纤维方向对单向C/SiC复合材料磨削加工性能的影响

为了研究碳纤维编织复合材料的去除机理，探明纤维编织方向对磨削加工性能的影响，设计并制备了单向复合材料C/SiC，并沿纤维典型方向进行了磨削实验。结果表明，单向复合材料磨削时，切向磨削力和法向磨削力均呈如下规律：法向磨削＞纵向磨削＞横向磨削；磨削加工过程中表面粗糙度值呈如下规律：纵向磨削＞法向磨削＞横向磨削。对加工表面显微形貌的分析，揭示了陶瓷基复合材料微观多向去除机理。     

2.5D Cf/SiC刹车材料浮动磨削工艺试验研究

为研究2.5D C_f/SiC刹车材料的浮动磨削加工性能,设计单因素试验探究了砂轮转速、工作台调定压力和磨削深度对磨削力、表面粗糙度和表面形貌的影响规律,分析了磨削表面典型加工缺陷及材料去除机理。结果表明：砂轮转速、工作台调定压力和磨削深度对法向磨削力影响显著,对切向磨削力影响不大;工作台调定压力对表面粗糙度的影响程度最大。2.5D C_f/SiC刹车材料以脆性断裂去除方式为主,不同纤维方向上的加工缺陷形式存在差异,其主要加工缺陷为界面脱粘、微裂纹、基体破碎、纤维剥离及破碎。试验通过单因素方法分析得到了较好的表面质量,表面粗糙度Sa可达0.6μm左右。     

SiCp/Al复合材料旋转超声辅助磨削的试验研究

铝基碳化硅颗粒增强复合材料(SiCp/Al)有许多优异的特性,但其加工非常困难,限制了该种材料在工程中的应用。旋转超声辅助磨削加工非常适合中、高体分SiCp/Al复合材料的加工。针对增强体体积分数45%、增强颗粒尺寸3μm、基体材料A12的SiCp/Al复合材料进行了实验研究,分析了加工表面形貌、表面粗糙度和切削力随切削参数的变化规律。实验结果表明,工件加工表面质量较高,表面粗糙度Ra值在0.131~0.340μm之间;切削过程平稳,轴向切削力Fz值在23.33~51.31N。     

电镀金刚石砂轮端面磨削Al2024/SiCp试验研究

使用电镀金刚石砂轮对SiC颗粒增强Al2024复合材料进行端面磨削加工试验研究.研究结果表明,端面磨削加工能获得高质量的加工表面,在所采用的试验参数范围内,表面粗糙度在Ra为0.185μm和Ra为0.5121μm之间,已加工表面残余应力表现为压应力;磨削加工参数对切向力和法向力的影响不大,并且在不同的加工条件下均保持较小数值.轴向磨削力大于其他两个方向的磨削力,并且随着磨削深度的增大而明显增大.     

基于新型金刚石砂轮的Al2O3陶瓷磨削性能

利用粉末注射成形和真空钎焊技术制备了一种新型金刚石砂轮,制备的新型金刚石砂轮具有金刚石把持力大、金刚石微刃有序排布等特点。进行了基于新型金刚石砂轮的Al2O3陶瓷磨削性能研究。实验结果表明：相对于普通树脂结合剂金刚石砂轮,新型金刚石砂轮磨削Al2O3陶瓷的加工表面形貌完整性较好,宏观裂纹和表面损伤相对较少;表面粗糙度较小,当进给速度为40mm/s、磨削深度为40μm时,加工表面粗糙度Ra在0.68μm左右;在相同实验条件下,新型金刚石砂轮的磨削力减小了12%~17%,磨削温度降低了80~120℃。     

磨削参数对GH4169高温合金磨削表面特征影响研究

采用单因素试验法,使用不同特性的砂轮进行GH4169高温合金的外圆磨削试验,研究了单晶刚玉砂轮和CBN砂轮对GH4169高温合金磨削表面特征中表面粗糙度和表面形貌的影响,分析了各磨削工艺参数对表面粗糙度的影响规律,并分析了单晶刚玉砂轮和CBN砂轮切屑的形态,还检测了磨削加工的表面形貌。结果表明：采用粒度为80、中软级、陶瓷结合剂的单晶刚玉砂轮磨削GH4169高温合金时,其磨削表面粗糙度较小,表面特征较稳定;磨削进给运动轨迹构成了试件已加工表面形貌轮廓的主要特征。在工件速度为8~21.66m/min、砂轮速度为15~30m/s、径向进给量为0.005~0.02mm、纵向进给量为1.3~3.6mm/r范围内,可以保证表面粗糙度Ra在0.14μm以内。     

石英玻璃超精密磨削加工的表面完整性研究

为了实现石英玻璃的高效低损伤超精密磨削加工,研究不同粒度金刚石砂轮磨削石英玻璃的表面和亚表面质量,建立表面粗糙度与亚表面损伤深度之间的关系模型。通过石英玻璃磨削试验研究400#、1 500#、2 000#和5 000#金刚石砂轮磨削石英玻璃的表面微观形貌、表面粗糙度及其亚表面损伤深度,分析相应的材料去除方式;基于压痕断裂力学理论分析脆性域磨削石英玻璃时工件表面微观形貌和亚表面微裂纹的形成机理,建立表面粗糙度PV值和亚表面损伤深度SSD之间的定量关系。研究结果表明:随着砂轮粒度的减小,石英玻璃磨削表面的凹坑、微裂纹、深划痕等缺陷逐渐减少,表面粗糙度Ra和PV以及亚表面损伤深度SSD均随之明显减小,从400#砂轮磨削表面的R_a 274.0 nm、PV 5.35μm和SSD 5.73μm降低至5 000#砂轮磨削表面的Ra 1.4 nm、PV 0.02μm和SSD 0.004μm。500#和1 500#砂轮磨削表面的材料去除方式为脆性断裂去除,2 000#砂轮磨削表面的材料去除方式同时包括脆性断裂去除和塑性流动去除,但以塑性流动去除为主,5 000#砂轮磨削表面的材料去除方式为塑性流动去除;脆性域磨削石英玻璃的表面粗糙度PV与亚表面损伤深度SSD之间满足SSD=(0.627～1.356) PV~(4/3)的数学关系。     

电火花机械复合磨削反应烧结SiC陶瓷的表面特征

研究了基于电火花机械复合磨削技术加工的反应烧结碳化硅(RB-SiC)陶瓷的表面特征。用电火花机械复合磨削(EDDG)、电火花磨削(EDG)以及普通磨削(CG)三种方法加工RB-SiC陶瓷,并采用激光共聚焦显微镜和扫描电子显微镜对加工后的SiC陶瓷的表面粗糙度、表面形貌及微观裂纹进行测量和对比试验,获得了RB-SiC陶瓷的EDDG加工特性。实验显示:EDDG加工的RB-SiC陶瓷的表面粗糙度优于EDG加工的表面粗糙度,为0.214 9μm,但比CG加工的表面粗糙度0.195 6μm略差。对加工后的SiC陶瓷表面形貌观察显示,传统磨削加工后的表面存在明显划痕,EDG加工表面主要由放电凹坑组成,而EDDG加工表面同时存在放电凹坑和磨削划痕;另外,传统磨削表面也存在磨削裂纹和晶界裂纹,但EDG加工后的表面只存在热裂纹,而EDDG加工后的表面存在磨削裂纹和热裂纹,不过热裂纹可以用金刚石磨粒磨削去除。对比实验显示RB-SiC陶瓷的EDDG加工与EDG和CG加工获得了不同的表面特征。     

一维斜向超声振动辅助磨削滚动轴承钢工艺及试验研究

针对目前只有一维轴向、一维切向等振动方向不变的一维超声振动辅助磨削的情况,首次提出了一维斜向超声振动辅助磨削工艺方法。利用MATLAB对一维斜向超声振动辅助磨削磨粒的运动轨迹进行了模拟分析。建立了超声振动试验系统的动力学模型。通过对超声振动工作台的模态分析,研制了一维斜向超声振动辅助磨削试验系统,对不同角度下超声振动辅助磨削滚动轴承钢的磨削力及表面粗糙度值进行了研究,探究了磨削力及表面粗糙度值随超声振动方向的变化规律。多次试验结果表明,超声振动角度为67.5°附近的表面粗糙度值明显优于其他角度的表面粗糙度值,磨削力也有减小。对正交试验结果的极差分析得出：当超声振动角度为67.5°、砂轮速度为20m/s、工件速度为0.5m/min以及磨削深度为4μm时,加工后的工件表面粗糙度达到最低值,其中工件速度是影响表面粗糙度的最重要工艺参数。     

单层钎焊金刚石磨头干式加工AlSiC复合材料试验研究

使用单层钎焊金刚石磨头对SiC含量为20%与50%(体积分数)的AlSiC复合材料进行磨削加工,对比了单层钎焊金刚石磨头加工两种AlSiC复合材料的磨削力,分析了复合材料被加工表面微观形貌及材料去除机理,观察了磨屑形貌,并对钎焊金刚石磨粒的磨损形式进行了分析。结果表明,SiC含量为50%的AlSiC复合材料的磨削力小于SiC含量为20%的复合材料,20%SiC复合材料的磨削力波动较50%SiC复合材料的更平稳;钎焊金刚石磨头干式加工AlSiC复合材料时,20%SiC的AlSiC复合材料以塑性去除为主,且Al基体易受热软化而涂覆在被加工材料表面,磨屑为较窄的锯齿状;而50%SiC的AlSiC复合材料在加工中以脆性去除为主,表面缺陷以SiC颗粒的断裂、破碎和粉末化为主要特征,其磨屑呈块状和颗粒状,加工20%SiC的复合材料时金刚石磨粒易形成铝涂覆层,而加工50%SiC的复合材料时金刚石磨粒以磨粒磨损和微破碎为主。     

Optimal designing of multiple deferred state sampling plan for assuring percentile life under Weibull distribution

Continuous carbon fiber reinforced silicon carbide ceramic matrix composites (C/SiC) are promising materials in aerospace and space optical fields due to their excellent properties. However, poor machining quality resulted from surface/subsurface breakage is hard to meet precision requirements of some components. With an objective to study surface/subsurface breakage formation mechanism and improve machining quality of C/SiC composites, ultrasonic assisted grinding (UAG) and conventional grinding (CG) tests with a defined diamond grain distribution brazed grinding wheel were conducted. The surface/subsurface breakage types and formation mechanism were studied by comparative analysis of grinding force, micro-morphology of grinding surface/subsurface, and ground surface roughness. The results showed that main breakage types of different angle fibers in ground surface were lamellar brittle fracture and pit group originating from fracture and pullout of fibers, while breakage types of different angles fibers in ground surface were brittle fracture. Compared to CG, these breakages were reduced by UAG in varying degrees because it can reduce grinding force that determined fiber breakage. Consequently, because of the lower fiber breakages, the ground surface roughness Sa obtained by UAG was lower than CG and the maximum reduction was 12%.     

单向C/SiC复合材料平面磨削的磨削力模型研究

为探究编织陶瓷基复合材料磨削力模型,探明材料去除机理,设计并制备了一种单向C/SiC复合材料。采用特殊的平面磨削实验,沿纤维典型方向进行磨削,同时结合多指数拟合方法确立了磨削力模型。研究结果表明：磨削参数对磨削力的影响较为显著,其中磨削力随着砂轮转速的增大而减小,随着磨削深度和进给速度的增大而增大。沿3种典型方向磨削时,磨削力从大到小依次为：法向、纵向、横向。利用模型优度分析,验证了模型预测单向C/SiC复合材料磨削力的可靠性。     

Effect of machining parameters on the milling process of 2.5D C/SiC ceramic matrix composites

Abstract

The C/SiC ceramic matrix composites are widely used for high-value components in the nuclear, aerospace and aircraft industries. The cutting mechanism of machining C/SiC ceramic matrix composites is one of the most challenging problems in composites application. Therefore, the effects of machining parameters on the machinability of milling 2.5D C/SiC ceramic matrix composites is are investigated in this article. The related milling experiments has been carried out based on the C/SiC ceramic matrix composites fixed in two different machining directions. For two different machining directions, the influences of spindle speed, feed rate and depth of cut on cutting forces and surface roughness are studied, and the chip formation mechanism is discussed further. It can be seen from the experiment results that the measured cutting forces of the machining direction B are greater than those of the in machining direction A under the same machining conditions. The machining parameters, which include spindle speed, feed rate, depth of cut and machining direction, have an important influence on the cutting force and surface roughness. This research provides an important guidance for improving the machining efficiency, controlling and optimizing the machined surface quality of C/SiC ceramic matrix composites in the milling process.     

Ceramic Response to High Speed Grinding

Material response was investigated with respect to normal grinding forces, surface roughness, and removal mechanisms in grinding of alumina, silicon carbide, silicon nitride, and zircona with a resin-bond 160 μm grit diamond wheel at the grinding speeds of upto 160 m/s. The results reveal that the normal grinding forces decreased significantly with an increase in grinding speed; they also increased substantially with an increase in a complex relation of the ceramic hardness and toughness. High speed grinding produced a reduction in surface roughness for silicon carbide and alumina but gave no improvement for zirconia and silicon nitride. Also the surface roughness in high speed grinding was found to be material-dependent that the ground silicon nitride exhibited much smoother than the other ground ceramics. The influence of grinding speed on material removal mechanisms was analyzed in terms of grinding geometry and ceramic material properties.     

SiCf/SiC陶瓷基复合材料单颗磨粒磨削试验研究

对碳化硅纤维增强碳化硅陶瓷基复合材料（SiCf/SiC）进行了单颗磨粒磨削试验,研究了脆性去除模式下磨削中侧边崩碎规律。研究结果表明：磨削SiC基体时,基体内裂纹易引发磨削中大块侧边崩碎;磨削纤维时,侧边崩碎宽度随纤维与磨削方向夹角的增大而增大;磨削90°纤维时,提高磨削速度可减小侧边崩碎程度;以50 m/s和90 m/s的磨削速度磨削造成的侧边崩碎宽度比以20 m/s磨削时的侧边崩碎宽度分别小30%和60%;在试验参数范围内,增大磨削用量不会增大磨削中侧边崩碎程度,但可以提高材料去除率。     

A study on the surface grinding of 2D C/SiC composites

This paper aims at studying the machinability of 2D C/SiC composite with 0°/90° woven carbon fibers using a resin bond diamond grinding wheel. The effects of grinding parameters on the grinding force, force ratio, specific grinding energy, surface topography, surface roughness, and grinding chips were investigated. And the grinding mechanism of the 2D C/SiC composite was discussed by analyzing the chip components and material removal characteristics. The results indicate that the grinding force and surface roughness increase with the increase of feeding speed and depth of cut, while decrease with the increase of wheel speed. The force ratio F _n /F _t and the specific grinding energy of 2D C/SiC composite were lower than those of conventional ceramics under the defined experimental conditions. Additionally, the grinding chips were composed of carbon powder, carbon fiber fragments, and SiC matrix debris. It can be deduced that the dominant removal mechanism of the 2D C/SiC composite was brittle fracture mode during grinding process.     

石英玻璃的热辅助高效塑性域干磨削

为了提高大口径石英玻璃光学元件的加工效率,提出了热辅助塑性域超精密磨削石英玻璃的新方法。分析了石英玻璃的热辅助塑性域磨削机理,通过理论推导得出磨削深度对磨削区表面最高温升的影响规律。采用陶瓷结合剂立方氮化硼(CBN)砂轮对石英玻璃进行干磨削,利用磨削热改善磨削区石英玻璃的力学性能,实现了石英玻璃的高效塑性域磨削。通过磨削实验研究了不同磨削深度对石英玻璃表面粗糙度(Ra)和亚表面损伤深度的影响。实验结果表明,随着磨削深度的增加,Ra和亚表面损伤深度反而降低。当磨削深度为5μm,大于粗磨表面的裂纹深度时,获得了Ra值为0.07μm的光滑无裂纹的塑性域磨削表面。通过扫描电镜观察研究了砂轮的磨损机理,结果显示陶瓷结合剂CBN砂轮塑性域干磨削石英玻璃时,砂轮以磨耗磨损为主,该结果为研究新型的陶瓷结合剂CBN砂轮提供了依据。     

垂直式超硬砂轮圆弧修整器设计与砂轮修整

针对圆弧形超硬砂轮修整难度大、修整精度低的问题，对树脂结合剂圆弧形金刚石砂轮进行了精密修整研究。设计制造了一种垂直式超硬砂轮圆弧修整器，通过修整试验研究了不同粒度的圆弧形砂轮在修整前后表面粗糙度、弧形精度、圆度、表面形貌的变化情况。砂轮修整前后对氮化硅陶瓷轴承套圈沟道进行了磨削，并测量了磨削后的轴承套圈沟形精度。研究结果表明：相比修整前，修整后砂轮表面粗糙度平均值由1.731 8 μm减小至0.772 4 μm，减小了55.4%；弧形精度平均值由33.604 7 μm减小至8.527 6 μm，减小了74.6%，修整后4个砂轮的弧形精度更加稳定，且随着砂轮粒度的减小，弧形精度略有减小趋势；砂轮圆度平均值由43.721 μm减小至18.002 μm，减小了58.8%，修整使大量新的磨粒露出。所设计的垂直式超硬砂轮圆弧形修整器可对圆弧砂轮进行精密修整，可改善圆弧形砂轮的弧形精度及圆度，修整后砂轮磨削的轴承套圈沟形精度得到了大幅提高。     

新型反应烧结碳化硅陶瓷的超精密磨削

介绍了一种可用作光学反射镜材料的新型反应烧结碳化硅。采用超精密磨床结合在线电解修整的磨削方法对新型反应烧结碳化硅进行磨削，研究了不同磨粒尺寸、不同结合剂以及不同形状砂轮对磨削面性状的影响，分析了磨削面微段差的形成机理。获得了表面粗糙度Ra=0．57nm的超平滑镜面。