Cu—Cr—Zr合金强化机理电子理论研究

通过自编软件建立了Cu合金液体、位错、晶界等原子集团模型,采用递归法计算了Cu合金电子结构。研究表明：Y在晶粒、表面、液体的环境敏感镶嵌能依次降低,Y从晶粒内向晶粒表面、液体Cu中扩散。扩散过程中Y原子填补在Cu晶粒表面缺陷处,阻碍Cu原子结晶,同时进入液体中的Y在晶粒周围形成含有高浓度Y的薄层,使晶粒生长受阻,晶粒细化。Sn向位错扩散,抑制Cr的沉淀析出,并能钉扎位错的攀移运动,推迟回复和再结晶。S在晶界偏析,使晶界结合强度降低。偏聚在晶界的S可将合金中的Zr吸附到晶界,使晶界得到强化。Cu晶粒、晶界与位错处的费米能级不同,电子在这些区域之间发生偏移,使合金内产生微电场。微电场对电子产生散射作用,使合金电阻增大。     

铝钎焊接头中Cu元素的扩散行为研究

为了研究Al-Cu共晶合金钎料中Cu元素在钎焊接头中的扩散行为,采用快速凝固技术制备了Al-Cu共晶合金钎料,以纯铝棒料为基体采用对接接头在不同温度下进行了真空钎焊,并利用SEM和EDS对接头进行了研究.研究表明:钎料中Cu原子的扩散以晶界扩散为主,当晶界上Cu原子的浓度达到一定值后开始向晶内扩散,当晶内的Cu原子饱和后又反向扩散到晶界上;钎焊温度过低、保温时间过短时,Cu元素在基体内部不能充分扩散,在基体晶界上产生严重偏析,生成Al-Cu相中最脆的θ相(Al2Cu);提高钎焊温度和保温时间有利于提高Cu元素在Al基体中的扩散,但过高的钎焊温度又导致θ相的重新出现,选取合适的钎焊工艺参数才能获得良好的钎缝.     

Al-6Cu-0.5Zr合金超塑变形后微观结构的研究

相分析表明该合金由Al基固溶体和CuAl_2、ZrAl_3两种粒子所组成。合金超塑性变形后,利用标记线法测定了晶界滑移量对总变形量的贡献为60％左右。在δ≈30％的试样上观察到晶界变宽,在晶界上呈现折皱区,并在遇到第二相时改变方向。透射电镜分析表明,晶界滑移时出现晶界位错,在三晶交界处或晶界坎处向晶内激发位错,晶界是位错源与壑,激活的晶内位错通过滑移和攀移会形成位错亚晶界,晶内位错的激活与运动是晶界滑移的重要协调机制,晶界滑移与晶界位错运动有关。合金超塑性变形时,在晶界和CuAl_2相界处有空洞形成,研究了空洞面积分数与面缩率的关系。靠近断口处,空洞数和面积分数急剧增加,说明空洞的增殖、扩展和连接导致断裂。     

超硬铝LC9合金的超塑性研究

微细晶粒超硬铝LC9合金在470～530℃温度范围内,速率为8.33×10~(-4)～1.66×10~(-2)s~(-1)条件下拉伸呈显出良好的超塑性。在最佳超塑性条件下(T=515℃,ε=1.66×10~(-3)s~(-1))获得延伸率δ=1300％、流变应力δ=1.7MN/M~2应变速率敏感性指数m=0.66 金相和电镜观察表明,在超塑流变过程中,除发生晶界滑动,扩散蠕变外,还发生明显的动态再结晶以及晶内结晶学滑移,晶内位错密度随变形量增大而增加。扩散蠕变导致在横向晶界上形成新的条带区,出现晶界迁移和无沉淀区,同时存在晶内和晶界扩散。空洞在三角晶界处萌生,沿横向晶界方向的扩展连结,导致突然断裂。     

高压扭转大塑性变形Al–Mg合金中的晶界结构*

利用透射电镜和高分辨透射电镜(HRTEM)研究了高压扭转大塑性变形纳米结构Al–Mg合金中的位错和晶界结构。结果表明: 对尺寸小于100 nm的晶粒, 晶内无位错, 其晶界清晰平直; 而尺寸大于200 nm的大晶粒通常由几个亚晶或位错胞结构组成, 局部位错密度可高达10¹⁷ m^-2, 这些位错往往以位错偶和位错环的形式出现。用HRTEM观察到了小角度及大角度非平衡晶界、小角度平衡晶界和大角度Σ9平衡晶界等不同的晶界结构。基于实验结果, 分析了局部高密度位错、位错胞和非平衡晶界等在晶粒细化过程中的作用, 提出了高压扭转Al–Mg合金的晶粒细化机制。     

7050高强铝合金晶界偏析和氢致应力腐蚀开裂

本文研究了7050铝合金的应力腐蚀开裂。用离子探针证实氢在裂尖区富集,通过俄歇能谱分析研究了 Zn,Mg 元素在晶界的偏析。应力腐蚀开裂包括三个过程:(1)在欠时效和峰时效的合金中,氢加速进入晶界;(2)氢和 Zn(或Mg)在位错芯部发生电荷转移产生 H-;(3)由于H-在晶界的尺寸失配导致晶界开裂。测定了应力腐蚀开裂激活能,表明氢在晶界中通过空位扩散是控制应力腐蚀开裂的主要过程。     

THE ROLE OF GRAIN BOUNDARY SEGREGATIONS AND HYDROGEN DIFFUSION ON SCC IN 7050 Al ALLOY

本文研究了7050铝合金的应力腐蚀开裂。用离子探针证实氢在裂尖区富集,通过俄歇能谱分析研究了Zn,Mg 元素在晶界的偏析。应力腐蚀开裂包括三个过程:(1)在欠时效和峰时效的合金中,氢加速进入晶界;(2)氢和Zn(或Mg)在位错芯部发生电荷转移产生H-;(3)由于H-在晶界的尺寸失配导致晶界开裂。测定了应力腐蚀开裂激活能,表明氢在晶界中通过空位扩散是控制应力腐蚀开裂的主要过程。     

LC4铝合金超塑变形后的电子衍衬象分析

本文展示出 LC4铝合金在500℃下,以不同应变速率和给定不同应变量后的超塑装形电子衍衬象。对微观形貌的综合分析表明:该合金的超塑变形机制为 Gifkins 模型。晶界滑移由品界位错协词:大块化合物与基体界面间的变形,由大块化合物周围的位错协凋。试验中发现的蛇形流纹、“Z”字形位错和位错环,证明了该合金中同时存在着扩散蠕变的协调作用。     

弥散强化Pt-10Rh合金高温微观组织结构研究

用金相显微镜、扫描电镜观测普通Pt-10Rh合金和弥散强化Pt-10Rh合金的微观组织结构,结果表明,普通Pt-10Rh合金在高温下晶粒长大趋势明显,且高温持久性低,而弥散强化Pt-10Rh合金中有强化颗粒氧化锆的存在,能减少晶界缺陷,提高晶界结合力,降低晶界的扩散速度,减缓位错攀移,有效阻止晶粒长大和晶界的滑移,从而提高材料的强度和使用寿命。     

Cu-Cr-Ti-Si合金加工软化的机理EI北大核心CSCD

通过大气熔炼制备Cu-Cr-Ti和Cu-Cr-Ti-Si合金铸锭,进行热轧—固溶—时效—冷轧工艺制备带材,研究合金经不同变形量冷轧后的组织和性能。采用金相显微镜(OM)、配备有电子背散射衍射系统(EBSD)的扫描电子显微镜(SEM)、X射线衍射仪(XRD)以及透射电子显微镜(TEM)等检测手段对冷轧后的合金的组织结构与性能进行分析。结果表明,添加微量Si元素的Cu-Cr-Ti-Si合金在变形量ε≥80%时,硬度不升反降,而Cu-Cr-Ti合金没有发现此现象。随着变形量增大,Cu-Cr-Ti-Si合金小角度晶界比例降低,位错胞增多,位错密度略有下降,但无再结晶晶粒,说明回复导致加工软化。通过分析冷轧前组织发现,Si元素能细化合金晶粒,导致变形前Cu-Cr-Ti-Si合金晶粒较Cu-Cr-Ti更加细小,单位面积内晶界数量多,从而为合金变形中发生回复提供更多的形核位置储能。     

喷射成形超高碳钢超塑性变形后的微观组织

研究了喷射成形超高碳钢的超塑性及其变形前后的显微组织.变形前,喷射态超高碳钢的组织为典型珠光体组织,而变形后,珠光体中的条状碳化物逐渐发生碎化和球化,并弥散分布于晶界处,此外,在铁素体基体中以及碳化物颗粒周围出现了高密度位错亚结构,而基体铁素体晶粒也有所伸长.喷射成形超高碳钢超塑性微观机制是以晶界滑动为主,晶内变形以及位错蠕变起了协调作用.     

Deformation response of grain boundary networks at high temperature

The deformation response of random grain boundary networks as a function of temperature and strain rate is explored using molecular dynamics atomistic simulations and an embedded atom method interatomic potential. We find that deformation at higher temperatures promotes both dislocation emission and grain boundary accommodation processes. The results allow estimating the activation energies and volumes for the deformation process. We find activation energy values for the deformation process similar to those for grain boundary diffusion and activation volumes consistent with an atomic shuffling mechanism. Our results suggest a picture of the deformation process as governed by the combination of the applied stress and thermally activated processes.     

Deformation of internal boundaries

A geometrical analysis of the deformation of internal boundaries is presented using the slip systems as reference co-ordinate axes to describe the orientation of the two phases adjacent to the boundary. The present analysis can be applied to any type of boundary such as a grain boundary, a twin boundary or a two-phase interface. The nature of the disturbance left by a dislocation cutting through the boundary is characterized by a boundary dislocation, the Burgers vector of which can be determined from the orientation relationship between the adjacent slip systems. Whenever the crystal dislocation, cutting through the boundary, has a Burgers vector component normal to the boundary, the disturbance also possesses a ledge character, the motion of which may cause both grain boundary sliding as well as migration. The formulae derived are applied to simple cases to determine the nature of the boundary dislocations.     

High Temperature Deformation of Al2O3/Cu Composites

This work concerns with the high temperature deformation of internally oxidized Al2O3/Cu composites. The investigation revealed that dispersive alumina can obstruct dislocation sliding and define the subgrain size thereby improve significantly the strength of the materials at high temperature. The sliding of dislocations is a main deformation mechanism in the given temperature range. The sliding of grain boundary and diffusive creep play important roles at high temperature and low strain rate. The dispersoids can raise the recrystallization temperature to higher than 1223 K. Dynamic recovery is a main softening way under the experimental conditions. Higher deformation rate and lower deformation temperature imply a higher flow stress.     

Mechanistic model for grain size and temperature dependence of flow stress in 316L austenitic stainless steel

Abstract

During plastic deformation of a polycrystalline material, both the grain interior and the grain boundary regions exhibit distinctly different dislocation behaviours at a given strain and temperature. Studying the variation of experimental flow stress with temperature, it seems that the flow stress of a fine grained polycrystalline material is mainly controlled by dislocation dynamics at and in the vicinity of grain boundaries. At low temperatures in a polycrystalline material, the dislocations are piled up at grain boundaries and the density of dislocations increases significantly in the grain boundary region, while at high temperatures the annihilation of dislocations take place at and in the vicinity of the grain boundaries during deformation. Therefore, the flow stress behaviour of a polycrystalline material can be understood in terms of the process of accumulation and annihilation of dislocations at and in the vicinity of grain boundaries at a given strain and temperature.     

TC18钛合金的超塑性行为与变形机制

通过高温拉伸实验研究TC18钛合金在温度为720~950℃,初始应变速率为6.7×10~(-5)~3.3×10~(-1)s~(-1)时的超塑性拉伸行为和变形机制。结果表明:TC18钛合金在最佳超塑性变形条件下(890℃,3.3×10~(-4)s~(-1)),最大伸长率为470%,峰值应力为17.93MPa,晶粒大小均匀。在相变点Tβ(872℃)以下拉伸,伸长率先升高后下降,在温度为830℃,初始应变速率为3.3×10~(-4)s~(-1)时取得极大值373%,峰值应力为31.45MPa。TC18钛合金在两相区的超塑性变形机制为晶粒转动与晶界滑移,变形协调机制为晶内位错滑移与攀移;在单相区的超塑性变形机制为晶内位错运动,变形协调机制为动态回复和动态再结晶。     

AZ61镁合金薄板超塑性变形特征的SEM研究

利用扫描电镜(SEM)和超塑性拉伸实验对一次热挤压加工成型的AZ61镁合金薄板(晶粒尺寸～12μm)超塑性变形特征进行了研究.结果显示,在最佳的变形温度(623K)和应变速率(1×10-4s-1)条件下,可获得的最大的超塑性形变量为920%.在523～673 K实验温度和1×10-2～1×10-5s-1应变速率范围内,材料的应变速率敏感指数(m值)随实验温度升高和应变速率的降低而增加.较高的m值(0.42～0.46)对应于晶界滑动机制(GBS),而较低的m值(0.22～0.25)则对应于位错滑移机制.变形温度和应变速率是影响超塑性变形量和变量机制的主要因素.     

7050铝合金在不同温度变形的动态析出行为

研究了7050铝合金在不同温度变形的动态析出行为,结果表明:7050铝合金在不同温度的变形过程中MgZn2相动态析出不影响流变应力的波动,变形加速了动态析出过程;随着变形温度的升高,部分析出相MgZn₂颗粒由球状变成板条状,尺寸增大数量减少,在450℃变形过程中粗大的板条状MgZn₂相易破碎;同时,位错密度减低,位错胞团变成离散位错墙。析出相钉扎位错和阻碍晶界迁移,主要以亚稳态η′和平衡态η形式存在,在变形过程中不会产生微裂纹。     

Dislocation interactions with tilt walls

The flow of plastic deformation in polycrystalline materials can be due to activation of sources in adjacent grains due to the effect of pile up dislocations against the grain boundary and also through the transmission of dislocations across the grain boundary. In this paper, we focus on these two issues by studying the evolution of resolved shear stress as a result of pile up dislocations against the boundary and understanding the basic phenomena of dislocation transmission through grain boundary. We also investigated the relaxed structures a grain boundary acquires after the process of dislocation transmission.     

Multiscale Modeling of Deformation in Polycrystalline Thin Metal Films on Substrates

The time‐dependent irreversible deformation of a thin metal film constrained by a substrate is investigated by a mesoscopic discrete dislocation simulation scheme incorporating information from atomistic studies of dislocation nucleation mechanisms. The simulations take into account dislocation climb along the grain boundaries in the film as well as dislocation glide along slip planes inclined and parallel to the film/substrate interface. The calculated flow stress and other features are compared with relevant experimental observations. The work is focused on deformation of a polycrystalline film without a cap layer, for which diffusive processes play an important role. The dislocation‐based simulations reveal information on the prevailing deformation mechanisms under different conditions and for different film thicknesses. Despite of the limitations of the two‐dimensional dislocation model, the simulations exhibit a film thickness dependent transition between creep dominated and dislocation glide dominated deformation, which is in good agreement with experimental observations.