Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer

Ti₃SiC₂ ceramic and SUS430 stainless steel (SS) were successfully joined by a solid diffusion bonding technique using Ni interlayers. Diffusion bonding was performed in the temperature range of 850 °C–1100 °C under vacuum. The interfacial reaction phase, morphology evolution, growth kinetics and tensile strength were systematically investigated. In all cases, the inter-diffusion and reaction between Ti₃SiC₂ and SS can be effectively prevented by Ni foil, and the good transition in the joint benefit to the sound joining. The interface in the joints adjacent to SS matrix was composed of γ solid solution and a small amount of σ intermetallic compound. The compounds in the Ni/Ti₃SiC₂ interface was Ni/Ni(Si)/Ni₃₁Si₁₂ + Ni₁₆Ti₆Si₇ + Ti₃SiC₂ + TiC_x/Ti₂Ni + Ti₃SiC₂ + TiC_x/Ti₃SiC₂, which formed by the inter-diffusion and chemical reactions between Si and Ni atoms. The diffusion mechanism and reaction mechanism were interrelated, and decided the width of each reaction zones. Furthermore, the diffusion activation energy was 113 kJ/mol. The tensile strength increases with increasing the bonding temperature. The minimum and maximum strength of 32.3 MPa and 88.8 MPa were obtained from SUS430/Ni/Ti₃SiC₂ joints, which bonding experiments were carried out at 850 °C and 1100 °C, respectively.     

Interfacial microstructure and mechanical properties of TC4/Ti3SiC2 contact-reactive brazed joints using a Cu interlayer

Reliable contact-reactive brazed joints of TC4 alloy and Ti₃SiC₂ ceramic were obtained using a Cu interlayer. The interfacial microstructure of a TC4/Ti₃SiC₂ joint brazed at 920?°C for 10?min was TC4/Ti₂Cu +?α-Ti +?β-Ti/Ti₂Cu +?AlCu₂Ti +?Ti₅Si₃/Ti₅Si₃ +?Ti₅Si₄/Ti₃SiC₂. The interfacial microstructure and mechanical properties of TC4/Ti₃SiC₂ joints brazed at different temperatures were investigated. With increasing temperature, the shear strength of the brazed joints first increased and then decreased. The maximum shear strength was 132?±?8?MPa, and the corresponding fracture occurred along the Ti–Si reaction layer and the Ti₃SiC₂ substrate adjacent to the Ti–Si reaction layer. The microhardness test also demonstrated that the Ti–Si reaction layer possessed the highest microhardness, 812?±?22 HV. The Ti-Si reaction layer was the weakest part of the brazed joints. To eliminate the Ti-Si reaction layer and improve the mechanical properties of TC4/Ti₃SiC₂ brazed joints, a 40-μm Ni layer was plated on the surface of the Ti₃SiC₂ ceramic before brazing. The results showed that the Ti–Si reaction layer that formed adjacent to the Ti₃SiC₂ ceramic was thin and intermittent. Moreover, the interface between the Ti₃SiC₂ ceramic and the TC4 alloy became jagged. The shear strength of the TC4/nickel-plated Ti₃SiC₂ brazed joints improved to 148?±?8?MPa; the corresponding fracture occurred mainly in the Ti₃SiC₂ ceramic and only a small portion of the fracture occurred in the brazing seam.     

Nickel interlayer on the microstructure and property of TC6 to copper alloy diffusion bonding

In the present study, diffusion bonding of two dissimilar materials TC6 and copper alloy was investigated in vacuum chamber by directly bonding and using Ni foil as interlayer. Interface quality of the joints was evaluated by mechanical property and microstructure. The maximum shear strength of directly bonding was found to be 64 MPa for the speciemen bonded at 850 °C, 5 MPa for 30 min; and the maximum shear strength with Ni foil interlayer was 113 MPa under the same bonding parameters. The bonding interfaces and fracture surfaces were analyzed by energy disperse spectrometer, scanning electron microscopy and X-ray diffraction. The results show that the diffusion region of directly bonding specimen generated several IMCs (Ti₂Cu and Ti₅CuSn₃, etc.). Fracture morphology showed that brittle fracture present at the Ti₅CuSn₃ IMCs, which was the weak point of the joint. While the diffusion zone of the specimen with Ni foil interlayer consists of various phase including Ti₂Ni, TiNi, TiNi₃ at TC6 side, and Cu-Ni solid solution at ZQSn11-4-3 side, and fracture surface of joint present a mixture of brittle and ductile characteristics, and fracture initiated at the TiNi₃/Ni interface.     

Microstructure and mechanical strength of transient liquid phase bonded Ti3SiC2 joints using Al interlayer

Based on the structure characteristic of Ti₃SiC₂ and the easy formation of Ti₃Si_1−xAl_xC₂ solid solution, a transient liquid phase (TLP) bonding method was used for bonding layered ternary Ti₃SiC₂ ceramic via Al interlayer. Joining was performed at 1100–1500 °C for 120 min under a 5 MPa load in Ar atmosphere. SEM and XRD analyses revealed that Ti₃Si(Al)C₂ solid solution rather than intermetallic compounds formed at the interface. The mechanism of bonding is attributed to aluminum diffusing into the Ti₃SiC₂. The strength of joints was evaluated by three point bending test. The maximum flexural strength reaches a value of 263 ± 16 MPa, which is about 65% of that of Ti₃SiC₂; for the sample prepared under the joining condition of 1500 °C for 120 min under 5 MPa. This flexural strength of the joint is sustained up to 1000 °C.     

Brazing of porous Si3N4 ceramic to Invar alloy with a novel Cu–Ti filler alloy: Microstructure and mechanical properties

Porous Si₃N₄ (P–Si₃N₄) ceramic was successfully joined to Invar alloy using a Cu–Ti active brazing alloy for the first time. The interfacial reactions between the Cu–Ti filler and two dissimilar substrates were studied. The influence of brazing process on the microstructure evolution of the joint was revealed, along with the formation of an infiltration layer that permitted the bonding of P–Si₃N₄ substrate. Ti reacted with Si₃N₄ to form TiN and Ti₅Si₃ compounds, resulting in the decomposition of Si₃N₄. In addition, the reaction and diffusion dual-layer formed at the Cu–Ti/Invar interface, which was attributed to the interaction of alloy elements between the braze filler and the Invar alloy. Fe–Ti and Ni–Ti intermetallics together with Cu solid solution (s,s) constituted the microstructure of the brazing seam. In addition, the optimal shear strength of the brazed joint was 20 MPa and the fracture propagation occurred in the P–Si₃N₄ ceramic substrate adjacent to the infiltration layer during the shearing tests.     

Microstructural characteristics and mechanical properties of WC-Co/steel joints diffusion bonded utilizing Ni interlayer

In this study, diffusion bonding of WC-Co cemented carbides to a tool steel was realized utilizing Ni foils as the interlayer in a vacuum. The effects of bonding temperature and Ni interlayer thickness on interfacial microstructure and mechanical properties of the joint were studied. The research results revealed that brittle phases and cracks were suppressed due to the Ni interlayer. Moreover, the coherent relationship of [1 2 0]_WC//[1 0 1]_Ni and (0 0 1)_WC//(0 2 0)_Ni was observed at the interface of WC grains and Ni interlayer, and it greatly contributed to the bonding strength of WC-Co/steel joint. As the bonding temperature increased, the atoms diffused sufficiently, and the interfacial defect dimensions decreased. Then, the Ni interlayer was transferred to solid solutions, resulting in the high shear strength of the bonded joint. The optimum shear strength (444.7 MPa) was achieved when the bonding was carried out at 1050 °C for 1 h with a 4-μm-thick Ni interlayer. The cracks were propagated in the interlayer and the WC-Co substrate near the bonding seam.     

Vacuum brazing Nb and BN-SiO2 ceramic using a composite interlayer with network reinforcement architecture

A novel composite interlayer with a reinforced network was designed using a SiC ceramic with a network structure and Ti-Ni-Nb composite filler foils, to which the Nb and BN-SiO₂ ceramic were successfully brazed under vacuum. For a brazing temperature of 1160 °C and holding time of 10 min, the interfacial microstructure of the Nb/BN-SiO₂ ceramic joint was Nb/(βTi,Nb)-TiNi eutectic structure+(βTi,Nb)₂Ni+SiC+TiC/TiN+Ti₂N+TiB+Ti₅Si₃+TiO/BN-SiO₂ ceramic. In addition, the shear strength and nano-hardness were analyzed to evaluate the effect of the composite interlayer with a network reinforcement architecture on the mechanical properties of the joint. During brazing, the Ti-Ni-Nb filler metal infiltrated and reacted with the SiC to form the network reinforcement architecture, resulting in the residual stress being relieved and the mechanical performance of the joint being significantly improved. A maximum shear strength of 102 MPa was achieved, which was 60 MPa (142%) higher than that of the joint brazed without the network reinforcement architecture. A reduction in the residual stress on the BN-SiO₂ ceramic side from 328 MPa to 210 MPa was observed with the network reinforcement architecture, and the fracture path of the joint changed from the surface of the BN-SiO₂ ceramic to the interfacial reaction zone.     

High temperature properties of the monolithic CVD β-SiC materials joined with a pre-sintered MAX phase Ti3SiC2 interlayer via solid-state diffusion bonding

Monolithic high purity CVD β-SiC materials were successfully joined with a pre-sintered Ti₃SiC₂ foil via solid-state diffusion bonding. The initial bending strength of the joints (∼ 220 MPa) did not deteriorate at 1000 °C in vacuum, and the joints retained ∼ 68 % of their initial strength at 1200 °C. Damage accumulation in the interlayer and some plastic deformation of the large Ti₃SiC₂ grains were found after testing. The activation energy of the creep deformation in the temperature range of 1000 – 1200 °C in vacuum was ∼ 521 kJmol⁻¹. During the creep, the linkage of a significant number of microcracks to form a major crack was observed in the interlayer. The Ti₃SiC₂ interlayer did not decompose up to 1300 °C in vacuum. A mild and well-localized decomposition of Ti₃SiC₂ to TiC_x was found on the top surface of the interlayer after the bending test at 1400 °C in vacuum, while the inner part remained intact.     

Joining of Cf/SiC composite to Ti-6Al-4V with (Ti-Zr-Cu-Ni)+Ti filler based on in-situ alloying concept

In this paper, a novel brazing process based on in-situ alloying concept was carried out to join C_f/SiC composite to TC4 alloy at 940 °C for 20 min. Mixed powders of Ti-Zr-Cu-Ni alloy and pure Ti metal were used as interlayer. In the process, Ti-Zr-Cu-Ni alloy melted and then dissolved pure Ti metal via liquid-solid reactions, achieving in-situ alloying of the interlayer. The interfacial microstructure and formation mechanism of the brazed joints were investigated. The effect of Ti powder content on the microstructure and the mechanical properties of joints were analyzed. The results showed that: the maximum lap-shear strength of the in-situ alloying brazed joints was 283±11 MPa when using (Ti-Zr-Cu-Ni)+40 vol% Ti composite filler, and this value was 79% higher than the mechanical strength when using Ti-Zr-Cu-Ni alone. A reaction layer of (Ti,Zr)C+Ti₅Si₃ formed near C_f/SiC composite side, while a diffusion layer of Ti₂Cu+Ti(s,s) formed near Ti-6Al-4V side. In the interlayer, lots of Ti(s,s) were distributed uniformly and few of Ti-Cu compounds were found, contributing to the plasticity of joints. Adding moderate Ti powder was beneficial for improving the interfacial reaction between C_f/SiC composite and filler material, which affected the lap-shear strength of joints.     

Improvement for Ti3SiC2/Cu joint brazed using composite fillers with abnormal expansion ceramic particulates

Reducing the residual stresses and improving the mechanical strength of large-scale ceramic/metal brazing joints is an important problem that must be solved for its practical engineering application. Using composite filler with solid-state phase transformation ceramic particulates, it is theoretically feasible to relieve the residual stress and improve the mechanical properties of ceramic/metal brazed joints. In this study, Cu mesh, Ag–28Cu–2Ti (wt.%), and yttria-stabilized zirconia (0.6 mol.% YSZ solid-state phase transformation ceramic particulates) composite power fillers were used in the brazing of Ti₃SiC₂ ceramic and pure copper. The microstructure of joints and YSZ particulates in the interface was investigated and confirmed by scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), scanning transmission electron microscopy (STEM), and transmission electron microscopy (TEM). In addition, the effect of YSZ particulates content on the mechanical properties of joints was investigated and evaluated by the shear strength. The results show that the interfacial phases were mainly Ti₅Si₃, TiC, Ti_xCu, Ag (s, s), Cu (s, s), and YSZ particulates. Moreover, most of YSZ particulates undergo the solid-state phase transformation from tetragonal zirconia (t-ZrO₂) to monoclinic zirconia (m-ZrO₂) during the cooling process of brazing. The abnormal volume expansion of the solid-state phase transformation reduced the thermal mismatch between Ti₃SiC₂ ceramic and filler, thereby reducing the residual stress in the interface of joint. When using composite filler with 6 wt.% YSZ particulates, the shear strength of Ti₃SiC₂/Cu joint reached the maximum. The maximum average shear strength of the joints was 80.2 MPa, which was about 103.6% more than the joint without YSZ particulates.     

Microstructure evolution of Si3N4/Si3N4 joint brazed with Ag–Cu–Ti + SiCp composite filler

The Si₃N₄ ceramic was brazed by Ag–Cu–Ti + SiCp composite filler (p = particle) prepared by mechanical mixing. Effects of the content of Ti and SiC particles on microstructure of the joint were investigated. A reliable Si₃N₄/Si₃N₄ joint was achieved by using Ag–Cu–Ti + SiCp composite filler at 1173 K for 10 min. A continuous and compact reaction layer, with a suitable thickness, forms at the Si₃N₄/braze interface. The SiC particles react with Ti in the brazing layers, forming Ti₃SiC₂ thin layers around the SiC particles themselves and Ti₅Si₃ small particles in the Ag[Cu] and Cu[Ag] based solid solution. The higher content of SiC particles in the filler (≥10 vol%) depresses interfacial bonding strength between the Si₃N₄ substrate and composite brazing layer due to the thinner reaction layer and the bad fluidity of the filler. The Ti₃SiC₂ → TiC + Ti₅Si₃ reaction occurs when Ti concentration around SiC particles in the filler increases.     

Diffusion bonding of (Hf0.2Zr0.2Ti0.2Ta0.2Nb0.2)C high-entropy ceramic with metallic Ni foil

To prepare large-sized and complex-shaped components, the feasibility of direct diffusion bonding of (Hf_0.2Zr_0.2Ti_0.2Ta_0.2Nb_0.2)C high-entropy ceramic (HEC) and its diffusion bonding with a metallic Ni foil was investigated, and the interfacial microstructure and mechanical properties of HEC/HEC and HEC/Ni/HEC joints were analyzed. For the direct diffusion bonding, reliable joints with a shear strength of 146 MPa could be achieved when the bonding temperature reached 1500 °C under a pressure of 30 MPa. By introducing a metallic Ni foil as the interlayer, the HEC was successfully bonded at the diffusion temperatures from 1150 °C to 1250 °C under 10 MPa through the formation of Ti₂Ni compound phase. Meanwhile, the HEC(Ni) phase formed by the diffusion of Ni into HEC and Ni(s, s) bulks precipitated in the bonding transition zone. The maximum joint shear strength of 151 MPa was obtained by optimizing the Ni-foil thickness, bonding temperature, and holding time.     

Thickness-dependent phase evolution and bonding strength of SiC ceramics joints with active Ti interlayer

A robust solid state diffusion joining technique for SiC ceramics was designed with a thickness-controlled Ti interlayer formed by physical vapor deposition and joined by electric field-assisted sintering technology. The interface reaction and phase revolution process were investigated in terms of the equilibrium phase diagram and the concentration-dependent potential diagram of the Ti-Si-C ternary system. Interestingly, under the same joining conditions (fixed temperature and annealing duration), the thickness of the Ti interlayer determined the concentration and distribution of the Si and C reactants in the resulting joint layer, and the respective diffusion distance of Si and C into the Ti interlayer differentiated dramatically during the short joining process (only 5 min). In the case of a 100 nm Ti coating as an interlayer, the C concentration in the joint layer was saturated quickly, which benefited the formation of a TiC phase and subsequent Ti₃SiC₂ phase. The SiC ceramics were successfully joined at a low temperature of 1000 °C with a flexural strength of 168.2 MPa, which satisfies applications in corrosive environments. When the Ti thickness was increased to 1 μm, Si atoms diffused easily through the diluted Ti-C alloy (a dense TiC phase was not formed), and the Ti₅Si₃ brittle phase formed preferentially. These findings highlight the importance of the diffusion kinetics of the reactants on the final composition in the solid state reaction, particularly in the joining technique for covalent SiC ceramics.     

Wetting and interfacial behavior of Al–Ti/4H–SiC system:A combined study of experiment and DFT simulation

Wetting and interfacial behavior of molten Al-(10, 20, 30, 40) at.%Ti alloys on C-terminated 4H–SiC at 1500 and 1550 °C were investigated experimentally, and theoretical bonding strength, structure stability and electronic structure of interfacial reaction products/C-terminated 4H–SiC interfaces were evaluated by first-principle calculations. The wetting experiments show that the Al–Ti/SiC systems present excellent wettability with contact angle of less than 15° except the Al–40Ti/SiC system performed at 1500 °C × 30 min. The SEM-EDS and TEM analyses demonstrate that the reaction products are mainly composed of Al₄C₃, TiC, Ti₃SiC₂, Ti₅Si₃C_X and τ phase, and their formation and evolution can be mainly affected by the Ti concentration in the Al–Ti alloys and wetting temperature. Moreover, the calculated results show that the SiC/C-terminated TiC interface presents the highest work of separation and its electronic property reveals that the localization of electrons and formation of covalent bond between interfacial C atoms lead to the excellent bonding strength of SiC/TiC interface.     

Microstructure and mechanical property of SiC whisker coating modified C/C composite/Ti2AlNb alloy dissimilar joints prepared by transient liquid phase diffusion bonding

SiC whisker coating was prepared on the surface of C/C composite successfully by CVD, and transient liquid phase (TLP) diffusion bonding was employed to realize the joining of SiC whisker coating modified C/C composite and Ti₂AlNb alloy using Ti–Ni–Nb foils as interlayer. The microstructure, shear strength and fracture behavior were investigated by scanning electron microscopy (SEM) with energy dispersive X-ray spectrometer (EDS), X-ray diffraction (XRD) and universal testing machine. The results show that SiC has good compatibility with C/C composite, and gradient interface formed between SiC-modified C/C composite and Ti₂AlNb alloy. When the bonding experiment was carried out under bonding temperature of 1040 °C and holding time of 30min with 5 MPa pressure in vacuum, the joints formed well and no obvious defects can be observed. The typical microstructure of joints is C/C composite/SiC + TiC/Ti–Ni compounds + Ti–Ni–Nb solid solutions/residual Nb/diffusion reaction layer/Ti₂AlNb alloy. With the increasing of bonding temperature, the thickness of joining area increased due to sufficient element diffusion. However, when bonding temperature is elevated to 1060 °C, some defects such as cracks and slag inclusions exist in the interface layer between interlayer and Ti₂AlNb. The joints with maximum average shear strength of 32.06 MPa are bonded at 1040 °C for 30min. C, SiC and TiC can be found on the fracture surface of joints bonded at 1040 °C which indicated that fracture occurred at the interface layer adjacent SiC layer.     

A high-temperature structural and wave-absorbing SiC fiber reinforced Si3N4 matrix composites

The SiC_f/Si₃N₄ composite with low–high–low permittivity sandwich structure was designed for high-temperature electromagnetic (EM) wave absorption and mechanical stability. The SiC_f/Si₃N₄ possessed the remarkable mechanical properties at room temperature (the flexural strength is 357 ± 16 MPa and the fracture toughness is 10.8 ± 1.7 MPa m^1/2) for the strong fiber strength, moderate interface bonding strength and uniform matrix. Furthermore, the retention rate is as high as 80% at 800 °C. The A/B/C nanostructure and the sandwich meta-structure endowed the SiC_f/Si₃N₄ with an excellent EM absorbing property at room temperature. The SiC_f/Si₃N₄ still absorbed 75% of the incident EM waves energy in X and Ku bands when the temperature increases up to 600 °C, which is only 6% lower than that at room temperature, for the partial compensation of the decreased interfacial polarization loss for the increased conductivity loss and dipole polarization loss.     

Microstructure and mechanical properties of Al2O3/Cu joints brazed with Ag–Cu–Ti+Zn composite fillers

In this study, Al₂O₃ ceramic and Cu bars were brazed with newly designed Ag–Cu–Ti(ABA)+Zn composite fillers. Systematic analysis of the microstructure of the brazed joints indicated that the volatilization of Zn atoms during the brazing process could promote the spreading of liquid brazing fillers on the surface of the Al₂O₃ ceramic, resulting in a uniform dendritic interfacial structure. The typical interfacial structure was an Al₂O₃/TiO/(Cu, Al)₃Ti₃O+Ag(s, s)/Cu interface. Notably, the tensile strength was improved to 20.89 MPa for Al₂O₃/Cu joint brazed with ABA+Zn composite fillers at 900 °C for 20 min, approximately 67.6% higher than the sample brazed without Zn foil. In this case, the fracture model was straight and sharp-angled inside the Al₂O₃ ceramic. In addition, the joint strength decreased with increased brazing temperatures from 900 to 940 °C.     

Microstructure and mechanical properties of the Si3N4/42CrMo steel joints brazed with Ag–Cu–Ti + Mo composite filler

The Si₃N₄ ceramic was joined to 42CrMo steel using Ag–Cu–Ti + Mo composite filler. Effect of Mo particles content on the microstructure and mechanical properties of the joints were investigated. Defect-free joints were received when the Si₃N₄/42CrMo steel joints were brazed with Ag–Cu–Ti + Mo composite filler. The results show that a continuous reaction layer which is composed of TiN and Ti₅Si₃ was formed near the Si₃N₄ ceramic. A double reaction layer which consists of Fe₂Ti and FeTi was also formed adjacent to 42CrMo steel, with Fe₂Ti being located near the steel. The central part of the joint is composed of Ag based solid solution, Cu based solid solution, Mo particles and some Cu–Ti intermetallic compounds. The maximal bending strength reached 587.3 MPa with 10 vol.% Mo particles in the joint, at which the joint strength was 414.3% higher than the average strength for the case without Mo particles addition.     

Effect of Ge on microstructure and mechanical properties of Ti3SiC2/Al2O3 composites

Owing to the good physicochemical compatibility and complementary mechanical properties of Ti₃SiC₂ and Al₂O₃, Ti₃SiC₂/Al₂O₃ composites are considered as ideal structural materials. However, TiC and TiSi₂ typically coexist during the synthesis of Ti₃SiC₂/Al₂O₃ composites through an in-situ reaction, which adversely affects the mechanical properties of the resulting composites. In this study, Ti₃SiC₂/Al₂O₃ composites were prepared via in-situ hot pressing sintering at 1450 °C. Ge, which was used as a sintering aid, improved the purity and mechanical properties of the Ti₃SiC₂/Al₂O₃ composites. This is because Ge replaced some of the Si atoms to compensate the evaporation loss of Si to form Ti₃(Si_1-xGe_x)C₂, which showed a crystal structure similar to that of Ti₃SiC₂. Furthermore, the molten Ge accelerated the diffusion reaction of the raw materials, increasing the overall density of the Ti₃SiC₂/Al₂O₃ composites. The optimum Ge amount for improving the mechanical properties of the composites was found to be 0.3 mol. The flexural strength, fracture toughness, and microhardness of the composite with the optimum Ge amount were 640.2 MPa, 6.57 MPa m^1/2, and 16.21 GPa, respectively. The formation of Ti₃(Si_1-xGe_x)C₂ was confirmed by carrying out X-ray diffraction, energy dispersive spectroscopy, and transmission electron microscopy analyses. A model crystal structure of Ti₃(Si_1-xGe_x)C₂ doped with 0.3 mol Ge was established by calculating the solid solubility of Ge.     

Improved shear strength of SiC-coated 3D C/SiC composite joints with a tailored Ti-Si-C interlayer

SiC-coated 3D C/SiC composites were successfully joined using SPS technology with a Ti-Si-C interlayer. The interface morphologies, phase composition, and mechanical properties of the joints were investigated in detail. By adjusting the joining temperature, the interlayer transitioned, in situ, from Ti-Si-C compounds to Ti₃SiC₂ grains without decomposition. Because of the plastic deformation behavior of Ti₃SiC₂ grains, the ability of the interlayer to inhibit crack propagation increased. For joints with different interlayer thickness, the distribution of thermal residual stress was calculated using finite element analysis, and the distribution was associated with the evolution of interlayer morphologies, which was eventually used to establish fracture models. Optimized bonding was achieved without erosion of carbon fibers and also without interfacial defects. Finally, a reliable joint with shear strength of 51 ± 3.0 MPa was obtained by precisely controlling the interlayer reaction and optimizing thermal residual stress.