the charge transfer coefficient (α) and the number of electrons involved in the rate determining step (n_α) were calculated as 0.44 and 1 respectively.     

化学镀铜溶液中稳定剂与铜沉积速率的关系

研究了化学镀铜溶液中稳定剂对铜沉积速率的影响,着重考虑主配位剂、副反应的抑制剂、甲醛捕获剂对化学镀铜的影响。结果表明,在基本配方8 g/L CuSO4.5H2O,3 g/L HCHO2,8 g/L EDTA7,.5 g/L NaOH,工艺参数pH=12.5,温度50℃,时间40 min的基础上,各种稳定剂的适宜用量为6 mL/L CH3OH、8 mg/L K4Fe(CN)6、6 mg/L 22,’-bipy。在最佳工艺下得到的镀层外观红亮,表面平整,晶粒细致,化学镀铜液稳定。     

铜负载Y分子筛中Cu物种的表征及分析

综述了铜负载Y分子筛(CuY)中Cu物种表征及分析的研究进展, 重点阐述了近年来X射线衍射分析(XRD)、透射电子显微镜分析(TEM)、X射线光电子能谱分析(XPS)、H₂程序升温还原(H₂-TPR)、原位红外光谱(CO-IR和NO-IR)、电子顺磁共振(ESR)等表征方法在CuY中Cu物种的微观结构分析方面取得的进展。还对制备方法对CuY中Cu物种落位和性能的影响进行了综述, 指出综合采用这些表征方法, 得到CuY中Cu物种状态、价态、落位及含量等更加全面、准确的信息, 进而选择合适的制备方法调控CuY中Cu物种存在状态、价态及落位, 制备出性能更佳的CuY是今后发展的方向。