糖精对脉冲电沉积镍层结构及性能的影响

利用脉冲电沉积制备细晶镍镀层。研究了糖精对镍镀层的晶粒尺寸、表面形貌、晶体取向和硬度的影响。结果表明：加入糖精后,可获得晶粒尺寸小于30nm的镍镀层,晶体择优取向由（200）织构向（111）织构转变,镀层的耐蚀性得到提高;镀层的硬度与镍镀层的晶粒尺寸有关,晶粒尺寸较大时,服从Hall—Petch关系,晶粒尺寸较小时产生...     

金刚石工具用电沉积纳米镍层的制备及性能

为了提高电镀金刚石工具的质量,采用脉冲电沉积纳米镍作为其胎体材料.在对其显微结构、晶粒尺寸、显微硬度及抗拉强度的测试基础上,确定了制备工具合适的电镀工艺参数.结果表明,在恒定脉冲模式下(脉冲导通时间2 ms,脉冲断开时间45 ms),镀层晶粒尺寸随电流密度的上升而明显下降,硬度与强度则显著上升,当电流密度超过8 A/dm2时,抗拉强度开始急剧下降而硬度保持6 kN/mm2 的高位基本不变,当超过12 A/dm2 时,硬度也开始下降.同时得到最大硬度与强度时材料的晶粒尺寸大约为20 nm,由其制出的工具切割使用寿命比普通Ni-Co胎体材料工具高20.2%.     

用脉冲喷射电沉积法制备纳米晶镍镀层

采用脉冲喷射电沉积方法制备了纳米晶镍镀层,用扫描电子显微镜(SEM)、透射电子显微镜(TEM)和X射线衍射(XRD)等方法研究了镀层的生长形貌和微观结构,并考察了脉冲电流密度对镀层微观结构如晶粒尺寸、织构等的影响.结果表明:镀层内表面(基体一侧)具有比外表面(镀液一侧)更为精细的晶粒结构,说明随着厚度的增加,镀层中的晶粒逐渐粗化.随着电流密度从45 A/dm2增加到180 A/dm2,镀层中晶粒生长的择优取向由(111)织构逐渐转变为强(220)织构.当电流密度从45 A/dm2增加到120 A/dm2时,镀层平均晶粒尺寸逐渐减小;而进一步增加电流密度到180 A/dm2,镀层晶粒尺寸又会有轻微的增大.     

超细晶/纳米晶反Hall-Petch变形机制最新研究进展

晶粒细化是提高晶体材料力学性能的一种有效强化方式,Hall-Petch关系表明晶体材料的屈服强度和硬度随晶粒尺寸降低而增强.随着超细晶材料和纳米材料的深入研究,实验发现了反Hall-Petch现象,即随着晶粒尺寸的减小,材料性能下降.综述了反Hall-Petch现象中屈服强度、显微硬度及模拟现状,并指出了超细晶和纳米晶细化晶粒的研究方向.     

喷射电沉积Ni及Ni-ZrO2复合镀层的表面形貌和硬度

采用喷射电沉积技术在45钢基体上制备了Ni及Ni-ZrO2复合镀层,并对各种镀层进行扫描电子显微镜(SEM)表面形貌观察、能谱分析(EDS)、X射线衍射仪(XRD)晶粒尺寸测定以及镀层显微硬度测定。比较了不同电流密度、温度和纳米颗粒浓度对镀层表面形貌和硬度的影响规律。结果表明:电流密度由0.55A/cm2提高到1.00A/cm2后,镀层表面越粗糙,晶粒尺寸由15nm增大到23nm,显微硬度由571HV降低到364HV;温度由20℃升高到50℃后,表面呈现先变粗糙后变平整趋势,且镀层中Ni含量上升,Fe含量下降,镀层硬度由551HV降低到364HV;ZrO2纳米颗粒质量浓度由0g/L提高到25g/L时,表面仍呈现先变平整后变粗糙趋势,镀层晶粒尺寸由22nm降低到13nm,硬度由384HV提高到521HV。     

硫代硫酸盐无氰镀银工艺

无氰镀银是电镀银的发展方向,目前仍存在许多问题.采用硫代硫酸盐无氰镀银工艺,分别以AgNO3和AgBr为主盐进行镀银,研究了主盐含量、电流密度对镀层表观质量、沉积速率、显微硬度的影响,测量了镀层结合强度、晶粒尺寸,确定了2种体系制备镀层的最佳工艺.结果表明:AgNO3体系AgNO3最佳用量为40 g/L,最佳电流密度为0.25 A/dm2,制备的镀层光亮平整,晶粒尺寸为35 nm;AgBr体系AgBr最佳用量为30 g/L,最佳电流密度为0.20 A/dm2,制备的镀层光亮平整,晶粒尺寸为55 nm;与AgBr体系相比,AgNO3体系适宜电镀的电流密度范围较宽,制备的镀层显微硬度较大,晶粒尺寸小;2种体系制备的镀层均为纳米晶.     

脉冲电沉积CeO2-SiO2／Ni—W-P纳米复合镀层性能研究

为了探讨脉冲参数对CeO2-SiO2/Ni-W-P四元纳米复合镀层性能的影响,采用脉冲沉积的方法,在普通碳钢表面制备了CeO2-SiO2/Ni-W-P纳米复合镀层.在脉冲关断时间1 000μs和脉冲峰值电流密度30 A/dm2下,研究了脉冲导通时间对纳米复合镀层组织及性能的影响,采用能谱分析、硬度测试、扫描电镜(SEM)等技术对镀层化学组成、沉积速率、显微硬度和表面形貌进行了表征.结果表明,纳米复合镀层中CeO2和SiO2颗粒的质量分数随着脉冲导通时间的延长而增加,当脉冲导通时间为400～600μs时,沉积速率为32.33～38.22μm/h,显微硬度为609～674 HV;脉冲导通时间由100μs增加到400μs时,纳米复合镀层晶粒尺寸降低,但当脉冲导通时间再由400μs增加到1000μs时,纳米复合镀层晶粒尺寸又有所增加.     

磁场强度对铜基电沉积Ni-ZrO_2复合镀层性能的影响

利用磁场-超声电沉积技术在铜基体上制备Ni-ZrO_2复合镀层。采用扫描电子显微镜、X射线衍射仪、显微硬度计、摩擦磨损试验机和电化学工作站,研究了磁场强度对Ni-ZrO_2复合镀层的微观表面形貌、织构组织、纳米粒子含量、显微硬度和电化学性能的影响。结果表明,随着磁场强度的增加,复合镀层ZrO_2复合量、显微硬度呈现先增加后减小的趋势,而基体晶粒尺寸和磨损量与之相反。磁场强度为0.4 T时,复合镀层ZrO_2复合量为3.96%(质量分数),晶粒尺寸为17.47 nm,显微硬度为420HV。电场与磁场垂直时产生的磁流体力学效应促进了镀层中ZrO_2纳米粒子含量,可细化复合镀层基体晶粒,提高复合镀层显微硬度。Ni-ZrO_2复合镀层耐磨性能优异,其磨损量和摩擦系数表现最小。同时,根据极化曲线和阻抗曲线分析数据,复合镀层电化学性能最优。     

脉冲电沉积纳米晶镍沉积层的力学性能研究

为了提高镍沉积层的显微硬度和抗拉强度,采用传统的Watt镀液通过脉冲电沉积制得纳米镍沉积层.通过扫描电镜(SEM)、X射线衍射(XRD)方法分析了沉积层的表面形貌、织构和晶粒大小与脉冲参数的关系.分析表明,微观形貌为胞状结构,平均晶粒尺寸为10.3 nm;随着占空比减小,晶粒得以细化.研究了脉冲参数对纳米镍镀层显微硬度、抗拉强度的影响,最大显微硬度达到591 HV,最大拉伸强度达900MPa,分别为直流镍镀层的4.0和1.4倍;热处理试验表明,200℃热处理有利于提高镍镀层的显微硬度.     

脉冲电流密度对Ni-WC/Co纳米复合镀层摩擦磨损性能的影响

目前,通过脉冲电沉积制备Ni-WC/Co复合镀层的研究报道较少。为了探究Ni-WC/Co纳米复合镀层对材料表面摩擦性能的影响,采用脉冲电沉积制备Ni-WC/Co纳米复合镀层,研究脉冲峰值电流密度对复合镀层晶体结构、晶粒尺寸和硬度的影响;室温下,在MM-W1B立式万能摩擦磨损试验机上测试复合镀层的摩擦磨损性能,分析其磨损机理。结果表明:随着峰值电流密度的增加,复合镀层晶粒尺寸先减小后增大,硬度则是先增大后减小,复合镀层的摩擦系数和磨损量都是先降低后升高;当峰值电流密度为10 A/dm2时,复合镀层的平均晶粒尺寸最小,硬度最高,摩擦系数和磨损量最低,耐磨性能最佳,复合镀层表面主要呈现轻微的划痕,且磨痕较窄,无疲劳磨损。     

Ion density increase in high power twin-cathode magnetron system

In contrast to conventional plasma deposition methods, High Power Impulse Magnetron Sputtering (HIPIMS) utilizes extremely high power inputs in short pulses, providing for the discharge current densities up to several A/cm². High ion densities are observed not only during the plasma on-time, but also within the afterglow period. Once ions are generated, they can contribute to the peak ion density of the next pulse if the off-time between the pulses is sufficiently small. When the HIPIMS cycle contains two pulses, separated by a short plasma off-time and followed by a long afterglow period, the peak ion density for the second pulse can be 5-7 percents higher than for the first pulse. With a dual cathode system and time-shifted pulsing with distinct magnetron heads it was possible to increase ion density gain up to 40% for Ti targets.     

Ion density increase in high power twin-cathode magnetron system

In contrast to conventional plasma deposition methods, High Power Impulse Magnetron Sputtering (HIPIMS) utilizes extremely high power inputs in short pulses, providing for the discharge current densities up to several A/cm². High ion densities are observed not only during the plasma on-time, but also within the afterglow period. Once ions are generated, they can contribute to the peak ion density of the next pulse if the off-time between the pulses is sufficiently small. When the HIPIMS cycle contains two pulses, separated by a short plasma off-time and followed by a long afterglow period, the peak ion density for the second pulse can be 5–7 percents higher than for the first pulse. With a dual cathode system and time-shifted pulsing with distinct magnetron heads it was possible to increase ion density gain up to 40% for Ti targets.     

Microstructure and mechanical properties of nanocrystalline nickel prepared by pulse reverse microelectroforming

Nanocrystalline nickel was produced by pulse reverse microelectroforming. The pulse microelectroforming was also performed for the comparative purposes. The surface morphology and microstructure of electroformed nickel layers were investigated by scanning electron microscopy and X-ray diffractometry. The microhardness of nickel layers was measured with a Vickers microhardness tester. The friction and wear experiments for nickel layers were performed on a friction and wear tester. The results indicate that the nickel layers prepared by pulse reverse microelectroforming exhibit higher density and their grain sizes in the nanometer range. The nickel layers with fine grains, high microhardness and better wear resistance are obtained at positive current density of 20?A/dm² and negative current density of 2?A/dm². The microhardness and wear resistance of nickel layers are improved as the positive and negative current densities are increased.     

脉冲放电工艺参数对TiC涂层形成的影响

采用液相脉冲放电技术对机械切削加工工具材料表面进行改性,具有很大的经济效益.将高熔点金属Ti电极置入含碳的液相介质中,利用脉冲放电所产生的低温高能等离子体在45钢基体上沉积TiC陶瓷涂层.讨论了脉冲放电工艺参数对涂层形成与涂层硬度的影响.结果表明:脉冲宽度和峰值电流是影响涂层沉积的主要因素,脉冲间隔和放电沉积时间对涂层厚度有影响,而对涂层的硬度几乎没有影响;在小峰值电流(8 A)和窄脉宽(12 μs)的条件下,可以获得高硬度的TiC涂层.     

Preparation of Ni nanoparticle-TiO2 nanotube composite by pulse electrodeposition

A Ni/TiO₂ nanocomposite was successfully prepared by a pulse electrodeposition (PED) technique. Highly-ordered TiO₂ nanotube arrays fabricated by anodization were employed as a substrate and loaded with Ni nanoparticles by PED. The influence of pulse electrodeposition parameters was investigated on the morphology of nickel electrodeposits. The nanocomposite was characterized by field emission scanning electron microscopy (FESEM) and X-ray diffraction (XRD). The results indicated that Ni nanoparticles with average size ranging from 19 to 84 nm were obtained by changing electrodeposition parameters. At constant current off-time (t_off) and pulse time of both negative and positive currents, the particle size decreased asymptotically with increasing amplitude of both negative and positive current. A progressive decrease of the particle size was observed with increasing current off-time at constant amplitude and pulse time of both negative and positive current. Increase in the deposition time at constant current off-time, amplitude and pulse time of both negative and positive current resulted in particle growth.     

脉冲电流处理对轧制316L不锈钢的快速强化

目的 探究不同参数的脉冲电流处理(EPT)对轧制316L不锈钢拉伸性能、显微硬度及微观组织的影响。方法 将轧制的316L不锈钢作为原始样，调节流过样品的脉冲电流密度，分别为130、170、190、260、310 A/mm²，分析脉冲电流密度与其拉伸性能和显微硬度的关系。结果 轧制316L不锈钢的抗拉强度和显微硬度随着脉冲电流密度的增大呈现先增大后减小的趋势，其中当脉冲电流密度为170 A/mm²时达到峰值，抗拉强度由1 485 MPa提升到1 625 MPa，同时显微硬度也由431HV增大到473HV。通过电子背散射衍射分析微观组织可知，与原始样相比，经过脉冲电流处理的样品晶粒尺寸明显减小，马氏体含量明显增多，脉冲电流处理可以促使微观组织快速均匀化。结论 脉冲电流处理可以在短时间内实现轧制316L不锈钢组织的均匀化调控，有效改善轧制316L不锈钢的微观组织，减少轧钢形变织构，促使参与的奥氏体转变为马氏体，使微观组织趋于稳定，同时还可以使轧制316L不锈钢晶粒快速细化，达到细晶强化的效果，有效提高整体抗拉强度和显微硬度。     

Surface modification of WC-Co alloy using Al and Si powder through WEDM: A thermal erosion process

This paper presents the surface modification of WC-Co alloy with the use of aluminum and silicon powder in wire electric discharge machining (WEDM) process. A separate attachment with the stirrer is used to mix the metal powder in the dielectric, which is further supplied by a pump at the workplace continuously. The effects of different process parameters like peak current, pulse on-time, pulse off-time and servo-voltage are investigated on the material transfer, crack formation and white-layer formation with the help of Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Spectroscopy (EDS) analysis. It was observed that silicon powder enhances the surface quality (4?µm white layer) compared with aluminum (6?µm white layer) powder. The white-layer thickness without the use of metal powder was around 14?µm. The cracks density after the addition powders reduces significantly.     

Generation of Si:H nanoparticles by a combination of pulse plasma and hydrogen gas pulses

Si:H nanoparticles have been generated from 3 nm to 500 nm in count mean diameter (CMD) using a plasma chemical vapor deposition (CVD) system. In the present work, the nanoparticles are synthesized using cold plasma in order to get monodispersed size distribution with a combination of square wave modulated RF pulse plasma and a hydrogen gas pulse for better control of their size. The size of synthesized nanoparticles was measured by scanning mobility particle sizer (SMPS). The synthesis was carried out using pulse plasma with on-time of 1 s and off-time of 4 s. During 1 s on-time of plasma we added hydrogen gas pulses varying from 0.1 s to 0.9 s. Our results show that by utilizing dual pulse plasma and by controlling hydrogen gas pulse on-time we achieved smaller diameter Si nanoparticles. Hence, it is easier to generate smaller nanoparticles which generally have quantum effect and be utilized for various applications especially in solar cell application.     

Synthesis of bulk nanocrystalline nickel by pulsed electrodeposition

Square-wave cathodic current modulation was used to produce nanocrystalline nickel electrodeposits with grain sizes in the range 40–10 nm from saccharin-containing Watts-type baths. The optimum plating conditions to synthesize nanocrystals, namely pulse on- and off-time and peak current density, as well as bath pH and temperature, were identified. At these plating conditions, the grain size of the electrodeposits was found to decrease with increasing saccharin concentration in the bath. The preferred orientation of the deposits progressively changed from a strong (2 0 0) fibre texture for a saccharin-free bath to a (1 1 1) (2 0 0) double fibre texture for a bath containing 10 gl^–1 saccharin. Transmission electron microscopy showed that the electrodeposits consist of uniform structure with narrow grain-size distribution. These deposits, as expected, were found to contain co-deposited sulphur and carbon impurities.