湿度对铝合金接头裂纹敏感性的影响规律及机理

采用能谱、扫描电镜和X射线衍射等测试方法,研究了湿度对铝合金接头裂纹敏感性的影响规律及机理. 结果表明,在40% ~ 80%相对湿度的条件下,改良的铝合金鱼骨试件接头表面可见结晶裂纹和液化裂纹;随着湿度的增大,接头裂纹敏感性逐渐提高,其中结晶裂纹的敏感性逐渐降低,液化裂纹的敏感性逐渐提高;湿度增大,铝合金焊缝晶粒逐渐细化,裂纹扩展阻力升高,焊缝组织细化导致结晶裂纹敏感性降低;同时提高湿度,电弧温度降低,焊接热输入量减少,液态金属越发不易在晶界处形成连续的网状薄膜结构,也导致结晶裂纹敏感性降低.     

Zn基钎料钎焊烧结NdFeB与DP1180钢接头微观组织及性能

采用Zn-5Sn-2Cu-1.5Bi(ZSCB)钎料实现了烧结NdFeB永磁材料(NdFeB)与DP1180钢的钎焊连接。在惰性气氛控制的高频感应炉中进行钎焊,采用OM、SEM、EDS、微区XRD和NIM-2000H磁性测试仪等手段分析了接头界面的微观组织结构、NdFeB的磁性能和接头剪切强度。结果表明,NdFeB与ZSCB钎料形成Nd-Fe-Zn和Fe-Zn冶金结合,FeZn13和Fe3Zn10相在DP1180钢侧的界面处形成。焊接温度对NdFeB的磁性能影响较小。与传统方法的粘接相比,接头的剪切强度从32.50MPa提高到44.00MPa,提高了35.38%。由于NdFeB和ZSCB钎料之间的热膨胀系数差异很大,在接近NdFeB的反应层处产生较高的残余应力,导致接头从NdFeB界面处断裂。     

Effects of Bi and rare earth metal on the microstructure and properties of Zn-based high-temperature solder

A novel Zn-based high-temperature solder was developed to join copper/steel at moderate temperature. The effects of Bi and rare earth metal on the microstructures, wettability of solders as well as the mechanical properties of solder joints were investigated. The results indicated that with the addition of Bi into Zn-Cu-Sn (ZCS) alloy, significant improvement in wettability is realized. When the content of Bi element is 1.5 wt. % in the solder, the spreading area researched over 200 mm². Further more, with the addition of RE, refined primary ε-CuZn₅ phases were formed and the shear strength of the solder joint was largely improved.     

钎焊立方氮化硼BCu80Ni5SnTi活性钎料的组织与性能

研制一种适合钎焊立方氮化硼与45钢异质材料的新型高温BCu80Ni5SnTi活性钎料,采用SEM、EDS及XRD对BCu80Ni5SnTi系活性钎料的微观组织及钎焊接头力学性能进行研究.结果表明:适合钎焊c-BN的活性钎料成分为Cu78～81Ni5～6Sn3～5.5Ti10～12(质量分数,%),固相线温度为858.4 ℃,液相线温度为874.8℃;钎料组织由α-Cu固溶体、Ni固溶体、Cu-Sn共晶及少量Cu_4Ti_3、Cu_3Ti_2、Cu_3Sn、CuSn和Ni_(17)Sn_3等化合物组成;该钎料对c-BN的润湿性较好,润湿角为28°～30°,钎焊c-BN与45钢的接头强度为210～230 MPa;新型钎料钎焊冶金特性较好,钎焊接头界面实现冶金结合.     

Microstructures and properties of welded joint of TiNi shape memory alloy and stainless steel

The fracture characteristics of the joint were analyzed by means of scanning electron microscope(SEM).Microstructures of the joint were examined by means of optical microscope, SEM and an image analyzer. The results show that the tensile strength of the inhomogeneous joint of TiNi shape memory alloy and stainless steel is lower than that of the homogeneous joint and a plastic field appears in the heat affected zone on the side of TiNi shape memory alloy. Because TiNi shape memory alloy and stainless steel melted, a brittle as-cast structure was formed in the weld. The tensile strength and the shape memory effect of the inhomogeneous joint are strongly influenced by the changes of composition and structure of the joint. Measures should be taken to reduce the base metal melting and prevent the weld metal from the invasion by O for improving the properties of the TiNi shape memory alloy and stainless steel inhomogeneous joint.     

TiNi形状记忆合金与不锈钢钎焊接头的微观组织与性能

采用含Ag50％~68％、Cu10％~30％、Zn12％~20％、Sn0％~10％的银基钎料,通过激光钎焊,改变钎焊 有效热输入(激光输出功率和钎焊时间),研究了TiNi形状记忆合金与不锈钢异质钎焊接头的微观组织和性能。结 果表明:AgCuZnSn钎料对TiNi形状记忆合金和不锈钢的润湿性较好,钎焊接头界面平整、致密,与TiNi形状记 忆合金形成的界面反应层较窄,而与不锈钢形成的界面反应层较宽。钎焊有效热输入对TiNi形状记忆合金热影响 区组织和性能影响较大。钎焊有效热输入量过高,将导致TiNi形状记忆合金侧热影响区组织晶粒粗大、硬度降低、 塑性提高。严格控制钎焊工艺参数可以获得具有较高抗拉强度、形状记忆效应和超弹性的TiNi形状记忆合金与不 锈钢钎焊接头。     

Ti／ZrN／瓷界面微观结构和力学性能

通过磁控溅射法在纯钛表面溅射了一层ZrN涂层,研究了Ti/ZrN/瓷界面组织和力学性能.结果表明,Ti/瓷界面由富含Ti,Si,O元素的反应层和钛表面氧化层组成.钛表面溅射ZrN涂层后,Ti/瓷界面的连接转变为Ti/ZrN/瓷界面的连接,ZrN涂层能有效地防止钛表面生成过厚的氧化层.Ti/ZrN/瓷结合强度为29.2MPa,与Ti/瓷结合强度23.5MPa相比,提高了24.3%.     

非连续增强铝基复合材料连接新工艺

介绍几种非连续增强铝基复合材料连接的新工艺，从不同途径改善了接头显微结构和提高接头力学性能，但仍存在一定问题，其目的旨在更多的工作者参与工艺完善和开发研究，加速先进材料焊(连)接技术革新，促进新材料应用．     

用纯金属Ni作中间层扩散连接铝基复合材料

采用纯金属Ni作中间层扩散连接氧化铝颗粒增强铝基复合材料(Al2O3P/6061Al),探究了连接温度和保温时间对接头显微结构与力学性能的影响.结果表明,连接温度610～620℃时,连接区主要由Al3Ni和Ni在Al中固溶体组成,Al3Ni含量随连接温度升高、保温时间延长而减少;连接温度630℃时,连接区主要由Al2O3颗粒和Ni在Al中固溶体组成,Al2O3颗粒偏聚于接头中心.连接温度620℃、保温时间5～120min条件下,接头抗剪强度68～93MPa,断裂于连接区与母材界面;连接温度630℃、保温时间5～120min条件下,接头抗剪强度93～97MPa,断裂于增强相偏聚区.