共查询到20条相似文献,搜索用时 250 毫秒
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《机械工程学报》2017,(17)
基于立铣刀螺旋槽的加工原理,根据安装参数确定砂轮磨削螺旋槽的磨削接触区;分析螺旋槽磨削接触区内砂轮与工件的等效直径和有效速度,发现立铣刀螺旋槽磨削既有外圆磨削的特点也有内圆磨削的特征。考虑硬质合金工件材料塑性隆起和砂轮速度与工件速度之间夹角对表面粗糙度的影响,建立立铣刀螺旋槽磨削表面粗糙度计算模型,分析砂轮直径、砂轮速度和工件进给速度对磨削表面粗糙度的影响。在五轴联动数控工具磨床上使用金刚石平行砂轮进行螺旋槽磨削试验。使用超景深显微镜对立铣刀螺旋槽磨削表面形貌进行分析,使用白光干涉仪测量螺旋槽磨削表面粗糙度大小。试验结果验证了硬质合金立铣刀螺旋槽磨削表面粗糙度计算模型的正确性。该模型为其他整体式刀具螺旋槽磨削表面粗糙度的计算提供了理论参考。 相似文献
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《光学精密工程》2021,29(7)
柱面微透镜阵列的加工精度要求高,加工效率低,采用具有微细轮廓结构的成形砂轮进行磨削加工能够极大地提高加工效率。为了预测成形砂轮磨削工件的面形误差和表面粗糙度,建立了成形砂轮磨削仿真模型。通过滤波方法分析和模拟微细结构成形砂轮的磨粒突出高度的偏态分布特征,结合实测的砂轮的轮廓形状和跳动完成了整体的空间砂轮的重构,同时建立了砂轮表面磨粒的磨削运动学模型,模拟出工件磨削加工后的表面形貌。最后,开展磨削实验验证了仿真模型的有效性。对比仿真与实验结果可知,面形误差PV值的偏差为5.78%,Ra值的偏差为17.3%,Rz值的偏差为12.9%。该磨削仿真模型能有效预测磨削表面的面形误差和表面粗糙度。 相似文献
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外圆磨削砂轮形貌仿真与工件表面粗糙度预测 总被引:1,自引:0,他引:1
对磨削砂轮形貌、外圆磨削过程及工件表面形貌进行了仿真,实现了对工件表面粗糙度的预测,并对仿真模型进行了验证。采用Johnson变换和Gabor小波变换,实现了高斯域和非高斯域的转化,在随机域内对磨削砂轮形貌进行了仿真。根据外圆磨削运动过程,通过对砂轮和工件相互作用过程的分析,建立了磨粒运动轨迹方程和工件形貌方程,在考虑磨粒切削、耕犁与摩擦作用的条件下,对外圆磨削过程进行了仿真。建立了外圆磨削模型,实现了对加工工件形貌的仿真和粗糙度预测。 相似文献
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以TC4钛合金为研究对象,在乳化液条件下采用金刚石砂轮对TC4钛合金进行平面磨削试验,对比分析在不同粒度和磨削用量下的磨削表面粗糙度、显微硬度、表面层微观组织及表面残余应力的变化规律.结果 表明:砂轮线速度和磨削深度对零件表面粗糙度和显微硬度的影响比较显著;磨削深度对表面残余应力的影响最大,工件速度次之;从工件表面层微观组织以及砂轮粒度对工件表面粗糙度的影响看,砂轮粒度号越大,砂轮磨削的工件表面质量越好.金刚石砂轮在乳化液条件下磨削TC4钛合金,磨削工件表面均为残余压应力,有利于提高零件的寿命. 相似文献
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提出了用声发射(AE)信号在线监测砂轮状态的方法.利用该方法可以监测工件材料、加工要求和磨削参数经常变化环境下的砂轮钝化程度和破碎情况;并采用神经网络建立了传感器信号与砂轮状态之间的非线性关系. 相似文献
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采用不同含水率的酚醛树脂金刚石砂轮,对硬质合金YG8进行了平面磨削试验,研究了含水率变化导致的砂轮磨削性能变化对磨削比、磨削功率和工件表面粗糙度的影响规律,并对砂轮磨削后表面形貌进行了观测,揭示了酚醛树脂金刚石砂轮磨削性能随含水率变化的规律。试验结果表明:含水率越高,砂轮的组织均匀性就越差,机械性能和磨削性能不稳定且总体趋势变差。磨削比、Ra值在一个耐用度周期内波动较大,不适合精密磨削加工。为了获得良好且稳定的粗糙度表面,应选用含水率小于0.3%的树脂原材料制作砂轮。含水率较低时(<0.3%)磨削功率相对稳定,砂轮表面磨粒脱落率低。但不是含水率越高时磨削性能越差,砂轮的磨削比、磨削钝化速度、粗糙度与含水率不是线性关系。 相似文献
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用声发射(AE)信号在线监测砂轮状态的方法,可以监测工件材料、加工要求和磨削参数经常变化环境下砂轮钝化程度和破碎;并采用神经网络建立传感器信号与砂轮状态之间的非线性关系. 相似文献
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Yanlong Cao Jiayan Guan Bo Li Xiaolong Chen Jiangxin Yang Chunbiao Gan 《The International Journal of Advanced Manufacturing Technology》2013,66(5-8):937-945
Grinding is an important means of realizing precision and ultra-precision machining. Vibration caused by an unbalanced grinding wheel in grinding process has a significant impact on the quality of workpiece surface. However, the effect of wheel surface topography and/or the relative vibration between grinding wheel and workpiece are not considered in most researches. Taking the relative vibration between grinding wheel and workpiece into account, alongside the abrasive grain trajectory equation, a new analysis and simulation model for surface topography of the grinding process is established. The model for the topography of the grinding wheel surface is first studied, and subsequently, a new simulation model for surface topography of the grinding process is proposed. Case studies are performed at the end, and the influence of grinding wheel vibration amplitude, wheel grit number, as well as grinding parameters on the surface waviness and roughness is discussed. The simulation results could be used to optimize the actual grinding process to improve the ground surface quality or predict the surface topography by given grinding parameters. 相似文献
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金刚石砂轮磨削结构陶瓷过程中,所产生的磨削热是影响工件表面质量的关键因素之一,而磨削参数对工件表层温度分布有重要影响。本文采用有限元法,通过两种陶瓷材料对比分析,运用ANSYS软件对磨削温度场进行了仿真研究,利用仿真模型对影响因素作了分析。 相似文献
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点磨削属于外圆磨削技术的一种,其砂轮与工件轴线之间存在变量夹角α,加工过程中磨粒的运动轨迹发生改变。为探索α对工件表面粗糙度的影响,利用砂轮与工件之间的运动关系及坐标转化,将磨粒运动函数等效为抛物线,得出点磨削的切削路径。基于砂轮表面磨粒分布状态,沿砂轮轴向扩展有效干涉痕迹,得到工件的三维几何仿真形貌。将45钢淬火后作为工件材料,选择典型磨削参数,利用试验对模型进行验证。结果表明:仿真与实际工件微观形貌呈现相似特征,两形貌表面高度概率密度分布十分吻合,在不同磨削速度下,两结果之间平均相差7.8%。当α在0°~4°变化时,Ra的浮动范围小于0.1μm,工件表面粗糙度不会发生明显改变,几何仿真模型为实际磨削工件形貌分析提供了一种辅助和验证方法。 相似文献
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Wafer rotational grinding is widely employed for back-thinning and flattening of semiconducting wafers during the manufacturing process of integrated circuits. Grit cutting depth is a comprehensive indicator that characterizes overall grinding conditions, such as the wheel structure, geometry, abrasive grit size, and grinding parameters. Furthermore, grit cutting depth directly affects wafer surface/subsurface quality, grinding force, and wheel performance. The existing grit cutting depth models for wafer rotational grinding cannot provide reasonable results due to the complex grinding process under extremely small grit cutting depth. In this paper, a new grit cutting depth model for wafer rotational grinding is proposed which considers machining parameters, wheel grit shape, wheel surface topography, effective grit number, and elastic deformation of the wheel grit and the workpiece during the grinding process. In addition, based on grit cutting depth and ground surface roughness relationship, a series of grinding experiments under various grit cutting depths are conducted to produce silicon wafers with various surface roughness values and compare the predictive accuracy of the proposed model and the existing models. The results indicate that predictions obtained by the proposed model are in better agreement with the experimental results, while accuracy is improved by 40%–60% compared to the previous models. 相似文献
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R. Saravanan M. Sachithanandam 《The International Journal of Advanced Manufacturing Technology》2001,17(5):330-338
A genetic algorithm (GA) based optimisation procedure has been developed to optimise the surface grinding process using a
multi-objective function model. The following ten process variables are considered in this work: wheel speed, workpiece speed,
depth of dressing, lead of dressing, cross-feedrate, wheel diameter, wheel width, grinding ratio, wheel bond percentage, and
grain size. The procedure evaluates the production cost and production rate for the optimum grinding conditions, subject to
constraints such as thermal damage, wheel-wear parameters, machine-tool stiffness and surface finish. A worked example is
used to illustrate how this procedure can be used to produce optimum production rate, low production cost, and fine surface
quality for the surface grinding process. 相似文献
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为充分发挥轴承钢GCr15优越的材料性能,保证GCr15轴承等产品的加工质量和加工效率,开展了高速外圆磨削参数优化研究。选用立方氮化硼(CBN)砂轮进行GCr15的高速外圆磨削响应曲面试验,根据试验结果建立磨削力、磨削温度、变质层深度等磨削结果的回归模型。结合回归模型与磨粒的最大未变形切屑厚度模型,综合分析砂轮线速度、工件速度、磨削深度等磨削参数对磨削结果的影响规律。以磨削结果综合最小为目标,进行磨削参数的多目标优化,通过试验验证优化模型和优化结果的正确性。 相似文献