共查询到20条相似文献,搜索用时 62 毫秒
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采用曼尼希反应,将玉米芯木质素改性制备木质素胺(AL),然后与水性聚酰胺(PAE)、聚乙二醇二缩水甘油醚(PEGDE)混合,以豆粕粉为原料,通过AL/PAE/PEGDE改性制备高固体含量的豆粕基胶黏剂(豆胶)。对豆胶性能进行表征和测试,结果表明:复合改性豆胶固化后的红外谱图中酰胺Ⅰ带吸收峰由1632 cm^(-1)处蓝移至1640 cm^(-1),酰胺Ⅱ带吸收峰由1533 cm^(-1)蓝移至1538 cm^(-1),此现象说明固化豆胶中形成了结构致密相互交联的网状结构;热重分析结果也说明PAE、PEGDE、AL与蛋白质分子之间形成了结构更为致密的网络结构;流变行为分析显示固化豆胶具有假塑性流体的特征;改性豆胶含固体高达42.5%,而表观黏度仅为3746 mPa·s,具有较好的涂布性能,适于工业化应用;所得胶合板的胶合强度为0.86 MPa,合格率100%,符合国家Ⅱ类胶合板的标准要求(胶合强度≥0.70 MPa,合格率≥90%)。 相似文献
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将十二烷基(Dod)与十六烷基(Cet)以酯键方式分别引入经羧甲基化改性的香豆胶大分子骨架上,制备了基于香豆胶的疏水改性阴离子聚电解质衍生物(HmCmFG)。通过荧光探针芘的激发光谱、发射光谱以及紫外光谱研究了HmCmFG溶液中的疏水缔合行为,研究发现,此疏水缔合行为受到HmCmFG大分子上烷基链长与取代度以及溶液中小分子电解质NaCl的显著影响,增加烷基链长、提高烷基取代度或增大NaCl浓度均有利于溶液中疏水缔合微区的形成。采用黏度法研究了溶液中HmCmFG大分子与NaCl、表面活性剂十六烷基三甲基溴化铵(CTAB)及十二烷基硫酸钠(SDS)的相互作用。结果表明,Dod取代度小于5.7时,NaCl的加入以增强HmCmFG分子间缔合为主,溶液黏度增加,加入CTAB对于Dod取代度小于5.7时的溶液黏度值的影响高于SDS;Dod取代度为10.2或Cet取代度为6.3时,加入NaCl、CTAB或SDS后使HmCmFG分子内缔合占优势,溶液黏度降低。 相似文献
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阳离子香豆胶的合成及结构表征 总被引:1,自引:1,他引:1
以3-氯-2-羟丙基三甲基氯化铵(HAT)为阳离子醚化剂,天然香豆胶为原料,异丙醇为分散剂制得季铵盐型阳离子香豆胶。研究了HAT、催化剂NaOH、反应温度和反应时间对合成阳离子香豆胶(CFG)的影响,用凯氏定氮法测定了CFG的取代度。合成CFG的优化实验条件为:m(香豆胶)∶m(异丙醇)∶m(HAT)∶m(NaOH)=1∶(1.6~2)∶(0.15~0.3)(∶4~8),反应温度40~50℃,反应时间2~3 h,制得的产品能满足工业应用要求的黏度及取代度范围(500~800 mPa.s,DS=0.86~1.32)。用FTIR和13CNMR对CFG的结构进行了表征。 相似文献
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Doroteja Vnučec Andreja Kutnar Andreja Goršek 《Journal of Adhesion Science and Technology》2013,27(8):910-931
Over recent years, the interest in bio-adhesives, including soy-based adhesives, has increased rapidly. Among natural renewable resources suitable for industrial use, soy is a reasonable choice due to its high production volume and the small use of soy meal-based products for human food consumption. Soy flour can be an ideal raw material for the manufacturing of wood adhesives due to its low cost, high protein content and easy processing. There are also more concentrated forms of soy proteins, i.e. concentrates and isolates, which are also suitable raw materials for adhesive production except that their prices are higher. Extensive research has been carried out on improving the cohesive properties, especially water resistance, of soy-based adhesives. However, there is insufficient experimental data available for understanding the influences of modification methods on the structure of soy proteins and therefore for understanding the influences of structural changes on the adhesion. In this paper, some experimental techniques are proposed to be used for analysing soy-based adhesives to enable better understanding of those factors and improve future development. This review of soy-based adhesives is made with the focus on soy proteins’ chemical composition, soy protein product types (raw materials for adhesive production), modification methods for improving the adhesive properties of soy-based adhesives, and commercial soy-based adhesives. 相似文献
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In Yang Monlin Kuo Deland J. Myers 《Journal of the American Oil Chemists' Society》2006,83(3):231-237
Increased demand for wood adhesives, environmental concerns, and the uncertainty of continuing availability of petrochemicals
have led to recent attention on protein-based adhesives. This study was conducted to investigate the glue bond qualities of
soy-based phenolic adhesive resins for southern pine plywood. Two types of soy-based resins were formulated and tested. The
first was made by cross-linking soy flour with phenol-formaldehyde (pf) resins at neutral pH. The second type was obtained
by cross-linking soy flour hydrolyzates with pf resin under alkaline conditions. Plywood bonded with the neutral phenolic
soy resins containing 70% soy flour and 30% 1.6 g/cm2 pf without the use of extenders and fillers compared favorably with the traditional southern pine pf glue mixes. Plywood
bonded with alkaline phenolic soy resins, containing 40 or 50% 0.5 g/cm2 PF with the addition of extender (19% corn-cob powder), provided better adhesive glue bond properties than traditional southern
pine pf glue mixes. These results suggest that soy-based phenolic adhesive resins have potential for the production of exterior
southern pine plywood. 相似文献
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利用饲料级大豆粉为原料,通过水性聚酰胺和异氰酸酯对其进行协同复合改性制备出具有良好流变行为和固化性能的大豆胶黏剂。采用旋转流变仪研究了复合改性剂用量对大豆胶黏剂流变行为和固化性能的影响,结果表明:改性后的大豆胶黏剂属于假塑性流体,当水性聚酰胺添加量为10%时,所得大豆胶黏剂的流变性能较优,而异氰酸酯添加量对大豆胶黏剂的流变行为几乎没有影响;运用动态温度扫描模式研究大豆胶黏剂的黏弹性能,异氰酸酯添加量对大豆胶黏剂的储能模量和损耗模量影响较大。水性聚酰胺/异氰酸酯协同交联体系可与大豆蛋白分子间发生交联,当10%水性聚酰胺和4%异氰酸酯协同改性时,所得胶合板的胶合强度可达0.74 MPa,满足国家Ⅱ类胶合板使用要求(≥0.70 MPa)。 相似文献
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豆基蛋白质胶粘剂改性及应用研究 总被引:2,自引:1,他引:1
为了降低豆基蛋白质胶粘剂的黏度、提高胶合板的耐沸水胶接强度和满足工业化的生产要求,对传统豆基蛋白质胶粘剂进行改性,并通过胶粘剂的黏度、pH值、凝胶时间、耐沸水胶接强度以及热分析结果等确定了改性剂的合理用量。然后以热压温度、热压时间、热压压力和涂胶量作为试验因素,以胶接强度作为考核指标,采用正交试验法优选出制备胶合板用改性豆基蛋白质胶粘剂的较佳工艺条件。结果表明:改性剂的合理用量(质量分数)是40%;胶合板的较佳热压工艺参数是热压温度140℃,热压时间5 min,热压压力1.2 MPa,双面涂胶量310 g/m2;在此较佳热压工艺条件下制备的胶合板,其耐沸水胶接强度较理想(为1.12 MPa),并且满足Ⅰ类胶合板的标准要求。 相似文献
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Jane L. O’Dell Charles R. Frihart 《Journal of Adhesion Science and Technology》2013,27(18-19):2027-2042
We studied the high temperature performance of soy meal processed to different protein concentrations (flour, concentrate, and isolate), as well as formulated soy-based adhesives, and commercial nonsoy adhesives for comparison. No thermal transitions were seen in phenol-resorcinol-formaldehyde (PRF) or soy-phenol-formaldehyde (SoyPF) or in as-received soy flour adhesive during differential scanning calorimetry scans heating at 10?°C/min between 35 and 235?°C. Heat flow rates decreased in the order soy flour (as received)?>?SoyPF?>?PRF?>?emulsion polymer isocyanate (EPI). In thermogravimetric analysis (TGA) scans from 110 to 300?°C at 2?°C/min, total weight loss decreased in the order soy flour (as-received)>SoyPF?>?PRF?>?casein?>?maple?>?EPI. For bio-based materials, the total weight loss (TGA) decreased in the order soy flour (as-received) > concentrate, casein?>?isolate. Dynamic mechanical analysis from 35 to 235?°C at 5?°C/min of two veneers bonded by cured adhesive showed 30–40% decline in storage modulus for maple compared to 45–55% for the adhesive made from soy flour in water (Soy Flour) and 70–80% for a commercial poly(vinyl acetate) modified for heat resistance. DMA on glass fiber mats showed thermal softening temperatures increasing in the order Soy Flour?<?casein?<?isolate?<?concentrate. We suggest that the low molecular weight carbohydrates plasticize the flour product. When soy-based adhesives were tested in real bondlines in DMA and creep tests in shear, they showed less decrease in storage modulus than the glass fiber-supported specimens. This suggests that interaction with the wood substrate improved the heat resistance property of the adhesive. Average hot shear strengths (ASTM D7247) were 4.6 and 3.1?MPa for SoyPF and Soy Flour compared to 4.7 and 0.8?MPa for PRF and EPI and 4.7 for solid maple. As a whole, these data suggest that despite indications of heat sensitivity when tested neat, soy-based adhesives are likely to pass the heat resistance criterion required for structural adhesives. 相似文献
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Yaolin Zhang Xiang‐Ming Wang Romulo Casilla Paul Cooper Zeen Huang Xiaodong Wang 《应用聚合物科学杂志》2011,120(2):657-665
Nine structural adhesives with varying pH were selected to examine the effect of adhesive pH on wood–adhesive bond quality. The adhesives evaluated included four highly alkaline phenol–formaldehyde, one intermediate pH phenol–resorcinol–formaldehyde, two acidic melamine–urea–formaldehyde, and two acidic melamine–formaldehyde resins. Block shear specimens were prepared using Douglas‐fir and black spruce wood. The adhesive performance was evaluated by measuring the shear properties (strength and wood failure) of the specimens tested at the dry and vacuum–pressure–redry (VPD) conditions. Adhesive pH, test condition, and wood species showed significant effects on shear properties. The different adhesives performed differently at the dry and VPD conditions. The high‐pH adhesives (phenol–formaldehyde and phenol–resorcinol–formaldehyde) showed similar high wood failures at both test conditions and performed better than the low‐pH adhesives (melamine–formaldehyde and melamine–urea–formaldehyde), especially after the VPD conditioning. The low‐pH adhesives showed high wood failure at the dry condition, but wood failure decreased significantly after VPD conditioning for both species, indicating that the low‐pH adhesives were less durable than the high‐pH adhesives. High‐pH adhesives did not have a negative impact on the strength of the bonded specimens. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011 相似文献
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Lignin is a natural and renewable organic compound that can be easily obtained from spent pulping liquors. It can be used as feedstock for making wood adhesives. Nonetheless, lignins need to be modified to enhance reactivity prior to being used as feedstock for making wood adhesives. Appropriate crosslinkers are also needed to ensure the bonding quality of the lignin-based wood adhesives. In the present review, the drawbacks of using lignins alone as wood adhesives, modifications to enhance the reactivity of lignins and production of lignin-based copolymer adhesives for composite wood panels are reviewed and discussed. The objective of this review is to provide background information about the recent status on the development of lignin-based copolymer adhesives for the production of composite wood panels as well as the future prospects of these adhesives in industry. Several modifications such as demethylation, oxidation, methylolation, phenolation, reduction and hydrolysis have shown promising results for enhancing the reactivity of lignins. Several crosslinkers such as phenolic resin, tannin, polymethylene polyphenyl isocyanate (pMDI), furfural and ethylenimine are capable of copolymerizing with lignins to produce lignin-based wood adhesives. The performance of composite wood panels bonded with modified lignin-based copolymer adhesives have been shown to meet the requirements of relevant standards. The main obstacles for the composite wood panels industry to widely adopt to lignin-based copolymer adhesives are the economic and technical issues. Nevertheless, lignin modification methods are proving to enhance the reactivity of lignins and the optimization in such modification methods would justify the economic issue. Together with the public awareness on the safety, health and environment concerns, the utilization of lignin-based adhesives in the composite wood panels industry is feasible. 相似文献