共查询到18条相似文献,搜索用时 109 毫秒
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铜合金材料作为高新技术产业的主流材料,需同时具备高强高导的性能.但是根据不同的应用环境,在保持高导电率的前提下如何选择合适的强化方法是制备铜合金的瓶颈.据研究可知,合金化法(形变强化、时效强化、固溶强化、细晶强化)和复合材料法(人工复合材料法、自身复合材料法)可以提高铜合金材料强度,但对其导电率有一定的影响.通过添加稀土元素、快速凝固法或大塑性变形等强化方法,有望获得高强度、高导电率的铜合金.本文着重探讨了合金化法和复合材料法的强化机理及其优缺点,并对铜合金的研究热点进行讨论和展望. 相似文献
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高强度、高导电铜合金及铜基复合材料研究进展 总被引:18,自引:9,他引:18
概述了高强度、高导电铜合金及铜基复合材料的研究现状,介绍了此类材料的强化机理、制备方法、组织、性能特点,指出:传统析出强化型铜合金具有较高的强度和导电性,且制备工艺较简单,适于用作各类电连接器件材料,今后此类材料应注重综合利用各种强化手段和多元合金化,以提高性能,降低成本;弥散强化铜(DSC)在高温应用领域有显著优势,但存在工艺复杂、性能不稳定等问题;形变铜基复合材料具有较前两者更为优异的性能,代表了高强度、高导电铜基导电材料的发展方向,但制备工艺复杂,应用受到限制。 相似文献
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高强高导铜合金具有优良的综合性能,在众多领域有着广泛应用。概述了高强高导铜合金的常用强化方法,分析了各种方法对铜合金性能的影响。介绍了高强高导铜合金的研究热点,包括稀土对高强高导铜合金性能的影响、剧烈塑性变形法、快速凝固技术、纳米孪晶强化。对高强高导铜合金的发展趋势作出了展望。 相似文献
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F. Lopez J. Reyes B. Campillo G. Aguilar-Sahagun J. A. Juarez-lslas 《Journal of Materials Engineering and Performance》1997,6(5):611-614
Rapid solidification has been employed to develop high-strength/high-conductivity copper alloys, because it offers advantages
not achievable by conventional ingot metallurgy practice. The effect of rapid solidification on mechanical properties and
electrical conductivity on copper alloys (with and without heat treatment) has been studied. Results indicated that alloys
of the Cu-Cr-Zr type, rapidly solidified and aged, show a good combination of electrical conductivity [45.82 × 106(l/Ω · m)] and microhardness Vickers (24.46 × 106 Pa) values. These values are superior to those of optimally aged conventional copper alloys for resistance welding electrode
applications. 相似文献
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Dr. James G. Schroth Ph.D. Mr. Vjekoslav Franetovic M.S. 《JOM Journal of the Minerals, Metals and Materials Society》1989,41(1):37-39
In the development of heat-resistant, high-conductivity copper alloys, beneficial properties may be obtained through the application of mechanical alloying. Mechanical alloying has been applied to copper-base materials with the ultimate goal of obtaining improved elevated-temperature performance through oxide dispersion strengthening in a complex matrix that has been solute- or precipitation-strengthened. Preliminary results indicate that a random distribution of fine oxide particles can be obtained in a copper matrix through high-energy attritor milling. 相似文献
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PENGLiming MAOXiemin XUKuangdi DINGWenjiang 《稀有金属(英文版)》2002,21(1):62-66
In order to develop a new type of contact cable with high strength and high electrical conductivity, Cu-Cr alloy series were selected as materials and Cu-Cr alloy castings were produced by means of directional solidification continuous casting (DSCC) process. The results show that the fibrillar strengthening phase, 13-Cr, orderly arranges among the copper matrix phase along the wire direction; and a microstructure of in-situ composite forms, which retains the basic property of good conductivity of the copper matrix and meanwhile obtains the strengthening effect of [3-Cr phase. The production technology as well as the mechanical property, electrical property, and synthetic property of the in-situ composite contact cables was discussed. 相似文献
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形变铜基原位复合材料具有超高的强度和良好的导电性,是高性能铜基材料发展的重要方向。综述了形变铜基原位复合材料的国内外研究现状,介绍了它的制备方法、组织演变、强化和导电机理,并对该类材料的研究方向进行了展望。 相似文献
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Al?high Si alloys were designed by the addition of Cu or Mg alloying elements to improve the mechanical properties. It is found that the addition of 1 wt.% Cu or 1 wt.% Mg as strengthening elements significantly improves the tensile strength by 27.2% and 24.5%, respectively. This phenomenon is attributed to the formation of uniformly dispersed fine particles (Al2Cu and Mg2Si secondary phases) in the Al matrix during hot press sintering of the rapidly solidified (gas atomization) powder. The thermal conductivity of the Al?50Si alloys is reduced with the addition of Cu or Mg, by only 7.3% and 6.8%, respectively. Therefore, the strength of the Al?50Si alloys is enhanced while maintaining their excellent thermo-physical properties by adding 1% Cu(Mg). 相似文献
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通过力学性能测试和TEM观察,对液相原位反应法制备的Cu-0.9Y2O3(体积分数,%)复合材料的凝固机理和强化机制进行研究。结果表明:在液相线温度上,熔融的Cu-Y合金在等温凝固的条件下,原位生成的纳米级Y2O3粒子均匀弥散分布在铜基体上,并没有在晶界附近聚集长大;通过不同强化机制定量计算Cu-0.9Y2O3复合材料的抗拉强度为593 MPa,与实测值568 MPa相当,其中,Orowan机制和切割机制作为主要的强化机制是共同存在的,其产生的强度增值分别为174和207 MPa,晶界强化作为辅助强化机制对材料的强度也有贡献。 相似文献