Cu/NbMoTaW纳米叠层材料具有尺寸效应的力学性能及变形机制（英文）

高熵合金(HEA)由于其在恶劣环境中优异的力学性能引起了研究者的广泛关注.我们将高熵合金NbMoTaW引入到纳米叠层材料中,制备出等层厚的Cu/HEA纳米多层膜,综合研究了其具有尺寸效应的力学性能及变形行为.实验表明,Cu/HEA纳米多层膜的硬度随着层厚h的减小而增加,随后在h≤50 nm的区域到达一个平台,而应变速率敏感性出现了一个最大值,这是由于Cu和HEA两相对应变速率敏感性的影响从协同转变为竞争.在层厚较大时,非共格界面导致Cu/HEA多层膜在变形后出现了剪切带,并且软相Cu层主导变形.     

Ultrathin,flexible,and high-strength Ni/Cu/metallic glass/Cu/Ni composite with alternate magneto-electric structures for electromagnetic shielding

Electromagnetic interference (EMI) shielding materials with ultrathin,flexible,superior mechanical and thermal management properties are highly desirable for smart and wearable electronics.Here,ultrathin and flexible Ni/Cu/metallic glass/Cu/Ni (Ni/Cu/MG) multilayer composite with alternate magnetic and electrical structures was designed via facial electroless plating of Cu and Ni on an Fe-based metallic glass.The resultant 0.02 mm-thick Ni/Cu/MG composite displays a superior EMI shielding effectiveness (EMISE)of 35 dB and a great EMISE/t of 1750 dB/mm,which is greater than those of composites with monotonous multilayer or homogeneous structures.The improved EMI SE originates from the massive ohmic losses,the enhanced internal reflection/absorption,and the abundant interfacial polarization loss.Particularly,Ni/Cu/MG exhibits a high tensile strength of up to 1.2 GPa and outstanding mechanical stability,enabling the EMI SE remains unchanged after 10,000 times of bending.Moreover,Ni/Cu/MG has excellent Joule heating characteristics and thermal stability,which is very suitable for heating components of wearable hyperthermia devices.     

Plasticity in small-sized metallic systems: Intrinsic versus extrinsic size effect

A material strength depends on its microstructure, which in turn, is controlled by an engineering process. Strengthening mechanisms like work hardening, precipitate, and grain boundary strengthening can alter the strength of a material in a predictive, quantitative manner and are readily linked to the deformation mechanism. This quantification strongly depends on the characteristic length scale of a particular microstructure, thereby dictating bulk material’s strength as a function of, for example, grain or precipitate size, twin boundary spacing, or dislocation density. This microstructural, or intrinsic, size governs the mechanical properties and post-elastic material deformation at all sample dimensions, as the classical definition of “ultimate tensile strength” deems it to be “an intensive property, therefore its value does not depend on the size of the test specimen.” Yet in the last 5 years, the vast majority of uniaxial deformation experiments and computations on small-scale metallic structures unambiguously demonstrated that at the micron and sub-micron scales, this definition no longer holds true. In fact, it has been shown that in single crystals the ultimate tensile strength and the yield strength scale with external sample size in a power law fashion, sometimes attaining a significant fraction of material’s theoretical strength, and exhibiting the now-commonly-known phenomenon “smaller is stronger.” Understanding of this “extrinsic size effect” at small scales is not yet mature and is currently a topic of rigorous investigations. As both the intrinsic (i.e. microstructural) and extrinsic (i.e. sample size) dimensions play a non-trivial role in the mechanical properties and material deformation mechanisms, it is critical to develop an understanding of their interplay and mutual effects on the mechanical properties and material deformation, especially in small-scale structures. This review focuses on providing an overview of metal-based material classes whose properties as a function of external size have been investigated and provides a critical discussion on the combined effects of intrinsic and extrinsic sizes on the material deformation behavior.     

Atomic deformation mechanism and interface toughening in metastable high entropy alloy

Metastable high entropy alloy (HEA) with excellent properties have attracted extensive attentions recently. However, as a consequence of limited experiments of high-resolution transmission electron microscopy (HRTEM) and the difficulties of molecular dynamic (MD) simulations for the phase transformation process, the detailed atomic deformation mechanisms in the HEA is not well understood. We carry out the in situ HRTEM observation of the martensitic transformation process and find surprisingly wide phase interface between the parent and the martensite in a typical high strength and high elongation metastable HEA. One specific interatomic potential is developed for the metastable HEA and large-scale MD simulation is carried out to investigate the martensitic transformation process from body-centered cubic to hexagonal close packed structures. The whole processes of the stress-induced martensitic transformation (nucleation, incubation, bursting and propagating of the new phase) are well reproduced in the MD simulations, suggesting its good agreements with the HRTEM observations. The width of the phase interface mainly depends on the competition between interfacial energy and lattice distortion energy during the martensitic transformation process. This wide phase interface acts as a buffer to coordinate the martensitic transformation induced strain and as a buffer storage for dislocation gliding and pile-up. As a result, the metastable HEA achieves a high strength combined with a large tensile elongation. The revealed atomic-scale deformation and corresponding interatomic potential should be useful to guide the design in the new series of high-performance metastable alloy.     

Ceramic joining III bonding of alumina via Cu/Nb/Cu interlayers

A method of ceramic-ceramic joining that exploits a multilayer interlayer designed to form a thin, potentially transient layer of liquid phase has been used to join alumina to alumina. Microdesigned multilayer Cu/Nb interlayers were used to achieve bonding at 1150 °C. Flexure strengths of as-bonded samples ranged from 119 to 255 MPa, with an average of 181 MPa. The ability to form strong ceramic/metal interfaces is also indicated by instances of ceramic failure. Microstructural and chemical characteristics of fracture surfaces were evaluated using SEM, EDS and microprobe. The impact of post-bonding anneals of 10 h duration at 1000 °C in gettered argon on room-temperature joint strength was assessed. High strengths (198 to 238 MPa) were obtained. The retention of strength following annealing in low oxygen partial pressure argon differs from the behaviour previously observed in Cu/Pt bonded alumina. Effects of the anneal on interfacial microstructure were determined, and an explanation for this difference in behaviour is proposed.     

Microstructure and ultrahigh strength of nanoscale Cu/Nb multilayers

The microstructure and mechanical properties of Cu/Nb multilayers were investigated by X-ray diffraction, transmission electron microscopy, scanning electron microscopy and nanoindentation. Ultrahigh strength of 3.27 GPa is achieved at the smallest layer thickness of 2.5 nm, which agrees well with the theoretical prediction based on the deformation mechanism of crossing of dislocations across interfaces. After that, the strength decreases with the increasing layer thickness and the transition of the deformation mechanism to confined layer slip occurs at the layer thickness of 6.5 nm. Additionally, strength of the Cu/Nb multilayers increases with increasing loading strain rate because of enhanced strain hardening.     

Structural observations of the interface of explosion-bonded Mo/Cu system

The structure of the interface of explosion-bonded Mo/Cu system has been examined by optical and electron (TEM, AEM) microscopy. Molybdenum and copper can be directly bonded along the flat interface without a diffusion zone, but only on the copper side of the interface is a thin (about 10 m thick) bond layer, which consists of very fine subgrains with an ill-defined boundary. The microstructure in the bond layer is generated by severe dynamic deformation due to jetting and subsequent recovery with frictional heating. On the molybdenum side, originally-existing and elongated subgrains are observed just adjacent to the interface, even after bonding. These results indicate that jetting can occur only on the copper side, with a strength much lower than molybdenum because bonding must be carried out at an impact pressure as low as possible to avoid cracking of molybdenum as well as melting of copper during welding.     

Enhanced Hall-Petch strengthening in graphene/Cu nanocomposites

Grain size dependent strength,known as Hall-Petch relation,has been approved to be valid in crystalline metals and alloys.However,softening would eventually occur as grain size reduced into nanoscale that below a critical value.Hence,it is essential to find a way to break the strength limitation by avoiding the deformation mechanism transition from dislocation-mediated to grain-boundary-mediated processes.By replacing grain boundary (GB) of nanocrystalline Cu with graphene,in the present study,molecular dynamics simulations show that graphene-boundary (GrB) embedded GrB/Cu nanocomposites exhibit enhanced enlarged Hall-Petch slope with decreasing grain size.The absence ofinverse-Hall-Petch relation and the extremely high strength derived at the GrB/Cu nanocomposites were interpreted by the high back stress and abundant dislocation activity that attributed from the high-degree of heterogeneous structure of the nanocomposites.     

Solidification and interfacial structure of in situ Al-4.5Cu/TiB2 composite

In situ particle reinforced Al-4.5Cu/TiB₂ composite was fabricated with TiO₂, H₃BO₃, Na₃AlF₆ powders and Al-4.5Cu alloy by reaction in melt. The composite can be directly casted into moulds to make composite parts. TiB₂ particles distribute uniformly in the matrix. The average size of TiB₂ particles is 0.93 m. At the atomic scale, TiB₂ is hexagonal, and exhibits hexagon or quadrilateral shape. The orientation relationships exist in the interfaces between TiB₂ particle and -Al, and between the reinforced small Al₂Cu phase and -Al in the composite. They are . TiB₂ particle is nucleation site for -Al matrix growth in the composite. The interface between TiB₂ particles and the matrix is clean and well bonded. No reaction product has been found through HREM observation. This is beneficial to the strength of the composite. The as-cast Al-4.5Cu/TiB₂ composite exhibits mechanical excellent properties: the tensile strength is 416.7 MPa, the yield strength is 316.9 MPa, and the elongation is 3.3 pct.     

Room‐Temperature Mechanical Properties of V20Nb20Mo20Ta20W20 High‐Entropy Alloy

Refractory high‐entropy alloys (HEAs) have shown promising high temperature strengths, while their mechanical behaviors at room temperature are rarely reported. In this work, the room‐temperature mechanical properties of V₂₀Nb₂₀Mo₂₀Ta₂₀W₂₀ refractory HEA under various different loading modes including tension, compression, bending, shear loading, and microhardness are investigated. The results show that this alloy exhibits very high compressive strength but quite low strengths under tension, bending, and shear loading, similar to the conventional brittle materials. However, pronounced plasticity and slip bands are observed in compression samples, and no indentation cracking is observed in low‐load microhardness tests, which indicate the potential ability of plastic deformation in this refractory HEA. The present work suggests that the microstructure or composition of this HEA should be carefully tailored before its practical usage to suppress its large tendency for cracking and eventually improve its ductility and strength under tension.

     

Effect of stacking fault energy on mechanical behavior of cold-forging Cu and Cu alloys

Cu, Cu–2.87 wt% Mn, Cu–4.40 wt% Mn and Cu-10.19 wt% Mn were prepared by cold-forging. The deformation behavior of Cu–Mn alloys is consistent with the Cu-Al alloys and Cu–Zn alloys but without lowering the stacking fault energy to simultaneously increase the strength and ductility. A series of analysis demonstrate that Cu–Mn alloys have a much smaller twin density than low stacking fault energy (SFE) metals, and dislocation strengthening is the major reason for the higher strength. The role of short range order (SRO) in promoting the mechanical properties has also been briefly discussed.     

石墨烯/Cu复合材料力学性能的分子动力学模拟

结合嵌入原子方法（EAM）、反应经验键序（REBO）作用势和Morse势函数,采用分子动力学方法研究了石墨烯/Cu复合材料的弹性性能和变形机制。分子动力学计算得到复合材料的弹性模量随石墨烯体积分数的增加而线性增加,这与Halpin-Tsai模型的预测趋势吻合。此外,石墨烯的加入同时也提供了复合材料的屈服强度。通过比较预制裂纹在单晶铜和石墨烯/Cu复合材料中的动态扩展,发现石墨烯的加入显著抑制了裂纹的扩展,材料的变形主要表现为沿石墨表面的滑移。石墨烯很大程度上提高了复合材料的塑性变形能力。     

Role of nanoscale Cu/Ta interfaces on the shock compression and spall failure of nanocrystalline Cu/Ta systems at the atomic scales

Molecular dynamics (MD) simulations are used to investigate the role of size and distribution of nanoscale Cu/Ta interfaces on the nucleation and evolution of defects during shock loading and spall failure of nanocrystalline (nc) Cu/Ta alloys. Cu/Ta interfaces are introduced through the embedding of Ta clusters in nc-Cu matrix. The phase stability of the embedded Ta clusters either as FCC or BCC clusters is first investigated and reveals that the FCC Ta clusters have a lower energy for diameters less than 4 nm, whereas the BCC Ta clusters have a lower energy for the larger diameters. The shock simulations are then carried out for Ta clusters with an average diameter of 1 and 3 nm and concentrations of 3.0, 6.3 and 10.0% to investigate the role of size and distribution of Cu/Ta interfaces (due to presence of clusters) on the nucleation and evolution of dislocations as well as the spall strength of the alloy. The MD simulations indicate that the Cu/Ta interfaces reduce the capability of nc-Cu to accommodate plasticity through nucleation of dislocations and create void nucleation sites during spallation. The MD simulations further reveal that the impact strengthening effects due to the presence of nanoscale Cu/Ta interfaces are strongly dependent upon the size and distribution of Ta clusters, as well as the grain size of Cu matrix. Smaller size of interfaces (cluster size), higher concentration of Ta (smaller spacing between interfaces) and larger matrix grain size render higher spall strengths of nc-Cu/Ta microstructures.     

High Temperature Deformation of Al2O3/Cu Composites

This work concerns with the high temperature deformation of internally oxidized Al2O3/Cu composites. The investigation revealed that dispersive alumina can obstruct dislocation sliding and define the subgrain size thereby improve significantly the strength of the materials at high temperature. The sliding of dislocations is a main deformation mechanism in the given temperature range. The sliding of grain boundary and diffusive creep play important roles at high temperature and low strain rate. The dispersoids can raise the recrystallization temperature to higher than 1223 K. Dynamic recovery is a main softening way under the experimental conditions. Higher deformation rate and lower deformation temperature imply a higher flow stress.     

Durable self-polishing antifouling Cu-Ti coating by a micron-scale Cu/Ti laminated microstructure design

Marine biofouling is a major issue deteriorating the service performance and lifespan of marine infrastruc-tures.The development of a durable,long-term,and environment-friendly antifouling coating is therefore of significant importance but still a critical challenge in maritime engineering.Herein,we developed a Cu-Ti composite antifouling coating with micron-sized alternating laminated-structure of Cu/Ti by plasma spraying of mechanically mixed Cu/Ti powders.The coating was designed to enable controlled release of Cu ions through galvanic dissolution of Cu laminates from the Cu/Ti micro-galvanic cell in aqueous solution.Results showed that remarkable antifouling efficiency against bacterial survival and adhesion up to ～100 ％ was achieved for the Cu-Ti coating.Cu/Ti micro-galvanic cell was in-situ formed within Cu-Ti coating and responsible for its Cu ions release.The successive dissolution of Cu laminates resulted in the formation of micro-channels under Ti laminates near surface,which contributed to controlled slow Cu ions release and self-polishing effect.Thus,environment-friendly antifouling capability and ～200 ％longer antifouling lifetime than that of the conventional organic antifouling coatings can be achieved for the Cu-Ti coating.On the other hand,as compared to the conventional organic antifouling coatings,the Cu-Ti composite coating presented much higher mechanical durability due to its strong adhesion strength,excellent mechanical properties,and two orders lower wear rate.The present laminated Cu-Ti coating exhibits combination of outstanding antifouling performance and high mechanical durability,which makes this coating very potentially candidates in marine antifouling application.     

Precipitation of Cu in Fe–Cu alloys by high-speed deformation

The differences between defect structures in Fe–Cu alloys deformed at the high (4.3×10⁵ s⁻¹) and the low strain rate (67 s⁻¹) were studied. Positron lifetime and coincidence Doppler broadening (CDB) measurements were carried out to investigate the formation of vacancy clusters and Cu precipitates. Both the size of vacancy clusters and the total amount of vacancy-type defects were larger after high-speed deformation at room temperature. Cu precipitation in the specimen deformed at the high-speed stopped for 10 h after annealing at 400 °C, while that in the specimen deformed at the low-speed continued for 100 h. Transmission electron microscopy (TEM) observations showed a heterogeneous distribution of dislocations in the case of low-speed deformation but a homogeneous distribution in the case of high-speed deformation. These results suggested that the sink efficiency for defects was higher in the specimen deformed at the high-speed.     

Microstructure and mechanical properties of a novel refractory AlNbTiZr high-entropy alloy

The microstructure and mechanical properties of a novel refractory AlNbTiZr high-entropy alloy (HEA) with a low density of ～5.85?g?cm^?3 were investigated after arc melting and homogenisation at 1473?K for 5?h. The as-cast HEA exhibits a single-phase ordered body-centred cubic (B2) structure. A hexagonal Zr₅Al₃-type second phase is introduced into the HEA through homogenisation treatment, resulting in increase of the yield strength, ultimate compressive strength and fracture strain by 70?MPa, 308?MPa and 9.2%, respectively. These results indicate that the introduction of the hexagonal Zr₅Al₃-type second phase into the B2 matrix can simultaneously improve the HEA strength and ductility, showing a strength–ductility combination superior to those of most reported refractory HEAs.     

Tunability of the mechanical properties of (Fe50Mn27Ni10Cr13)100-xMox high-entropy alloys via secondary phase control

The single-phase face-centered cubic (fcc)-structured Fes0Mn27Ni10Cr1 3 high entropy alloy (HEA) exhibits good ductility but low strength,which presents a challenge.By Mo-alloying and thermomechanical treatments,we have designed the (Fes0Mn27Ni10Cr13)100-xMOx (x=0-6 at.％) alloy series with a wide range of mechanical properties.The careful control of secondary phases introduced in the cold-rolled and annealed (Fe50Mn27Ni10Cr13)Mo2 sample resulted in an enhanced tensile strength from 250MPa to 665 MPa,still having ～25 ％ ductility.TEM investigations of this alloy revealed the presence of deformation twins,dislocation cells,and ordered bcc nano-particles embedded in the ductile fcc matrix post-deformation.The observed deformation structures are an indication of successful cooperation between deformation twinning and precipitation strengthening in enhancing the tensile strength at maintained ductility compared to its cast counterpart.This work provides insight into the tunability of the mechanical properties of non-equiatomic HEAs via alloying and thermomechanical processing.     

Beating Thermal Coarsening in Nanoporous Materials via High-Entropy Design

Controlling the feature sizes of 3D bicontinuous nanoporous (3DNP) materials is essential for their advanced applications in catalysis, sensing, energy systems, etc., requiring high specific surface area. However, the intrinsic coarsening of nanoporous materials naturally reduces their surface energy leading to the deterioration of physical properties over time, even at ambient temperatures. A novel 3DNP material beating the universal relationship of thermal coarsening is reported via high-entropy alloy (HEA) design. In newly developed TiVNbMoTa 3DNP HEAs, the nanoporous structure is constructed by very fine nanoscale ligaments of a solid-solution phase due to enhanced phase stability by maximizing the configuration entropy and suppressed surface diffusion. The smallest size of 3DNP HEA synthesized at 873 K is about 10 nm, which is one order of magnitude smaller than that of conventional porous materials. More importantly, the yield strength of ligament in 3DNP HEA approaches its theoretical strength of G/2π of the corresponding HEA alloy even after thermal exposure. This finding signifies the key benefit of high-entropy design in nanoporous materials—exceptional stability of size-related physical properties. This high-entropy strategy should thus open new opportunities for developing ultrastable nanomaterials against its environment.     

Influence of Cu Addition and Microstructural Configuration on the Creep Resistance and Mechanical Properties of an Fe-Based α/α′/α″ Superalloy

Introducing Cu nanoparticles is an effective mechanism for strengthening and toughening Fe-based materials such as ultra-high-strength steels. Herein, the effect of Cu on the mechanical properties of a novel Fe-based α/α′/α″ superalloy is studied. Compared to a Cu-free reference alloy, nanoindentation reveals an increase in hardness, which was associated with the formation of Cu nanoparticles. Both alloys show room temperature (RT) compressive plastic strain at maximum stress greater than 8%, irrespective of the heat-treatment. At RT and at 750 °C, the Cu-containing alloy exhibits a slightly higher strength, but the heat treatment has a more significant impact: A configuration of α-matrix and intermetallic α′/α″-phases forming an interpenetrating network is superior to a state with isolated precipitates. This difference vanishes in monotonic creep experiments, and under the same conditions, the Cu-containing alloy exhibits a twice as high creep rate despite a slightly higher precipitate fraction. This is linked to a higher lattice misfit and faster-coarsening kinetics. Post-mortem transmission electron microscopy analysis of the creep-deformed specimens identifies dislocation bypass as the dominant deformation mechanism. However, the presence of <010>{110} dislocations in the interfacial networks and evidence of dislocation activity within α′/α″ precipitates suggest the occurrence of shearing events.