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1.
It is very difficult to prepare full-densified aluminum nitride-boron nitride(AIN/BN)composite ceramics with homogeneous microstructure and high thermal conductivity.Spark plasma sintering(SPS)was used to fully densify the AIN/BN composites in this work.Microstructure,mechanical properties and thermal conductivity of the SPS sintered AIN/BN composites with 5-30 vol% BN were investigated.The results show that the microstructure of composites is fine and homogenous,and the AIN/BN composites exhibit high mechanical properties.To promote the growth of AIN grains and modify the distribution of grain boundary in AIN/BN composites,a heat treating methodology was introduced through gas pressure sintering(GPS).This processing was significantly beneficial to enhancing the thermal conductivity of the specimen.The thermal conductivity of AIN/BN composites with 5-30 vol% BN reached 60 W/m K after the samples were treated by GPS.  相似文献   

2.
It is very difficult to prepare full-densified aluminum nitride-boron nitride (AIN/BN) composite ceramics with homogeneous microstructure and high thermal conductivity. Spark plasma sintering (SPS) was used to fully densify the AIN/BN composites in this work. Microstructure, mechanical properties and thermal conductivity of the SPS sintered AIN/BN composites with 5-30 vol% BN were investigated. The results show that the microstructure of composites is fine and homogenous, and the AIN/BN composites exhibit high mechanical properties. To promote the growth of AIN grains and modify the distribution of grain boundary in AIN/BN composites, a heat treating methodology was introduced through gas pressure sintering (GPS). This processing was significantly beneficial to enhancing the thermal conductivity of the specimen. The thermal conductivity of AIN/BN composites with 5-30 vol% BN reached 60 W/m K after the samples were treated by GPS.  相似文献   

3.
Spark plasma sintering was used to fabricate Al/diamond composites.The effect of sintering temperature on the microstructure and thermal conductivity(TC) of the composites was investigated with the combination of experimental results and theoretical analysis.The composite sintered at 550℃shows high relative density and strong interfacial bonding,whereas the composites sintered at lower(520CC) and higher(580-600℃) temperatures indicate no interfacial bonding and poor interfacial bonding,respectively.High ...  相似文献   

4.
Two hafnium diboride based ceramic matrix composites containing 20% (volume fraction) SiC particle and with or without AlN as sintering additives were fabricated by hot-pressed sintering. The mechanical properties and microstructures of these two composites were tested and the thermal shock resistances were evaluated by plasma arc heater. The results indicate that the composite with AlN as sintering additive has a denser and finer microstructure than composite without sintering additive, and the mechanical properties, thermal shock resistance of the composite with AlN as sintering additive are also higher than those of the composite without AlN. Microstructure analysis on the cross-section of two composites after thermal shock tests indicates that a compact oxidation scale contains HfO2 and Al2O3 liquid phase is found on the surface of composite with AlN, which could fill the voids and cracks of surface and improve the thermal shock resistance of composite.  相似文献   

5.
W-15Cu composite powders prepared by mechanical alloying (MA) of raw powders were consolidated by spark plasma sintering (SPS) process at temperature ranged 1 230-1 300 ℃ for 10 min and under a pressure of 30 MPa. By using high energy milling, particles containing very fine tungsten grains embedded in copper, called composite particles, could be produced. The W grains were homogeneously dispersed in copper phase, which was very important to obtain W-Cu alloy with high mechanical properties, fine and homogeneous microstructure. The microstructure and properties of W-15Cu alloys prepared by SPS processes at different temperature were researched. The results show that W-15Cu alloys consolidated by SPS can reach 99.6 % relative density, and transverse rupture strength (TRS) is 1 400.9 MPa, Rockwell C hardness (HRC) is 45.2, the thermal conductivity is 196 W/m-K at room temperature, the average grain size is less than 2 μm, and W-15Cu alloy with excellent properties, homogeneous and fine microstructure is obtained.  相似文献   

6.
1 IntroductionSiCp/Al composites have aroused considerable inter-ests in manyfields of industry due to their tailorable me-chanical and thermophysical properties .SiCp/Al compos-ites have been developed mainly as structural materials inapplicationfor automobile industries and aerospace indus-tries . However ,thermal management applicationsin elec-tronic packaging,such as substrates ,heat slugs and heatspreads have been focused on. Electronic componentsused in thermal management applications …  相似文献   

7.
BN ceramic is advanced engineering ceramics with excellent thermal shock resistance,good workability and excellent dielectricity.TiB2 ceramic has excellent electric conductivity,high melting points,and corrosion resistance to molten metal.Therefore,the composite consisting of BN and TiB2 ceramics is expected to have a combination of above-mentionaed properties,thereby can be used as self-heating crucible.In this puper,hot pressing technology was used to fabricate the high performance BN-TiB2 composite materials,microstructure and electric conducting mechanism were studied,and the relationship between the microstructure and physical property was discussed.the results show that the microstructure of composites has a great influence on the physical property of composites.The BN-TiB2 composites with excellent mechanical strength and stable resistivity can be obtained by optimizing the processing parameter and controlling the microstructure of composites.  相似文献   

8.
氮化铝陶瓷基片热导率的理论分析   总被引:2,自引:0,他引:2  
对氮化铝陶瓷基片的热导率进行了实验和理论分析,结果证实,烧结初始氧含量低的氧化铝粉体,加入较多的Y2O3作烧结助剂才能获得最大热导率,并且其值较高;随着氧含量的增加,可达到的最大热导率逐渐降低,而需加入的Y2O3量减少,同时,晶间相的存在对热导率有重要影响,文中推导出热导率与氧含量和Y2O3添加量之间的定量关系式并指出,获得最大热导率必须使用氧含量低的陶瓷粉体,同时根据氧含量的大小来确定Y2O3的  相似文献   

9.
A series of samples of hexagonal boron nitride-aluminum nitride ceramic composites with different amounts of CaF2 as sintering aid were prepared by spark plasma sintered at 1700-1850 ℃ for 5 min.The addition of CaF2 effectively lowered the sintering temperature and promoted the densification of AlN-BN composites.With the increase of sintering temperature,the density increased,and the contiguity of AIN grains enhanced in AIN-BN composites.Thermal conductivity of AIN-BN composites increased with the increase in CaF2 content and sintering temat 1800 ℃.  相似文献   

10.
By using Nb and Si elemental powders as raw materials,dense Nb/Nb 5 Si 3 composites were successfully fabricated by a spark plasma sintering(SPS)technology.The microstructure of the fabricated composites was analyzed by OM,SEM,XRD and EPMA;the microstructure evolution of the composites was also investigated by a quenching test.The experimental results show that the prepared composites consist of Nb and Nb 5 Si 3 phases;Nb particle uniformly distributes in the in-situ synthesized Nb5 Si3 matrix.During the SPS process,an interfacial reaction occurs between Nb and Si particles to synthesize Nb 5 Si 3 until reactant silicon has been completely depleted.  相似文献   

11.
For improving the properties of SiC-mullite composite ceramics used for solar sensible thermal storage, MnO2 was introduced as sintering additive when preparing. The composite ceramics were synthesized by using SiC, andalusite, α-Al2O3 as the starting materials with non-contact graphite-buried sintering method. Phase composition and microstructure of the composites were investigated by XRD and SEM, and the effect of MnO2 on the properties of SiC composites was studied. Results indicated that samples SM1 with 0.2 wt% MnO2 addition achieved the optimum properties: bending strength of 70.96 MPa, heat capacity of 1.02 J·(g·K)-1, thermal conductivity of 9.05 W·(m·K)-1. Proper addition of MnO2 was found to weaken the volume effect of the composites and improve the thermal shock resistance with an increased rate of 27.84% for bending strength after 30 cycles of thermal shock (air cooling from 1 100 °C to RT).  相似文献   

12.
Fabrication and Mechanical Properties of TiC/TiAl Composites   总被引:3,自引:0,他引:3  
TiC/ TiAl composites with different TiC content were fabricated by rapid heating technique of spark plasma sintering ( SPS ). The effect of TiC purticles on microstructure and mechanical properties of TiAl matrix was imestigated. The results indicate that grain sizes of TiAl matrix decrease and mechanical properties are improved because of the addition of TiC particles. The composites display a 26.8% increase in bending strength when 10wt% TiC is added and 43.8% improvement in fracture toughness when 5ut% TiC is added compared to values of TiC-free materials. Grain-refinement and dispersion-strengthening were the main strengthening mechanism. The improvement of fracture toughness was due to the deflexion of TiC particles to the crack.  相似文献   

13.
The efficiency-upgrading role that La0.8Sr_(0.2)CoO_3(LSCO) plays in the thermoelectric properties of Bi Cu Se O(BCSO) has been studied. LSCO was introduced into BCSO, increasing the electrical conductivity from 3.3 to 52.3 S cm-1 at 303 K, from 35.8 to 97.3 S cm~(-1) at 873 K; respectively. The Seebeck coefficient of all composites still holds around or more than 200 μV/K. Based on the enhanced electrical conductivity and high Seebeck coefficient, the power factor is enhanced by approximately 35%, with the best sample reaching a maximum value of 476.7 μ Wm~(-1) K~(-2) at 873 K. The lattice thermal conductivity of the nanocomposites is reduced as LSCO content increases from 15 vol% to 30 vol% due to the phonon scattering by nanoparticles and grain boundaries, resulting in a significant reduction in total thermal conductivity. In short, the enhanced thermoelectric figure of merit of 0.67 at 873 K for the sample containing 20 vol% LSCO as compared to 0.53 for the pure sample; announces the promising effect of LSCO on improving thermoelectric properties of Bi Cu Se O.  相似文献   

14.
BN/聚砜导热绝缘复合材料的制备及性能   总被引:1,自引:0,他引:1  
采用粉末混合法制备了BN/聚砜导热绝缘复合材料,用扫描电子显微镜(SEM)、导热系数测试仪和超高电阻微电流测试仪对复合材料的微观形貌、导热性能和电绝缘性能进行了表征。结果表明:硅烷偶联剂改性处理后的BN粉体与聚砜基体之间的相容性较好;BN/聚砜复合材料的导热系数随BN含量的增加而增大,最大可达2.08(W·m^-1·K^-1);表面电阻率和体积电阻率随BN含量的增加而减小,最低值分别为0.82×10^15Ω和1.78×10^15(Ω·cm),具有电绝缘性。  相似文献   

15.
The precursor infiltration and pyrolysis(PIP) method for preparation of BN/SiO2 composites was used to improve mechanical properties, dielectric properties and feasibility of high temperature dielectric parts with large dimensions and complex shapes. In the processing procedure, the porous BN ceramic matrix was first successfully prepared by compacting the mixed powders of B and BN and then sintering them at a certain temperature under normal pressure of N2. The polycarbosilane(PCS) solution was vacuum infiltrated into porous BN ceramics at the room temperature and then at 800℃ in the air to depolimerize out amorphous SiO2, and sintered further at 1 300℃ in N2 to get BN/SiO2 composites. The microstructure of materials was studied by means of X-ray diffraction and electron probe micro analysis. The thermo-decomposition mechanism of PCS was investigated by a TG-DTA and infrared (IR) spectrum analysis. The flexural strengths were measured by the three-point bending method. The dielectric constant and the loss tangent were measured by the wave-guide method. The results show BN/SiO2 composites were fabricated. The obtained composites posses a flexural strength of 61.96 - 93.31 MPa, the dielectric constant in the range of 3.50 - 3.78 and the order of magnitude of the loss tangent at 10^-3 , which are good for the high tempera turedielectric parts with large size and complex shapes.  相似文献   

16.
In order to compare the spark plasma sintedng (SPS) process plus hot isostatic press (HIP) with vacuum sintedng plus HIP, an investigation was carried out on the topography, microstructure and gain size distribution of nanocrystalline WC-10Co composite powder and the sintered specimens prepared by SPS plus HIP and by vacuum sintering plus HIP by means of atomic force microscopy (AFM). The mechanical properties of the sintered specimens were also investigated. It is very easy to find cobalt lakes in the specimen prepared by vacuum sintering plus HIP process. But the microstructure of the specimen prepared by SPS plus HIP is more homogeneous, and the grain size is smaller than that prepared by vacuum sintering plus HIP. The WC-10Co ultrafine cemented carbide consolidated by SPS plus HIP can reach a relative density of 99.4%, and the transverse rupture strength (TRS) is higher than 3540 MPa, the Rockwell A hardness (HRA) is higher than 92.8, the average grain size is smaller than 300 nm, and the WC-10Co ultrafine cemented carbide with excellent properties is achieved. The specimen prepared by SPS with HIP has better properties and microstructure than that prepared by vacuum sintering with HIP.  相似文献   

17.
为了研究铁电相LiNbO3对Al2O3陶瓷材料结构及其力学性能的影响,以Al2O3 Nb2O5 和LiCO3为主要原料,分别通过高温固相法和热压烧结法,制备LiNbO3/Al2O3复合材料.对制备的复合材料进行物相分析,抗折强度的测试以及显微形貌观察.结果发现:LiNbO3的加入有利于促进Al2O3的烧结,降低了Al2O3陶瓷的烧结温度.当烧结温度超过1 200℃时,复合材料的主晶相仍然为LiNbO3和Al2O3,但由于少量Li元素挥发,生成物相LiNb3O8.在1 200℃保温3h,通过高温固相法烧结,5vol% LiNbO3/95vol% Al2O3复合材料的抗弯强度达到了最高,为162.34MPa.在1 300℃,150MPa(保温保压1h)热压烧结制备的15 vol% LiNbO3/85 vol% Al2O3复合材料致密度为92.82%,其抗弯强度和断裂韧性分别为393.94 MPa和2.38 MPa· m1/2.该复合材料中的LiNbO3晶粒出现了非180°畴结构,这种电畴结构有利于改善材料的力学性能.  相似文献   

18.
为了解决AlN陶瓷难于制备复杂形状、生产成本高、重复性差等问题,采用无毒的壳聚糖体系,以Y2O3+CaF2为烧结助剂,利用凝胶注模成型及无压烧结制备了AlN陶瓷.利用粘度计、X射线衍射仪、扫描电镜等对AlN陶瓷浆料性能和AlN陶瓷的显微组织与导热性能进行研究.结果表明:戊二醛浓度、pH值及壳聚糖含量对凝胶化时间有影响;醋酸含量降低、固相含量增加会使AlN陶瓷浆料粘度下降;真空处理有助于陶瓷浆料中气泡的去除;Y2O3+CaF2烧结助剂不但可以降低烧结温度,还可有效改善AlN陶瓷的导热性能;固相含量为52vol.%的AlN陶瓷坯体无压烧结后,热导率达到95.6 W/(m·K).  相似文献   

19.
Due to the high specific surface area of graphene, the effective incorporation of high-content graphene in metals is challenging.Here, aluminum composites with graphene nanoplatelet(GNP) content up to 5.0 vol% were prepared by spark plasma sintering(SPS) of blended powders with various ball milling regimes and subsequent hot extrusion. The effects of GNP distribution state on the properties of GNP/Al composite were investigated. 5.0 vol% GNPs were uniformly dispersed in aluminum matrix by high-speed ball milling(HSBM) process, but with damage GNPs due to the too high energy input. By contrast, the wellstructured and dispersed GNPs in aluminum powders were obtained via shift-speed ball milling(SSBM). The clear GNP-Al interface in extruded SSBM composite was attributed to well-structured GNPs. As a result, the yield strength(YS) and ultimate tensile strength(UTS) of composite produced by SSBM reached 279 and 303 MPa, which are 166% and 116% higher than those of monolithic Al. This demonstrated that it may be promising to introduce high-content GNPs with tailorable interface in Al alloys via modified ball milling technique and hot extrusion.  相似文献   

20.
SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/(m·K) and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.  相似文献   

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