Whisker growth on SnAgCu–xPr solders in electronic packaging

The addition of rare earth Pr into Sn3.8Ag0.7Cu solder results in the formation of PrSn₃ phase, which can induce the whiskers growth. After several hours’ exposure at room temperature in air, different morphologies of whiskers appear in the regions of PrSn₃ intermetallic compounds. The Pr content and storage time are the main parameters for affecting the whiskers growth at ambient temperature. The oxidation mechanism of PrSn₃ phase was used to explain the whiskers growth, the compressive stress is proposed as the driving force for whisker growth.     

铜铝钎焊接头中的金属间化合物

本文对近年来钎焊铜铝异种材料的相关研究进行回顾,分析了在接头形成与服役时,焊缝中金属间化合物(IMCs)的形成与生长。结果表明,金属间化合物的形成与生长在接头形成与服役过程中是不可避免的。金属间化合物的形成和生长取决于铜铝之间以及与钎料之间的原子相互扩散。金属间化合物的形核和生长必须同时满足热力学与动力学条件。脆硬性金属间化合物容易引起应力集中,且其形成与生长会加剧扩散原子的消耗,因此金属间化合物的形成与生长是导致接头缺陷(如孔洞、空洞和裂纹)的主要原因之一。当界面处金属间化合物层的厚度超过2~5μm时,接头性能会急剧下降。影响金属间化合物生长与扩散和接头缺陷的主要因素有温度,导热性,接头设计,热输入和钎料成分等。以上因素主要通过改变原子扩散过程影响金属间化合物的形成与生长。目前,控制金属间化合物形成与生长的主要方法有控制接头热输入、优化接头设计和在钎料中添加第三元素等。     

FB3-F银钎剂去膜机理

研究了由H₃BO₃、K₂B₄O₇和KF（质量比为7:10:3）3种组分配制而成的银钎剂的去膜机理。结果表明：在700 ℃时,K₂B₄O₇或KF都不能单独去除Q235钢板表面的氧化膜,且KF会加快高温下钢表面的氧化速率;H₃BO₃能够去除Q235钢表面的氧化膜,然而其反应产物具有明显的非晶结构特征,并且流动性差。此外在700 ℃时,H₃BO₃与KF能够发生反应,其反应产物可以去除钢表面氧化膜。KF和K₂B₄O₇之间也能在700 ℃发生类似的反应,然而其反应产物非常坚硬。因此,在700 ℃时,H₃BO₃、K₂B₄O₇和KF混合钎剂能够与Q235钢板表面氧化膜反应,且反应产物具有明显的非晶特征。KF的加入将非反应性H₃BO₃-K₂B₄O₇二元体系转化为反应性KF-H₃BO₃-K₂B₄O₇三元体系。在这个三元体系中,KF不但对钢板没有腐蚀性,反而促进了氧化膜的去除。     

Sc,La对Al-Mg焊料中杂质元素偏聚的调控作用

采用金相显微镜、扫描电镜、能谱分析和X射线衍射仪,研究了添加微量钪、镧对铝镁焊料中杂质元素偏聚的调控作用. 结果表明,在铝镁焊料合金凝固过程中,铁、硅等杂质元素在晶界有偏聚效应,添加微量钪、镧可以降低铁、硅杂质在晶界的偏聚浓度. 钪与镧减轻杂质元素在晶界偏聚的效果存在差别,添加钪的合金比添加镧的合金晶界处杂质元素偏聚强度明显减弱. 造成这种差别的原因是,钪、镧对杂质元素偏聚的调控机制不同.     

热扩散对镀锡银钎料界面组织及熔化特性的影响

对带锡镀覆层的银钎料进行热扩散处理,采用差示扫描量热仪(DSC)、扫描电镜(SEM)、X射线衍射仪(XRD)研究热扩散工艺对其熔化温度和扩散界面组织、物相的影响. 结果表明,在扩散时间一定条件下,随着扩散温度升高,扩散界面层厚度增加;随着扩散温度升高或扩散时间延长,钎料的固、液相线温度均降低,熔化温度区间缩小;扩散界面层物相主要由棒状Ag₃Sn相和块状Cu₃Sn相组成;最佳热扩散工艺为220 ℃,24 h. 经最佳工艺处理后,扩散界面层厚度为9.1 μm,钎料中Sn含量为7.2%,此时钎料熔化温度区间为642.34 ℃~676.37 ℃. 与传统熔炼合金化方法相比,钎料中Sn含量提高近31%.     

Interface characteristics and mechanical properties of the induction brazed joint of magnesium alloy AZ31B with an Al-based filler metal

In this paper, wrought magnesium alloy AZ31B sheets were brazed by means of high-frequency induction heating device using a novel Al-based filler metal in argon gas shield condition. The interfacial microstructure, phase constitution and fracture morphology of the brazed joint were studied. The experimental results show that α-Mg solid solution and β-Mg₁₇Al₁₂ phase were formed in brazing region. Moreover, the homogeneous Mg₃₂(Al, Zn)₄₉ phase in the original Al-based filler metal disappeared entirely after the brazing process due to the fierce alloying between the molten filler metal and the base metal during brazing. Test results show that the shear strength of the brazed joint is 45 MPa. The fracture morphology of the brazed joint exhibits intergranular fracture mode and the crack originates from the hard β-Mg₁₇Al₁₂ phase.     

Ti-50Ni钎焊TZM与ZrCp-W接头界面组织及性能

采用Ti-50Ni(at%)钎料实现了TZM合金与ZrC_p-W复合材料的真空钎焊连接,通过SEM、EDS、XRD等方法分析了接头界面的微观组织结构,研究了钎焊温度对TZM/Ti-50Ni/ZrC_p-W接头界面组织及性能的影响。结果表明:钎焊接头的典型界面结构为TZM/Ti-Mo+TiNi_3+Mo-Ti-W/Ti Ni+TiNi_3+W(s,s)+(Ti,Zr)C/ZrC_p-W。随着钎焊温度的升高,Ti-Mo固溶体层宽度逐渐增大,线状条纹增多、增宽,组织逐渐粗大,晶界变圆滑;接头的抗剪强度随钎焊温度升高先升高后降低,当钎焊温度为1340℃,保温10 min时,接头获得最大抗剪强度为146 MPa。     

光束偏移量对DD407/GH1140激光焊接头性能的影响

对航空发动机整体叶盘所采用的DD407和GH1140异种材料进行了激光对接试验,分析了光束偏移对接头力学性能的影响及典型接头横截面的组织特征,并分析了光束偏移对焊缝微观硬度影响。结果表明,该异种材料激光焊接头强度可达到466.3MPa,且光束偏移量对接头强度影响不大,主要取决于GH1140母材;焊缝横截面呈典型的"酒杯状",主要由焊缝两侧的枝状晶及中心的等轴晶组成;接头的显微硬度从GH1140侧经焊缝到DD407侧呈逐渐递增趋势,W和Co元素的固溶强化、γ'强化相的含量的增加、晶粒粗化是显微硬度上升的原因。     

Improved mechanical properties of reaction-bonded SiC through in-situ formation of Ti3SiC2

Reaction-bonded SiC is a ceramic with excellent thermal properties, good corrosion resistance and the characteristic of near-net-shape manufacturing. However, the poor fracture toughness of free Si limits the applications of reaction-bonded SiC. In this study, TiC was added to reaction-bonded SiC and reacted with free Si to form Ti₃SiC₂. The effects of TiC and carbon black on the mechanical properties of reaction-bonded SiC were investigated. The results demonstrated that the in-situ formation of Ti₃SiC₂ and decrease in the content and size of free Si improved the mechanical properties of reaction-bonded SiC ceramics. The mechanical properties of TiC-added reaction-bonded SiC with 17.5 wt% carbon black were superior to those of TiC-added reaction-bonded SiC with 15 wt% carbon black. Moreover, increasing the TiC content of reaction-bonded SiC with 17.5 wt% carbon black from 0 to 7.5 wt% caused an increase in its bending strength from 183.92 to 424.43 MPa and an increase in fracture toughness from 3.7 to 5.24 MPa m^1/2.     

热浸镀锡铜磷钎料的性能

以Cu93P钎料为基体,在其表面热浸镀锡,制备CuPSn钎料,采用扫描电镜、万能力学试验机、显微硬度计、差热分析仪、箱式电阻炉和体视显微镜分析锡镀层的界面形貌,钎料的抗拉强度、显微硬度、熔化温度和润湿性。结果表明：在Cu93P钎料表面热浸镀锡过程中,液态锡与钎料发生了界面反应,生成Cu₆Sn₅金属间化合物,即钎料基体与锡镀层形成良好的冶金结合;随着热浸镀温度的升高和时间的延长,CuPSn钎料的抗拉强度和显微硬度均呈降低趋势,抗拉强度的降低源于界面处产生的Cu₆Sn₅脆性化合物和孔洞,显微硬度的降低源于热浸镀的去应力退火作用;Cu93P钎料表面热浸镀锡可降低钎料的熔化温度,提高钎料的润湿性,Cu93P钎料表面热浸镀5.20%（质量分数）锡之后,Cu88.16P6.64Sn5.20在纯铜板上的润湿铺展面积比基体Cu93P钎料增加43.15%。