A highly active composite electrocatalyst Ni–Fe–P–Nb2O5/NF for overall water splitting

This work demonstrates a facile Nb₂O₅-decorated electrocatalyst to prepare cost-effective Ni–Fe–P–Nb₂O₅/NF and compared HER & OER performance in alkaline media. The prepared electrocatalyst presented an outstanding electrocatalytic performance towards hydrogen evolution reaction, which required a quite low overpotential of 39.05 mV at the current density of ?10 mA cm^?2 in 1 M KOH electrolyte. Moreover, the Ni–Fe–P–Nb₂O₅/NF catalyst also has excellent oxygen evolution efficiency, which needs only 322 mV to reach the current density of 50 mA cm^?2. Furthermore, its electrocatalytic performance towards overall water splitting worked as both cathode and anode achieved a quite low potential of 1.56 V (10 mA cm^?2).     

Deep‐UV Photochemistry and Patterning of (Aminoethylaminomethyl)phenethylsiloxane Self‐Assembled Monolayers

The 193 nm photochemistry of (aminoethylaminomethyl)phenethylsiloxane (PEDA) self‐assembled monolayers (SAMs) under ambient conditions is described. The primary photodegradation pathways at low exposure doses (< 100 mJ cm^–2) are benzylic C–N bond cleavage (ca. 68 %), with oxidation of the benzyl C to the aldehyde, and Si–C bond cleavage (ca. 32 %). Amine‐containing photoproducts released from the SAM during exposure remain physisorbed on the surface, where they undergo secondary photolysis leading to their complete degradation and removal after ca. 1200 mJ cm^–2. NaCl(aq) post‐exposure rinsing removes the physisorbed materials, showing that degradation of the original PEDA species (leaving Si–OH) is substantially complete after ca. 450 mJ cm^–2. Consequently, patterned, rinsed PEDA SAMs function as efficient templates for fabrication of high‐resolution, negative‐tone, electroless metal and DNA features with good selectivity at low dose (i.e., ca. 400 mJ cm^–2) via materials grafting to the intact amines remaining in the unirradiated PEDA SAM regions.     

镀液中SiC含量和粒径对Ni-P-SiC复合化学镀层性能的影响

采用化学镀方法制备了Ni P SiC复合镀层 ,系统研究了镀液中SiC含量和粒径对镀层结构及显微硬度的影响。结果表明 ,镀层中SiC析出量随镀液中SiC含量的增加而增加 ,在SiC含量一定的情况下 ,当SiC粒径为 7.0 μm时 ,析出量最大 ;镀液中SiC的含量和粒度对原始镀层的硬度影响不大 ,但对 4 0 0℃热处理后的镀层硬度有显著影响     

化学镀镍合金在电子工业中的应用

对化学镀镍合金铁工艺和性能特性及其在电子工业中的应有委展现状作了评述。化学镀镍合金具有镀层均匀，适用基材广，结合力高，硬度高，优良的耐磨、耐蚀性，可焊性好和特殊的电磁性能等特性，在电子工业中获得了广泛的应用。文中着重介绍了化学镀镍合金在磁盘、电磁屏蔽、微电路、半导体、连接器及薄膜电阻上的应用情况。这些案例说明，合理应用化学镀镍合金技术，有利于提高电子元器件的质量，降低成本，促进技术进步。     

化学镀Ni—P镀层的X射线衍射研究

根据X射线衍射分析结果,对化学镀高P(含P>11wt％或19at％)Ni-P镀层加热时效时,镀层成分和加热温度对结构转变的影响作了研究,结果表明,高P共晶、过共晶(含P>11wt％或19at％)合金的结构转变有如下特征:(1)相同加热时效条件下,Ni-P合金的结构转变与成分有密切关系:(2)对同一成分的过共晶合金,Ni-P合金的结构转变与时效温度密切相关;(3)过共晶合金在290～360℃温度范围内时效处理,出现Ni_xP_y介稳相,X射线衍射分析认为Ni_xP_y为Ni_(12)P_5。     

Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers

Argon plasma-pretreated polyimide (PI, Kapton^® HN) films were subjected to UV-induced surface graft copolymerization with N,N′-(dimethylamino)ethyl methacrylate (DMAEMA) and 2-(trimethylammonium)ethyl methacrylate chloride (TMMAC). The DMAEMA graft-copolymerized PI (DMAEMA-g-PI) surfaces were also quaternized and amino-functionalized with 3-bromopropylamine hydrobromide (the Q-DMAEMA-g-PI surfaces). The surface composition and the degree of quaternization of the graft-modified PI films were determined by X-ray photoelectron spectroscopy. The DMAEMA-g-PI, Q-DMAEMA-g-PI and TMMAC graft-copolymerized PI (TMMAC-g-PI) surfaces can be activated directly by PdCl₂, in the absence of prior sensitization by SnCl₂ (the ‘Sn-free’ activation process), for the subsequent electroless plating of copper. A shorter induction time for the electroless deposition of copper was found for the palladium-activated Q-DMAEMA-g-PI and TMMAC-g-PI surfaces than for the palladium-activated DMAEMA-g-PI surface. The T-peel adhesion strength of the electrolessly deposited copper with the Q-DMAEMA-g-PI surface was enhanced to above 6 N/cm, in comparison to only about 4 N/cm for the DMAEMA-g-PI surface, about 2.5 N/cm for the TMMAC-g-PI surface, or about 0.5 N/cm for the PI surface with argon plasma treatment alone.     

Microhardness and corrosion behavior in CrN/electroless Ni/mild steel complex coating

The electroless nickel–phosphorous (Ni–P) coating was chosen as an interlayer to improve the properties of the CrN/mild steel (MS) composite. A hypophosphite-reduced acid solution was used to first deposit electroless Ni–P onto MS substrates, and then the CrN overlayer was deposited by reactive r.f. magnetron sputtering onto the electroless Ni–P modified substrate. The electroless Ni–P layer crystallizes with the precipitation of a Ni₃P phase during r.f. sputtering, and thus a coating–substrate composite of CrN/Ni–Ni₃P/MS is formed. The electroless Ni–P coating increases the surface hardness of the steel substrate to more than three times. The surface hardness of the CrN coating modified by an electroless Ni–P interlayer exhibits a hardness higher than 2000 HK_0.015. The usual substrate effect on the microhardness of the coatings is nearly eliminated with the complex coating feature, and a significant enhancement of surface hardness in the coating assembly is achieved. The corrosion tests indicate that the Ni–Ni₃P/MS configuration exhibits a more positive E_corr value (i.e. less electronegative) than CrN/MS and the corresponding potential curve is shifted toward the low-current side, indicating a better anti-corrosion performance. Through comparison of the E_corr values and the polarization curves, it is demonstrated that the CrN/Ni–Ni₃P/MS composite exhibits significantly higher corrosion resistance than the Ni–Ni₃P/MS and CrN/MS coating configurations.     

化学镀镍内应力的研究

用于非金属电镀、电铸、化学镀、化学铸的现行许多化学镀镍工艺,总是在零件尖端部位发生崩裂,在镜面光洁的地方易起泡,这种难题至今未得到很好解决,这大大限制了化学镀镍的应用.针对这种情况,采用正交实验方法开发出一个低温、低内应力化学镀镍工艺,初步探讨了沉积层内应力与各工艺参数之间的关系,以及作为添加剂的糖精在化学沉积层中的作用机理,并对内应力和结合力的关系作了简介.实践证明了该工艺在短时间内能于多种复杂形状或镜面光亮的非金属表面上获得完整的化学镍沉积层.     

化学镀钴-磷基多元合金的研究现状

由于钴－磷基合金膜具有优异的磁性能和较高的耐蚀性，能有效的用于数字存储装置，已引起人们的极大关注。     

镍磷合金镀层防变色性能初探

采用正交试验和条件试验，筛选出了一种以植酸、苯甲酸钠、钼酸钠和EDTA为基本组成的镍磷合金抗蚀防变色剂。通过孔隙率测定、18％～20％盐酸点滴实验、10％氯化钠浸泡实验和阳极极化曲线测试等实验，对镍磷合金层的抗腐蚀性能进行了研究。