Effects of Bi and rare earth metal on the microstructure and properties of Zn-based high-temperature solder

A novel Zn-based high-temperature solder was developed to join copper/steel at moderate temperature. The effects of Bi and rare earth metal on the microstructures, wettability of solders as well as the mechanical properties of solder joints were investigated. The results indicated that with the addition of Bi into Zn-Cu-Sn (ZCS) alloy, significant improvement in wettability is realized. When the content of Bi element is 1.5 wt. % in the solder, the spreading area researched over 200 mm². Further more, with the addition of RE, refined primary ε-CuZn₅ phases were formed and the shear strength of the solder joint was largely improved.     

CuAgNi钎料钎焊钨基粉末合金接头高温行为的研究

采用OM、SEM和XRD观察了CuAgNi钎料及其钎焊钨基粉末合金接头的微观组织,对比研究了CuAg和CuAgNi钎料钎焊钨基粉末合金接头的高温剪切强度,进一步分析了CuAgNi钎料钎焊接头的热疲劳性能。研究表明：Ni对钎焊接头室温和高温下的剪切强度均有促进作用;接近室温(50℃)时,钎焊接头剪切强度为214.7MPa,比不添加Ni时增加了32.37%;400℃时,剪切强度为121.9MPa,比未添加Ni时增加了91.67%;且当温度超过300℃时,结合界面的氧化使接头的结合强度急剧下降。热疲劳试验中,随着热循环次数的增加,裂纹在α-Ag和β-Cu结合处萌生后逐步扩展,使接头剪切强度逐步降低。