全文获取类型
收费全文 | 126篇 |
免费 | 41篇 |
国内免费 | 25篇 |
专业分类
电工技术 | 6篇 |
综合类 | 14篇 |
化学工业 | 33篇 |
金属工艺 | 3篇 |
机械仪表 | 9篇 |
建筑科学 | 11篇 |
矿业工程 | 1篇 |
能源动力 | 1篇 |
轻工业 | 10篇 |
无线电 | 29篇 |
一般工业技术 | 8篇 |
冶金工业 | 4篇 |
自动化技术 | 63篇 |
出版年
2024年 | 1篇 |
2023年 | 2篇 |
2022年 | 4篇 |
2021年 | 14篇 |
2020年 | 5篇 |
2019年 | 7篇 |
2018年 | 8篇 |
2017年 | 6篇 |
2016年 | 12篇 |
2015年 | 15篇 |
2014年 | 12篇 |
2013年 | 9篇 |
2012年 | 19篇 |
2011年 | 16篇 |
2010年 | 7篇 |
2009年 | 8篇 |
2008年 | 11篇 |
2007年 | 7篇 |
2006年 | 7篇 |
2005年 | 6篇 |
2004年 | 2篇 |
2003年 | 1篇 |
2002年 | 3篇 |
2001年 | 4篇 |
2000年 | 3篇 |
1997年 | 1篇 |
1994年 | 1篇 |
1986年 | 1篇 |
排序方式: 共有192条查询结果,搜索用时 15 毫秒
1.
本文就衣架式模头水滴形歧管的结构设计,根据聚合物加工的流变理论,结合生产实际对水滴形截面的歧管流道分配系统进行分析,使得所设计的挤塑模在尽可能高的流速下,生产出符合尺寸及形状公差的均质片材。 相似文献
2.
With the wide application and further study of the genetic algorithm in multi-objective optimization problems, the NSGA-Ⅱ has been one of the representative evolutionary algorithms for multi-objective optimization problems. Crowding distance in the NSGA-Ⅱ plays an important role in convergence and uniform distribution of the solutions, but the NSGA-Ⅱ does not fully take the effect of each individual and the whole population into consideration. To estimate the region density more reasonably so as to make the solution set more uniformly converge to the Pareto optimal front, we design a uniformly crowding distance operator based on the uniformly crowding range and Gini weight, and propose an improved NSGA-Ⅱ algorithm. Finally, the effectiveness of the proposed algorithm is verified by experiments on six multi-objective optimization test functions. 相似文献
3.
4.
基于拥挤距离的动态粒子群多目标优化算法 总被引:1,自引:0,他引:1
提出了一种改进的基于拥挤距离的动态粒子群多目标优化算法。为提高粒子的全局搜索能力,提出了新的动态变化惯性权重和加速因子的方法。引进了拥挤距离排序方法维护外部精英集和更新全局最优值。为保持非劣解的多样性,采用了小概率变异机制,并根据种群的大小选择不同的变异概率。最后,把算法应用到5个典型的多目标测试函数并与其他算法进行比较。实验结果表明,该算法所得的Pareto解集有很好的收敛性和多样性。 相似文献
5.
Risako Kobayashi Hiroshi Inaba Kazunori Matsuura 《International journal of molecular sciences》2021,22(9)
Recent progress in the de novo design of self-assembling peptides has enabled the construction of peptide-based viral capsids. Previously, we demonstrated that 24-mer β-annulus peptides from tomato bushy stunt virus spontaneously self-assemble into an artificial viral capsid. Here we propose to use the artificial viral capsid through the self-assembly of β-annulus peptide as a simple model to analyze the effect of molecular crowding environment on the formation process of viral capsid. Artificial viral capsids formed by co-assembly of fluorescent-labelled and unmodified β-annulus peptides in dilute aqueous solutions and under molecular crowding conditions were analyzed using fluorescence correlation spectroscopy (FCS). The apparent particle size and the dissociation constant (Kd) of the assemblies decreased with increasing concentration of the molecular crowding agent, i.e., polyethylene glycol (PEG). This is the first successful in situ analysis of self-assembling process of artificial viral capsid under molecular crowding conditions. 相似文献
6.
A method of extraction of source and drain resistances in linear mode of operation from a single transistor is described. The proposed method can also be used to measure source resistance over the entire operating range from linear to saturation mode of operation. The method uses two floating probes outside the channel, one adjacent to the source and the other to the drain to sense the voltage under these contacts. Using transmission line analysis, the source and drain resistances are directly extracted from these measurements. 2D numerical simulation results confirm the validity of the proposed technique and sensitivity analysis shows that the method is more accurate than the conventional gated four probe technique, especially, when the source resistance is much smaller than the channel resistance. Experimental results obtained with Pentacene top-contact transistors are used to illustrate the proposed technique. Analysis of two devices with very different source resistance is carried out to highlight the ability of the proposed technique to offer insight into the different contributing factors. Current crowding under the source contact and accurate estimation of mobility without the distorting effects of source resistance are also described. 相似文献
7.
Murial L. Ross Jeffrey Kunkel Steven Long Prashanth Asuri 《International journal of molecular sciences》2020,21(22)
Confinement and crowding have been shown to affect protein fates, including folding, functional stability, and their interactions with self and other proteins. Using both theoretical and experimental studies, researchers have established the independent effects of confinement or crowding, but only a few studies have explored their effects in combination; therefore, their combined impact on protein fates is still relatively unknown. Here, we investigated the combined effects of confinement and crowding on protein stability using the pores of agarose hydrogels as a confining agent and the biopolymer, dextran, as a crowding agent. The addition of dextran further stabilized the enzymes encapsulated in agarose; moreover, the observed increases in enhancements (due to the addition of dextran) exceeded the sum of the individual enhancements due to confinement and crowding. These results suggest that even though confinement and crowding may behave differently in how they influence protein fates, these conditions may be combined to provide synergistic benefits for protein stabilization. In summary, our study demonstrated the successful use of polymer-based platforms to advance our understanding of how in vivo like environments impact protein function and structure. 相似文献
8.
This work demonstrates high-performance and current crowding-free InGaN/GaN light-emitting diodes (LEDs) using an electrically-reverse-connected Schottky diode (SD) and an Mg-delta (δ) doped layer.Poss... 相似文献
9.
In this letter, lateral GaN-based Light Emitting Diodes (LEDs) with a SiO2 current blocking layer (CBL) buried in the indium tin oxide (ITO) film and highly reflective metal materials have been proposed. Compared with the conventional CBL structure which was inserted between ITO film and p-type GaN, simulation results showed that LEDs with a buried CBL in the ITO film effectively facilitated current spreading under the CBL. We demonstrated that buried CBL was beneficial for suppressing current crowding (CC) effect around the edge of CBL and may facilitate higher LED efficiency. Furthermore, experimental results showed that LEDs with the buried structure we proposed showed lower working voltage and higher light output power (LOP) compared with those with conventional CBL structure. These results further confirmed that the buried CBL scheme was effective to reduce current crowding (CC) effect. In addition, highly reflective metal materials of Cr/Al/Pt/Au were employed to reduce light absorption and achieve high light extraction efficiency. 相似文献
10.
Temperature and current-density distributions in flip-chip solder joints with Cu traces 总被引:1,自引:0,他引:1
C. Y. Hsu D. J. Yao S. W. Liang Chih Chen Everett C. C. Yeh 《Journal of Electronic Materials》2006,35(5):947-953
Three-dimensional simulation was performed to investigate the temperature and current density distribution in flip-chip solder
joints with Cu traces during current stressing. It was found that the Cu traces can reduce the Joule heating effect significantly
at high stressing currents. When the solder joints were stressed by 0.6 A, the average temperature increases in solder bumps
with the Al traces was 26.7°C, and it was deceased to 18.7°C for the solder joint with the Cu traces. Hot spots exist in the
solder near the entrance points of the Al or Cu traces. The temperature increases in the hot spot were 29.3°C and 20.6°C,
for solder joints with the Al traces and Cu traces, respectively. As for current density distribution, the maximum current
density inside the solder decreased slightly from 1.66×105 A/cm2 to 1.46×105 A/cm2 when the Al traces were replaced by the Cu traces. The solder joints with the Cu traces exhibited lower Joule heating and
current crowding effects than those with the Al traces, which was mainly attributed to the lower electrical conductivity of
the Cu traces. Therefore, the solder joints with the Cu traces are expected to have better electromigration resistance. 相似文献