薄膜材料导热行为及其测试和预测

薄膜材料在集成电路,光电子技术,微结构传感器等微电子元件的应用日益广泛,其导热性能直接影响元器件的热噪声,进而对其可行一和使用性能产生明显影响,薄膜材料导热性能及其测试研究愈益受人瞩目,为此,本文对薄膜材料导热性能及各种测试方法进行了综述,并在分析薄膜微结构模型的基础上,对计算薄膜有效热导率的不同预测议程进行了评述,从而可为薄膜材料的制备工艺和性能变化提供技术判据。     

铁电薄膜导电过程与机理

铁电薄膜具有优良的铁电、压电、热释电、电光等物理性质，近几年随着铁电随机存贮器（ＦＥＲＡＭ）的研制，铁电薄膜的研究成为材料领域的研究新热点。本文综述了铁电薄膜的导电机理，并结合国内外研究者的最新报道及我们自己的实验结果，进行了分析和讨论。     

AIN电子薄膜材料的研究进展

AIN是一种在热、电、光和机械等方面具有良好综合性能的材料，作为电子薄膜材料在微电子、电子元件、高频宽带通信以及功率半导体器件等领域有广泛应用。简介了AIN薄膜的制备方法，评述了国内外各科研团体的最新研究成果和进展，阐述了AIN薄膜的应用，并综述了近年来AIN薄膜作为缓冲层、SOI结构的绝缘埋层和吉赫兹级声表面波器件压电薄膜的研究现状。     

AlN电子薄膜材料的研究进展

AlN是一种在热、电、光和机械等方面具有良好综合性能的材料,作为电子薄膜材料在微电子、电子元件、高频宽带通信以及功率半导体器件等领域有广泛应用.简介了AlN薄膜的制备方法,评述了国内外各科研团体的最新研究成果和进展,阐述了AlN薄膜的应用,并综述了近年来AlN薄膜作为缓冲层、SOI结构的绝缘埋层和吉赫兹级声表面渡器件压电薄膜的研究现状.     

低温制备高质量多晶硅薄膜技术及其应用

多晶硅薄膜是集晶体硅材料和非晶硅氢合金薄膜优点于一体,在能源科学、信息科学的微电子技术中有广泛应用的一种新型功能材料。本文综述低温（＜600℃）制备高质量多晶硅薄膜技术的研究进展及其应用,着重讨论用等离子体化学气相沉积（PECVD）硅基薄膜固相晶化制备多晶硅技术及其在薄膜硅太阳能电池上的应用。     

塑料软包装材料测试技术的进展

大家知道．我国软包装材料的发展是近二十年的事情，尤其近十年通过大规模地引进原材料薄膜生产设备、印刷设备、复合设备等，软包装材料的生产、开发、使用越来越多．新产品、新材料层出不穷，材料的物性评价愈显重要，测试技术和各类性能实验方法标准也相继产生，塑料软包装材料的测试是为了正确掌握塑料的各种性能，这对控制塑料产品的质量、指导加工、研究塑料材料的物理性质和结构关系、了解使用范围等有重要意义。测试仪器的发展可以说是随着经济的发展而不断发展的。     

场致电子发射薄膜材料研究评述

场致电子发射(场发射)薄膜材料由于在场发射平板显示器、电子源等诸多高性能真空微电子器件上具有广阔的应用前景,引起了人们广泛的关注与研究兴趣.综述了场发射薄膜材料的理论与实验研究进展,并评述了场致电子发射薄膜材料研究的瓶颈问题及未来发展方向与趋势.     

钛酸铅和锆钛酸铅铁电薄膜的热释电效应的研究

本文测量了钛酸铅和锆钛酸铅铁电薄膜的热释电效应，在这些以钛薄片为衬底，用Ｓｏｌ－Ｇｅｌ方法制备的铁电薄膜上可测到明显的热释电响应，同时，对这些薄膜的牡民Ｉ－Ｖ特性也进行了测试，对敏感元工之间的热传导以及材料中发现的光效应对热释电响应的影响进行了分析和讨论。     

氮氧化硅薄膜的研究进展

氮氧化硅薄膜材料具有优异的热力学、介电及光学性能,在微电子、光学器件等方面有着重要应用.其主要制备方法包括化学气相沉积、溅射、直接氮化/氧化及离子植入.综述了该类材料的制备方法和应用研究进展,并指出了制备方法和应用研究的发展方向.     

PECVD法沉积SiOxNy及其性质研究

本文采用PECVD技术制备了SiO_xN_y薄膜。用光电子能谱仪和红外光谱仪等对薄膜的结构、组成和其它物理性质作了测量。对温度、功率等工艺参数对薄膜性质的影响作了研究。结果表明,该薄膜是一种非晶态无序结构的、具有良好的抗腐蚀和掩蔽特性的电绝缘介质膜。     

Thermal Diffusivity Measurement for Titanium Thin Films on Copper Substrate by Laser Produced Plasmas

The transport properties of condensed phase materials are, in principle, dependent on the local structure and composition of the specimen. This is particularly evident near the free surface of a solid alloy specimen where the morphology, composition, and thermal diffusivity exhibit significant depth dependence, as demonstrated in an earlier study of the depth-resolved thermal diffusivity of a galvanized steel specimen. A new non-contact method was used, based on time-resolved, spectroscopic measurement of the total mass removed from the specimen surface representatively in elemental composition by a high-power laser pulse. A new study of a titanium thin film of varying thickness deposited on a copper substrate is presented. The titanium thin film is first fabricated in a vacuum and then immediately analyzed for composition and thermophysical properties in situ, both by the method of representative laser-produced plasmas (LPP). Successive ablation layers of the thin film, as exposed by LPP ablation, have revealed the dependence of the thermophysical properties on film thickness as well as on depth. The existence of a characteristic length over which the substrate influences the dynamics of thermal transport in the titanium thin film has also been observed.     

Determination of Thermophysical Properties for Polymer Films using Conduction Analysis of Laser Heating

Determination of the thermophysical properties of thin film materials is important for modeling and optimizing laser microvia drilling of organic substrates in microelectronics applications. Techniques to measure the density, thermal conductivity, thermal diffusivity, thermal decomposition point, and specific ablation heat of thin polymer films are described. An experimental apparatus was set up for laser heating of the sample. To measure the thermal diffusivity, an analytic heat transfer model is developed. One-dimensional heat conduction is assumed due to the small thickness of the film compared to the radius of the laser beam. The value of thermal diffusivity is obtained by fitting the experimental data to the theory. The specific ablation heat is obtained by measuring the mass loss during laser ablation. The experimental apparatus and the property determination methodology can also be applied to thin samples of other materials.     

Development of a Thermophysical Handy Tester for Non-Destructive Evaluation of Engineering Materials

Techniques of quality inspection and non-destructive diagnosis of engineering materials have been developed as procedures for determining various physical properties. The diagnostic techniques are usually based on detecting a very delicate signal concerned with changeable properties, and therefore detecting such a signal requires a great deal of experience in the procedures. In situ measurement for thermophysical properties of engineering parts is also important for judgment of the intrinsic soundness of the parts or for distinction between similar materials. The purpose of this study is the development of a thermophysical properties handy tester that can be used to simultaneously measure thermal conductivity and thermal effusivity and can be applied to the non-destructive diagnosis of numerous engineering materials. The tester consists of a portable data-acquisition unit, a probe holder equipped with a thermal probe, and a notebook computer. Measurements can be carried out by merely bringing the probe into point contact with a testing body for a period of 10 s. The thermal probe is constructed from a thin thermocouple in order to satisfy conditions based on the measurement principle. Materials that can be measured include polymeric resins, glasses, ceramics, alloys, and pure metals, among others.     

Preparation,structure, properties,and application of copper nitride (Cu3N) thin films: A review

Copper nitride (Cu₃N) thin films display typical trans-rhenium trioxide structures. They exhibit excellent physical properties, low cost, nontoxicity, and high stability under room temperature. However, they possess low-thermal decomposition temperature, and their lattice constant often changes significantly with prepared technologies or techniques, thereby enabling the transformation from insulators to semiconductors and even conductors. Moreover, Cu₃N thin films are becoming the new research hotspot of optical information storage devices, microelectronic semiconductor materials, and new energy materials. In this study, existing major prepared technologies of Cu₃N thin films are summarized. Influences of prepared technologies of Cu₃N thin films on crystal structure of films, as well as influences of prepared conditions and methods (e.g., nitrogen pressure, deposition power, substrate temperature, and element addition) on crystal structure and optical, electrical, and thermal properties of films were analyzed. The relationship between crystal structure and physical properties of Cu₃N thin films was explored. Finally, applications of Cu₃N thin films in photoelectricity, energy sources, nanometer devices, and other fields were discussed.     

Compositional effects on microstructure evolution and microwave properties of silver–palladium based thick film microstrips

Recent improvements in materials and processing technologies have dramatically increased the frequency range where ceramic thick film circuits can be utilized. Coupled with inherent advantages of thick film technology viz. low manufacturing cost, multilayering capability and relative insensitivity to substrate surface characteristics, such improvements have resulted in circuits that are penetrating the domain which was previously reserved to thin film technology. In view of newer developments in modern electronics, there is still ample scope for the development of new materials and processes especially in thick film technology. In thick films, conductors play a major role and silver–palladium is one of the important conductor materials in microelectronic circuits. Efforts are made in this work towards the development of suitable silver–palladium thick film conductors from the standpoint of microwave applications. The properties such as surface microstructure, sheet resistance, adhesion and microwave performance of the indigenously developed silver–palladium paste compositions is reported here. Highly porous surface structure, low adhesion and low characteristic impedance of thick film microstrip are observed for pastes with high palladium concentration.     

Compositional effects on microstructure evolution and microwave properties of silver–palladium based thick film microstrips

Recent improvements in materials and processing technologies have dramatically increased the frequency range where ceramic thick film circuits can be utilized. Coupled with inherent advantages of thick film technology viz. low manufacturing cost, multilayering capability and relative insensitivity to substrate surface characteristics, such improvements have resulted in circuits that are penetrating the domain which was previously reserved to thin film technology. In view of newer developments in modern electronics, there is still ample scope for the development of new materials and processes especially in thick film technology. In thick films, conductors play a major role and silver–palladium is one of the important conductor materials in microelectronic circuits. Efforts are made in this work towards the development of suitable silver–palladium thick film conductors from the standpoint of microwave applications. The properties such as surface microstructure, sheet resistance, adhesion and microwave performance of the indigenously developed silver–palladium paste compositions is reported here. Highly porous surface structure, low adhesion and low characteristic impedance of thick film microstrip are observed for pastes with high palladium concentration.     

Comparison of Thermal Conductivity and Thermal Boundary Conductance Sensitivities in Continuous-Wave and Ultrashort-Pulsed Thermoreflectance Analyses

Thermoreflectance techniques are powerful tools for measuring thermophysical properties of thin film systems, such as thermal conductivity, Λ, of individual layers, or thermal boundary conductance across thin film interfaces (G). Thermoreflectance pump–probe experiments monitor the thermoreflectance change on the surface of a sample, which is related to the thermal properties in the sample of interest. Thermoreflectance setups have been designed with both continuous wave (cw) and pulsed laser systems. In cw systems, the phase of the heating event is monitored, and its response to the heating modulation frequency is related to the thermophysical properties; this technique is commonly termed a phase sensitive thermoreflectance (PSTR) technique. In pulsed laser systems, pump and probe pulses are temporally delayed relative to each other, and the decay in the thermoreflectance signal in response to the heating event is related to the thermophysical properties; this technique is commonly termed a transient thermoreflectance (TTR) technique. In this work, mathematical models are presented to be used with PSTR and TTR techniques to determine the Λ and G of thin films on substrate structures. The sensitivities of the models to various thermal and sample parameters are discussed, and the advantages and disadvantages of each technique are elucidated from the results of the model analyses.     

内嵌弹性区和结合力模型在薄膜/基底界面断裂中的应用

薄膜/基底结构是微电子学和材料科学中广泛应用的典型结构。由于加工工艺中材料力学、热学性能失配等原因导致的薄膜中出现的残余应力,是界面裂纹的萌生和扩展的重要原因。采用三参数(Γ₀, /σ_y,t)的修正的断裂过程区结合力模型,讨论了在塑性氛围下裂尖解理断裂的过程,裂尖应力分布,裂尖形貌和表征裂纹尖端断裂过程区特征参数对断裂过程的影响,并应用到均质金属薄膜/陶瓷基底结构中残余应力导致界面裂纹起裂和扩展的全过程分析中。     

Japanese research on thermophysical properties of solids

The research activities on thermophysical properties in many engineering fields in Japan have been promoted for the past 10 years. In this paper, the outlook is reviewed on recent research work on thermophysical properties, mainly on thermal conductivity and thermal diffusivity of solids, in Japan. The research activities are described in such areas as measuring methods, metals, nuclear fuels and ceramics, building materials and insulators, soils and rocks, energy storage materials and compound materials, and dispersed materials.Presented at the Japan-United States Joint Seminar on Thermophysical Properties, October 24–26, 1983, Tokyo, Japan.     

Absolute Measurement of Thermophysical and Optical Thin-Film Properties by Photothermal Methods for the Investigation of Laser Damage

Perspectives and limits of the application of the photothermal technique are given for the measurement of absorption, thermal, and thermoelastic properties in thin films. The peculiarities of this technique in the frequency and time domains are discussed in some detail, and selected important results with respect to laser damage studies in optical coatings are pointed out. Emphasis is placed on the absolute measurement of both optical and thermophysical properties in dielectric materials in thin-film form and, also, on the influence of both absorption and changed thermal properties in thin films on their thermally induced laser damage resistance.